JP5307652B2 - Method of applying adhesive to support surface - Google Patents
Method of applying adhesive to support surface Download PDFInfo
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- JP5307652B2 JP5307652B2 JP2009152971A JP2009152971A JP5307652B2 JP 5307652 B2 JP5307652 B2 JP 5307652B2 JP 2009152971 A JP2009152971 A JP 2009152971A JP 2009152971 A JP2009152971 A JP 2009152971A JP 5307652 B2 JP5307652 B2 JP 5307652B2
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- 239000000853 adhesive Substances 0.000 title claims description 57
- 230000001070 adhesive effect Effects 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 75
- 239000004973 liquid crystal related substance Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 73
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003098 cholesteric effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- Liquid Crystal (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本発明は、対向する2枚の基板の対向間隙を一定に維持して2枚の基板を支持する支持体の支持面に接着剤を塗布する支持体支持面への接着剤塗布方法に関する。 The present invention relates to a method for applying an adhesive to a support supporting surface, in which an adhesive is applied to a support surface of a support that supports two substrates while maintaining a facing gap between the two opposing substrates constant.
従来、液晶を挟んで2枚の基板が対向して配置される構造の液晶パネルがある。液晶パネルは、近年、各企業や各大学等において電子ペーパーへの利用が考えられ開発が盛んに進められて一部では実現しつつある。 Conventionally, there is a liquid crystal panel having a structure in which two substrates are opposed to each other with a liquid crystal interposed therebetween. In recent years, liquid crystal panels are being realized in part due to active progress in development for electronic paper at companies and universities.
電子ペーパーは、従来、紙印刷物であった書籍や雑誌、新聞などを、電気的に表示書き換え可能な装置によって実現するものであり、薄く、軽く、そして見やすいという紙印刷物の優れた特性を備えるものである。 Electronic paper is a book, magazine, newspaper, etc. that has been printed on paper in the past by means of a device that can be electrically displayed and rewritten, and has the excellent characteristics of printed paper that is thin, light, and easy to read. It is.
電子ペーパーが紙印刷物より優れているのは、表示内容の書き換えが可能であるという点にある。このため、電子ペーパーは紙印刷物のように使い捨てられることはないので、紙印刷物の代替として普及した場合、紙資源消費の削減に大きく貢献でき、環境保護の観点からも非常に有用であると考えられる。 The electronic paper is superior to the printed paper in that the display content can be rewritten. For this reason, electronic paper is not disposable like paper prints, so when it is widely used as an alternative to paper prints, it can greatly contribute to the reduction of paper resource consumption and is considered very useful from the viewpoint of environmental protection. It is done.
このような電子ペーパーとしては、電気泳動方式やツイストボール方式、液晶表示ディスプレイや有機EL表示ディスプレイなどを利用して、研究・開発が行われている。このような液晶の一つに、コレステリック相が形成された液晶組成物(以下、コレステリック液晶という)を用いた液晶表示素子がある。 As such electronic paper, research and development are performed using an electrophoresis method, a twist ball method, a liquid crystal display, an organic EL display, or the like. One of such liquid crystals is a liquid crystal display element using a liquid crystal composition in which a cholesteric phase is formed (hereinafter referred to as cholesteric liquid crystal).
コレステリック液晶を用いた液晶表示素子は、カラー表示が可能であるだけでなく、メモリ性があるので、画面を書き換えるとき以外は、液晶に電圧を印加して駆動する必要がなく、消費電力の節減に有効である。 A liquid crystal display element using cholesteric liquid crystal not only enables color display but also has a memory property, so that it is not necessary to drive by applying voltage to the liquid crystal except when rewriting the screen, thus reducing power consumption. It is effective for.
一方、電子ペーパーとしての液晶表示素子には、柔軟性が要求される。したがって、表示面にガラス基板を用いたのでは曲げの外力が加わったりすると表示面が割れてしまうため、電子ペーパーの液晶表示面にはフィルム基板が使用される。 On the other hand, a liquid crystal display element as electronic paper is required to have flexibility. Therefore, if a glass substrate is used for the display surface, the display surface is broken when an external force is applied to the display. Therefore, a film substrate is used for the liquid crystal display surface of the electronic paper.
