JP5296446B2 - Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling - Google Patents
Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling Download PDFInfo
- Publication number
- JP5296446B2 JP5296446B2 JP2008198057A JP2008198057A JP5296446B2 JP 5296446 B2 JP5296446 B2 JP 5296446B2 JP 2008198057 A JP2008198057 A JP 2008198057A JP 2008198057 A JP2008198057 A JP 2008198057A JP 5296446 B2 JP5296446 B2 JP 5296446B2
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- pressure
- electro
- adhesive composition
- peelable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 61
- 239000000853 adhesive Substances 0.000 title claims abstract description 58
- 239000000203 mixture Substances 0.000 title claims abstract description 46
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 58
- 238000000034 method Methods 0.000 title claims description 16
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 21
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 20
- 239000003792 electrolyte Substances 0.000 claims abstract description 16
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims abstract description 13
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 12
- 239000000243 solution Substances 0.000 claims abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 26
- 239000000178 monomer Substances 0.000 claims description 23
- 239000003960 organic solvent Substances 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 14
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 10
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910013528 LiN(SO2 CF3)2 Inorganic materials 0.000 claims description 5
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 5
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical group O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229910013375 LiC Inorganic materials 0.000 claims description 3
- 229910013385 LiN(SO2C2F5)2 Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000005486 organic electrolyte Substances 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- -1 alkali metal salt Chemical class 0.000 abstract description 45
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000011156 evaluation Methods 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000002608 ionic liquid Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- XFJPESDYWYMVJQ-UHFFFAOYSA-N (3,3,5-trimethylcyclohexanecarbonyl) 3,3,5-trimethylcyclohexane-1-carboperoxoate Chemical compound C1C(C)(C)CC(C)CC1C(=O)OOC(=O)C1CC(C)(C)CC(C)C1 XFJPESDYWYMVJQ-UHFFFAOYSA-N 0.000 description 1
- OTMBZPVYOQYPBE-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclododecane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCCCCCCCC1 OTMBZPVYOQYPBE-UHFFFAOYSA-N 0.000 description 1
- ZZXUZKXVROWEIF-UHFFFAOYSA-N 1,2-butylene carbonate Chemical compound CCC1COC(=O)O1 ZZXUZKXVROWEIF-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- VUAXHMVRKOTJKP-UHFFFAOYSA-M 2,2-dimethylbutanoate Chemical compound CCC(C)(C)C([O-])=O VUAXHMVRKOTJKP-UHFFFAOYSA-M 0.000 description 1
- CCTFAOUOYLVUFG-UHFFFAOYSA-N 2-(1-amino-1-imino-2-methylpropan-2-yl)azo-2-methylpropanimidamide Chemical compound NC(=N)C(C)(C)N=NC(C)(C)C(N)=N CCTFAOUOYLVUFG-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- XMJBDTDLTXVBRA-UHFFFAOYSA-N 2-[(1-amino-1-benzylimino-2-methylpropan-2-yl)diazenyl]-n'-benzyl-2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=1C=CC=CC=1CNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCC1=CC=CC=C1 XMJBDTDLTXVBRA-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910015015 LiAsF 6 Inorganic materials 0.000 description 1
- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- 229910013684 LiClO 4 Inorganic materials 0.000 description 1
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- URLYGBGJPQYXBN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound OCC1CCC(COC(=O)C=C)CC1 URLYGBGJPQYXBN-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WPKWPKDNOPEODE-UHFFFAOYSA-N bis(2,4,4-trimethylpentan-2-yl)diazene Chemical compound CC(C)(C)CC(C)(C)N=NC(C)(C)CC(C)(C)C WPKWPKDNOPEODE-UHFFFAOYSA-N 0.000 description 1
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000005678 chain carbonates Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000005676 cyclic carbonates Chemical class 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910003473 lithium bis(trifluoromethanesulfonyl)imide Inorganic materials 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- QSZMZKBZAYQGRS-UHFFFAOYSA-N lithium;bis(trifluoromethylsulfonyl)azanide Chemical compound [Li+].FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F QSZMZKBZAYQGRS-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- CHJKOAVUGHSNBP-UHFFFAOYSA-N octyl 2,2-dimethylpropanoate Chemical compound CCCCCCCCOC(=O)C(C)(C)C CHJKOAVUGHSNBP-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007717 redox polymerization reaction Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940079827 sodium hydrogen sulfite Drugs 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000014616 translation Effects 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法に関する。更に詳しくは、本発明は、電圧を印加するだけで粘着力が低下し、その結果、被着体から容易に剥離可能な電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法に関する。 The present invention relates to an electric peelable pressure-sensitive adhesive composition, an electric peelable pressure-sensitive adhesive product, and a peeling method thereof. More specifically, the present invention relates to an electro-releasable pressure-sensitive adhesive composition, an electro-releasable pressure-sensitive adhesive product that can be easily peeled from an adherend, and a method for peeling the same. .
再剥離性の粘着テープが種々の用途（例えば、表面保護フィルム、塗装用マスキングテープ、再剥離可能なメモ等）で使用されている。この粘着テープは、一般的に基材と、その上に積層された粘着剤層とからなる。粘着剤層には、粘着性と共に再剥離性が求められる。即ち、被着体の運搬時、貯蔵時、加工時等には、被着体から剥離しない程度の粘着性と、機能を果たした後には、容易に取り除きうる再剥離性が求められている。
上記粘着性と再剥離性との相反する性質を実現する方法として、例えば特表２００３−５０４５０４号公報（特許文献１）、ＷＯ２００７／０１８２３９号公報（特許文献２）等に記載された方法が提案されている。
Removable adhesive tapes are used in various applications (for example, surface protective films, coating masking tapes, removable notes, etc.). This pressure-sensitive adhesive tape generally comprises a base material and a pressure-sensitive adhesive layer laminated thereon. The adhesive layer is required to have removability as well as adhesiveness. That is, when transporting, storing, and processing the adherend, there is a demand for adhesiveness that does not peel from the adherend and removability that can be easily removed after performing the function.
As a method for realizing the contradictory properties of the adhesive property and the removability, for example, methods described in Japanese Patent Publication No. 2003-504504 (Patent Document 1), WO 2007/018239 (Patent Document 2), etc. are proposed. Has been.
特表２００３−５０４５０４号公報では、電圧印加時に剥離性を有するエポキシ系化合物を含むエポキシ系接着剤が提案されている。実施例に例示されているエポキシ系化合物は、分子中にジスルフィド結合を有する特殊な化合物である。このエポキシ系接着剤を使用することで、電圧印加時に剥離可能な接着剤が提供できると記載されている。
一方、ＷＯ２００７／０１８２３９号公報では、接着剤として、イオン性液体を使用することで、電圧印加時に剥離可能な接着剤が提供できると記載されている。この公報では、イオン性液体とは、室温で液体である溶融塩であり、蒸気圧がなく、高耐熱性、不燃性、高化学安定性等の性質を有するとされている。
In Japanese translations of PCT publication No. 2003-504504, an epoxy-based adhesive containing an epoxy-based compound having peelability when a voltage is applied is proposed. The epoxy compounds exemplified in the examples are special compounds having a disulfide bond in the molecule. It is described that an adhesive that can be peeled off when a voltage is applied can be provided by using this epoxy adhesive.
On the other hand, WO2007 / 018239 describes that an adhesive that can be peeled off when a voltage is applied can be provided by using an ionic liquid as an adhesive. In this publication, an ionic liquid is a molten salt that is liquid at room temperature, has no vapor pressure, and has properties such as high heat resistance, nonflammability, and high chemical stability.
しかしながら、このエポキシ系接着剤による接合は、６０℃及び５０Ｖの条件下で、３０分間維持することで剥離するとされており、剥離に加温や長時間の電圧の印加が必要であった。
また、エポキシ系化合物及びイオン性液体は、これらの公報に記載されているように、特殊な構造を有する化合物であるため価格が高く、それらを用いて安価な粘着テープを提供することは困難であった。
そのため、安価な材料を使用して、短時間で加温せずとも剥離可能であり、エポキシ系化合物及びイオン性液体を使用した場合と同等以上の物性を示しうる粘着テープを製造できる電気剥離性粘着剤組成物の提供が望まれていた。
However, this bonding with an epoxy adhesive is supposed to be peeled off by maintaining it for 30 minutes under the conditions of 60 ° C. and 50 V, and heating and application of a voltage for a long time are necessary for peeling.
In addition, as described in these publications, epoxy compounds and ionic liquids are expensive because they are compounds having a special structure, and it is difficult to provide an inexpensive adhesive tape using them. there were.
Therefore, it is possible to produce an adhesive tape that can be peeled off without heating in a short time using an inexpensive material, and can produce an adhesive tape that can exhibit physical properties equivalent to or better than those using an epoxy compound and an ionic liquid. It has been desired to provide an adhesive composition.
