JP5113264B2 - 流体噴射カートリッジ及び方法 - Google Patents
流体噴射カートリッジ及び方法 Download PDFInfo
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- JP5113264B2 JP5113264B2 JP2010542212A JP2010542212A JP5113264B2 JP 5113264 B2 JP5113264 B2 JP 5113264B2 JP 2010542212 A JP2010542212 A JP 2010542212A JP 2010542212 A JP2010542212 A JP 2010542212A JP 5113264 B2 JP5113264 B2 JP 5113264B2
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- 239000012530 fluid Substances 0.000 title claims description 197
- 238000000034 method Methods 0.000 title claims description 39
- 229910052710 silicon Inorganic materials 0.000 claims description 130
- 239000010703 silicon Substances 0.000 claims description 130
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 128
- 238000004519 manufacturing process Methods 0.000 claims description 15
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910020175 SiOH Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
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- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
Claims (10)
- 流体噴射カートリッジであって、
第1間隔の流体流路を有する本体と、
シリコンから形成され、より狭い第2間隔の流体流路を有するダイと、
第1表面で前記本体に接着接合され、第2表面で前記ダイに直接プラズマ接合される、前記第1表面と前記第2表面との間に流体流路を有し、前記流路が前記本体及び前記ダイのそれぞれの流路と実質的に整列するシリコンインターポーザとを備え、
前記インターポーザの前記流体流路が、前記第1間隔と前記第2間隔との間に延びる傾斜ホールであり、各該傾斜ホールが、前記第1表面の大きな第1開口部と、前記第2表面の小さな第2開口部と、前記第1開口部及び前記第2開口部の間で概して先細る横断面サイズとを有し、
前記ダイの前記流体流路が隣り合って位置決めされている4つの平行な細長スロットから成り、前記本体の前記流体流路が隣り合って位置決めされている4つの平行な細長スロットから成り、前記インターポーザの前記傾斜ホールが少なくとも4つの傾斜ホールから成り、当該インターポーザの2つの隣り合う傾斜ホールが前記ダイと前記本体の両方における第1スロット及び第3スロットに接続し、当該インターポーザの続く2つの隣り合う傾斜ホールが前記ダイと前記本体の両方における第2スロット及び第4スロットに接続していることを特徴とするカートリッジ。 - 前記第1間隔が約1000ミクロン以上であり、前記第2間隔が約400ミクロンから約1000ミクロンの範囲内であることを特徴とする請求項1に記載のカートリッジ。
- 前記インターポーザが約500ミクロンから約2000ミクロンの範囲内の厚さを有することを特徴とする請求項1又は2に記載のカートリッジ。
- 前記本体がプラスチック材料から形成されていることを特徴とする請求項1から3のいずれか1項に記載のカートリッジ。
- 流体噴射カートリッジの作製方法であって、
第1表面に第1間隔を有し、第2表面により狭い第2間隔を有する流体流路を、シリコンインターポーザの前記第1表面と前記第2表面との間に作製する工程と、
前記インターポーザの前記第2表面を、実質的により狭い前記第2間隔の流体流路を有するシリコンから形成されているダイの上面に直接プラズマ接合する工程と、
前記インターポーザの前記第1表面を実質的に前記第1間隔で流体流路を有するカートリッジ本体に接着接合する工程とを含み、
前記ダイの前記流体流路が隣り合って位置決めされている4つの平行な細長スロットから成り、前記カートリッジ本体の前記流体流路が隣り合って位置決めされている4つの平行な細長スロットから成り、前記流体流路を作製する前記工程が少なくとも4つのホールを作製し、それにより2つの隣り合うホールが前記ダイと前記カートリッジ本体の両方における第1スロット及び第3スロットに接続し、続く2つの隣り合うホールが前記ダイと前記カートリッジ本体の両方における第2スロット及び第4スロットに接続し、
前記少なくとも4つのホールが、前記第1表面と前記第2表面との間に延びる傾斜ホールであり、各該傾斜ホールが、前記第1表面の大きな第1開口部と、前記第2表面の小さな第2開口部と、前記第1開口部及び前記第2開口部の間で概して先細る横断面サイズとを有することを特徴とする作製方法。 - 前記インターポーザを前記ダイにプラズマ接合する前記工程は、
前記インターポーザの前記第2表面と前記ダイの前記上面とをプラズマに曝露することによって前記表面上の結合部位を活性化させ、
前記インターポーザの前記第2表面と前記ダイの上面とを押し付け合い、
前記取り付け済みのダイとインターポーザとをアニーリングすることによってその間の結合を強化することをさらに含むことを特徴とする請求項5に記載の方法。 - 前記インターポーザの前記第2表面と前記ダイの前記上面とをプラズマに曝露する前記工程が、
前記第2表面と前記上面とを窒素プラズマに曝露することによって前記シリコン表面上のSi+結合部位を活性化させ、
前記第2表面と前記上面とを水プラズマに曝露することによって前記シリコン表面上にSiOH種を生成し、
前記第2表面と前記上面とを酸素プラズマに曝露することによって前記シリコン表面を清浄化することをさらに含むことを特徴とする請求項6に記載の方法。 - 前記取り付け済みのダイ及びインターポーザをアニーリングする前記工程が、前記取り付け済みのダイ及びインターポーザを約120℃に約2時間に亘って加熱することを含むことを特徴とする請求項6又は7に記載の方法。
- 前記第1間隔が約1000ミクロン以上であり、前記第2間隔が約400ミクロンから約1000ミクロンの範囲内であることを特徴とする請求項5から8のいずれか1項に記載の方法。
- 前記カートリッジ本体がプラスチック材料から形成されていることを特徴とする請求項5から9のいずれか1項に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2008/050608 WO2009088510A1 (en) | 2008-01-09 | 2008-01-09 | Fluid ejection cartridge and method |
