JP5067355B2 - 回路接続材料及び回路部材の接続構造 - Google Patents

回路接続材料及び回路部材の接続構造 Download PDF

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Publication number: JP5067355B2
Authority: JP; Japan
Prior art keywords: circuit; connection; adhesive layer; connection terminal; conductive particles
Prior art date: 2007-12-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2008319815A

Other languages

English (en)

Japanese (ja)

Other versions

JP2009170898A (ja

Inventor

貴立澤

宏治小林

貢藤縄

征宏有福

彰浩伊藤

耕太郎関

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Showa Denko Materials Co Ltd

Original Assignee

Hitachi Chemical Co Ltd

Showa Denko Materials Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-12-17

Filing date

2008-12-16

Publication date

2012-11-07

2008-12-16 Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd

2008-12-16 Priority to JP2008319815A priority Critical patent/JP5067355B2/ja

2008-12-17 Priority to KR20080128345A priority patent/KR101020469B1/ko

2009-07-30 Publication of JP2009170898A publication Critical patent/JP2009170898A/ja

2012-11-07 Application granted granted Critical

2012-11-07 Publication of JP5067355B2 publication Critical patent/JP5067355B2/ja

Status Active legal-status Critical Current

2028-12-16 Anticipated expiration legal-status Critical

Links

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XNTUJOTWIMFEQS-UHFFFAOYSA-N octadecanoyl octadecaneperoxoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCCCCCCCC XNTUJOTWIMFEQS-UHFFFAOYSA-N 0.000 description 1
SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
239000011368 organic material Substances 0.000 description 1
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PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
239000013034 phenoxy resin Substances 0.000 description 1
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NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
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229920001228 polyisocyanate Polymers 0.000 description 1
239000005056 polyisocyanate Substances 0.000 description 1
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239000004800 polyvinyl chloride Substances 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
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POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 1
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BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
238000010526 radical polymerization reaction Methods 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
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HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
229920002050 silicone resin Polymers 0.000 description 1
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OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives

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Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Adhesives Or Adhesive Processes (AREA)
General Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Combinations Of Printed Boards (AREA)
Wire Bonding (AREA)
Non-Insulated Conductors (AREA)
Adhesive Tapes (AREA)

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US10141084B2 (en)	2010-10-08	2018-11-27	Cheil Industries, Inc.	Electronic device
CN103155050B (zh) *	2010-10-08	2017-05-03	第一毛织株式会社	各向异性导电膜
JP5690648B2 (ja) *	2011-04-28	2015-03-25	デクセリアルズ株式会社	異方性導電フィルム、接続方法及び接続構造体
KR101271470B1 (ko)	2011-08-08	2013-06-05	도레이첨단소재 주식회사	전자종이 디스플레이 소자용 유전 점착필름
WO2013042203A1 (ja) *	2011-09-20	2013-03-28	日立化成株式会社	接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
JP5925482B2 (ja) *	2011-12-21	2016-05-25	日本シイエムケイ株式会社	異方性導電膜を利用した多層プリント配線板
JP5972009B2 (ja) *	2012-03-30	2016-08-17	デクセリアルズ株式会社	回路接続材料、及びこれを用いた実装体の製造方法
KR101659139B1 (ko) *	2014-01-29	2016-09-22	제일모직주식회사	접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
FR3029530B1 (fr) *	2014-12-05	2018-11-09	Scapa Group Plc.	Ruban adhesif conducteur d'electricite
KR101822700B1 (ko) *	2014-12-23	2018-01-30	삼성에스디아이 주식회사	점착제 조성물, 이로부터 형성된 점착필름 및 이를 포함하는 디스플레이 부재
US10978489B2 (en) *	2015-07-24	2021-04-13	Semiconductor Energy Laboratory Co., Ltd.	Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device
KR20230074287A (ko) *	2017-09-11	2023-05-26	가부시끼가이샤 레조낙	회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
WO2019050012A1 (ja) *	2017-09-11	2019-03-14	日立化成株式会社	回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP7020029B2 (ja) *	2017-09-28	2022-02-16	昭和電工マテリアルズ株式会社	導電性接着フィルム
JP7468507B2 (ja) *	2019-03-13	2024-04-16	株式会社レゾナック	回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
US20220418058A1 (en) *	2020-02-10	2022-12-29	Pioneer Corporation	Electronic device and method for manufacturing electronic device

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JPH079821B2 (ja) *	1993-03-25	1995-02-01	日本黒鉛工業株式会社	三層構造異方性導電膜部材の製造方法
JPH07230840A (ja) *	1994-02-17	1995-08-29	Hitachi Chem Co Ltd	接続部材及びこれを用いた電極の接続構造
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