JP5145225B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000010408 film Substances 0.000 claims description 83
- 229910052751 metal Inorganic materials 0.000 claims description 78
- 239000002184 metal Substances 0.000 claims description 78
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 25
- 239000010409 thin film Substances 0.000 claims description 24
- 230000004888 barrier function Effects 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 238000004544 sputter deposition Methods 0.000 claims description 18
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 229910052723 transition metal Inorganic materials 0.000 claims description 5
- 150000003624 transition metals Chemical class 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 110
- 239000011572 manganese Substances 0.000 description 21
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 18
- 230000001681 protective effect Effects 0.000 description 16
- 239000007789 gas Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 13
- 239000012495 reaction gas Substances 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 8
- 229910052748 manganese Inorganic materials 0.000 description 8
- RRZKHZBOZDIQJG-UHFFFAOYSA-N azane;manganese Chemical compound N.[Mn] RRZKHZBOZDIQJG-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- -1 SiN Chemical class 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
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Description
また、銅薄膜中のMnの添加量を正確に制御するためには、各ターゲットの成膜速度を逐一制御する必要があるが、スパッタリング中にターゲットの表面状態は変化するため、成膜速度を一定に保つのは困難である。
「Applied Physics Letters」、(米国)、2005年、87、041911
前記中間層を加熱して、前記孔の側壁の表面に、前記拡散性金属の窒化物又は酸化物を含有するバリア膜と、前記バリア膜表面に銅を主成分とする下地層とを形成する加熱工程と、を有する半導体装置の製造方法である。
本発明は半導体装置の製造方法であって、前記孔の底面には金属配線の表面が位置し、前記エッチング工程の後に、前記孔の底面と前記孔の側壁上に金属層を析出させる半導体装置の製造方法である。
本発明は半導体装置の製造方法であって、前記第一の絶縁膜上には、前記第一の絶縁膜が露出する溝を有する第二の絶縁膜が配置され、前記孔は前記溝の底面に配置され、前記中間層の形成工程は、前記溝の側壁と前記溝の底面にも前記中間層を形成する半導体装置の製造方法である。
本発明は半導体装置の製造方法であって、前記エッチング工程は、前記溝の底面に成長する前記中間層を残す半導体装置の製造方法である。
本願に使用するターゲットは銅を主成分とし、拡散性金属が添加された合金ターゲットであり、処理対象物表面に成長する中間層の組成は、合金ターゲットの組成と一致するので、中間層中の拡散性金属の添加量を正確に制御できる。
しかも、拡散性金属のターゲットは合金ターゲットに比べ機械的強度が弱いので、スパッタリング中にパーティクルも発生しやすい。また、ターゲットの交換時期は、銅ターゲットと拡散性ターゲットのいずれか一方の交換時期に合わせる必要があり、合金ターゲットを用いた場合に比べターゲットを頻繁に交換する必要がある。
基板12の第一の金属配線14が配置された表面には下部絶縁層15が配置され、下部絶縁層15の表面には第一の保護膜16が配置され、下部絶縁層15と第一の保護膜16とで第一の絶縁膜26が構成されている。
第一、第二の絶縁膜26、27には第一の金属配線14の真上位置で、第一、第二の絶縁膜26、27を貫通する貫通孔が形成されており、第二の絶縁膜27はパターニングされ、該貫通孔と交差する位置を通る溝22が形成されている。
第一の保護膜16は溝22を形成するときの上部絶縁層17のエッチングストッパーとして用いられており、従って、溝22底面の孔21以外の部分には第一の保護膜16が露出している。
図1の符号1は本発明に用いる成膜装置の一例を示している。
この成膜装置1は真空槽2と、真空槽2内部にそれぞれ配置された基板ホルダ7とターゲット5とを有している。
真空槽2の外部にはスパッタ電源8とバイアス電源6がそれぞれ配置され、ターゲット5はスパッタ電源8に、基板ホルダ7はバイアス電源6にそれぞれ接続されている。
ターゲット5は銅を主成分とし、マンガンが所定量(例えば2原子%を超える)添加された合金ターゲットであり、ターゲット5がマグネトロンスパッタされると、銅を主成分とし、マンガンが添加された合金材料からなるスパッタ粒子が放出される。