ところで、コレステリック液晶を用いた液晶表示素子は、表示面を押したり曲げたりする外圧が加わると記憶された表示状態が変化してしまい、一旦表示が変化すると再駆動されるまで表示が元に戻らないという問題がある。 By the way, a liquid crystal display element using cholesteric liquid crystal changes its stored display state when an external pressure is applied to push or bend the display surface, and once the display changes, the display is restored until it is driven again. There is no problem.
そこで、表示面に押圧や曲げの外圧が加わっても記憶された表示状態が変化しないように、つまりベース基板と表示面基板の対向間隔を常に一定に保つために、十字形の「壁面構造体」と称される支持体構造を2枚の基板間に備えたドットマトリクス方式の液晶表示素子が提案されている(例えば、特許文献1参照)。 Therefore, in order to prevent the stored display state from changing even when external pressure is applied to the display surface such as pressing or bending, that is, in order to keep the facing distance between the base substrate and the display surface substrate constant, A dot matrix type liquid crystal display element having a support structure called "" between two substrates has been proposed (for example, see Patent Document 1).
また、第1電極を備えた集積回路チップと第2電極を備えたベースとが一定の間隔を持って対向配置される構成の構造体において、第1電極と第2電極を、バンプ、導電性金属、第1接着剤、第2接着剤を介して導通するように接着する方法が提案されている(例えば、特許文献2参照)。 Further, in a structure having a configuration in which an integrated circuit chip having a first electrode and a base having a second electrode are arranged to face each other with a certain distance, the first electrode and the second electrode are bumps, conductive A method of bonding so as to be conducted through a metal, a first adhesive, and a second adhesive has been proposed (for example, see Patent Document 2).
ところで、特許文献1において、ベース基板上の支持体は、薄膜形成技術とフォトリソ技術等によって形成されているのでベース基板と支持体との接着性は強固である。しかし、後から支持体の上面に張り合わせられる表示面基板は、支持体の接着性に依存して接着されているだけであるから、曲げの外圧が加わると表示面基板が支持体から剥がれる虞がある。 By the way, in Patent Document 1, the support on the base substrate is formed by a thin film formation technique, a photolithography technique, or the like, and therefore, the adhesion between the base substrate and the support is strong. However, since the display surface substrate that is subsequently bonded to the upper surface of the support body is only bonded depending on the adhesiveness of the support body, the display surface substrate may be peeled off from the support body when an external pressure is applied. is there.
特許文献1の液晶表示素子は、特許文献2でいうところの第1電極を備えた集積回路チップと第2電極を備えたベースとが一定の間隔を持って対向配置される構成の構造体ではあるものの、第1電極と第2電極を導通させる構成の構造体ではないから、特許文献2のような接着方法を採用することはできない。 The liquid crystal display element of Patent Document 1 is a structure having a configuration in which an integrated circuit chip having a first electrode and a base having a second electrode, which are referred to in Patent Document 2, are opposed to each other with a certain distance. However, since it is not a structure having a configuration in which the first electrode and the second electrode are electrically connected, the bonding method as in Patent Document 2 cannot be adopted.
また、特許文献1の支持体(壁面構造体)の、四方に延びる十字形の4本の枝支持体の上面の幅は15μm程度と極めて狭いため、ベース基板に支持体(壁面構造体)を形成後、その15μm幅の枝支持体の上面に、上面の幅に合わせて接着材を塗布することは極めて困難である。 Moreover, since the width of the upper surface of the four cross-shaped branch supports extending in four directions of the support (wall structure) of Patent Document 1 is as extremely narrow as about 15 μm, the support (wall structure) is attached to the base substrate. After the formation, it is extremely difficult to apply an adhesive on the upper surface of the 15 μm wide branch support in accordance with the width of the upper surface.
この液晶表示パネルの1画素は、隣接する4個の支持体(壁面構造体)の十字形のそれぞれ2本の枝支持体で囲まれる約0.16mm角の液晶領域で構成されている。支持体の上面に塗布された接着材が、枝支持体の上面の幅15μmよりも外にはみ出ると、0.16mm角の液晶領域に進出することになり、液晶の表示機能を阻害し、高画質の液晶表示パネルを構成できなくなる。 One pixel of this liquid crystal display panel is composed of a liquid crystal region of about 0.16 mm square surrounded by two cross-shaped branch supports each of four adjacent supports (wall surface structures). If the adhesive applied to the upper surface of the support protrudes beyond the width 15 μm of the upper surface of the branch support, it will enter the 0.16 mm square liquid crystal region, impeding the liquid crystal display function, An image quality LCD panel cannot be constructed.