かくして本発明によれば、アクリル系ポリマーと、電解液とを含む電気剥離性粘着剤組成物であり、前記電気剥離性粘着剤組成物が、１０-11〜１０-3Ｓ／ｃｍのイオン導電率を有し、前記電解液が、前記アクリル系ポリマー１００重量部に対して、１５〜２５０重量部の割合で使用され、前記電解液が、０．０１〜３ｍｏｌ／ｌの濃度で電解質としての第四級アンモニウム塩又はアルカリ金属塩を含む有機溶液であり、
前記第四級アンモニウム塩が、式（Ｒ） 4 ＮＢＦ 4 （式中Ｒは、同一又は異なって、メチル基又はエチル基）であるホウ素含有有機電解質塩であり、
前記アルカリ金属塩が、ＬｉＮ（ＳＯ 2 ＣＦ 3 ） 2 、ＬｉＮ（ＳＯ 2 Ｃ 2 Ｆ 5 ） 2 及びＬｉＣ（ＳＯ 2 ＣＦ 3 ） 3 から選択されることを特徴とする電気剥離性粘着剤組成物が提供される。
Thus, according to the present invention, an electro-peelable pressure-sensitive adhesive composition comprising an acrylic polymer and an electrolyte solution, wherein the electro-peelable pressure-sensitive adhesive composition has an ionic conductivity of 10 −11 to 10 −3 S / cm. The electrolyte is used at a rate of 15 to 250 parts by weight with respect to 100 parts by weight of the acrylic polymer, and the electrolyte is used as an electrolyte at a concentration of 0.01 to 3 mol / l. Ri organic solution der containing quaternary ammonium salts or alkali metal salts,
The quaternary ammonium salt is a boron-containing organic electrolyte salt of the formula (R) 4 NBF 4 (wherein R is the same or different and is a methyl group or an ethyl group);
Wherein the
また、本発明によれば、導電性支持体と、その上に形成された電気剥離性粘着剤層とを有し、前記電気剥離性粘着剤層が、上記電気剥離性粘着剤組成物を含むことを特徴とする電気剥離性粘着製品が提供される。
更に、本発明によれば、上記電気剥離性粘着製品を、被着体上に、前記電気剥離性粘着剤層が面するように貼り付けた後、前記電気剥離性粘着剤層に電圧を印加することで、前記電気剥離性粘着製品を前記被着体から剥離することを特徴とする電気剥離性粘着製品の剥離方法が提供される。
Moreover, according to this invention, it has an electroconductive support body and the electrically peelable adhesive layer formed on it, and the said electrically peelable adhesive layer contains the said electrically peelable adhesive composition. An electrically peelable adhesive product is provided.
Furthermore, according to the present invention, after the above-described electro-releasable pressure-sensitive adhesive product is attached to an adherend so that the electro-releasable pressure-sensitive adhesive layer faces, a voltage is applied to the electro-peelable pressure-sensitive adhesive layer. Thus, there is provided a method for peeling the electro-peelable adhesive product, wherein the electro-peelable adhesive product is peeled from the adherend.
本発明によれば、電圧の印加により、短時間で加温せずとも剥離可能な粘着剤層を形成しうる電気剥離性粘着剤組成物を安価に提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the electric peelable adhesive composition which can form the adhesive layer which can be peeled without applying a voltage for a short time by the application of a voltage can be provided at low cost.
本発明の電気剥離性粘着剤組成物（以下、単に粘着剤組成物という）は、アクリル系ポリマーと電解液とを含んでいる。 The electropeelable pressure-sensitive adhesive composition of the present invention (hereinafter simply referred to as a pressure-sensitive adhesive composition) contains an acrylic polymer and an electrolytic solution.
（アクリル系ポリマー）
アクリル系ポリマーは、アクリル系モノマーを、任意に重合開始剤の存在下で重合させることで得ることができる。アクリル系ポリマーは、少なくとも被着体に粘着できさえすれば、どのようなポリマーも使用できる。通常、粘着性の観点から、アクリル系ポリマーとしては、１万〜５００万の範囲の重量平均分子量を有するポリマーが使用される。
重量平均分子量は、Ｓｈｏｄｅｘ社製ＧＰＣ Ｓｙｓｔｅｍ２１を用い、移動相をテトラヒドロフランとして算出した値を意味する。この値は、ポリスチレン換算の重量平均分子量である。
(Acrylic polymer)
The acrylic polymer can be obtained by polymerizing an acrylic monomer optionally in the presence of a polymerization initiator. As the acrylic polymer, any polymer can be used as long as it can at least adhere to the adherend. Usually, from the viewpoint of tackiness, a polymer having a weight average molecular weight in the range of 10,000 to 5,000,000 is used as the acrylic polymer.
The weight average molecular weight means a value calculated using a GPC System 21 manufactured by Shodex and assuming the mobile phase as tetrahydrofuran. This value is a weight average molecular weight in terms of polystyrene.
（１）アクリル系モノマー
アクリル系モノマーには、炭素数１〜１０のアルキル基を有するアルキル（メタ）アクリレートが主成分（５０重量％以上）として含まれていることが好ましい。なお、（メタ）アクリレートは、メタクリレート又はアクリレートを意味する。
(1) Acrylic monomer The acrylic monomer preferably contains an alkyl (meth) acrylate having an alkyl group having 1 to 10 carbon atoms as a main component (50% by weight or more). In addition, (meth) acrylate means a methacrylate or an acrylate.
炭素数１〜１４のアルキル基を有するアルキル（メタ）アクリレートとしては、例えば、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−プロピル（メタ）アクリレート、イソプロピル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｓｅｃ−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、ｎ−オクチル（メタ）アクリレート、イソオクチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、イソノニル（メタ）アクリレート、ドデシル（メタ）アクリレートなどが挙げられる。これらアルキル（メタ）アクリレートは、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。これらアルキル（メタ）アクリレートの内、炭素数１〜８のアルキル基を有するアルキル（メタ）アクリレートが好ましく、炭素数１〜４のアルキル基を有するアルキル（メタ）アクリレートがより好ましく、ｎ−ブチル（メタ）アクリレートが更に好ましく、ｎ−ブチルアクリレートが特に好ましい。 Examples of the alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl ( (Meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, dodecyl ( And (meth) acrylate. These alkyl (meth) acrylates may be used alone or in combination of two or more. Among these alkyl (meth) acrylates, alkyl (meth) acrylates having an alkyl group having 1 to 8 carbon atoms are preferred, alkyl (meth) acrylates having an alkyl group having 1 to 4 carbon atoms are more preferred, and n-butyl ( (Meth) acrylate is more preferred, and n-butyl acrylate is particularly preferred.
他のアクリル系モノマーとしては、アクリル酸、メタクリル酸、カルボキシエチルアクリレート等のカルボキシル基含有モノマー、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、６−ヒドロキシヘキシル（メタ）アクリレート、（４−ヒドロキシメチルシクロヘキシル）−メチルアクリレート等のヒドロキシル基含有モノマーが挙げられる。これら他の（メタ）アクリレートは、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。（メタ）アクリレートには、カルボキシル基含有モノマー及びヒドロキシル基含有モノマーが両方含まれていることが好ましい。 Other acrylic monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate And hydroxyl group-containing monomers such as 6-hydroxyhexyl (meth) acrylate and (4-hydroxymethylcyclohexyl) -methyl acrylate. These other (meth) acrylates may be used alone or in combination of two or more. The (meth) acrylate preferably contains both a carboxyl group-containing monomer and a hydroxyl group-containing monomer.
アクリル系モノマーには、炭素数１〜１０のアルキル基を有するアルキル（メタ）アクリレートが主成分として含有されている。従って、アクリル系モノマーは、他のアクリル系モノマーを使用せず、アルキル（メタ）アクリレートのみからなっていてもよい。また、所望の性能の粘着剤組成物を容易に入手する観点から、他のアクリル系モノマーが５０重量％未満及び１重量％以上含まれていることが好ましく、５〜３０重量％含まれていることがより好ましく、５〜１５重量％含まれていることが更に好ましい。 The acrylic monomer contains an alkyl (meth) acrylate having an alkyl group having 1 to 10 carbon atoms as a main component. Therefore, the acrylic monomer may be composed only of alkyl (meth) acrylate without using any other acrylic monomer. Further, from the viewpoint of easily obtaining a pressure-sensitive adhesive composition having desired performance, other acrylic monomers are preferably contained in an amount of less than 50% by weight and 1% by weight or more, and contained in an amount of 5 to 30% by weight. More preferably, it is more preferably 5 to 15% by weight.
また、カルボキシル基含有モノマー及びヒドロキシル基含有モノマーが両方含まれている場合、両者の含有量は、全モノマー量を１００重量部とした場合、１〜２０重量部の範囲であることが好ましい。この範囲で両モノマーを使用することで、粘着特性を改善できる。更に、１〜１０重量部の範囲であることがより好ましい。 Moreover, when both the carboxyl group-containing monomer and the hydroxyl group-containing monomer are included, the content of both is preferably in the range of 1 to 20 parts by weight when the total monomer amount is 100 parts by weight. Adhesive properties can be improved by using both monomers within this range. Furthermore, the range of 1 to 10 parts by weight is more preferable.