Publications (2)
Publication Number | Publication Date |
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JP2011509203A JP2011509203A (ja) | 2011-03-24 |
JP5113264B2 true JP5113264B2 (ja) | 2013-01-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010542212A Expired - Fee Related JP5113264B2 (ja) | 2008-01-09 | 2008-01-09 | 流体噴射カートリッジ及び方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8240828B2 (ja) |
EP (1) | EP2231408B1 (ja) |
JP (1) | JP5113264B2 (ja) |
CN (1) | CN101909893B (ja) |
TW (1) | TWI454389B (ja) |
WO (1) | WO2009088510A1 (ja) |
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US9539814B2 (en) | 2013-02-28 | 2017-01-10 | Hewlett-Packard Development Company, L.P. | Molded printhead |
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US9902162B2 (en) | 2013-02-28 | 2018-02-27 | Hewlett-Packard Development Company, L.P. | Molded print bar |
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US6679587B2 (en) * | 2001-10-31 | 2004-01-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with a composite substrate |
US7063413B2 (en) * | 2003-07-23 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection cartridge utilizing a two-part epoxy adhesive |
EP1518681B1 (en) * | 2003-09-24 | 2007-11-28 | Hewlett-Packard Development Company, L.P. | Inkjet printhead |
US20050219327A1 (en) * | 2004-03-31 | 2005-10-06 | Clarke Leo C | Features in substrates and methods of forming |
US7261793B2 (en) * | 2004-08-13 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | System and method for low temperature plasma-enhanced bonding |
ATE536263T1 (de) * | 2004-10-26 | 2011-12-15 | Hewlett Packard Development Co | Verfahren zur plasmaverstärkten verbindung und durch plasmaverstärkte verbindung erzeugte verbundstrukturen |
US7563691B2 (en) * | 2004-10-29 | 2009-07-21 | Hewlett-Packard Development Company, L.P. | Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding |
US20070263038A1 (en) * | 2006-05-12 | 2007-11-15 | Andreas Bibl | Buried heater in printhead module |
US8061810B2 (en) * | 2009-02-27 | 2011-11-22 | Fujifilm Corporation | Mitigation of fluid leaks |
US8147040B2 (en) * | 2009-02-27 | 2012-04-03 | Fujifilm Corporation | Moisture protection of fluid ejector |
-
2008
- 2008-01-09 CN CN200880124428XA patent/CN101909893B/zh not_active Expired - Fee Related
- 2008-01-09 JP JP2010542212A patent/JP5113264B2/ja not_active Expired - Fee Related
- 2008-01-09 EP EP08727466.8A patent/EP2231408B1/en not_active Not-in-force
- 2008-01-09 US US12/747,629 patent/US8240828B2/en not_active Expired - Fee Related
- 2008-01-09 WO PCT/US2008/050608 patent/WO2009088510A1/en active Application Filing
- 2008-12-11 TW TW097148182A patent/TWI454389B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20100271445A1 (en) | 2010-10-28 |
US8240828B2 (en) | 2012-08-14 |
CN101909893B (zh) | 2012-10-10 |
EP2231408A1 (en) | 2010-09-29 |
WO2009088510A1 (en) | 2009-07-16 |
JP2011509203A (ja) | 2011-03-24 |
CN101909893A (zh) | 2010-12-08 |
TW200936385A (en) | 2009-09-01 |
EP2231408A4 (en) | 2013-03-13 |
EP2231408B1 (en) | 2014-06-25 |
TWI454389B (zh) | 2014-10-01 |
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