したがって、現状では支持体上面に接着材を塗布することが出来ず、支持体上面の接着力のみで、表示面基板と支持体上面が接着していた。そのため、表示面基板と支持体間が剥がれやすいという課題を有していた。 Therefore, at present, an adhesive cannot be applied to the upper surface of the support, and the display surface substrate and the upper surface of the support are bonded only by the adhesive force of the upper surface of the support. Therefore, there was a problem that the display surface substrate and the support were easily peeled off.
上記の課題を解決するために、本発明の支持体支持面への接着剤塗布方法は、対向して配置された2枚の基板の間の外周端部をシール部材で塞ぎ、該シール部材で塞いだ内部に液晶を封入したフィルム液晶パネルの製造方法における支持体支持面への接着剤塗布方法であって、上記2枚の基板のうち、いずれか一方の基板上に支持体の母材となる光硬化性樹脂膜を形成する工程と、該光硬化性樹脂膜の上に上記支持体の形状の切り抜きを形成した非透過性のマスクを張設する工程と、該マスクに対し、該光硬化性樹脂膜とは反対の方向から光を照射し、上記マスクの切り抜き部分に対応する部分の上記光硬化性樹脂膜のみを上記支持体の形状に硬化させる工程と、上記マスクを該光硬化性樹脂膜の上から除去する工程と、上記光硬化性樹脂膜の上記支持体の形状に硬化させた硬化部の上に接着剤を塗布する工程と、上記光硬化性樹脂膜のうち、上記マスクにより上記光が遮断され、硬化していない非硬化部を除去して、上記支持体形状の硬化部と該硬化部の上の上記接着剤のみを上記少なくとも一方の基板上に形成する工程と、上記支持体形状の硬化部の上に残留する上記接着剤の上から上記支持体形状の硬化部を介して上記2枚の基板を対向させて配置する工程と、上記接着剤を固化させる工程と、を含んで構成される。 In order to solve the above-described problem, the adhesive coating method on the support surface of the present invention is such that the outer peripheral end between two substrates arranged opposite to each other is closed with a sealing member, and the sealing member is used. A method of applying an adhesive to a support supporting surface in a manufacturing method of a film liquid crystal panel in which liquid crystal is sealed inside, wherein the base material of the support is placed on one of the two substrates. A step of forming a photocurable resin film, a step of stretching a non-transparent mask formed with a cutout in the shape of the support on the photocurable resin film, and Irradiating light from the opposite direction to the curable resin film, curing only the photocurable resin film in the portion corresponding to the cut-out portion of the mask into the shape of the support, and photocurable the mask. Removing from the top of the curable resin film, and the photocurable resin film A step of applying an adhesive onto the cured portion cured to the shape of the support, of the photo-curable resin film, the light is blocked by the mask, to remove the non-cured portion not cured Forming only the support-shaped cured portion and the adhesive on the cured portion on the at least one substrate, and the adhesive remaining on the support-shaped cured portion. To a step of arranging the two substrates so as to face each other through the support-shaped curing portion, and a step of solidifying the adhesive.
この支持体支持面への接着剤塗布方法において、例えば、上記光は紫外線であり、上記光硬化性樹脂膜は紫外線硬化性樹脂膜である、また、例えば、上記接着剤は、紫外線硬化性樹脂からなり、上記接着剤を固化させる工程は、上記2枚の基板のうち他方の基板を介して上記接着剤に紫外線を照射して上記接着剤を上記2枚の基板のうち他方の基板に接着させながら固化させる工程である。 In this method of applying an adhesive to the support surface, for example, the light is ultraviolet light, the photocurable resin film is an ultraviolet curable resin film, and the adhesive is, for example, an ultraviolet curable resin. It consists, solidifying the adhesive is bonded with the other substrate of the two substrates by irradiating ultraviolet rays to the adhesive the adhesive on the other substrate of the two substrates It is the process of solidifying while making it.
本発明の支持体支持面への接着剤塗布方法によれば、光硬化性樹脂膜を支持体の形状に硬化させた部分に接着剤を塗布した後、硬化させていない部分を支持体の形状に硬化させた部分よりも外部に広がった接着剤と共に除去するので、接着剤を支持体の形状に合わせて正しく塗布したと同様の効果を奏する。
また、支持体の形状に合わせて塗布した接着剤に2枚目の上基板を貼り付けるので、上基板を支持体の全面に強固に貼り付けることができ、これにより、上基板が支持体から剥がれる不具合が解消さるという効果を奏する。
According to the adhesive coating method to a substrate supporting surface of the present invention, after the photocurable resin film adhesive is applied to the part cured to the shape of the support, the part which is not cured of the support shape since it removed together with the adhesive spread to the outside than the portion cured to the same effects as correctly applied to fit an adhesive in the shape of the support.