更に、（メタ）アクリレートには、必要に応じて、ビニル系モノマーを添加してもよい。ビニル系モノマーとしては、例えば、イタコン酸、マレイン酸、クロトン酸；無水マレイン酸、無水イタコン酸、酢酸ビニル、Ｎ−ビニルピロリドン、Ｎ−ビニルカルボン酸アミド類、スチレン、Ｎ−ビニルカプロラクタム等が挙げられる。これらビニル系モノマーは、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。 Furthermore, you may add a vinyl-type monomer to (meth) acrylate as needed. Examples of vinyl monomers include itaconic acid, maleic acid, crotonic acid; maleic anhydride, itaconic anhydride, vinyl acetate, N-vinylpyrrolidone, N-vinylcarboxylic amides, styrene, N-vinylcaprolactam, and the like. It is done. These vinyl monomers may be used alone or in combination of two or more.
（２）重合開始剤
任意に使用される重合開始剤としては、例えば、２，２’−アゾビスイソブチロニトリル、２，２’−アゾビス（２−メチルプロピオンアミジン）二硫化物、２，２’−アゾビス（４−メトキシ−２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２−メチルブチロニトリル）、１，１’−アゾビス（シクロヘキサン−１−カルボニトリル）、２，２’−アゾビス（２，４，４−トリメチルペンタン）、ジメチル−２，２’−アゾビス（２−メチルプロピオネート）、２，２’−アゾビス［２−メチル−Ｎ−（フェニルメチル）−プロピオンアミジン］ジハイドロクロライド、２，２’−アゾビス［２−（３，４，５，６−テトラハイドロピリミジン−２−イル）プロパン］ジハイドロクロライド、２，２’−アゾビス［２−（２−イミダゾリン−２−イル）プロパン］等のアゾ系重合開始剤；過硫酸カリウム、過硫酸アンモニウム等の過硫酸塩系重合開始剤；ベンゾイルパーオキサイド、過酸化水素、ｔ−ブチルハイドロパーオキサイド、ジ−ｔ−ブチルパーオキサイド、ｔ−ブチルパーオキシベンゾエート、ジクミルパーオキサイド、１，１−ビス（ｔ−ブチルパーオキシ）−３，３，５−トリメチルシクロヘキサン、１，１−ビス（ｔ−ブチルパーオキシ）シクロドデカン、３，３，５−トリメチルシクロヘキサノイルパーオキサイド、ｔ−ブチルペルオキシピバレイト等の過酸化物系重合開始剤；過硫酸塩と亜硫酸水素ナトリウムとにより構成されたレドックス系重合開始剤等が挙げられる。これら重合開始剤は、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。
(2) Polymerization initiator As an optional polymerization initiator, for example, 2,2′-azobisisobutyronitrile, 2,2′-azobis (2-methylpropionamidine) disulfide, 2, 2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (2-methylbutyronitrile), 1 , 1′-azobis (cyclohexane-1-carbonitrile), 2,2′-azobis (2,4,4-trimethylpentane), dimethyl-2,2′-azobis (2-methylpropionate), 2, 2'-azobis [2-methyl-N- (phenylmethyl) -propionamidine] dihydrochloride, 2,2'-azobis [2- (3,4,5,6-tetrahydropyrimidin-2-yl) pro Azo-based polymerization initiators such as dihydrochloride and 2,2′-azobis [2- (2-imidazolin-2-yl) propane]; persulfate-based polymerization initiators such as potassium persulfate and ammonium persulfate; Benzoyl peroxide, hydrogen peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide, 1,1-bis (t-butylperoxy) -3, Start of peroxide polymerization such as 3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclododecane, 3,3,5-trimethylcyclohexanoyl peroxide, t-butylperoxypivalate Agents: Redox polymerization initiators composed of persulfate and sodium hydrogen sulfite. These polymerization initiators may be used alone or in combination of two or more.
重合開始剤は、アクリル系モノマー１００重量部に対して０．００５〜１重量部の範囲で使用することが好ましい。この範囲で重合開始剤を使用することで、粘着特性が改善されたアクリル系ポリマーを形成できる。更に、重合開始剤の使用量は、０．１〜０．５重量部の範囲であることがより好ましい。 The polymerization initiator is preferably used in the range of 0.005 to 1 part by weight with respect to 100 parts by weight of the acrylic monomer. By using a polymerization initiator in this range, an acrylic polymer with improved adhesive properties can be formed. Furthermore, the amount of the polymerization initiator used is more preferably in the range of 0.1 to 0.5 parts by weight.
（３）他の成分
他の成分としては、基体上への粘着剤組成物の使用容易性の観点から、有機溶剤が含まれていてもよい。この有機溶剤としては、特に限定されず、粘着剤組成物に使用可能な公知の有機溶剤が挙げられる。例えば、ヘキサン、ヘプタン等の脂肪族炭化水素、酢酸メチル、酢酸エチル、酢酸プロピル等のエステル類、トルエン、キシレン、エチルベンゼン等の芳香族系炭化水素が挙げられる。これら有機溶剤は、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。
なお、有機溶剤を使用する場合、アクリル系ポリマーからなる固形分含量が１０重量％以上となるように、その使用割合を調整することが好ましい。また、使用割合は、固形分含量が２０〜５０重量％となるように調製されていることが好ましい。
(3) Other component As another component, the organic solvent may be contained from a viewpoint of the ease of use of the adhesive composition on a base | substrate. The organic solvent is not particularly limited, and examples thereof include known organic solvents that can be used for the pressure-sensitive adhesive composition. Examples thereof include aliphatic hydrocarbons such as hexane and heptane, esters such as methyl acetate, ethyl acetate, and propyl acetate, and aromatic hydrocarbons such as toluene, xylene, and ethylbenzene. These organic solvents may be used alone or in combination of two or more.
In addition, when using an organic solvent, it is preferable to adjust the use ratio so that the solid content content which consists of an acryl-type polymer may be 10 weight% or more. Moreover, it is preferable that the usage rate is prepared so that the solid content is 20 to 50% by weight.
（４）粘度
粘着剤組成物は、固形分含量が４０重量％のとき、１０００ｍＰａ・ｓ以上の粘度を有していることが好ましい。この粘度を有することで、電圧の非印加時の粘着性を確保できる。より好ましい粘度は、２０００〜１００００ｍＰａ・ｓである。
粘度は、粘着剤組成物を２５℃になるように調温し、その後、トキメック社製ＢＨ型粘度計を用い、回転数が１０ｒｐｍの条件により測定した値である。
(4) Viscosity The pressure-sensitive adhesive composition preferably has a viscosity of 1000 mPa · s or more when the solid content is 40% by weight. By having this viscosity, it is possible to ensure adhesiveness when no voltage is applied. A more preferable viscosity is 2000 to 10000 mPa · s.
The viscosity is a value measured by adjusting the temperature of the pressure-sensitive adhesive composition to 25 ° C., and then using a BH viscometer manufactured by Tokimec Co., Ltd. under a rotation speed of 10 rpm.
（電解液）
電解液は、１０-6〜１０-2Ｓ／ｃｍのイオン導電率を有する。この範囲のイオン導電率を有することで、粘着剤組成物に電圧の印加による十分な剥離性を付与できる。より好ましいイオン導電率は、１０-3〜１０-2Ｓ／ｃｍである。イオン導電率の測定法は、実施例の欄に記載する。
電解液は、電解質としての第四級アンモニウム塩又はアルカリ金属塩と、有機溶剤とを含む有機溶液からなる。
(Electrolyte)
The electrolytic solution has an ionic conductivity of 10 −6 to 10 −2 S / cm. By having an ionic conductivity in this range, it is possible to impart sufficient peelability to the pressure-sensitive adhesive composition by applying a voltage. More preferable ionic conductivity is 10 −3 to 10 −2 S / cm. The measuring method of ionic conductivity is described in the column of an Example.
The electrolytic solution is composed of an organic solution containing a quaternary ammonium salt or alkali metal salt as an electrolyte and an organic solvent.
（１）電解質
（ａ）第四級アンモニウム塩
第四級アンモニウム塩としては、（Ｒ）4ＮＸ（式中Ｒは、同一又は異なって、炭素数１〜４のアルキル基、Ｘはハロゲン原子、ＣｌＯ4、ＢＦ4又はＰＦ6）、［（Ｒ）4Ｎ］2Ｙ（式中Ｒは、上記と同一、ＹはＳＯ4）等が挙げられる。
Ｘがハロゲン原子の場合、例えば、テトラブチル、テトラプロピル、テトラエチル、テトラメチル、トリエチルブチル、トリエチルプロピル、トリエチルメチル等のアンモニウムブロミド又はアンモニウムクロリドが挙げられる。
(1) Electrolyte (a) Quaternary ammonium salt As the quaternary ammonium salt, (R) 4 NX (wherein R is the same or different, an alkyl group having 1 to 4 carbon atoms, X is a halogen atom, ClO 4 , BF 4 or PF 6 ), [(R) 4 N] 2 Y (wherein R is the same as above, and Y is SO 4 ).
