JP5418738B1 - 積層体、導電性パターン、電気回路及び積層体の製造方法 - Google Patents
積層体、導電性パターン、電気回路及び積層体の製造方法 Download PDFInfo
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- JP5418738B1 JP5418738B1 JP2013533432A JP2013533432A JP5418738B1 JP 5418738 B1 JP5418738 B1 JP 5418738B1 JP 2013533432 A JP2013533432 A JP 2013533432A JP 2013533432 A JP2013533432 A JP 2013533432A JP 5418738 B1 JP5418738 B1 JP 5418738B1
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
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- 150000003951 lactams Chemical class 0.000 description 1
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- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical group NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- CXHHBNMLPJOKQD-UHFFFAOYSA-M methyl carbonate Chemical compound COC([O-])=O CXHHBNMLPJOKQD-UHFFFAOYSA-M 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
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- 238000006386 neutralization reaction Methods 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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Abstract
Description
本発明の積層体を構成する支持体層(I)は、積層体を支える支持体からなる層である。前記支持体層(I)としては、支持体に使用可能なものとして後述したものと同様のものを使用することができ、樹脂からなる層であることが好ましい。
前記導電層(II)は、主として導電性物質によって構成される層である。
前記導電層(II)としては、例えば前記導電性物質として遷移金属またはその化合物を含有する層が挙げられ、なかでもイオン性の遷移金属を含有する層であることがが好ましく、銅、銀、金、ニッケル、パラジウム、白金、コバルト等の遷移金属を含有する層であることがより好ましく、銅、銀、金等を含有する層であることが、電気抵抗が低く、腐食に強い導電性パターン等の積層体を形成するうえでさらに好ましい。
本発明の積層体は、例えば前記支持体層(I)を構成する支持体の表面の一部または全部に、導電性物質を含有する流動体を塗布し、焼成することによって、前記導電性物質を含有する層(II’)を形成する工程[1]、及び、前記前記導電性物質を含有する層(II’)の表面の一部または全部を酸化させ、次いで、その酸化された表面をめっき処理することによって、前記導電層(II)の酸化された表面に積層されためっき層(III)を形成する工程[2]を経ることによって製造することができる。
前記工程[1]は、前記支持体の表面の一部または全部に、導電性物質を含有する流動体を塗布し、焼成することによって、前記導電性物質を含有する層(II’)を形成する工程である。前記流動体は、前記支持体の表面に直接、塗布してもよい。また、前記流動体は、前記支持体の表面に必要に応じて設けられた前記プライマー層(X)の表面の一部または全部に塗布してもよい。
前記工程[2]は、前記導電性物質を含有する層(II’)のうち、前記めっき層(III)と接触する表面を酸化処理することによって、酸化された表面を備えた導電層(II)を形成し、その表面をめっき処理することによって、前記導電層(II)の酸化された表面にめっき層(III)を積層する工程である。
温度計、窒素ガス導入管、攪拌器を備えた窒素置換された容器中で、ポリエステルポリオール(1,4−シクロヘキサンジメタノールとネオペンチルグリコールとアジピン酸とを反応させて得られたポリエステルポリオール)を100質量部、2,2―ジメチロールプロピオン酸17.6質量部、1,4−シクロヘキサンジメタノール21.7質量部、ジシクロヘキシルメタンジイソシアネート106.2質量部を、メチルエチルケトン178質量部の中で反応させることによって、末端にイソシアネート基を有するウレタンプレポリマーの有機溶剤溶液を得た。
冷却管、撹拌装置、温度計、窒素導入管を備えた4つ口フラスコに、メタクリル酸メチル45質量部、アクリル酸n−ブチル45質量部、アクリル酸4−ヒドロキシブチル5質量部及びメタクリル酸5質量部を含有するビニル単量体混合物と、酢酸エチルとを仕込み、窒素雰囲気下で撹拌しながら50℃まで昇温し、その後、2、2’−アゾビス(2−メチルブチロニトリル)を2.0質量部仕込み、24時間反応させることによって、重量平均分子量40万のビニル重合体と酢酸エチルとを含有する混合物500質量部(不揮発分20質量%)を得た。
