JP5298047B2 - 複合センサの製造方法 - Google Patents
複合センサの製造方法 Download PDFInfo
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- JP5298047B2 JP5298047B2 JP2010041246A JP2010041246A JP5298047B2 JP 5298047 B2 JP5298047 B2 JP 5298047B2 JP 2010041246 A JP2010041246 A JP 2010041246A JP 2010041246 A JP2010041246 A JP 2010041246A JP 5298047 B2 JP5298047 B2 JP 5298047B2
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- B81C2203/033—Thermal bonding
- B81C2203/035—Soldering
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- G01—MEASURING; TESTING
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- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0882—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing damping of vibrations
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- H01L2224/92—Specific sequence of method steps
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- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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Description
加速度センサを角速度センサと同じ真空雰囲気下で封止すると、加速度センサの可動体は、ダンピング効果が小さくなるため、振動し続ける現象が発生して、加速度を感度良く検出できない。したがって、加速度センサは、ダンピング効果の大きい、すなわち大気雰囲気下で封止する。
大気圧雰囲気、角速度センサを真空雰囲気で封止する構成である。
片側にSi DRIE(Deep Reactive Ion Etching)により形成する。その後、シリコン酸化層を除去することで、リリースされて、可動体11,振動体12となる。また、可
動体11,振動体12は、壁16で隔てて配置する。加速度センサの可動体11,角速度センサの振動体12は、電極15と接続されており、駆動,変位量検出は、電極15を介して行う。
DRIE(Deep Reactive Ion Etching)により形成する。その後、シリコン酸化層を除去することで、リリースされて、可動体11,振動体12となる。また、可動体11,
振動体12は、壁16で隔てて配置する。加速度センサの可動体11,角速度センサの振動体12は、電極15と接続されており、駆動,変位量検出は、電極15を介して行う。
所定の駆動感度が得られたところで、吸着材(ゲッタ)24の活性化を終了する。上記方法により、加速度センサは、希ガス(100Pa)と活性ガス(999900Pa)とで大気圧雰囲気で封止され、角速度センサは、希ガス(100Pa)と吸着剤(ゲッタ)24に吸着されずに残っている活性ガスとで真空雰囲気下で封止される。吸着剤(ゲッタ)24の活性化の程度を調整することで、ウエハ内でセンサの駆動感度ばらつきを低減することができる。
DRIE(Deep Reactive Ion Etching)により形成する。その後、シリコン酸化層を除去することで、リリースされて、可動体11,振動体12となる。また、可動体11,
振動体12は、壁16で隔てて配置する。加速度センサの可動体11,角速度センサの振動体12は、電極15と接続されており、駆動,変位量検出は、電極15を介して行う。
また、脱着材124は、高温にすることにより、特定ガスを脱離する金属材料,合金,金属化合物,半導体材料の少なくとも1種類、もしくは、組合せて用いる。
DRIE(Deep Reactive Ion Etching)により形成する。その後、シリコン酸化層を除去することで、リリースされて、可動体11,振動体12となる。また、可動体11,
振動体12は、壁16で隔てて配置する。加速度センサの可動体11,角速度センサの振動体12は、電極15と接続されており、駆動,変位量検出は、電極15を介して行う。
2 キャップウエハ
10 センサ基板
11 可動体
12 振動体
13 接合部
14,15,41,81 電極
16 壁
20 キャップ基板
21 加速度センサ用ギャップ
22 角速度センサ用ギャップ
23 接合部
24 吸着材(ゲッタ)
25 ヒータ
30 複合センサ
40 回路基板
50 配線基板
60 ワイヤ
70 樹脂
80 セラミックスパッケージ
82 蓋
124 脱着材
Claims (10)