When X is a halogen atom, for example, ammonium bromide or ammonium chloride such as tetrabutyl, tetrapropyl, tetraethyl, tetramethyl, triethylbutyl, triethylpropyl, triethylmethyl and the like can be mentioned.
ＸがＢＦ4の場合、例えば、テトラブチル、テトラプロピル、テトラエチル、テトラメチル、トリエチルブチル、トリエチルプロピル、トリエチルメチル等のアンモニウムテトラフルオロボレートが挙げられる。
ＸがＰＦ6の場合、例えば、テトラブチル、テトラプロピル、テトラエチル、テトラメチル、トリエチルブチル、トリエチルプロピル、トリエチルメチル等のアンモニウムヘキサフルオロフォスフェートが挙げられる。
When X is BF 4 , for example, ammonium tetrafluoroborate such as tetrabutyl, tetrapropyl, tetraethyl, tetramethyl, triethylbutyl, triethylpropyl, triethylmethyl and the like can be mentioned.
When X is PF 6 , for example, ammonium hexafluorophosphate such as tetrabutyl, tetrapropyl, tetraethyl, tetramethyl, triethylbutyl, triethylpropyl, triethylmethyl and the like can be mentioned.
ＸがＣｌＯ4の場合、例えば、テトラブチル、テトラプロピル、テトラエチル、テトラメチル、トリエチルブチル、トリエチルプロピル、トリエチルメチル等のアンモニウムパークロレートが挙げられる。
ＹがＳＯ4の場合、例えば、テトラブチル、テトラプロピル、テトラエチル、テトラメチル、トリエチルブチル、トリエチルプロピル、トリエチルメチル等のアンモニウムサルフェートが挙げられる。
When X is ClO 4 , for example, ammonium perchlorate such as tetrabutyl, tetrapropyl, tetraethyl, tetramethyl, triethylbutyl, triethylpropyl, triethylmethyl and the like can be mentioned.
When Y is SO 4 , for example, ammonium sulfate such as tetrabutyl, tetrapropyl, tetraethyl, tetramethyl, triethylbutyl, triethylpropyl, triethylmethyl and the like can be mentioned.
上記第四級アンモニウム塩は、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。また、以下で説明するアルカリ金属塩と組み合わせて使用してもよい。
上記第四級アンモニウム塩の内、ホウ素含有有機電解質塩である（Ｒ）4ＮＢＦ4が好ましい。このアンモニウム塩を使用すれば、粘着剤組成物の電気剥離特性をより向上できる。特に、Ｒが、同一又は異なって、メチル基又はエチル基である第四級アンモニウム塩は、粘着剤組成物の電気剥離特性をより向上できるので好ましい。
The quaternary ammonium salt may be used alone or in combination of two or more. Moreover, you may use it in combination with the alkali metal salt demonstrated below.
Of the quaternary ammonium salts, (R) 4 NBF 4 which is a boron-containing organic electrolyte salt is preferred. If this ammonium salt is used, the electric peeling property of the pressure-sensitive adhesive composition can be further improved. In particular, a quaternary ammonium salt in which R is the same or different and is a methyl group or an ethyl group is preferable because the electric peeling property of the pressure-sensitive adhesive composition can be further improved.
（ｂ）アルカリ金属塩
アルカリ金属塩としては、ＬｉＣｌ、Ｌｉ2ＳＯ4、ＬｉＢＦ4、ＬｉＰＦ6、ＬｉＣｌＯ4、ＬｉＡｓＦ6、ＬｉＣＦ3ＳＯ3、ＬｉＮ（ＳＯ2ＣＦ3）2、ＬｉＮ（ＳＯ2Ｃ2Ｆ5）2、ＬｉＣ（ＳＯ2ＣＦ3）3等が挙げられる。なお、これら例示は、リチウム塩であるが、ナトリウム塩やカリウム塩であってもよい。これらアルカリ金属塩は、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。
上記アルカリ金属塩の内、ＬｉＮ（ＳＯ2ＣＦ3）2が好ましい。これら好ましいアルカリ金属塩を使用すると、電気剥離特性をより向上できる。
(B) Alkali metal salt Examples of the alkali metal salt include LiCl, Li 2 SO 4 , LiBF 4 , LiPF 6 , LiClO 4 , LiAsF 6 , LiCF 3 SO 3 , LiN (SO 2 CF 3 ) 2 , LiN (SO 2 C 2 F 5 ) 2 , LiC (SO 2 CF 3 ) 3 and the like. In addition, although these illustrations are lithium salts, a sodium salt and potassium salt may be sufficient. These alkali metal salts may be used alone or in combination of two or more.
Of the alkali metal salts, LiN (SO 2 CF 3 ) 2 is preferable. When these preferable alkali metal salts are used, the electric peeling property can be further improved.
（ｃ）使用量
電解液は、０．０１〜３ｍｏｌ／ｌの濃度で電解質を含んでいる。この濃度の範囲で電解質を含むことで、電圧の印加時の剥離性の確保と、電圧の非印加時の粘着性の確保を高い次元で両立実現できる。より好ましい濃度は０．１〜２．０ｍｏｌ／ｌであり、更に好ましい濃度は０．５〜２．０ｍｏｌ／ｌである。
(C) Amount used The electrolytic solution contains an electrolyte at a concentration of 0.01 to 3 mol / l. By including the electrolyte in this concentration range, it is possible to achieve both high levels of securing peelability when applying a voltage and ensuring adhesiveness when no voltage is applied. A more preferable concentration is 0.1 to 2.0 mol / l, and a further preferable concentration is 0.5 to 2.0 mol / l.
（２）有機溶媒
有機溶媒としては、粘着剤組成物の電圧の印加時の剥離性と、電圧の非印加時の粘着性を阻害しない有機溶媒であれば特に限定されない。例えば、エチレンカーボネート、プロピレンカーボネート、ブチレンカーボネート等の環状カーボネート、ジメチルカーボネート、ジエチルカーボネート、エチルメチルカーボネート等の鎖状カーボネート、γ−ブチロラクトン、γ−バレロラクトン等のラクトン類、プロピオン酸メチル、ピバリン酸メチル、ピバリン酸オクチル等の鎖状カルボン酸エステル、テトラヒドロフラン、２−メチルテトラヒドロフラン、１，４−ジオキサン、１，２−ジメトキシエタン、１，２−ジエトキシエタン、１，２−ジブトキシエタン等のエーテル類、アセトニトリルのようなニトリル類、ジメチルホルムアミド、Ｎ−メチル−２−ピロリドン等のアミド類が挙げられる。これら有機溶媒は、１種のみ使用してもよく、２種以上組み合わせて使用してもよい。
(2) Organic solvent The organic solvent is not particularly limited as long as it is an organic solvent that does not impair the peelability when the voltage of the pressure-sensitive adhesive composition is applied and the adhesiveness when no voltage is applied. For example, cyclic carbonates such as ethylene carbonate, propylene carbonate, butylene carbonate, chain carbonates such as dimethyl carbonate, diethyl carbonate, and ethyl methyl carbonate, lactones such as γ-butyrolactone, γ-valerolactone, methyl propionate, and methyl pivalate , Chain carboxylic esters such as octyl pivalate, ethers such as tetrahydrofuran, 2-methyltetrahydrofuran, 1,4-dioxane, 1,2-dimethoxyethane, 1,2-diethoxyethane, 1,2-dibutoxyethane , Nitriles such as acetonitrile, amides such as dimethylformamide and N-methyl-2-pyrrolidone. These organic solvents may be used alone or in combination of two or more.
上記有機溶媒中、３０以上の比誘電率を有する有機溶媒を使用することが好ましい。この比誘電率の有機溶媒を使用することで、電圧の印加時の剥離性をより向上できる。この比誘電率を有する有機溶媒としては、例えば、エチレンカーボネート（８９．８）、プロピレンカーボネート（６４．９２）、γ−ブチロラクトン（３９．１）、Ｎ−メチル−２−ピロリドン（３２．２）等が挙げられる（括弧内は約２５℃における比誘電率を意味する）。より好ましい比誘電率の範囲は、６０以上である。 Among the organic solvents, it is preferable to use an organic solvent having a relative dielectric constant of 30 or more. By using an organic solvent having this relative dielectric constant, the releasability upon application of voltage can be further improved. Examples of the organic solvent having this relative dielectric constant include ethylene carbonate (89.8), propylene carbonate (64.92), γ-butyrolactone (39.1), and N-methyl-2-pyrrolidone (32.2). (The value in parentheses means the relative dielectric constant at about 25 ° C.). A more preferable range of the relative dielectric constant is 60 or more.