エチレングリコール45質量部と、イオン交換水55質量部との混合溶媒に、平均粒径30nmの銀粒子を分散させることによって導電性インク1を調製した。
ポリイミドフィルム(東レ・デュポン株式会社製Kapton200H、厚さ50μm)からなる支持体の表面に、前記プライマー(X−1)を、スピンコーターを用いて、その乾燥後の厚さが0.1μmとなるように塗布し、次いで、熱風乾燥機を用いて80℃の条件で5分間乾燥することによって、前記支持体の表面にプライマー層を形成した。
前記AP−T01(積水化学工業株式会社製、常圧プラズマ処理装置)によるコロナ放電処理の代わりに、TEC−4AX(春日電機株式会社製のコロナ表面改質評価装置、ガス;空気(酸素濃度約21質量%)、ギャップ;1.5mm、出力;100W、処理時間;2秒)を用いてコロナ放電処理を施すこと以外は、実施例1と同様の方法によって、前記支持体層(I)とプライマー層(X)と前記導電層(II)と前記めっき層(III)に相当する層が積層された積層体(L−2)を得た。なお、前記コロナ放電処理前の前記層(II’)に相当する層の表面抵抗は3Ω/□であったが、コロナ放電処理した導電層の表面抵抗は5Ω/□となり増加した。また、前記同様のX線光電子分析装置を用いてその表面を分析したところ、銀が酸化されていることを示すピークを確認することができた。また、前記酸化に伴って、その表面抵抗値が増加したことを確認した。
ポリイミドフィルム(東レ・デュポン株式会社製Kapton200H)からなる支持体の表面に、前記プライマー(X−1)を、スピンコーターを用いて、その乾燥膜厚が0.1μmとなるように塗布し、次いで、熱風乾燥機を用いて80℃の条件で5分間乾燥することによって、前記支持体の表面にプライマー層を形成した。
前記電解めっき処理の代わりに、下記に示す無電解めっき処理を施すこと以外は、実施例2と同様の方法によって、前記支持体層(I)とプライマー層(X)と前記導電層(II)と前記めっき層(III)に相当する層が積層された積層体(L−4)を得た。コロナ放電処理前の前記層(II’)に相当する層の表面抵抗は2Ω/□であったが、コロナ放電処理した導電層の表面抵抗は3Ω/□となり増加した。また、前記同様のX線光電子分析装置を用いてその表面を分析したところ、銀が酸化されていることを示すピークを確認することができた。また、前記酸化に伴って、その表面抵抗値が増加したことを確認した。
ポリイミドフィルム(東レ・デュポン株式会社製Kapton200H)からなる支持体を40℃の1mol/Lの水酸化カリウム水溶液に15分浸漬後、イオン交換水で十分洗浄し、常温で乾燥した。
プライマー(X−1)の代わりに、プライマー(X−2)を使用すること以外は、実施例2と同様の方法で、前記支持体層(I)と前記導電層(II)と前記めっき層(III)に相当する層が積層された積層体(L−6)を得た。コロナ放電処理前の前記層(II’)に相当する層の表面抵抗は2Ω/□であったが、コロナ放電処理した導電層の表面抵抗は3Ω/□となり増加した。また、前記同様のX線光電子分析装置を用いてその表面を分析したところ、銀が酸化されていることを示すピークを確認することができた。また、前記酸化に伴って、その表面抵抗値が増加したことを確認した。
プラズマ放電処理及びコロナ放電処理を施さないこと以外は、実施例3と同様の方法で、前記支持体層(I)とプライマー層(X)と前記層(II’)と前記めっき層(III)とに相当する層が積層した積層体(L’−1)を得た。前記層(II’)に相当する層の表面抵抗は2Ω/□であったのに対し、前記めっきを施す前の前記層(II’)に相当する層の表面抵抗も2Ω/□であり変化がなかった。また、前記同様のX線光電子分析装置を用いてその表面を分析したが、銀が酸化されていることを示すピークを確認することはできなかった。また、その表面抵抗値は、増加していなかった。
プラズマ放電処理及びコロナ放電処理の代わりに、紫外線表面改質装置(センエンジニアリング(株)製、「低圧水銀ランプEUV200WS」、照度20mW/cm2、出力200W、照射時間60秒)を用い、前記層(II’)に相当する層の表面を紫外線照射したこと以外は、実施例1と同様の方法で、前記支持体層(I)とプライマー層(X)と、紫外線処理された層と、前記めっき層(III)とに相当する層が積層した積層体(L’−2)を得た。紫外線照射前の前記層(II’)に相当する層の表面抵抗は2Ω/□であったのに対し、紫外線照射された層の表面抵抗も2Ω/□であり変化がなかった。また、前記同様のX線光電子分析装置を用いてその表面を分析したが、銀が酸化されていることを示すピークを確認することはできなかった。また、その表面抵抗値は、増加していなかった。
表面抵抗の測定は、ダイアインスツルメンツ社製のロレスターGP(型番MCP−T610)直列4探針プローブ(ASP)を用い、前記表面の任意の10カ所を測定し、その平均値を算出し行った。
<目視による評価>
前記で得た積層体の各めっき層の表面に、セロハン粘着テープ(ニチバン(株)製,CT405AP−24,24mm)を指で圧着し貼付した後、前記セロハン粘着テープを、前記積層体を構成するめっき層の表面に対して90度方向に剥離した。剥離したセロハン粘着テープの粘着面を目視で観察し、剥離の有無、及び、剥離した界面の位置を確認した。
