JP5315268B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP5315268B2 JP5315268B2 JP2010053698A JP2010053698A JP5315268B2 JP 5315268 B2 JP5315268 B2 JP 5315268B2 JP 2010053698 A JP2010053698 A JP 2010053698A JP 2010053698 A JP2010053698 A JP 2010053698A JP 5315268 B2 JP5315268 B2 JP 5315268B2
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- Prior art keywords
- wire
- relay
- relay member
- electronic device
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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Description
平面視で前記第1外部接続端子と重なっておらず、第2外部接続端子を有する第2電子部品と、
少なくとも一部が平面視で前記第2電子部品と前記第1外部接続端子の間に位置しており、表面に複数の金属が互いに絶縁した状態で設けられている中継領域と、
一端が前記第1外部接続端子に接続していて他端が前記中継領域に位置している第1ワイヤと、
一端が前記第2外部接続端子に接続していて他端が前記中継領域に位置している第2ワイヤと、
前記第1電子部品、前記第2電子部品、前記中継領域、前記第1ワイヤ、及び前記第2ワイヤを封止する封止樹脂と、
を備え、
前記第1ワイヤ及び前記第2ワイヤの少なくとも一方は、前記他端が少なくとも一つの前記金属に接合しており、
前記第1ワイヤの前記他端と前記第2ワイヤの前記他端は、前記中継領域において互いに接合している電子装置が提供される。
少なくとも表面が絶縁性の基材と、
前記基材の表面の少なくとも一部に位置しており、互いに離間している複数の金属と、
を備える中継部材が提供される。
前記第1電子部品が実装される第1実装領域と、
平面視で前記第1実装領域とは異なる場所に設けられ、前記第1電子部品にワイヤを介して接続される接続端子が配置される端子領域と、
前記第1実装領域と前記端子領域との間に位置しており、表面に複数の金属が互いに絶縁した状態で設けられている中継領域と、
を備える実装基板が提供される。
前記第1外部接続端子と前記第2電子部品の間に、少なくとも表面に複数の金属が互いに絶縁した状態で設けられている中継領域を設ける工程と、
第1ワイヤの一端を前記第1外部接続端子に接続し、第2ワイヤの一端を前記第2外部接続端子に接続し、前記第1ワイヤ及び前記第2ワイヤの少なくとも一方の他端を、前記中継領域に位置している少なくとも一つの前記金属に接合させ、かつ、前記第1ワイヤの前記他端及び前記第2ワイヤの前記他端を、前記中継領域において互いに接合させる工程と、
前記第1電子部品、前記第2電子部品、前記中継領域、前記第1ワイヤ、及び前記第2ワイヤを封止樹脂で封止する工程と、
を備える電子装置の製造方法が提供される。
12 ダイパッド
14 リード
20 半導体チップ
22 電極パッド
30 第2ワイヤ
32 一端
34 他端
40 第1ワイヤ
42 一端
44 他端
50 封止樹脂
60 インターポーザ
62 電極
64 外部端子
70 半導体チップ
72 電極パッド
80 ワイヤ
90 ワイヤ
100 中継部材
101 中継領域
102 金属パターン
103 金属粒子
104 基板
105 導体膜
106 基板
107 絶縁層
108 基材
Claims (1)
- 第1外部接続端子を有する第1電子部品と、
平面視で前記第1外部接続端子と重なっておらず、第2外部接続端子を有する第2電子部品と、
少なくとも一部が平面視で前記第2電子部品と前記第1外部接続端子の間に位置しており、表面に複数の金属が互いに絶縁した状態で設けられている中継領域と、
一端が前記第1外部接続端子に接続していて他端が前記中継領域に位置している第1ワイヤと、
一端が前記第2外部接続端子に接続していて他端が前記中継領域に位置している第2ワイヤと、
前記第1電子部品、前記第2電子部品、前記中継領域、前記第1ワイヤ、及び前記第2ワイヤを封止する封止樹脂と、
を備え、
前記第1ワイヤ及び前記第2ワイヤの少なくとも一方は、前記他端が少なくとも一つの前記金属に接合しており、
前記第1ワイヤの前記他端と前記第2ワイヤの前記他端は、前記中継領域において互いに接合しており、
前記複数の金属は、それぞれが、平面視において前記第1ワイヤの前記他端及び前記第2ワイヤの前記他端よりも小さい電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010053698A JP5315268B2 (ja) | 2010-03-10 | 2010-03-10 | 電子装置 |
US12/929,756 US8304870B2 (en) | 2010-03-10 | 2011-02-14 | Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010053698A JP5315268B2 (ja) | 2010-03-10 | 2010-03-10 | 電子装置 |
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JPS5598837A (en) * | 1979-01-19 | 1980-07-28 | Mitsubishi Electric Corp | Semiconductor device |
JPH02154435A (ja) * | 1988-12-06 | 1990-06-13 | Matsushita Electron Corp | 半導体装置 |
JPH03167872A (ja) * | 1989-11-28 | 1991-07-19 | Seiko Epson Corp | 半導体装置用リードフレーム |
JPH03211740A (ja) * | 1990-01-16 | 1991-09-17 | Fujitsu Ltd | 半導体装置 |
JPH04306849A (ja) * | 1991-04-03 | 1992-10-29 | Fuji Xerox Co Ltd | 半導体装置 |
JPH065647A (ja) * | 1992-06-24 | 1994-01-14 | Nec Kyushu Ltd | 半導体装置 |
JPH0621134A (ja) | 1992-07-01 | 1994-01-28 | Seiko Epson Corp | 半導体装置およびその製造方法 |
JPH06326235A (ja) | 1993-05-11 | 1994-11-25 | Nec Kyushu Ltd | 半導体装置 |
KR100843137B1 (ko) * | 2004-12-27 | 2008-07-02 | 삼성전자주식회사 | 반도체 소자 패키지 |
JP4707548B2 (ja) | 2005-12-08 | 2011-06-22 | 富士通セミコンダクター株式会社 | 半導体装置、及び半導体装置の製造方法 |
JP2008034567A (ja) * | 2006-07-27 | 2008-02-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US7888781B2 (en) * | 2008-08-27 | 2011-02-15 | Fairchild Semiconductor Corporation | Micro-layered lead frame semiconductor packages |
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