（アクリル系ポリマーと電解液の使用割合）
電解液は、アクリル系ポリマー１００重量部に対して、１５〜２５０重量部の範囲で使用される。この範囲で使用することで、電圧の印加時の剥離性の確保と、電圧の非印加時の粘着性の確保を両立実現できる。より好ましい電解液の使用割合は、４０〜１２０重量部である。
(Use ratio of acrylic polymer and electrolyte)
The electrolytic solution is used in the range of 15 to 250 parts by weight with respect to 100 parts by weight of the acrylic polymer. By using in this range, it is possible to achieve both securing of peelability when voltage is applied and securing adhesiveness when voltage is not applied. A more preferable usage rate of the electrolytic solution is 40 to 120 parts by weight.
（他の成分）
アクリル系ポリマーに架橋剤を作用させることで、架橋させてもよい。架橋剤としては、トルエンジイソシアネート、メチレンビスフェニルイソシアネート等のイソシアネート系架橋剤が挙げられる。架橋剤の使用割合は、アクリル系ポリマー１００重量部に対して、１重量以上であることが好ましい。架橋させることで、粘着剤組成物を支持体上に層として形成した場合、その層の耐クリープ性や耐せん断性を改良できる。より好ましい使用割合は、５〜１０重量部である。
また、粘着剤組成物には、帯電防止剤、着色剤、酸化防止剤、充填材等が含まれていてもよい。
(Other ingredients)
You may make it bridge | crosslink by making a crosslinking agent act on an acrylic polymer. Examples of the crosslinking agent include isocyanate crosslinking agents such as toluene diisocyanate and methylene bisphenyl isocyanate. The use ratio of the crosslinking agent is preferably 1 weight or more with respect to 100 parts by weight of the acrylic polymer. When the pressure-sensitive adhesive composition is formed as a layer on the support by crosslinking, the creep resistance and shear resistance of the layer can be improved. A more preferable usage rate is 5 to 10 parts by weight.
The pressure-sensitive adhesive composition may contain an antistatic agent, a colorant, an antioxidant, a filler, and the like.
（粘着剤組成物の製造方法）
粘着剤組成物は、アクリル系ポリマーと電解液と任意に架橋剤とを公知の方法で攪拌することにより得ることができる。
(Method for producing pressure-sensitive adhesive composition)
The pressure-sensitive adhesive composition can be obtained by stirring the acrylic polymer, the electrolytic solution, and optionally the cross-linking agent by a known method.
（粘着剤組成物の用途）
粘着剤組成物の用途としては、リサイクルが必要な金属材（例えば、アルミニウム、貴金属）と他の部材との接着用途が挙げられる。この用途では、電圧の印加により容易に金属材を回収できるので、例えば家電リサイクルに有用である。
また、センサーと被着体との接着用途が挙げられる。この用途では、電圧の印加により容易にセンサーを回収でき、センサーを繰り返し使用できるので、経済的である。
(Use of adhesive composition)
As an application of the pressure-sensitive adhesive composition, an adhesive application between a metal material (for example, aluminum or noble metal) that needs to be recycled and another member can be mentioned. In this application, the metal material can be easily recovered by applying a voltage, which is useful for home appliance recycling, for example.
Moreover, the adhesive use of a sensor and a to-be-adhered body is mentioned. This application is economical because the sensor can be easily recovered by applying a voltage, and the sensor can be used repeatedly.
更に、動物のトラッキングマーカーに使用される首輪の接着用途が挙げられる。この用途では、トラッキングの必要がなくなれば、首輪を接合する部分に遠隔操作で電圧を印加することで、動物から首輪を外すことができる。
製造工程中において、部品の仮止めに粘着剤組成物を使用できる。例えば、ＬＳＩチップのダイシング時のウェハの仮止めに使用することが挙げられる。この用途では、電圧を印加することで、仮止め状態を容易に解除できる。
Furthermore, the use of the collar used for the animal tracking marker is mentioned. In this application, when the tracking is not necessary, the collar can be removed from the animal by applying a voltage to the portion where the collar is joined by remote control.
During the manufacturing process, the pressure-sensitive adhesive composition can be used for temporarily fixing parts. For example, it can be used for temporarily fixing a wafer when dicing an LSI chip. In this application, the temporarily fixed state can be easily released by applying a voltage.
人工衛星をその筐体から切り離す際の両者の接着用途に使用できる。従来、切り離しは、ジェット噴射のような微妙な制御が困難な方法が使用されていた。しかし、粘着剤組成物を使用すれば、電圧を印加することで微妙な制御が可能であり、人工衛星に与える物理的なダメージも軽減できる。 It can be used to bond both satellites when separating them from their enclosures. Conventionally, a method such as jet injection, which is difficult to perform delicate control, has been used for separation. However, if the pressure-sensitive adhesive composition is used, fine control can be performed by applying a voltage, and physical damage to the artificial satellite can be reduced.
（電気剥離性粘着製品）
電気剥離性粘着製品（以下、単に粘着製品ともいう）は、導電性支持体と、その上に形成された電気剥離性粘着剤層とを有している。電気剥離性粘着剤層は、上記粘着剤組成物を含んでいる。
粘着製品の形状は、特に限定されず、導電性支持体の形状に応じて決定される。例えば、導電性支持体が箔状である場合は、製品は粘着テープとなる。
(Electrically peelable adhesive products)
An electrically peelable adhesive product (hereinafter also simply referred to as an adhesive product) has a conductive support and an electrically peelable adhesive layer formed thereon. The electrically peelable pressure-sensitive adhesive layer contains the pressure-sensitive adhesive composition.
The shape of the pressure-sensitive adhesive product is not particularly limited, and is determined according to the shape of the conductive support. For example, when the conductive support is a foil, the product is an adhesive tape.
導電性支持体としては、例えば、アルミニウム、銅、銀、金等の金属、これら金属の合金、導電性金属酸化物（ＩＴＯ等）からなる箔（厚さ１００μｍ未満）や板（厚さ１００μｍ以上）等、これら金属又は合金が混合されるかコーティングされた繊維を含有した布、これら金属又は合金を含有した樹脂シート、これら金属、合金又は導電性金属酸化物からなる層を備えた樹脂板が挙げられる。 Examples of the conductive support include metals such as aluminum, copper, silver, and gold, alloys of these metals, foils (thickness less than 100 μm) and plates (thickness of 100 μm or more) made of conductive metal oxide (ITO, etc.) ) And the like, a cloth containing fibers mixed or coated with these metals or alloys, a resin sheet containing these metals or alloys, and a resin plate provided with a layer made of these metals, alloys or conductive metal oxides. Can be mentioned.
（剥離方法）
上記粘着製品は被着体に粘着させることができる。被着体は特に限定されないが、導電性を有していることが好ましい。
粘着製品の被着体からの剥離は、粘着製品を構成する電気剥離性粘着剤層に電圧を印加することにより行うことができる。例えば、導電性支持体と被着体に端子を接続し、端子間に電圧を印加する方法や、導電性支持体と電気剥離性粘着剤層に端子を接触させ、端子間に電圧を印加する方法等が挙げられる。
(Peeling method)
The adhesive product can be adhered to an adherend. The adherend is not particularly limited, but preferably has conductivity.
Peeling of the adhesive product from the adherend can be performed by applying a voltage to the electrically peelable pressure-sensitive adhesive layer constituting the adhesive product. For example, the terminal is connected to the conductive support and the adherend, and a voltage is applied between the terminals, or the terminal is brought into contact with the conductive support and the electro-releasable adhesive layer, and the voltage is applied between the terminals. Methods and the like.
印加される電圧は、剥離ができさえすれば特に限定されないが、１Ｖ以上であることが好ましく、３Ｖ以上であることがより好ましい。電圧の上限は剥離の観点からは特に規定されないが、電圧印加装置や被着体への影響を考慮すると、２００Ｖであることが好ましい。印加時間は、例えば、１秒以上であることが好ましく、３秒以上であることがより好ましい。印加時間の上限は、剥離の観点からは特に規定されないが、被着体への影響を考慮すると、１０分間であることが好ましい。更に、剥離時の温度は、常温（約２５℃）でもよく、常温より低い温度や高い温度でもよい。剥離作業の容易性から、常温で行うことが好ましい。 The applied voltage is not particularly limited as long as it can be peeled off, but is preferably 1 V or more, and more preferably 3 V or more. The upper limit of the voltage is not particularly defined from the viewpoint of peeling, but is preferably 200 V in consideration of the influence on the voltage application device and the adherend. For example, the application time is preferably 1 second or longer, and more preferably 3 seconds or longer. The upper limit of the application time is not particularly defined from the viewpoint of peeling, but it is preferably 10 minutes considering the influence on the adherend. Furthermore, the temperature at the time of peeling may be room temperature (about 25 ° C.), or may be lower or higher than room temperature. It is preferable to carry out at normal temperature from the ease of peeling work.