このとき、基板ホルダ7には高周波電圧(0Vを含む)が印加されており、処理対象物11の溝22が形成された面には高周波電圧の大きさに応じた量のプラズマが入射し、表面に成長する薄膜がエッチングされる。
酸化マンガンと窒化マンガンのいずれか一方又は両方を含むバリア膜29は、SiO2やSiN等のケイ素化合物と、銅やアルミニウム等の金属材料の両方に対する接着性が高い。
中間層25を加熱してバリア膜と下地層を形成する加熱工程は、金属層31を形成する前に行ってもよいが、金属層31を形成した後に行えば、中間層25の加熱と金属層31のアニール化が同時に行われ、製造時間が短縮されるだけでなく、処理対象物11に余計な熱ダメージを与えずにすむ。
拡散性金属は、銅中の拡散速度が速く、かつ、窒素又は酸素と反応するものであれば、Mn以外にもTiと、Taと、Moと、Wと、V等の種々の遷移金属や、Mgと、Al等の非遷移金属を、拡散性金属としてターゲット5に添加することができる。
これらの遷移金属は単独で合金ターゲット5に添加してもよいし、2種類以上を添加してもよい。
合金ターゲット5中の拡散性金属の添加量は特に限定されないが、その添加量は、例えば、1原子%以上40原子%以下である。
例えば、第二の絶縁膜27が形成されておらず、第一の絶縁膜26表面が露出する処理対象物11を用いて半導体装置を製造する場合も本発明には含まれる。
成膜雰囲気中の反応ガス(O2、酸素)の分圧と、ターゲット5のMn添加量をそれぞれ変えて中間層形成工程とエッチング工程を行い中間層25を形成した後、上述した工程で半導体装置10を製造した。ここでは、アニール化の条件は、真空雰囲気の圧力が6×10-6Pa、加熱温度が350℃、加熱時間が1時間であった。
Mn添加量が7原子%のターゲットを用い、反応ガスである酸素ガスの流量をそれぞれ変えて中間層形成工程とエッチング工程を行い中間層25を形成した後、上述した工程で半導体装置10を製造した。
各半導体装置10の第一、第二の金属配線14、32の比抵抗と抵抗値変化を測定し、その測定結果を図6のグラフに示す。
Claims (4)
- 基板と、前記基板表面に配置され、孔が形成された第一の絶縁膜とを有する処理対象物の、
前記孔の側壁に銅を主成分とする薄膜をスパッタリングにより形成する半導体装置の製造方法であって、
遷移金属と、Alと、Mgとからなる拡散性金属群より選択される少なくとも1種類以上の拡散性金属が添加されたターゲットと、前記処理対象物とが配置された真空槽に、
前記拡散性金属と反応して前記拡散性金属の酸化物又は窒化物を生成する反応ガスと、スパッタガスとを供給し、前記ターゲットに電圧を印加してスパッタリングし、
銅を主成分とし、前記拡散性金属と前記反応ガスとを含有する中間層を生成する中間層形成工程と、
前記中間層形成工程で印加した電圧よりも小さい電圧を前記ターゲットに印加し、前記処理対象物を保持する基板ホルダに高周波電圧を印加して、前記孔の底面の前記中間層を除去するエッチング工程と、
前記中間層を加熱して、前記孔の側壁の表面に、前記拡散性金属の窒化物又は酸化物を含有するバリア膜と、前記バリア膜表面に銅を主成分とする下地層とを形成する加熱工程と、を有する半導体装置の製造方法。 - 前記孔の底面には金属配線の表面が位置し、
前記エッチング工程の後に、前記孔の底面と前記孔の側壁上に金属層を析出させる請求項1記載の半導体装置の製造方法。 - 前記第一の絶縁膜上には、前記第一の絶縁膜が露出する溝を有する第二の絶縁膜が配置され、
前記孔は前記溝の底面に配置され、
前記中間層の形成工程は、前記溝の側壁と前記溝の底面にも前記中間層を形成する請求項1又は請求項2のいずれか1項記載の半導体装置の製造方法。 - 前記エッチング工程は、前記溝の底面に成長する前記中間層を残す請求項1乃至請求項3のいずれか1項記載の半導体装置の製造方法。
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US7932176B2 (en) * | 2008-03-21 | 2011-04-26 | President And Fellows Of Harvard College | Self-aligned barrier layers for interconnects |
JP5343417B2 (ja) * | 2008-06-25 | 2013-11-13 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
JP5339830B2 (ja) * | 2008-09-22 | 2013-11-13 | 三菱マテリアル株式会社 | 密着性に優れた薄膜トランジスター用配線膜およびこの配線膜を形成するためのスパッタリングターゲット |
JP5466889B2 (ja) * | 2009-06-18 | 2014-04-09 | 東京エレクトロン株式会社 | 多層配線の形成方法 |
JP2013080779A (ja) * | 2011-10-03 | 2013-05-02 | Ulvac Japan Ltd | 半導体装置の製造方法、半導体装置 |
US9076661B2 (en) | 2012-04-13 | 2015-07-07 | Applied Materials, Inc. | Methods for manganese nitride integration |
US9048294B2 (en) * | 2012-04-13 | 2015-06-02 | Applied Materials, Inc. | Methods for depositing manganese and manganese nitrides |
WO2013191065A1 (ja) * | 2012-06-18 | 2013-12-27 | 東京エレクトロン株式会社 | マンガン含有膜の形成方法 |
TWI609095B (zh) * | 2013-05-30 | 2017-12-21 | 應用材料股份有限公司 | 用於氮化錳整合之方法 |
US9275952B2 (en) * | 2014-01-24 | 2016-03-01 | International Business Machines Corporation | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
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