JP5067355B2 - 回路接続材料及び回路部材の接続構造 - Google Patents
回路接続材料及び回路部材の接続構造 Download PDFInfo
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- JP5067355B2 JP5067355B2 JP2008319815A JP2008319815A JP5067355B2 JP 5067355 B2 JP5067355 B2 JP 5067355B2 JP 2008319815 A JP2008319815 A JP 2008319815A JP 2008319815 A JP2008319815 A JP 2008319815A JP 5067355 B2 JP5067355 B2 JP 5067355B2
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- 239000013034 phenoxy resin Substances 0.000 description 1
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- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 239000011135 tin Substances 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
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JP2008319815A JP5067355B2 (ja) | 2007-12-17 | 2008-12-16 | 回路接続材料及び回路部材の接続構造 |
KR20080128345A KR101020469B1 (ko) | 2007-12-17 | 2008-12-17 | 회로 접속 재료 및 회로 부재의 접속 구조 |
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JP4752986B1 (ja) * | 2010-01-08 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用接着フィルム及び回路接続構造体 |
US10141084B2 (en) | 2010-10-08 | 2018-11-27 | Cheil Industries, Inc. | Electronic device |
CN103155050B (zh) * | 2010-10-08 | 2017-05-03 | 第一毛织株式会社 | 各向异性导电膜 |
JP5690648B2 (ja) * | 2011-04-28 | 2015-03-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法及び接続構造体 |
KR101271470B1 (ko) | 2011-08-08 | 2013-06-05 | 도레이첨단소재 주식회사 | 전자종이 디스플레이 소자용 유전 점착필름 |
WO2013042203A1 (ja) * | 2011-09-20 | 2013-03-28 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法 |
JP5925482B2 (ja) * | 2011-12-21 | 2016-05-25 | 日本シイエムケイ株式会社 | 異方性導電膜を利用した多層プリント配線板 |
JP5972009B2 (ja) * | 2012-03-30 | 2016-08-17 | デクセリアルズ株式会社 | 回路接続材料、及びこれを用いた実装体の製造方法 |
KR101659139B1 (ko) * | 2014-01-29 | 2016-09-22 | 제일모직주식회사 | 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
FR3029530B1 (fr) * | 2014-12-05 | 2018-11-09 | Scapa Group Plc. | Ruban adhesif conducteur d'electricite |
KR101822700B1 (ko) * | 2014-12-23 | 2018-01-30 | 삼성에스디아이 주식회사 | 점착제 조성물, 이로부터 형성된 점착필름 및 이를 포함하는 디스플레이 부재 |
US10978489B2 (en) * | 2015-07-24 | 2021-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device |
KR20230074287A (ko) * | 2017-09-11 | 2023-05-26 | 가부시끼가이샤 레조낙 | 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트 |
WO2019050012A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
JP7020029B2 (ja) * | 2017-09-28 | 2022-02-16 | 昭和電工マテリアルズ株式会社 | 導電性接着フィルム |
JP7468507B2 (ja) * | 2019-03-13 | 2024-04-16 | 株式会社レゾナック | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
US20220418058A1 (en) * | 2020-02-10 | 2022-12-29 | Pioneer Corporation | Electronic device and method for manufacturing electronic device |
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JPH04366630A (ja) * | 1991-06-13 | 1992-12-18 | Sharp Corp | 異方性導電接着テープ |
JPH079821B2 (ja) * | 1993-03-25 | 1995-02-01 | 日本黒鉛工業株式会社 | 三層構造異方性導電膜部材の製造方法 |
JPH07230840A (ja) * | 1994-02-17 | 1995-08-29 | Hitachi Chem Co Ltd | 接続部材及びこれを用いた電極の接続構造 |
JPH08148213A (ja) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | 接続部材、該接続部材を用いた電極の接続構造及び接続方法 |
JP2004035686A (ja) * | 2002-07-02 | 2004-02-05 | Bridgestone Corp | 異方性導電フィルム |
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