以下、実施例を用いて本発明を更に説明するが、本発明は、以下の実施例に限定されるものではない。
実施例１
（アクリル系ポリマーの調製）
ｎ−ブチルアクリレート（三菱化学社製）９１重量部、アクリル酸（三菱化学社製）８重量部、２−ヒドロキシエチルメタクリレート（日本触媒社製）１重量部とからなるモノマー混合物と、重合開始剤としてのアゾビスイソブチロニトリル（ＡＩＢＮ、純正化学社製）０．２重量部と、溶剤（酢酸エチル：トルエン（重量比）＝９：１）１８６重量部とを、窒素気流中、８５℃で５時間重合反応させてアクリル系粘着剤を得た。得られたアクリル系粘着剤は、樹脂分（アクリル系ポリマー：重量平均分子量約８０万）を３５重量％含み、７０００ｍＰａ・ｓの粘度を有していた。
EXAMPLES Hereinafter, although this invention is further demonstrated using an Example, this invention is not limited to a following example.
Example 1
(Preparation of acrylic polymer)
A monomer mixture composed of 91 parts by weight of n-butyl acrylate (manufactured by Mitsubishi Chemical), 8 parts by weight of acrylic acid (manufactured by Mitsubishi Chemical), and 1 part by weight of 2-hydroxyethyl methacrylate (manufactured by Nippon Shokubai Co., Ltd.), and a polymerization initiator Azobisisobutyronitrile (AIBN, manufactured by Junsei Chemical Co., Ltd.) 0.2 parts by weight and a solvent (ethyl acetate: toluene (weight ratio) = 9: 1) 186 parts by weight in a nitrogen stream at 85 ° C. Was subjected to a polymerization reaction for 5 hours to obtain an acrylic pressure-sensitive adhesive. The obtained acrylic pressure-sensitive adhesive contained 35% by weight of a resin component (acrylic polymer: weight average molecular weight of about 800,000), and had a viscosity of 7000 mPa · s.
（電解液の調製）
第四級アンモニウム塩としてのテトラエチルアンモニウムテトラフルオロボレート（Ｅｔ4ＮＢＦ4、キシダ化学社製）を、有機溶剤としてのプロピレンカーボネート（ＰＣ、キシダ化学社製）に濃度１．０ｍｏｌ／ｌになるように常温で溶解させて電解液を得た。
(Preparation of electrolyte)
Tetraethylammonium tetrafluoroborate (Et 4 NBF 4 , manufactured by Kishida Chemical Co., Ltd.) as a quaternary ammonium salt is added to propylene carbonate (PC, manufactured by Kishida Chemical Co., Ltd.) as an organic solvent so as to have a concentration of 1.0 mol / l. It was made to melt | dissolve at normal temperature and the electrolyte solution was obtained.
（粘着剤組成物の調製）
上記アクリル系粘着剤１００重量部（アクリル系ポリマー３５重量部）に、イソシアネート系架橋剤としてのコロネートＬ−５５Ｅ（日本ポリウレタン社製）２．０重量部と上記電解液１４重量部とを添加し、常温で１０分間攪拌し、脱泡することで粘着剤組成物を得た。
(Preparation of adhesive composition)
To 100 parts by weight of the acrylic pressure-sensitive adhesive (35 parts by weight of acrylic polymer), 2.0 parts by weight of Coronate L-55E (manufactured by Nippon Polyurethane Co., Ltd.) as an isocyanate-based crosslinking agent and 14 parts by weight of the electrolytic solution are added. The pressure-sensitive adhesive composition was obtained by stirring at room temperature for 10 minutes and degassing.
（イオン導電率の測定）
粘着剤組成物のイオン導電率を次のようにして測定した。測定は、Ｓｏｌａｒｔｒｏｎ社製１２６０周波数応答アナライザを用い、ＡＣインピーダンス法によって行った。具体的には、二極式セル（東洋システム社製）を用いて粘着剤組成物をステンレスで挟み、テフロン（登録商標）製のスペーサーによって、一定の面積（１．３ｃｍ2）と厚さ（０．００４ｃｍ）の円盤状に制御した。このセルに振幅が１０ｍＶの電圧を印加し、振幅を規定する周波数を１ＭＨｚ〜０．１Ｈｚへと変化させたときに得られるＣｏｌｅ−Ｃｏｌｅプロットを等価回路を用いてカーブフィットすることにより抵抗を求めた。面積Ａ、厚さＬ及び抵抗Ｒｂを下記式に代入することで、粘着剤組成物のイオン導電率σを算出した。
（式）σ＝Ｌ／（Ｒｂ×Ａ）
（σ：イオン導電率、Ｒｂ：バルク抵抗、Ｌ：サンプルの厚さ（ｃｍ）、Ａ：サンプルの面積（ｃｍ2））
(Measurement of ionic conductivity)
The ionic conductivity of the pressure-sensitive adhesive composition was measured as follows. The measurement was performed by the AC impedance method using a Solartron 1260 frequency response analyzer. Specifically, the adhesive composition is sandwiched between stainless steel using a bipolar cell (manufactured by Toyo System Co., Ltd.), and a certain area (1.3 cm 2 ) and thickness (with a Teflon (registered trademark) spacer ( 0.004 cm). The resistance is obtained by applying a Cole-Cole plot obtained by applying a voltage of 10 mV to this cell and changing the frequency defining the amplitude from 1 MHz to 0.1 Hz using an equivalent circuit. It was. By substituting the area A, the thickness L, and the resistance Rb into the following formula, the ionic conductivity σ of the pressure-sensitive adhesive composition was calculated.
(Formula) σ = L / (Rb × A)
(Σ: ionic conductivity, Rb: bulk resistance, L: sample thickness (cm), A: sample area (cm 2 ))
（電気剥離性粘着製品の調製）
上記粘着剤組成物を、シリコーン剥離剤をコーティングしたＰＥＴシート上に塗工し、得られた塗膜を１００℃で２分間乾燥させることで、厚さ４０μｍの電気剥離性粘着剤層を得た後、導電性支持体としてのアルミニウム基材（１００μｍ）に電気剥離性粘着剤層を貼り合わせた。その後、４０℃で３日間養生させることで、粘着テープとしての電気剥離性粘着製品を得た。得られた電気剥離性粘着製品を下記評価に付した。結果を表１に示す。
(Preparation of electro-releasable adhesive products)
The pressure-sensitive adhesive composition was applied onto a PET sheet coated with a silicone release agent, and the resulting coating film was dried at 100 ° C. for 2 minutes to obtain an electro-releasable pressure-sensitive adhesive layer having a thickness of 40 μm. Thereafter, an electro-releasable pressure-sensitive adhesive layer was bonded to an aluminum substrate (100 μm) as a conductive support. Then, the electrically peelable adhesive product as an adhesive tape was obtained by making it age at 40 degreeC for 3 days. The obtained electrically peelable adhesive product was subjected to the following evaluation. The results are shown in Table 1.
（電気剥離性粘着製品の評価）
（１）粘着力の測定
得られた粘着テープを幅２５ｍｍ、長さ２５０ｍｍにカットして試料片を得た。研磨したステンレス板（被着体）に試料片を置き、２ｋｇのゴムローラを用いて３００ｍｍ／分の速度で試料片の長さ方向に１往復させることで、試料片を圧着して評価サンプルを得た。圧着３０分後、ＪＩＳ Ｚ−０２３７に準拠して、島津製作所社製オートグラフＡＧＳ−Ｈを用いて、引張速度３００ｍｍ／分で１８０°の角度に剥がす（１８０°ピールする）のに要した力（粘着力：Ｎ／２５ｍｍ）を測定した。
(Evaluation of electrical peelable adhesive products)
(1) Measurement of adhesive strength The obtained adhesive tape was cut into a width of 25 mm and a length of 250 mm to obtain a sample piece. Place the sample piece on a polished stainless steel plate (adhered body), and reciprocate once in the length direction of the sample piece at a speed of 300 mm / min using a 2 kg rubber roller to obtain an evaluation sample by pressing the sample piece. It was. 30 minutes after pressure bonding, in accordance with JIS Z-0237, the force required for peeling (180 ° peel) at an angle of 180 ° at a tensile speed of 300 mm / min using an autograph AGS-H manufactured by Shimadzu Corporation (Adhesive strength: N / 25 mm) was measured.
上記と同様に用意した試料サンプルの圧着３０分後、図１（ａ）及び（ｂ）に示すように評価サンプルの導電性支持体と被着体に電極を取り付け、１００Ｖの電圧を３分間印加した。印加後、上記と同様にして１８０°ピールするのに要した力を測定した。
図１（ａ）及び（ｂ）は電圧印加方法の概略説明図であり、図１（ａ）は平面図、図１（ｂ）は断面図である。図中、１は導電性支持体、２は電気剥離性粘着剤層、３は被着体、４は直流電源を意味する。
After 30 minutes of pressure bonding of the sample sample prepared in the same manner as above, as shown in FIGS. 1A and 1B, electrodes are attached to the conductive support and adherend of the evaluation sample, and a voltage of 100 V is applied for 3 minutes. did. After application, the force required to peel 180 ° was measured in the same manner as described above.
