JP5172269B2 - 不揮発性半導体記憶装置 - Google Patents
不揮発性半導体記憶装置 Download PDFInfo
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- JP5172269B2 JP5172269B2 JP2007269770A JP2007269770A JP5172269B2 JP 5172269 B2 JP5172269 B2 JP 5172269B2 JP 2007269770 A JP2007269770 A JP 2007269770A JP 2007269770 A JP2007269770 A JP 2007269770A JP 5172269 B2 JP5172269 B2 JP 5172269B2
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- 229910004121 SrRuO Inorganic materials 0.000 description 1
- 229910004491 TaAlN Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- ZXOKVTWPEIAYAB-UHFFFAOYSA-N dioxido(oxo)tungsten Chemical group [O-][W]([O-])=O ZXOKVTWPEIAYAB-UHFFFAOYSA-N 0.000 description 1
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- YDZQQRWRVYGNER-UHFFFAOYSA-N iron;titanium;trihydrate Chemical group O.O.O.[Ti].[Fe] YDZQQRWRVYGNER-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5685—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using storage elements comprising metal oxide memory material, e.g. perovskites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0064—Verifying circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
- G11C2013/0054—Read is performed on a reference element, e.g. cell, and the reference sensed value is used to compare the sensed value of the selected cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/0073—Write using bi-directional cell biasing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/56—Structure including two electrodes, a memory active layer and a so called passive or source or reservoir layer which is NOT an electrode, wherein the passive or source or reservoir layer is a source of ions which migrate afterwards in the memory active layer to be only trapped there, to form conductive filaments there or to react with the material of the memory active layer in redox way
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/71—Three dimensional array
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Description
[全体構成]
図1は、本発明の一実施形態に係る不揮発性メモリのブロック図である。
図2は、メモリセルアレイ1の一部の斜視図、図3は、図2におけるI−I′線で切断して矢印方向に見たメモリセル1つ分の断面図である。
次に、多値データのリード・ライト動作に先立ち、説明の理解のために、二値のリード・ライト動作を説明する。
次に二値データの書き込み動作について説明する。
次に、不揮発性メモリの多値データの書き込み動作について説明する。
次に、多値データの読み出しについて説明する。
Claims (3)
- 可変抵抗素子を使用した電気的に書き換え可能な不揮発性のメモリセルをマトリクス状に配置してなるメモリセルアレイと、
3値以上の書き込みデータに基づいて前記可変抵抗素子の抵抗値を3段階以上に変化させる書き込みパルスを生成出力するパルスジェネレータと、
書き込みアドレスに基づいて前記メモリセルアレイの書き込むべきメモリセルを選択して前記パルスジェネレータから生成出力された書き込みパルスを供給する選択回路と
を備え、
前記パルスジェネレータは、前記書き込みデータに応じて異なる数の前記書き込みパルスを生成し、生成された当該書き込みパルスは、当該書き込みデータに応じて異なる初期値で、且つ、異なるステップ幅でステップアップ又はステップダウンする
ことを特徴とする不揮発性半導体記憶装置。 - 前記メモリセルは、前記可変抵抗素子と直列に接続された非オーミック素子を有する
ことを特徴とする請求項1記載の不揮発性半導体記憶装置。 - 前記非オーミック素子は、ダイオードである
ことを特徴とする請求項2記載の不揮発性半導体記憶装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007269770A JP5172269B2 (ja) | 2007-10-17 | 2007-10-17 | 不揮発性半導体記憶装置 |
KR1020107008287A KR101239582B1 (ko) | 2007-10-17 | 2008-09-09 | 불휘발성 반도체 기억 장치 |
CN200880112062.4A CN101828236B (zh) | 2007-10-17 | 2008-09-09 | 非易失性半导体存储器件 |
PCT/JP2008/066613 WO2009050969A1 (en) | 2007-10-17 | 2008-09-09 | Nonvolatile semiconductor memory device |
US12/677,017 US8259489B2 (en) | 2007-10-17 | 2008-09-09 | Nonvolatile semiconductor memory device generating different write pulses to vary resistances |
TW097135266A TWI401683B (zh) | 2007-10-17 | 2008-09-12 | 非揮發性半導體記憶裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007269770A JP5172269B2 (ja) | 2007-10-17 | 2007-10-17 | 不揮発性半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009099198A JP2009099198A (ja) | 2009-05-07 |
JP5172269B2 true JP5172269B2 (ja) | 2013-03-27 |
Family
ID=40567245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007269770A Expired - Fee Related JP5172269B2 (ja) | 2007-10-17 | 2007-10-17 | 不揮発性半導体記憶装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8259489B2 (ja) |
JP (1) | JP5172269B2 (ja) |
KR (1) | KR101239582B1 (ja) |
CN (1) | CN101828236B (ja) |
TW (1) | TWI401683B (ja) |