In addition, since the second upper substrate is attached to the adhesive applied in accordance with the shape of the support, the upper substrate can be firmly attached to the entire surface of the support, whereby the upper substrate is removed from the support. There is an effect that the problem of peeling is eliminated.
また、支持体の形状に合わせて塗布した接着剤に2枚目の上基板を貼り付けるので、上基板を支持体の全面に強固に貼り付けることができ、これにより、上基板が支持体から剥がれる不具合が解消さるという効果を奏する。 In addition, since the second upper substrate is attached to the adhesive applied in accordance with the shape of the support, the upper substrate can be firmly attached to the entire surface of the support, whereby the upper substrate is removed from the support. There is an effect that the problem of peeling is eliminated.
以下、本発明の実施の形態について、詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
図1(a),(b),(c) は、本発明の実施例1に係るフィルム液晶パネルの製造方法における手順(その1)を示す図である。先ず、本実施例1においては、図1(a) 以下図4(b) までに示す一連の工程において、上下2枚のフィルム基板(以下、上基板又は下基板という)が用意される。 FIGS. 1A, 1B and 1C are views showing a procedure (No. 1) in the method for manufacturing a film liquid crystal panel according to Embodiment 1 of the present invention. First, in Example 1, two upper and lower film substrates (hereinafter referred to as an upper substrate or a lower substrate) are prepared in a series of steps shown in FIG. 1A and FIG. 4B.
図1(a) に示す第1の工程は、下基板1を形成する。透明フィルム2、透明電極層3、配向膜4の順序で積層させ形成させる。下基板1は図1(a)に示す通り、下から順に透明フィルム2、透明電極層3、配向膜4の順序となる。 In the first step shown in FIG. 1A, the lower substrate 1 is formed. The transparent film 2, the transparent electrode layer 3, and the alignment film 4 are laminated in this order. As shown in FIG. 1A, the lower substrate 1 is in the order of a transparent film 2, a transparent electrode layer 3, and an alignment film 4 from the bottom.
本実施例では、透明フィルム2は、縦10cm、横8cmに切断した厚さは約125μmのポリカーボネイト(PC)フィルムを用いる。また、PCフィルムに代えて、ポリエチレンテレフタレート(PET)等のフィルムを使用することもできる。これらのフィルムは十分な可撓性を備えている。 In this embodiment, the transparent film 2 is a polycarbonate (PC) film having a thickness of about 125 μm cut into a length of 10 cm and a width of 8 cm. Moreover, it can replace with PC film and can use films, such as a polyethylene terephthalate (PET). These films are sufficiently flexible.
尚、通常フィルム液晶パネルのフィルムには、透光性を有するものが用いられるが、下基板1に用いられるフィルム2には、透光性のもの又は不透光性のもの、いずれを用いてもよい。 In addition, although what has translucency is normally used for the film of a film liquid crystal panel, as the film 2 used for the lower board | substrate 1, either a translucent thing or a non-translucent thing is used. Also good.
透明電極層3は、フィルム2上にパターニングされた0.24mmピッチの320本の帯状の走査電極が並列に配置された電極層である。層の厚さは透明フィルム2の厚さの略1/10となる約130nmである。 The transparent electrode layer 3 is an electrode layer in which 320 strip-shaped scan electrodes with a 0.24 mm pitch patterned on the film 2 are arranged in parallel. The thickness of the layer is about 130 nm, which is about 1/10 of the thickness of the transparent film 2.
走査電極の形成材料としては、例えばインジューム錫酸化物(ITO)が代表的であるが、その他インジューム亜鉛酸化物(IZO)等の透明電極膜、アルミニューム又はシリコン等の金属電極、又はアモルファスシリコン等の光導電性膜等を用いることが出来る。 As a material for forming the scan electrode, for example, indium tin oxide (ITO) is representative, but other transparent electrode films such as indium zinc oxide (IZO), metal electrodes such as aluminum or silicon, or amorphous A photoconductive film such as silicon can be used.