ピール強度測定は、IPC−TM−650、NUMBER2.4.9に準拠した方法により行った。測定に用いるリード幅は1mm、そのピールの角度は90°とした。なお、ピール強度は、前記めっき層の厚さが厚くなるほど高い値を示す傾向にあるが、本発明でのピール強度の測定は、現在汎用されているめっき層8μmにおける測定値を基準として実施した。
一方、導電層の表面を酸化させることなく、その表面にめっき層を設けた比較例1記載の積層体は、前記導電層とめっき層との界面で剥離を生じる場合があった。また、導電層の表面を紫外線照射し、その表面にめっき層を設けた比較例2記載の積層体は、導電層とめっき層との界面で剥離が確認された。
Claims (8)
- 少なくとも、支持体層(I)と、導電層(II)と、めっき層(III)とを有する積層体であって、前記導電層(II)が酸化された表面を有し、かつ、前記めっき層(III)が、前記導電層(II)の酸化された表面に積層されたものであることを特徴とする積層体。
- 前記導電層(II)の酸化された表面の一部または全部が、酸化銀によって構成されたものである請求項1に記載の積層体。
- 前記支持体層(I)と前記導電層(II)とが、プライマー層(X)を介して積層したものである請求項1記載の積層体。
- 前記めっき層(III)が、前記導電層(II)の酸化された表面を電解めっき処理することによって形成された層である請求項1に記載の積層体。
- 前記導電層(II)の酸化された表面の抵抗値が0.1Ω/□〜50Ω/□の範囲である請求項1に記載の積層体。
- 請求項1〜5のいずれか1項に記載の積層体からなる導電性パターン。
- 請求項1〜5のいずれか1項に記載の積層体からなる電気回路。
- 支持体層(I)と導電性物質を含有する層(II’)とがプライマー層(X)を介して積層した基体の前記層(II’)の表面に、コロナ放電処理を施すことによって、その表面が酸化された導電層(II)を形成し、次いで、前記導電層(II)の酸化された表面に電解めっき処理を施すことによって、前記導電層(II)の酸化された表面にめっき層(III)を積層することを特徴とする積層体の製造方法。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9728304B2 (en) * | 2009-07-16 | 2017-08-08 | Pct International, Inc. | Shielding tape with multiple foil layers |
KR101548420B1 (ko) * | 2012-07-24 | 2015-08-28 | 주식회사 엘지화학 | 금속입자층 형성 방법 및 이를 이용하여 제조된 발광소자 |
CN104936774B (zh) * | 2013-01-23 | 2017-11-14 | Dic株式会社 | 层叠体、导电性图案、电路及层叠体的制造方法 |
WO2014157581A1 (ja) * | 2013-03-29 | 2014-10-02 | トッパン・フォームズ株式会社 | 積層体及び回路基板 |
JP6418435B2 (ja) * | 2014-02-21 | 2018-11-07 | Dic株式会社 | 積層体、導電性パターン及び電子回路 |
JP6439973B2 (ja) * | 2014-12-24 | 2018-12-19 | Dic株式会社 | 積層体、導電性パターン及び電子回路 |
US11189393B2 (en) * | 2015-03-23 | 2021-11-30 | Bando Chemical Industries, Ltd. | Conductive coated composite body and method for producing same |
WO2016208672A1 (ja) * | 2015-06-26 | 2016-12-29 | Dic株式会社 | 積層体、成形品、導電性パターン、電子回路及び電磁波シールド |
JP6576463B2 (ja) * | 2015-11-12 | 2019-09-18 | 三菱電機株式会社 | Cuめっきの形成方法、および、Cuめっき付き基板の製造方法 |
WO2017154879A1 (ja) * | 2016-03-11 | 2017-09-14 | Dic株式会社 | 積層体の製造方法 |
CN108779358B (zh) * | 2016-05-09 | 2021-02-02 | Dic株式会社 | 柔版印刷用金属纳米粒子墨液及使用其的层叠体的制造方法 |
KR102341502B1 (ko) * | 2019-07-01 | 2021-12-21 | 김태현 | 애완동물용 배변 훈련장치 |
US11848120B2 (en) | 2020-06-05 | 2023-12-19 | Pct International, Inc. | Quad-shield cable |
CN112233851A (zh) * | 2020-10-19 | 2021-01-15 | 廖斌 | 一种透明导电电极制备方法及*** |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05327207A (ja) * | 1991-01-11 | 1993-12-10 | Sumitomo Metal Mining Co Ltd | ポリイミド基板の製造方法 |
JP2003115662A (ja) * | 2001-10-05 | 2003-04-18 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2009004617A (ja) * | 2007-06-22 | 2009-01-08 | Sumitomo Osaka Cement Co Ltd | 電磁波遮蔽膜付き透明基材およびその製造方法 |
