JP5179883B2 - めっきレジストによるビア構造の同時かつ選択的な分割 - Google Patents
めっきレジストによるビア構造の同時かつ選択的な分割 Download PDFInfo
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- JP5179883B2 JP5179883B2 JP2007558346A JP2007558346A JP5179883B2 JP 5179883 B2 JP5179883 B2 JP 5179883B2 JP 2007558346 A JP2007558346 A JP 2007558346A JP 2007558346 A JP2007558346 A JP 2007558346A JP 5179883 B2 JP5179883 B2 JP 5179883B2
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- XPPWAISRWKKERW-UHFFFAOYSA-N copper palladium Chemical compound [Cu].[Pd] XPPWAISRWKKERW-UHFFFAOYSA-N 0.000 description 1
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/01—Dielectrics
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- H05K2201/07—Electric details
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (17)
- 多層プリント回路基板であって、
第1の導電層と第2の導電層との間に挟まれた誘電体層と、間隙の中に堆積された、めっきレジストの選択的堆積物と、を有する、少なくとも1つのサブコンポジット構造と、
当該多層プリント回路基板にドリリングされ、前記めっきレジストの層を貫通するスルーホールと、
を備え、
前記間隙及び前記めっきレジストが、前記第1の導電層及び前記第2の導電層のうち少なくとも1つと前記誘電体層とを通って延びており、
前記スルーホールの内側表面の、前記めっきレジストがない部分に導電性材料がめっきされて、前記多層プリント回路基板を通る、分割されたビア構造が形成された、多層プリント回路基板。 - 多層プリント回路基板であって、
第1の導電層と第2の導電層との間に挟まれた誘電体層と、間隙の中に堆積された、めっきレジストの選択的堆積物と、を有する、少なくとも1つのサブコンポジット構造と、
当該多層プリント回路基板を通って延びており、第1の部分と第2の部分とに分割されたスルーホールと、
を備え、
前記間隙及び前記めっきレジストが、前記第1の導電層及び前記第2の導電層のうち少なくとも1つと前記誘電体層とを通って延びており、
前記第1の部分は、前記第1の導電層及び前記第2の導電層のうち少なくとも1つと前記誘電体層とを貫通する、前記少なくとも1つのサブコンポジット構造を通って延びており、前記第2の部分は前記めっきレジストを貫通しており、
前記第2の部分の内側表面の、前記めっきレジストがない部分に導電性材料がめっきされて、当該多層プリント回路基板を通る、分割されたビア構造が形成されている、多層プリント回路基板。 - ビア構造を分割する方法であって、
第1の導電層と第2の導電層との間に位置する誘電体層を有する少なくとも1つのサブコンポジット構造を形成するステップと、
少なくとも1つのサブコンポジット構造の、前記第1の導電層及び前記第2の導電層のうち少なくとも1つと前記誘電体層の中に、少なくとも1つの間隙を形成するステップと、
前記少なくとも1つの間隙の中にめっきレジストを堆積させるステップと、
前記少なくとも1つのサブコンポジット構造を積層して多層プリント回路基板積重体にするステップと、
前記多層プリント回路基板積重体を通り、前記めっきレジストの各部分を貫通するスルーホールをドリリングするステップと、
各スルーホールの内側表面の、前記めっきレジストがない部分に導電性材料をめっきして、前記多層プリント回路基板を通る、対応する分割されたビア構造を形成するよう、前記プリント回路基板積重体を処理するステップと、
を備える方法。 - 前記めっきするステップが、電解めっき操作を行うステップを備える、請求項3に記載の方法。
- 前記めっきするステップが、無電解めっき操作を行うステップを備える、請求項3に記載の方法。
- 前記めっきレジストが、無電解金属堆積物に触媒作用を及ぼすことが可能な触媒種の堆積に抵抗する絶縁疎水性樹脂系材料を含む、請求項3に記載の方法。
- 前記絶縁疎水性樹脂系材料が、シリコーン樹脂、ポリエチレン樹脂、フルオロカーボン樹脂、ポリウレタン樹脂、アクリル樹脂のうちの1つ以上を含む、請求項6に記載の方法。
- 前記絶縁疎水性樹脂系材料が、他の樹脂系材料との結合組成の形で、前記結合組成における疎水特性を維持するのに十分な量において用いられ、または、単独で用いられる、請求項6に記載の方法。
- 前記めっきレジストがドライフィルムである、請求項3に記載の方法。
- 前記めっきレジストが、ペーストまたは粘稠液体を含む、請求項3に記載の方法。
- 前記分割されたビア構造が、信頼性または機能性を高めるために、電圧切換可能誘電体材料を充填される、請求項3に記載の方法。
- 絶縁誘電体材料が、FR−4、エポキシガラス、ポリイミドガラス、セラミック炭化水素、ポリイミドフィルム、樹脂含浸ガラス繊維、テフロン(登録商標)フィルム、樹脂含浸マット材料、ケブラー、紙、ナノパウダーが分散した樹脂誘電体のうちの少なくとも1つである、請求項3に記載の方法。
- コンピュータプログラムを用いて、前記めっきレジストを選択的に堆積させる場所を決定し、前記めっきレジストの選択的堆積、ならびに前記分割されたビア構造を通る回路パターンの引き回しのために、プリント回路基板設計レイアウトプログラムおよびコンピュータ支援製造システムのうちの少なくとも1つで使用される情報を生成するステップをさらに備える、請求項3に記載の方法。
- ビア構造のバックドリリングを含む既存のプリント回路基板設計において、バックドリリングの場所に前記めっきレジストを堆積させるステップをさらに備える、請求項3に記載の方法。
- 逐次プロセスにおいて、2つ以上の別々のプリント回路基板サブアセンブリを分離する場所に前記めっきレジストを堆積させるステップをさらに備える、請求項3に記載の方法。
- 前記間隙がブラインドホールである、請求項1に記載の多層プリント回路基板。
- 前記分割されたビア構造を少なくとも部分的に充填する電圧切換可能誘電体材料を更に備える、請求項1に記載の多層プリント回路基板。
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-
2006
- 2006-03-03 TW TW095107242A patent/TWI389205B/zh active
- 2006-03-06 EP EP06737501.4A patent/EP1856723B1/en active Active
- 2006-03-06 CN CN200680007139A patent/CN100587921C/zh active Active
- 2006-03-06 WO PCT/US2006/008334 patent/WO2006094307A2/en active Application Filing
- 2006-03-06 US US11/369,448 patent/US20060199390A1/en not_active Abandoned
- 2006-03-06 JP JP2007558346A patent/JP5179883B2/ja active Active
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2008
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10244640B2 (en) | 2014-02-21 | 2019-03-26 | Mitsui Mining & Smelting Co., Ltd. | Copper clad laminate provided with protective layer and multilayered printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
EP1856723A2 (en) | 2007-11-21 |
US20080296057A1 (en) | 2008-12-04 |
EP1856723B1 (en) | 2013-05-01 |
US8667675B2 (en) | 2014-03-11 |
CN101133478A (zh) | 2008-02-27 |
WO2006094307A3 (en) | 2007-08-30 |
US8222537B2 (en) | 2012-07-17 |
US20080301934A1 (en) | 2008-12-11 |
JP2008532326A (ja) | 2008-08-14 |
US20090288874A1 (en) | 2009-11-26 |
TWI389205B (zh) | 2013-03-11 |
CN100587921C (zh) | 2010-02-03 |
TW200703508A (en) | 2007-01-16 |
EP1856723A4 (en) | 2010-08-04 |
US20060199390A1 (en) | 2006-09-07 |
WO2006094307A2 (en) | 2006-09-08 |
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