この透明電極層3の上には、機能膜として液晶分子の配列を制御するための配向膜4がコーティングされている。配向膜4は下基板1の透明電極層3と後述する上基板の透明電極層との短絡を防止する絶縁性薄膜を兼用するようにしてもよい。 On the transparent electrode layer 3, an alignment film 4 for controlling the alignment of liquid crystal molecules is coated as a functional film. The alignment film 4 may also serve as an insulating thin film that prevents a short circuit between the transparent electrode layer 3 of the lower substrate 1 and the transparent electrode layer of the upper substrate described later.
この配向膜4には、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリビニルブチラール樹脂及びアクリル樹脂等の有機膜や、酸化シリコン、酸化アルミニューム等の無機材料を用いることができる。この配向膜4の厚さは約40nmである。 For the alignment film 4, an organic film such as polyimide resin, polyamideimide resin, polyetherimide resin, polyvinyl butyral resin, and acrylic resin, or an inorganic material such as silicon oxide or aluminum oxide can be used. The thickness of the alignment film 4 is about 40 nm.
図1(b) に示す第2の工程では、下基板1の表面、つまり配向膜4の上に支持体の母材である光硬化性樹脂膜(ネガ型フォトレジスタ(光の照射を受けた部分が硬化して残るタイプの感光性樹脂)の膜)厚さにスピンコート又はロールコート等で塗布する。 In the second step shown in FIG. 1 (b), the surface of the lower substrate 1, that is, the alignment film 4 is coated with a photocurable resin film (a negative photoresistor (received light) on the support base material. The photosensitive resin) of the type that remains partially cured is applied to the thickness by spin coating or roll coating.
続いて、図1(c) に示す第3の工程では、光硬化性樹脂膜5の上に、マスク6を積層する。マスク6は、従来のパターニング用ガラスマスクを使用し、支持体の形状の切り抜き7を有するマスク6を、光硬化性樹脂膜5の上に設置する。なお、マスク6として、紫外線を透過させない例えばTi、Ni、Cu又はAl等の金属を用いても良い。 Subsequently, in a third step shown in FIG. 1C, a mask 6 is laminated on the photocurable resin film 5. As the mask 6, a conventional glass mask for patterning is used, and the mask 6 having the cutout 7 in the shape of the support is placed on the photocurable resin film 5. For example, a metal such as Ti, Ni, Cu, or Al that does not transmit ultraviolet rays may be used as the mask 6.
図2(a),(b),(c) は、図1(a),(b),(c) に続くフィルム液晶パネルの製造方法における手順(その2)を示す図である。図2(a) に示す第4の工程では、マスク6の上から紫外線照射光源8により紫外線を照射する。これにより、マスク6の下の光硬化性樹脂膜5は、支持体の形状の切り抜き7にしたがって紫外線を照射され、放射された部分が硬化部5aを形成する。つまり、切り抜き7の部分(紫外線が照射された部分5a)のみ硬化し、それ以外の部分(紫外線が照射されなかった部分5b)は硬化しない。 FIGS. 2 (a), (b), and (c) are diagrams showing a procedure (part 2) in the method for manufacturing a film liquid crystal panel following FIGS. 1 (a), (b), and (c). In the fourth step shown in FIG. 2A, ultraviolet rays are irradiated from above the mask 6 by the ultraviolet light source 8. Thereby, the photocurable resin film 5 under the mask 6 is irradiated with ultraviolet rays according to the cutout 7 in the shape of the support, and the radiated portion forms a cured portion 5a. That is, only the portion of the cutout 7 (the portion 5a irradiated with the ultraviolet rays) is cured, and the other portion (the portion 5b not irradiated with the ultraviolet rays) is not cured.
次に、図2(b) に示す第5の工程では、マスク6を撤去(除去)する。
続いて、図2(c) に示す第6の工程では、インクジェットヘッド9を用いて、光硬化性樹脂膜5の硬化部5aに対して、接着剤11の液滴を吐出し、接着剤11を硬化部5aの上面に塗布する。
Next, in a fifth step shown in FIG. 2B, the mask 6 is removed (removed).
Subsequently, in the sixth step shown in FIG. 2 (c), a droplet of the adhesive 11 is discharged to the cured portion 5 a of the photocurable resin film 5 using the inkjet head 9, and the adhesive 11 Is applied to the upper surface of the cured portion 5a.
