JP5310660B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5310660B2 JP5310660B2 JP2010150931A JP2010150931A JP5310660B2 JP 5310660 B2 JP5310660 B2 JP 5310660B2 JP 2010150931 A JP2010150931 A JP 2010150931A JP 2010150931 A JP2010150931 A JP 2010150931A JP 5310660 B2 JP5310660 B2 JP 5310660B2
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- 239000000853 adhesive Substances 0.000 claims description 168
- 230000001070 adhesive effect Effects 0.000 claims description 167
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 37
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- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/481—Disposition
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- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/19101—Disposition of discrete passive components
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Description
この半導体装置は、金属ベース10に対向する樹脂ケース16の接合面29に接着剤17を塗布する接着剤塗布溝30が形成され、この接着剤塗布溝30に隣接して両側に流出接着剤収容溝31が凹設されている。接着剤塗布溝30と流出接着剤収容溝31との間の壁の頂面(金属ベース対向面)は、金属ベース10との接合面29の平面から離間されていて金属ベース10との間に接着剤逃しスペース32が形成されている。本実施の形態では、さらに、最も外側および内側に位置する流出接着剤収容溝31の外側および内側に接着剤17が樹脂ケース16の外側または内側に流出するのを防止する接着剤流出防止溝33が凹設されている。この接着剤流出防止溝33は、本実施の形態では、流出接着剤収容溝31よりも外側および内側の両方に設けられているが、これらは必要に応じて設けられるもので、流出接着剤収容溝31の外側だけ、または流出接着剤収容溝31の内側だけでも良い。これら接着剤塗布溝30、流出接着剤収容溝31および接着剤流出防止溝33は、金属ベース10に対向する樹脂ケース16の接合面29の全周にわたって連続して形成されている。
11 絶縁基板
12,13,14,15 半導体チップ
16 樹脂ケース
17 接着剤
18,19,20,21 外部主回路端子
22,23,24,25 外部制御端子
26,27 ボンディングワイヤ
28 孔
29 接合面
30 接着剤塗布溝
31 流出接着剤収容溝
32 接着剤逃しスペース
33 接着剤流出防止溝
Claims (4)
- 金属ベースに額縁状の樹脂ケースを接合して半導体チップを収容する空間が形成される半導体装置において、
前記金属ベースに対向する前記樹脂ケースの接合面に全周にわたって連続して凹設された接着剤塗布用の接着剤塗布溝と、
前記接着剤塗布溝の両側壁の少なくとも一方の頂面が前記接合面の平面から離間して形成されていて前記金属ベースとの間に前記接着剤塗布溝に塗布された接着剤の余剰分を導入して収容するための接着剤逃しスペースと、
前記接合面に、前記接着剤塗布溝に隣接して前記接着剤逃しスペースに連通するよう形成された流出接着剤収容溝と、
を備えていることを特徴とする半導体装置。 - 前記接合面に、前記接着剤塗布溝、前記流出接着剤収容溝および前記接着剤逃しスペースの組が複数設けられていることを特徴とする請求項1記載の半導体装置。
- 前記接合面に、前記樹脂ケースの最も外側に形成された前記接着剤塗布溝または前記流出接着剤収容溝の外側に接着剤流出防止溝が形成されていることを特徴とする請求項2記載の半導体装置。
- 前記接合面に、前記樹脂ケースの最も内側に形成された前記接着剤塗布溝または前記流出接着剤収容溝の内側にも前記接着剤流出防止溝が形成されていることを特徴とする請求項3記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010150931A JP5310660B2 (ja) | 2010-07-01 | 2010-07-01 | 半導体装置 |
CN201110192485.5A CN102315178B (zh) | 2010-07-01 | 2011-06-28 | 半导体装置 |
US13/175,151 US8546933B2 (en) | 2010-07-01 | 2011-07-01 | Semiconductor apparatus including resin case |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010150931A JP5310660B2 (ja) | 2010-07-01 | 2010-07-01 | 半導体装置 |
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Publication Number | Publication Date |
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JP2012015349A JP2012015349A (ja) | 2012-01-19 |
JP5310660B2 true JP5310660B2 (ja) | 2013-10-09 |
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JP2010150931A Active JP5310660B2 (ja) | 2010-07-01 | 2010-07-01 | 半導体装置 |
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US (1) | US8546933B2 (ja) |
JP (1) | JP5310660B2 (ja) |
CN (1) | CN102315178B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6039311B2 (ja) * | 2012-08-29 | 2016-12-07 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
KR102047378B1 (ko) * | 2012-11-30 | 2019-11-21 | 엘지이노텍 주식회사 | 카메라 모듈 |
EP2797111A1 (en) | 2013-04-24 | 2014-10-29 | Nxp B.V. | Electrical component packaging |
WO2015008563A1 (ja) * | 2013-07-17 | 2015-01-22 | カルソニックカンセイ株式会社 | 組電池 |
DE112015000183B4 (de) | 2014-04-30 | 2022-05-05 | Fuji Electric Co., Ltd. | Halbleitermodul und Verfahren zu dessen Herstellung |
JP6775385B2 (ja) * | 2015-11-10 | 2020-10-28 | 昭和電工株式会社 | パワーモジュール用ベース |
JP6645134B2 (ja) * | 2015-11-16 | 2020-02-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
WO2017098593A1 (ja) * | 2015-12-09 | 2017-06-15 | 三菱電機株式会社 | パワーモジュール |
JP6556656B2 (ja) * | 2016-03-31 | 2019-08-07 | 京セラ株式会社 | 接続構造、サーマルヘッドおよびサーマルプリンタ |
FR3060937B1 (fr) * | 2016-12-19 | 2020-11-06 | Valeo Systemes De Controle Moteur | Ceinture de protection pour module electronique, et module electronique comprenant une telle ceinture de protection |
JP6766744B2 (ja) * | 2017-05-10 | 2020-10-14 | 株式会社豊田自動織機 | 半導体モジュール |
JP7238330B2 (ja) * | 2018-10-18 | 2023-03-14 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP7364168B2 (ja) * | 2019-02-12 | 2023-10-18 | 住友電工デバイス・イノベーション株式会社 | 半導体モジュール及び半導体デバイス収容体 |
JP7173375B2 (ja) * | 2019-11-27 | 2022-11-16 | 三菱電機株式会社 | 半導体モジュール |
JP7482833B2 (ja) | 2021-05-27 | 2024-05-14 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
KR102600993B1 (ko) * | 2021-07-19 | 2023-11-10 | (주) 세명유리 | 유리패널의 장착구조 |
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JPS4941091B1 (ja) * | 1970-10-09 | 1974-11-07 | ||
JPS59177949A (ja) | 1983-03-29 | 1984-10-08 | Toshiba Corp | 民生用素子 |
JPS59177949U (ja) * | 1983-05-17 | 1984-11-28 | 日本電気株式会社 | 半導体装置 |
JPS61139048A (ja) * | 1984-12-11 | 1986-06-26 | Toshiba Corp | 半導体装置 |
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US8546933B2 (en) | 2013-10-01 |
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US20120001309A1 (en) | 2012-01-05 |
CN102315178B (zh) | 2015-10-07 |
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