WO (1) | WO2009050969A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101418434B1 (ko) | 2008-03-13 | 2014-08-14 | 삼성전자주식회사 | 비휘발성 메모리 장치, 이의 제조 방법, 및 이를 포함하는프로세싱 시스템 |
JP4977180B2 (ja) * | 2009-08-10 | 2012-07-18 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
US9184213B2 (en) * | 2010-01-29 | 2015-11-10 | Hewlett-Packard Development Company, L.P. | Nanoscale switching device |
US8437174B2 (en) | 2010-02-15 | 2013-05-07 | Micron Technology, Inc. | Memcapacitor devices, field effect transistor devices, non-volatile memory arrays, and methods of programming |
US8416609B2 (en) | 2010-02-15 | 2013-04-09 | Micron Technology, Inc. | Cross-point memory cells, non-volatile memory arrays, methods of reading a memory cell, methods of programming a memory cell, methods of writing to and reading from a memory cell, and computer systems |
JP2011198440A (ja) * | 2010-03-24 | 2011-10-06 | Toshiba Corp | 不揮発性半導体記憶装置 |
JP5566776B2 (ja) | 2010-05-21 | 2014-08-06 | 株式会社東芝 | 抵抗変化メモリ |
US8634224B2 (en) * | 2010-08-12 | 2014-01-21 | Micron Technology, Inc. | Memory cells, non-volatile memory arrays, methods of operating memory cells, methods of writing to and reading from a memory cell, and methods of programming a memory cell |
WO2012043502A1 (ja) * | 2010-09-28 | 2012-04-05 | 日本電気株式会社 | 半導体装置 |
CN102034535B (zh) * | 2010-12-15 | 2013-01-16 | 清华大学 | 带有操控电路的三值型阻变存储单元及其读写实现方法 |
CN102610748B (zh) * | 2011-01-25 | 2014-02-12 | 中国科学院微电子研究所 | 非挥发性存储单元及存储器 |
CN102610749B (zh) * | 2011-01-25 | 2014-01-29 | 中国科学院微电子研究所 | 阻变型随机存储单元及存储器 |
JP2012216702A (ja) * | 2011-04-01 | 2012-11-08 | Rohm Co Ltd | データ保持装置及びこれを用いた論理演算回路 |
JP5634367B2 (ja) * | 2011-09-26 | 2014-12-03 | 株式会社東芝 | 半導体記憶装置 |
KR102030326B1 (ko) * | 2013-01-21 | 2019-10-10 | 삼성전자 주식회사 | 비휘발성 메모리 장치 및 그 구동 방법 |
KR20140128482A (ko) | 2013-04-25 | 2014-11-06 | 에스케이하이닉스 주식회사 | 저항변화 메모리 소자와 이를 위한 쓰기제어 회로, 이를 포함하는 메모리 장치 및 데이터 처리 시스템과 동작 방법 |
TWI514551B (zh) * | 2013-05-15 | 2015-12-21 | Toshiba Kk | Nonvolatile memory device |
KR102126967B1 (ko) | 2013-10-11 | 2020-07-08 | 삼성전자주식회사 | 메모리 소자 및 그 제조 방법 |
US10134470B2 (en) | 2015-11-04 | 2018-11-20 | Micron Technology, Inc. | Apparatuses and methods including memory and operation of same |
US10446226B2 (en) | 2016-08-08 | 2019-10-15 | Micron Technology, Inc. | Apparatuses including multi-level memory cells and methods of operation of same |
US10157667B2 (en) * | 2017-04-28 | 2018-12-18 | Micron Technology, Inc. | Mixed cross point memory |
JP6517385B1 (ja) * | 2018-02-07 | 2019-05-22 | ウィンボンド エレクトロニクス コーポレーション | 半導体記憶装置 |
Family Cites Families (21)
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KR100790043B1 (ko) | 2005-09-16 | 2008-01-02 | 가부시끼가이샤 도시바 | 상변화 메모리장치 |
KR100773095B1 (ko) * | 2005-12-09 | 2007-11-02 | 삼성전자주식회사 | 상 변화 메모리 장치 및 그것의 프로그램 방법 |
KR100746224B1 (ko) * | 2006-01-02 | 2007-08-03 | 삼성전자주식회사 | 멀티비트 셀들을 구비하는 상변화 기억소자들 및 그프로그램 방법들 |
JP5143415B2 (ja) * | 2006-01-02 | 2013-02-13 | 三星電子株式会社 | マルチビットセル及び直径が調節できるコンタクトを具備する相変化記憶素子、その製造方法及びそのプログラム方法 |
-
2007
- 2007-10-17 JP JP2007269770A patent/JP5172269B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-09 US US12/677,017 patent/US8259489B2/en active Active
- 2008-09-09 KR KR1020107008287A patent/KR101239582B1/ko not_active IP Right Cessation
- 2008-09-09 WO PCT/JP2008/066613 patent/WO2009050969A1/en active Application Filing
- 2008-09-09 CN CN200880112062.4A patent/CN101828236B/zh active Active
- 2008-09-12 TW TW097135266A patent/TWI401683B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200933632A (en) | 2009-08-01 |
KR101239582B1 (ko) | 2013-03-05 |
US8259489B2 (en) | 2012-09-04 |
JP2009099198A (ja) | 2009-05-07 |
TWI401683B (zh) | 2013-07-11 |
CN101828236B (zh) | 2014-03-12 |
KR20100068445A (ko) | 2010-06-23 |
US20100328988A1 (en) | 2010-12-30 |
CN101828236A (zh) | 2010-09-08 |
WO2009050969A1 (en) | 2009-04-23 |
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