- 振動子を用いて角速度を検出する角速度検出部と、質量体を用いて加速度を検出する加速度検出部と、活性化することにより特定ガスを吸着する複数個に分割された吸着剤とを有する複合センサの製造方法において、
(a):前記特定ガスと他のガスとをある割合で混合した雰囲気中で、前記振動子と前記吸着剤とを第一の部屋に、前記質量体を第二の部屋に気密に封止し、
(b):その後に、前記第一の部屋が所望の圧力になるように、前記複数個の中から選択した前記吸着剤を活性化することを特徴とする複合センサの製造方法。
ここで、前記特定ガスは活性ガスであり、前記他のガスは希ガスまたは不活性ガスである。
- 請求項1において、
前記吸着剤は、その近傍に設けられたヒーターへの通電による加熱又はレーザー照射により活性化することを特徴とする複合センサの製造方法。
- 請求項2において、
前記第一の部屋と前記第二の部屋は、前記振動子および前記質量体が形成された1のシリコンウエハと、他の基板とが接合又は接着されることにより、夫々複数個が形成されることを特徴とする複合センサの製造方法。
- 請求項3において、
前記他の基板はガラスまたはシリコンよりなることを特徴とする複合センサの製造方法。
- 請求項4において、
前記吸着剤を活性化した後で、
前記シリコンウエハと他の基板とを切断することにより、一組の前記第一の部屋と前記第二の部屋とを有する複合センサを複数個形成することを特徴とする複合センサの製造方法。
- 振動子を用いて角速度を検出する角速度検出部と、質量体を用いて加速度を検出する加速度検出部と、活性化することにより特定ガスを脱着する複数個に分割された脱着剤とを有する複合センサの製造方法において、
(a):他のガスの雰囲気中で、前記振動子を第一の部屋に、前記質量体と予め前記特定ガスを吸着した脱着剤とを第二の部屋に気密に封止し、
(b):その後に、前記第二の部屋が所望の圧力になるように、前記前記複数個の中から選択した前記脱着剤を活性化することを特徴とする複合センサの製造方法。
ここで、前記特定ガスは活性ガスであり、前記他のガスは、希ガスまたは不活性ガスである。
- 請求項6において、
前記脱着剤は、その近傍に設けられたヒーターへの通電による加熱又はレーザー照射により活性化することを特徴とする複合センサの製造方法。
- 請求項7において、
前記第一の部屋と前記第二の部屋は、前記振動子および前記質量体とが形成された1のシリコンウエハと、他の基板とが接合又は接着されることにより、夫々複数個が形成されることを特徴とする複合センサの製造方法。
- 請求項8において、
前記他の基板はガラスまたはシリコンよりなることを特徴とする複合センサの製造方法。
- 請求項9において、
前記脱着剤を活性化した後で、
前記シリコンウエハと他の基板とを切断することにより、一組の前記第一の部屋と前記第二の部屋とを有する複合センサを複数個形成することを特徴とする複合センサの製造方法。
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JP2010041246A JP5298047B2 (ja) | 2010-02-26 | 2010-02-26 | 複合センサの製造方法 |
EP11154558.8A EP2362182B1 (en) | 2010-02-26 | 2011-02-15 | Manufacturing method of combined sensor |
US13/028,592 US8438718B2 (en) | 2010-02-26 | 2011-02-16 | Manufacturing method of combined sensor |
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JP2010041246A JP5298047B2 (ja) | 2010-02-26 | 2010-02-26 | 複合センサの製造方法 |
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JP2011179821A JP2011179821A (ja) | 2011-09-15 |
JP5298047B2 true JP5298047B2 (ja) | 2013-09-25 |
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DE102012202183B4 (de) * | 2012-02-14 | 2020-03-19 | Robert Bosch Gmbh | Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur |
DE102012209973B4 (de) | 2012-06-14 | 2024-03-07 | Robert Bosch Gmbh | Mikromechanische Vorrichtung und Verfahren zur Herstellung einer mikromechanischen Vorrichtung |
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EP2362182B1 (en) | 2018-06-13 |
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EP2362182A3 (en) | 2016-01-13 |
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