硬化部5aの形状は、マスク6の切り抜き7を設計する際に、形状及び位置データとして保存されているので、この形状及び位置データを用いてインクジェットヘッド9を制御する。この制御には厳密な精度は要求されない。 Since the shape of the cured portion 5a is stored as shape and position data when the cutout 7 of the mask 6 is designed, the inkjet head 9 is controlled using this shape and position data. This control does not require strict accuracy.
つまり、硬化部5aの上面へ塗布する接着剤11の塗布面積は、硬化部5a(後に支持体となる上面の幅)ほどの精度が無くてもよく、図2(c) に示すように、接着剤11が硬化部5aの上面よりも拡がって非硬化部5bの上に塗布されても十分に許容される。 That is, the application area of the adhesive 11 applied to the upper surface of the cured portion 5a may not be as accurate as the cured portion 5a (the width of the upper surface that will later become a support), as shown in FIG. Even if the adhesive 11 spreads from the upper surface of the cured portion 5a and is applied onto the non-cured portion 5b, it is sufficiently acceptable.
図3(a),(b),(c) は、図2(a),(b),(c) に続くフィルム液晶パネルの製造方法における手順(その3)を示す図である。図3(a) に示す第7の工程では、硬化部5aを下基板1上に現像する。すなわち、光硬化性樹脂膜5の非硬化部5bを、支持体形状の硬化部5aよりも外部に広がった接着剤11bと共に除去する。 FIGS. 3A, 3B, and 3C are views showing a procedure (part 3) in the method for manufacturing a film liquid crystal panel subsequent to FIGS. 2A, 2B, and 2C. In the seventh step shown in FIG. 3A, the cured portion 5a is developed on the lower substrate 1. That is, the non-cured portion 5b of the photocurable resin film 5 is removed together with the adhesive 11b spread outside than the curing portion 5a of the support shape.
この処理では、下基板1を光硬化性樹脂膜5の硬化部5aの高さまで溶剤に浸漬する。溶剤により非硬化部5bが逐次溶解して除去されることにより、非硬化部5bの上に広がっていた硬化前の接着剤11bも除去される。硬化部5aの上には接着剤11aが、支持体形状の硬化部5aの形状に沿って残留する。 In this process, the lower substrate 1 is immersed in a solvent up to the height of the cured portion 5a of the photocurable resin film 5. As the non-cured portion 5b is sequentially dissolved and removed by the solvent, the uncured adhesive 11b spreading on the non-cured portion 5b is also removed. The adhesive 11a remains on the cured portion 5a along the shape of the support-shaped cured portion 5a.
これにより、下基板1の上には、上面に接着剤11a(11)を塗布された支持体形状の硬化部5a(以下、支持体12という)が形成される。
尚、図3(a),(b),(c) には、支持体12を円柱であるかのように示しているが、これは例えば平面が十字形の支持体の場合では、四方に延びる4本の枝支持部の断面を示しているものである。この断面の幅(接着剤11が載っている部分の幅)は例えば15μm程度のものである。
Thereby, on the lower substrate 1, a support-shaped cured portion 5a (hereinafter referred to as a support 12) having an adhesive 11a (11) applied on the upper surface is formed.
In FIGS. 3A, 3B, and 3C, the support 12 is shown as if it were a cylinder. For example, when the plane is a cross-shaped support, The cross section of the four branch support parts which extend is shown. The width of this cross section (the width of the portion on which the adhesive 11 is placed) is, for example, about 15 μm.
図3(b) に示す第8の工程では、上記のように光硬化性樹脂膜5の硬化部5a(支持体12)に残留する接着剤11の上から、支持体12を介して2枚のフィルム基板の他方のフィルム基板(以下この他方のフィルム基板を、上基板13という)を下基板1に対向させて配置する。 In the eighth step shown in FIG. 3 (b), from the top of the adhesive 11 remaining on the cured portion 5a of the photocurable resin film 5 (support 12) as described above, two via a support 12 The other film substrate (hereinafter, the other film substrate is referred to as the upper substrate 13) is opposed to the lower substrate 1.
この上基板13も、透明フィルム14と、この透明フィルム14の上(図では下面)に積層された透明電極層15と、その透明電極層15の上(図では下面)に積層された配向膜16から成る。 The upper substrate 13 is also a transparent film 14, a transparent electrode layer 15 laminated on the transparent film 14 (lower surface in the figure), and an alignment film laminated on the transparent electrode layer 15 (lower surface in the figure). It consists of 16.