1A and 1B are schematic explanatory views of a voltage application method, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view. In the figure, 1 is a conductive support, 2 is an electro-releasable pressure-sensitive adhesive layer, 3 is an adherend, and 4 is a DC power source.
（２）剥離形態の評価
剥離後の電気剥離性粘着剤層を観察し、粘着剤層が被着体と導電性支持体の両方に存在する場合を「凝集破壊」とし、被着体側に存在せず、導電性支持体側にのみ存在する場合を「界面剥離」とした。
（３）電気剥離性の評価
電気剥離性は、電圧印加後の粘着力の低下度合いにより評価した。電圧印加前の粘着力に対する電圧印加後の粘着力の割合（％）を粘着力の維持率として算出する。維持率が１０％以下の場合を電圧の印加による剥離が容易であるとして◎とし、１０％より大きく５０％以下の場合を剥離が可能であるとして○とし、５０％より大きい場合を剥離が困難であるとして×とした。
(2) Evaluation of peeling mode When the peelable adhesive layer is observed and the pressure-sensitive adhesive layer is present on both the adherend and the conductive support, it is called “cohesive failure” and is present on the adherend side. The case where it was present only on the conductive support side was defined as “interfacial peeling”.
(3) Evaluation of electrical peelability The electrical peelability was evaluated by the degree of decrease in adhesive strength after voltage application. The ratio (%) of the adhesive strength after voltage application to the adhesive strength before voltage application is calculated as the adhesive strength maintenance rate. When the retention rate is 10% or less, ◎ is assumed that peeling is easy due to the application of voltage, and when it is larger than 10% and 50% or less is marked as ◯, peeling is difficult when it is larger than 50%. X.
実施例２〜１６及び比較例１〜７
電解液を表１に示す種類の電解質及び有機溶剤、濃度及び添加量とし、表１に示す導電性支持体を使用すること以外は、実施例１と同様にして電気剥離性粘着製品を得た。得られた電気剥離性粘着製品を実施例１と同様にして評価した。結果を表１に示す。
Examples 2-16 and Comparative Examples 1-7
The electrolysable adhesive product was obtained in the same manner as in Example 1 except that the electrolytic solution was the type of electrolyte and organic solvent shown in Table 1, concentration and addition amount, and the conductive support shown in Table 1 was used. . The obtained electrically peelable adhesive product was evaluated in the same manner as in Example 1. The results are shown in Table 1.
なお、表１のこれら実施例及び比較例中、Ｅｔ3ＭｅＮＢＦ4は東洋合成工業社製のトリエチルメチルアンモニウムテトラフルオロボレート（第四級アンモニウム塩）を、ＬｉＴＦＳＩはアルドリッチ社製のリチウムビス（トリフルオロメタンスルホニル）イミド（ＬｉＮ（ＳＯ2ＣＦ3）2、アルカリ金属塩）を、ＥＣ−ＰＣはキシダ化学社製のエチレンカーボネートとプロピレンカーボネートとの重量比１：１の溶媒を、ＧＢＬは純正化学社製のγ−ブチロラクトンを、ＮＭＰは純正化学社製のＮ−メチル−２−ピロリドンを、ＩＴＯ−ＰＥＴはアルドリッチ社製のＰＥＴ基材上にＩＴＯ（Ｉｎｄｉｕｍ Ｔｉｎ Ｏｘｉｄｅ）膜を備えた導電性支持体（表面抵抗値３５Ω／ｓｑ）を、それぞれ意味する。 In these examples and comparative examples in Table 1, Et 3 MeNBF 4 is triethylmethylammonium tetrafluoroborate (quaternary ammonium salt) manufactured by Toyo Gosei Co., Ltd., LiTFSI is lithium bis (trifluoromethane manufactured by Aldrich) Sulfonyl) imide (LiN (SO 2 CF 3 ) 2 , alkali metal salt), EC-PC is a solvent having a weight ratio of 1: 1 between ethylene carbonate and propylene carbonate manufactured by Kishida Chemical Co., Ltd., GBL is manufactured by Junsei Chemical Co., Ltd. Γ-butyrolactone, NMP is N-methyl-2-pyrrolidone manufactured by Junsei Chemical Co., Ltd., ITO-PET is a conductive support comprising an ITO (Indium Tin Oxide) film on a PET substrate manufactured by Aldrich. Surface resistance value 35Ω / sq).
表１から、電解液の未添加の比較例１及び添加量が少ない比較例２〜６は、いずれも電圧印加により粘着力が低下しなかった。これに対して、実施例では電圧印加による粘着力の低下が見られた。
電解液の添加量が多い比較例７は、製膜自体ができなかった。
実施例１、２及び実施例４から、電解質濃度が、１．０ｍｏｌ／ｌの場合、電圧印加により特に粘着力を低下できることが分かった。また、実施例３〜８から、電解液の添加量が、４０重量部以上の場合、電圧印加により特に粘着力を低下できることが分かった。
From Table 1, the comparative example 1 to which the electrolytic solution was not added and the comparative examples 2 to 6 having a small addition amount did not decrease in adhesive strength due to voltage application. On the other hand, in the examples, a decrease in adhesive force due to voltage application was observed.
In Comparative Example 7 in which the amount of electrolytic solution added was large, film formation itself was not possible.
From Examples 1 and 2 and Example 4, it was found that when the electrolyte concentration was 1.0 mol / l, the adhesive strength could be particularly reduced by voltage application. Moreover, from Examples 3-8, when the addition amount of electrolyte solution was 40 weight part or more, it turned out that adhesive force can be reduced especially by voltage application.
実施例９、１０及び１５から、電解液の有機溶媒の種類を変えても、電圧印加による粘着力の低下が見られた。また、実施例１１〜１７から、電解質の種類を変えても、電圧印加による粘着力の低下が見られた。実施例１８から、導電性支持基材の種類を変えても、電圧印加による粘着力の低下が見られた。 From Examples 9, 10 and 15, even when the type of the organic solvent of the electrolytic solution was changed, a decrease in adhesive force due to voltage application was observed. Moreover, even if it changed the kind of electrolyte from Examples 11-17, the fall of the adhesive force by voltage application was seen. From Example 18, even if the type of the conductive support base material was changed, a decrease in adhesive force due to voltage application was observed.
実施例１９
比較例１、実施例５〜８、１４及び１８の電気剥離性粘着製品から評価サンプルを採取し、その評価サンプルに、５Ｖの電圧を１０秒間印加すること以外は、実施例１と同様にして粘着力を測定した。結果を表２に示す。表２では参考のため電圧印加前の粘着力と、１００Ｖの電圧を３分間印加後の粘着力を合わせて示す。
Example 19
An evaluation sample was taken from the electrically peelable adhesive products of Comparative Example 1 and Examples 5 to 8, 14 and 18, and the same procedure as in Example 1 was performed except that a voltage of 5 V was applied to the evaluation sample for 10 seconds. The adhesive strength was measured. The results are shown in Table 2. For reference, Table 2 shows the adhesive strength before voltage application and the adhesive strength after applying a voltage of 100 V for 3 minutes.
５Ｖの電圧を１０秒間印加する条件は、１００Ｖの電圧を３分間印加する条件よりシビアな条件であるが、実施例の電気剥離性粘着製品は、低電圧短時間印加条件でも粘着力の低下が顕著に見られた。 The condition for applying the voltage of 5V for 10 seconds is more severe than the condition for applying the voltage of 100V for 3 minutes. It was noticeable.
実施例２０
比較例１、実施例４及び１１の電気剥離性粘着製品から評価サンプルを４個採取し、それぞれの評価サンプルに、１００Ｖの電圧を、３秒間、１０秒間、１分間及び３分間印加後の粘着力を測定した。測定法は実施例１と同様とした。得られた結果を表３に示す。
Example 20
Four evaluation samples were collected from the electro-releasable adhesive products of Comparative Example 1, Examples 4 and 11, and 100 V was applied to each evaluation sample for 3 seconds, 10 seconds, 1 minute, and 3 minutes. The force was measured. The measurement method was the same as in Example 1. The obtained results are shown in Table 3.
表３の結果を図２にプロットした。
表３及び図２から、実施例の電気剥離性粘着製品は、いずれも短時間で粘着力が著しく低下していることがわかる。
The results of Table 3 are plotted in FIG.
It can be seen from Table 3 and FIG. 2 that the adhesive strength of the examples of the electro-peelable pressure-sensitive adhesive products is significantly reduced in a short time.
実施例２１
比較例１、実施例４及び１１の電気剥離性粘着製品から評価サンプルを３個採取し、それぞれの評価サンプルに、１０Ｖ、５０Ｖ及び１００Ｖの電圧を３分間印加後の粘着力を測定した。測定法は実施例１と同様とした。得られた結果を表４に示す。
Example 21
Three evaluation samples were collected from the electrically peelable adhesive products of Comparative Example 1, Examples 4 and 11, and the adhesive strength after applying 10V, 50V and 100V voltages for 3 minutes to each evaluation sample was measured. The measurement method was the same as in Example 1. Table 4 shows the obtained results.