JP2010069861A (ja) * | 2008-08-21 | 2010-04-02 | Oike Ind Co Ltd | 支持体付き金属箔、及び該金属箔の製造方法、並びにフレキシブル回路基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60246695A (ja) | 1984-05-22 | 1985-12-06 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
JP3192717B2 (ja) * | 1991-11-19 | 2001-07-30 | 三洋電機株式会社 | 複写機 |
US7423750B2 (en) * | 2001-11-29 | 2008-09-09 | Applera Corporation | Configurations, systems, and methods for optical scanning with at least one first relative angular motion and at least one second angular motion or at least one linear motion |
JP2003046138A (ja) * | 2001-08-01 | 2003-02-14 | Sharp Corp | Ledランプ及びledランプ製造方法 |
US20050153059A1 (en) * | 2002-02-28 | 2005-07-14 | Yasuhiro Wakizaka | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board |
JP2005286158A (ja) | 2004-03-30 | 2005-10-13 | Seiko Epson Corp | パターン形成方法、電子デバイス及びその製造方法並びに電子機器 |
JP4490861B2 (ja) * | 2005-04-25 | 2010-06-30 | 日立協和エンジニアリング株式会社 | 基板 |
US20070262341A1 (en) * | 2006-05-09 | 2007-11-15 | Wen-Huang Liu | Vertical led with eutectic layer |
JP2008041765A (ja) * | 2006-08-02 | 2008-02-21 | Bridgestone Corp | 電磁波シールド性光透過窓材及びその製造方法 |
JP5261989B2 (ja) * | 2007-06-01 | 2013-08-14 | 住友大阪セメント株式会社 | 電磁波遮蔽膜付き透明基材及びその製造方法 |
WO2009091013A1 (ja) * | 2008-01-17 | 2009-07-23 | Idemitsu Kosan Co., Ltd. | 電界効果型トランジスタ、半導体装置及びその製造方法 |
-
2013
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05327207A (ja) * | 1991-01-11 | 1993-12-10 | Sumitomo Metal Mining Co Ltd | ポリイミド基板の製造方法 |
JP2003115662A (ja) * | 2001-10-05 | 2003-04-18 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2009004617A (ja) * | 2007-06-22 | 2009-01-08 | Sumitomo Osaka Cement Co Ltd | 電磁波遮蔽膜付き透明基材およびその製造方法 |
JP2010069861A (ja) * | 2008-08-21 | 2010-04-02 | Oike Ind Co Ltd | 支持体付き金属箔、及び該金属箔の製造方法、並びにフレキシブル回路基板 |
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JP5569662B1 (ja) * | 2012-09-28 | 2014-08-13 | Dic株式会社 | 積層体、導電性パターン及び電気回路 |
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JPWO2013147050A1 (ja) | 2015-12-14 |
TW201347968A (zh) | 2013-12-01 |
DE112013001780T5 (de) | 2015-01-15 |
KR101601694B1 (ko) | 2016-03-09 |
KR20140114420A (ko) | 2014-09-26 |
WO2013147050A1 (ja) | 2013-10-03 |
US20150068907A1 (en) | 2015-03-12 |
TWI551433B (zh) | 2016-10-01 |
CN104203561B (zh) | 2016-05-04 |
CN104203561A (zh) | 2014-12-10 |
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