下基板1と同様に、上基板13の透明フィルム14は、縦10cm、横8cmに切断した厚さは約125μmのポリカーボネイト(PC)フィルムを用いる。また、PCフィルムに代えて、ポリエチレンテレフタレート(PET)等のフィルムを使用することもできる。これらのフィルムが、下基板1の場合と同様に、十分な可撓性を備えていることは言うまでも無い。 Similar to the lower substrate 1, the transparent film 14 of the upper substrate 13 is a polycarbonate (PC) film having a thickness of about 125 μm cut to a length of 10 cm and a width of 8 cm. Moreover, it can replace with PC film and can use films, such as a polyethylene terephthalate (PET). Needless to say, these films have sufficient flexibility as in the case of the lower substrate 1.
また、透明電極層15は、透明フィルム14上にパターニングされた0.24mmピッチの240本の帯状のデータ電極が並列に配置された電極層である。層の厚さは、この場合も透明フィルム2の厚さの略1/10となる約130nmである。また、データ電極の形成材料は、下基板1の透明電極層3とほぼ同様である。 The transparent electrode layer 15 is an electrode layer in which 240 strip-shaped data electrodes with a 0.24 mm pitch patterned on the transparent film 14 are arranged in parallel. In this case, the thickness of the layer is about 130 nm, which is about 1/10 of the thickness of the transparent film 2. The material for forming the data electrode is substantially the same as that of the transparent electrode layer 3 of the lower substrate 1.
図3(c) に示す第9の工程では、下基板1と上基板13の位置合わせを行ったのち、適度に押圧を加えて上基板13を接着剤11に接着させる。これで下基板1と上基板13とが正しく対向して配置される。 In the ninth step shown in FIG. 3 (c), after performing the positioning of the lower substrate 1 and the upper substrate 13, it is bonded on the substrate 13 to the adhesive 11 by the addition of moderate pressing. Thus, the lower substrate 1 and the upper substrate 13 are disposed so as to face each other correctly.
この状態で、上基板13の透明電極層15の240本の帯状のデータ電極は、下基板1の透明電極層3の320本の帯状の走査電極に直交する向きで並列に配置されている。これらデータ電極と走査電極とが交差する領域が、完成したフィルム液晶パネルの1画素を構成する。すなわち完成したフィルム液晶パネルの総画素数は240×320=76800である。 In this state, the 240 belt-like data electrodes of the transparent electrode layer 15 of the upper substrate 13 are arranged in parallel in a direction orthogonal to the 320 belt-like scanning electrodes of the transparent electrode layer 3 of the lower substrate 1. A region where the data electrode and the scan electrode intersect constitute one pixel of the completed film liquid crystal panel. That is, the total number of pixels of the completed film liquid crystal panel is 240 × 320 = 76800.
図4(a),(b) は、図3(a),(b),(c) に続くフィルム液晶パネルの製造方法における手順(その4)を示す図である。図4(a) に示す第10の工程では、上基板13の上から紫外線照射光源8により紫外線を照射する。これにより、透明な上基板13を透過した紫外線が接着剤11に照射される。 4 (a) and 4 (b) are diagrams showing a procedure (part 4) in the method for manufacturing a film liquid crystal panel subsequent to FIGS. 3 (a), (b) and (c). In the tenth step shown in FIG. 4A, ultraviolet rays are irradiated from above the upper substrate 13 by the ultraviolet irradiation light source 8. Thus, ultraviolet light passing through the transparent upper substrate 13 is irradiated to the adhesive 11.
これにより、接着剤11が硬化し、図4(b) に示す第11の工程に示すように、2枚の対向する下基板1と上基板13と相互に固定される。
この際、特には図示しないが、対向して配置された下基板1と上基板13の間の外周端部をシール部材で塞いでいる。この後、このシール部材で塞いだ内部に液晶を封入して、フィルム液晶パネルが完成する。
Thus, the adhesive 11 is cured, as shown in the eleventh step shown in FIG. 4 (b), are fixed to each other and the lower substrate 1 and the upper substrate 13 to two opposite.
At this time, although not particularly illustrated, an outer peripheral end portion between the lower substrate 1 and the upper substrate 13 arranged to face each other is closed with a seal member. Thereafter, a liquid crystal is sealed in the interior sealed with the sealing member, thereby completing a film liquid crystal panel.