表４の結果を図３にプロットした。
表４及び図３から、実施例の電気剥離性粘着製品は、いずれも低電圧で粘着力が著しく低下していることがわかる。
The results of Table 4 are plotted in FIG.
From Table 4 and FIG. 3, it can be seen that the adhesively peelable adhesive products of the examples are remarkably reduced in adhesive strength at low voltage.
１ 導電性支持体、２ 電気剥離性粘着剤層、３ 被着体、４ 直流電源
DESCRIPTION OF SYMBOLS 1
Claims (6)
前記第四級アンモニウム塩が、式（Ｒ） 4 ＮＢＦ 4 （式中Ｒは、同一又は異なって、メチル基又はエチル基）であるホウ素含有有機電解質塩であり、
前記アルカリ金属塩が、ＬｉＮ（ＳＯ 2 ＣＦ 3 ） 2 、ＬｉＮ（ＳＯ 2 Ｃ 2 Ｆ 5 ） 2 及びＬｉＣ（ＳＯ 2 ＣＦ 3 ） 3 から選択されることを特徴とする電気剥離性粘着剤組成物。 An electro-peelable pressure-sensitive adhesive composition comprising an acrylic polymer and an electrolytic solution, wherein the electro-peelable pressure-sensitive adhesive composition has an ionic conductivity of 10 −11 to 10 −3 S / cm, and the electrolysis The liquid is used in a ratio of 15 to 250 parts by weight with respect to 100 parts by weight of the acrylic polymer, and the electrolyte is a quaternary ammonium salt or alkali as an electrolyte at a concentration of 0.01 to 3 mol / l. Ri organic solution der containing metal salt,
The quaternary ammonium salt is a boron-containing organic electrolyte salt of the formula (R) 4 NBF 4 (wherein R is the same or different and is a methyl group or an ethyl group);
Wherein the alkali metal salt, LiN (SO 2 CF 3) 2, LiN (SO 2 C 2 F 5) 2 and LiC (SO 2 CF 3) 3 electrically-peelable pressure-sensitive adhesive composition to a selected said Rukoto from .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008198057A JP5296446B2 (en) | 2008-07-31 | 2008-07-31 | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008198057A JP5296446B2 (en) | 2008-07-31 | 2008-07-31 | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010037354A JP2010037354A (en) | 2010-02-18 |
| JP5296446B2 true JP5296446B2 (en) | 2013-09-25 |
Family
ID=42010241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008198057A Active JP5296446B2 (en) | 2008-07-31 | 2008-07-31 | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5296446B2 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5757816B2 (en) | 2010-08-05 | 2015-08-05 | アークレイ株式会社 | Mount unit, sensor unit, and measuring device |
| JP5774375B2 (en) * | 2011-05-23 | 2015-09-09 | 日東電工株式会社 | Adhesive film |
| CN105143385B (en) * | 2013-09-27 | 2017-09-29 | 琳得科株式会社 | The application method of electric Stripping adhesive compositeon, electric fissility bonding sheet and electric fissility bonding sheet |
| JP6318398B2 (en) * | 2014-02-27 | 2018-05-09 | 日東電工株式会社 | Laminate |
| JP6767104B2 (en) * | 2015-11-24 | 2020-10-14 | 日東電工株式会社 | How to join / separate adherends |
| TWI791012B (en) | 2017-03-02 | 2023-02-01 | 日商日東電工股份有限公司 | Ionic compositions and related uses thereof |
| EP3591020A4 (en) | 2017-03-03 | 2020-12-09 | Nitto Denko Corporation | Electrically peelable adhesive composition, adhesive sheet, and adhered body |
| CN111630125B (en) | 2017-11-21 | 2022-04-26 | 日东电工株式会社 | Basic ionic liquid composition and element comprising same |
| WO2020050169A1 (en) | 2018-09-03 | 2020-03-12 | 日東電工株式会社 | Adhesive composition, adhesive sheet and bonded body |
| JP2020164778A (en) | 2018-09-03 | 2020-10-08 | 日東電工株式会社 | Adhesive composition, pressure sensitive adhesive sheet and conjugate |
| JP2019023304A (en) * | 2018-09-27 | 2019-02-14 | 日東電工株式会社 | Method for bonding and separating adherends |
| JP2020050850A (en) | 2018-09-28 | 2020-04-02 | 日東電工株式会社 | Conjugation and separation method of adherend |
| JP2020050846A (en) | 2018-09-28 | 2020-04-02 | 日東電工株式会社 | Conjugation and separation method of adherend |
| JP7427235B2 (en) | 2020-02-18 | 2024-02-05 | ビッグテクノス株式会社 | Electrically removable adhesive composition, electrically removable adhesive product and method for peeling the same |
| CN115210334A (en) | 2020-03-02 | 2022-10-18 | 日东电工株式会社 | Adhesive composition, adhesive sheet, and bonded body |
| JP2021138898A (en) * | 2020-03-09 | 2021-09-16 | リンテック株式会社 | Electrically peelable adhesive composition, electrically peelable adhesive sheet, and method of using electrically peelable adhesive sheet |
| CN115335486A (en) | 2020-03-30 | 2022-11-11 | 日东电工株式会社 | Adhesive composition, adhesive sheet, and bonded body |
| EP4194198A1 (en) | 2020-08-07 | 2023-06-14 | Nitto Denko Corporation | Electrically peelable adhesive sheet and bonded body |
| JP2020200481A (en) * | 2020-09-16 | 2020-12-17 | 日東電工株式会社 | Joint/separation method for adherend |
| CN113136159B (en) * | 2021-04-27 | 2022-07-19 | 西南科技大学 | Preparation and use methods of epoxy structure adhesive capable of being peeled off as required when electrified |
| JPWO2023152911A1 (en) | 2022-02-10 | 2023-08-17 | ||
| WO2023152912A1 (en) | 2022-02-10 | 2023-08-17 | ビッグテクノス株式会社 | Electrically peelable adhesive composition, electrically peelable adhesive product, and use of same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6394501A (en) * | 1986-10-09 | 1988-04-25 | 宇部興産株式会社 | Manufacture of ion conducting solid electrolytic shield |
| KR100269204B1 (en) * | 1997-04-10 | 2000-10-16 | 윤종용 | Polymer solid electolyte and lithium secondary cell adopting the same |
| US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| JP4851753B2 (en) * | 2005-09-05 | 2012-01-11 | 日東電工株式会社 | Adhesive composition and adhesive sheet |
-
2008
- 2008-07-31 JP JP2008198057A patent/JP5296446B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010037354A (en) | 2010-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5296446B2 (en) | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling | |
| JP5503926B2 (en) | Electrically peelable adhesive product and peeling method thereof | |
| JP5210078B2 (en) | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling | |
| US11236256B2 (en) | Double-sided adhesive sheet, joined body comprising double-sided adhesive sheet, and method for joining/separating adherends | |
| JP6767104B2 (en) | How to join / separate adherends | |
| WO2017064918A1 (en) | Electrically peelable adhesive composition, adhesive sheet, and joined body | |
| KR102589071B1 (en) | Electrically peelable adhesive composition, electrically peelable adhesive product, and peeling method thereof | |
| JP4984735B2 (en) | Acrylic adhesive manufacturing method | |
| JP2017075289A (en) | Adhesive sheet joint separating method | |
| US20230159799A1 (en) | Adhesive composition, adhesive sheet, and joined body | |
| TW201216301A (en) | Anisotropic conductive film | |
| JP7063660B2 (en) | How to join and separate electro-peelable adhesive sheets, joints, and adherends | |
| CN112639045A (en) | Adhesive composition, adhesive sheet, and joined body | |
| US20210002516A1 (en) | Electrical debonding type adhesive sheet, joined body, and debonding method for joined body | |
| JP2021028388A (en) | Electrically peelable type adhesive sheet, assembly and separation method of assembly | |
| WO2020067221A1 (en) | Adherend separation method and joining method | |
| JP2010265388A (en) | Antistatic adhesive and adhesive sheet | |
| JP2020147761A (en) | Adhesive sheet joint separating method | |
| JP2020200481A (en) | Joint/separation method for adherend | |
| KR20220156538A (en) | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and bonded body | |
| WO2020067222A1 (en) | Joining and separation method for adherends | |
| JP4363844B2 (en) | Low temperature curable adhesive and anisotropic conductive adhesive film using the same | |
| EP4365254A1 (en) | Electrically peelable pressure-sensitive adhesive composition, electrically peelable pressure-sensitive adhesive product, and use of same | |
| KR20230048024A (en) | Electrical peelable adhesive sheet, and bonded body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110801 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130205 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130405 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130604 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130613 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5296446 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |