JP5141917B2 - 実装基板 - Google Patents
実装基板 Download PDFInfo
- Publication number
- JP5141917B2 JP5141917B2 JP2009151511A JP2009151511A JP5141917B2 JP 5141917 B2 JP5141917 B2 JP 5141917B2 JP 2009151511 A JP2009151511 A JP 2009151511A JP 2009151511 A JP2009151511 A JP 2009151511A JP 5141917 B2 JP5141917 B2 JP 5141917B2
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- bent portion
- circuit board
- printed circuit
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/91—Coupling devices allowing relative movement between coupling parts, e.g. floating or self aligning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10537—Attached components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
Claims (3)
- 端子の先端部分がプリント基板に形成された挿通孔に挿通されて半田付けされることにより、複数の前記端子が前記プリント基板に実装された実装基板において、
前記端子を支持する複数の台座が、前記プリント基板の一方の面において、互いに異なる所定位置に相互に離隔して配設されている一方、前記複数の台座が変形可能な連結部を介して連結されるように、前記複数の台座と前記連結部が合成樹脂材料により一体成形されていると共に、該連結部によって前記複数の台座間での相対変位が許容されていることを特徴とする実装基板。 - 前記連結部が屈曲部を有している請求項1に記載の実装基板。
- 前記屈曲部の内周面と外周面が何れも滑らかな湾曲面で構成されている請求項2に記載の実装基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151511A JP5141917B2 (ja) | 2009-06-25 | 2009-06-25 | 実装基板 |
CN2009801266688A CN102089934A (zh) | 2009-06-25 | 2009-12-14 | 安装板 |
PCT/JP2009/006863 WO2010150329A1 (ja) | 2009-06-25 | 2009-12-14 | 実装基板 |
US13/123,814 US9040844B2 (en) | 2009-06-25 | 2009-12-14 | Electronic component mounting board having a plurality of terminals and method of manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151511A JP5141917B2 (ja) | 2009-06-25 | 2009-06-25 | 実装基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011009072A JP2011009072A (ja) | 2011-01-13 |
JP5141917B2 true JP5141917B2 (ja) | 2013-02-13 |
Family
ID=43386125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009151511A Active JP5141917B2 (ja) | 2009-06-25 | 2009-06-25 | 実装基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9040844B2 (ja) |
JP (1) | JP5141917B2 (ja) |
CN (1) | CN102089934A (ja) |
WO (1) | WO2010150329A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5387863B2 (ja) | 2011-03-31 | 2014-01-15 | 日本電気株式会社 | プレスフィットコネクタ |
JP6820292B2 (ja) * | 2018-06-19 | 2021-01-27 | 矢崎総業株式会社 | 導通部材 |
EP4207498A1 (en) * | 2021-12-30 | 2023-07-05 | Steward (Foshan) Magnetics Co., Ltd. | Press-fit connector and wireless charging coil module |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5575191U (ja) * | 1978-11-17 | 1980-05-23 | ||
US4943248A (en) * | 1988-06-29 | 1990-07-24 | Molex Incorporated | Electrical terminal for bladed fuse |
JPH07263877A (ja) * | 1994-03-18 | 1995-10-13 | Matsushita Electric Works Ltd | 電子部品支持具 |
JPH08124635A (ja) * | 1994-10-24 | 1996-05-17 | Matsushita Electric Works Ltd | コネクタ |
JPH10106653A (ja) | 1996-10-01 | 1998-04-24 | Yazaki Corp | 基板直付け端子の接続構造 |
JPH10173311A (ja) * | 1996-12-13 | 1998-06-26 | Ryosei Denso Kk | 回路基板 |
JP3703322B2 (ja) * | 1997-12-03 | 2005-10-05 | シャープ株式会社 | 電子部品 |
JP3593249B2 (ja) * | 1998-01-06 | 2004-11-24 | イビデン株式会社 | 変換モジュール |
JP3619358B2 (ja) * | 1998-01-06 | 2005-02-09 | イビデン株式会社 | 変換モジュール |
JP2002251953A (ja) * | 2001-02-22 | 2002-09-06 | Jst Mfg Co Ltd | マルチヒューズホルダー |
US6942499B2 (en) * | 2001-03-07 | 2005-09-13 | Yazaki Corporation | Terminal holding and heat dissipating structure |
JP2002270986A (ja) * | 2001-03-07 | 2002-09-20 | Yazaki Corp | 端子の保持構造 |
JP2002270982A (ja) * | 2001-03-12 | 2002-09-20 | Yazaki Corp | 基板の積層構造 |
JP2002271077A (ja) * | 2001-03-12 | 2002-09-20 | Yazaki Corp | 発熱部品の保持放熱構造 |
ES2380425T3 (es) * | 2001-04-19 | 2012-05-11 | Pacific Engineering Corporation | Composición de resina de poliamida para dispositivo fusible |
JP4360771B2 (ja) | 2002-01-17 | 2009-11-11 | 矢崎総業株式会社 | ヒューズ接続端子の基板への取付構造 |
JP4329790B2 (ja) * | 2006-07-31 | 2009-09-09 | 住友電装株式会社 | 電気接続箱および該電気接続箱の組立方法 |
-
2009
- 2009-06-25 JP JP2009151511A patent/JP5141917B2/ja active Active
- 2009-12-14 WO PCT/JP2009/006863 patent/WO2010150329A1/ja active Application Filing
- 2009-12-14 US US13/123,814 patent/US9040844B2/en active Active
- 2009-12-14 CN CN2009801266688A patent/CN102089934A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2010150329A1 (ja) | 2010-12-29 |
JP2011009072A (ja) | 2011-01-13 |
US9040844B2 (en) | 2015-05-26 |
CN102089934A (zh) | 2011-06-08 |
US20110192641A1 (en) | 2011-08-11 |
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