上述した本発明の実施例によれば、支持体上面に接着時剤を塗布することにより、パネルと支持体上面の接着力が強化され、異物や液晶の熱膨張による剥離を防ぐことができ、フィルム液晶パネルの信頼性や歩留まりが向上する。 According to the embodiment of the present invention described above, by applying an adhesive agent on the upper surface of the support, the adhesion between the panel and the upper surface of the support is enhanced, and peeling due to thermal expansion of foreign matter and liquid crystal can be prevented. The reliability and yield of film LCD panels are improved.
また、接着剤を塗布するに際し、支持体上面の幅までの精度を必要とすることなく支持体上面に接着剤を塗布することができるので、工程管理が容易で製品の歩留まりが向上する。 Moreover, upon applying the adhesive, it is possible to apply the adhesive to the support top surface without the need for accurate to the width of the support upper surface, the process control is improved the yield of easy product.
本発明は、液晶を挟んで2枚の基板が対向して配置される構造のフィルム液晶パネルに利用することができる。 The present invention can be used for a film liquid crystal panel having a structure in which two substrates are disposed to face each other with a liquid crystal interposed therebetween.
1 下基板
2 透明フィルム
3 透明電極層
4 配向膜
5 光硬化性樹脂膜
5a 硬化部
5b 非硬化部
6 マスク
7 支持体の形状の切り抜き
8 紫外線照射光源
9 インクジェットヘッド
11 接着剤
11a 硬化部上の接着剤
11b 硬化部外の接着剤
12 支持体
13 上基板
14 透明フィルム
15 透明電極層
16 配向膜
DESCRIPTION OF SYMBOLS 1 Lower board | substrate 2 Transparent film 3 Transparent electrode layer 4 Orientation film 5 Photocurable resin film 5a Curing part 5b Uncured part 6 Mask 7 Cutout of the shape of a support body 8 Ultraviolet irradiation light source 9 Inkjet head 11 Adhesive 11a On cured part adhesive 11b curing outer adhesive 12 support 13 upper substrate 14 a transparent film 15 transparent electrode layer 16 alignment layer
Claims (3)
前記2枚の基板のうち、いずれか一方の基板上に支持体の母材となる光硬化性樹脂膜を形成する工程と、
該光硬化性樹脂膜の上に前記支持体の形状の切り抜きを形成した非透過性のマスクを張設する工程と、
該マスクに対し、該光硬化性樹脂膜とは反対の方向から光を照射し、前記マスクの切り抜き部分に対応する部分の前記光硬化性樹脂膜のみを前記支持体の形状に硬化させる工程と、
前記マスクを該光硬化性樹脂膜の上から除去する工程と、
前記光硬化性樹脂膜の前記支持体の形状に硬化させた硬化部の上に接着剤を塗布する工程と、
前記光硬化性樹脂膜のうち、前記マスクにより前記光が遮断され、硬化していない非硬化部を除去して、前記支持体形状の硬化部と該硬化部の上の前記接着剤のみを前記少なくとも一方の基板上に形成する工程と、
前記支持体形状の硬化部の上に残留する前記接着剤の上から前記支持体形状の硬化部を介して前記2枚の基板を対向させて配置する工程と、
前記接着剤を固化させる工程と、
を含むことを特徴とする支持体支持面への接着剤塗布方法。 Application of an adhesive to a support surface in a manufacturing method of a film liquid crystal panel in which a liquid crystal is sealed in an inner periphery closed between two substrates disposed opposite to each other with a sealing member A method,
A step of forming a photocurable resin film serving as a base material of a support on one of the two substrates;
Stretching a non-permeable mask formed with a cutout in the shape of the support on the photocurable resin film;
Irradiating the mask with light from a direction opposite to the photocurable resin film, and curing only the photocurable resin film in a portion corresponding to the cutout portion of the mask into the shape of the support; ,
Removing the mask from the photocurable resin film;
Applying an adhesive on the cured portion of the photocurable resin film cured to the shape of the support;
Of the photocurable resin film, the light is blocked by the mask and uncured uncured portions are removed, and only the cured portion of the support body and the adhesive on the cured portion are removed. Forming on at least one substrate;
Placing to face the two substrates through the curing portion of the support shape from the top of the adhesive remaining on the cured portion of the support shape,
Solidifying the adhesive;
A method for applying an adhesive to a support surface, comprising:
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