JP5032687B2 - Al合金膜、Al合金膜を有する配線構造、およびAl合金膜の製造に用いられるスパッタリングターゲット - Google Patents
Al合金膜、Al合金膜を有する配線構造、およびAl合金膜の製造に用いられるスパッタリングターゲット Download PDFInfo
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- 229910000838 Al alloy Inorganic materials 0.000 title claims description 144
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000005477 sputtering target Methods 0.000 title claims description 10
- 239000010408 film Substances 0.000 claims description 500
- 230000007797 corrosion Effects 0.000 claims description 103
- 238000005260 corrosion Methods 0.000 claims description 103
- 239000000758 substrate Substances 0.000 claims description 65
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 64
- 239000003870 refractory metal Substances 0.000 claims description 40
- 239000011780 sodium chloride Substances 0.000 claims description 32
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 12
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 6
- 229910052779 Neodymium Inorganic materials 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 29
- 239000000243 solution Substances 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 26
- 239000012298 atmosphere Substances 0.000 description 25
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 22
- 238000012360 testing method Methods 0.000 description 20
- 239000000203 mixture Substances 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- 230000004888 barrier function Effects 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 11
- 238000001755 magnetron sputter deposition Methods 0.000 description 11
- 229910052750 molybdenum Inorganic materials 0.000 description 11
- 239000012299 nitrogen atmosphere Substances 0.000 description 10
- -1 pressure = 2 mTorr Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 238000009616 inductively coupled plasma Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 206010027146 Melanoderma Diseases 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910001257 Nb alloy Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 229910001182 Mo alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53219—Aluminium alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
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Description
(a)上記組成のAl合金膜を基材表面にスパッタリング法等で形成する工程、
(b)Al合金膜上に、窒化シリコン(SiN)膜等の絶縁層を模擬した熱処理を行なう工程、
(c)透明導電膜(例えばITO膜)を形成する工程、
(d)透明導電膜(例えばITO膜)を結晶化するための熱処理を行なう工程。
本実施例では、腐食評価用試料として、基板上にAl膜を成膜した試料(単層試料)と、基板上に、基板側から順にAl膜およびITO膜が順次成膜された試料(Al−ITO積層試料)と、基板上に、基板側から順にAl膜、高融点金属膜(Mo膜またはTi膜)、およびITO膜が順次成膜された試料(Al−高融点金属−ITO積層試料)の合計4種類の試料を用い、耐塩化ナトリウム溶液腐食性を評価した。また、Al−ITO積層試料について、耐熱性を評価した。
下記表1のNo.1〜33に示す組成のAl膜(膜厚=300nm、残部:Alおよび不可避的不純物)を、DCマグネトロン・スパッタ法(条件は、基板=ガラス(コーニング社製「Eagle XG」)、雰囲気ガス=アルゴン、圧力=2mTorr、基板温度=25℃、ターゲットサイズ=4インチ、成膜パワー=260W/4インチ、成膜時間=100秒)で成膜した。
ここでは、(ア)の積層試料:Al膜上の一部にITO膜が直接形成されたAl(下)−ITO(上)の積層試料、または(イ)の積層試料:Al膜上の一部に高融点金属を介してITO膜が形成されたAl(下)−高融点金属(中間)−ITO(上)の積層試料を作製した。本実施例では、高融点金属としてMoまたはTiを用いた。
各試料について、1%の塩化ナトリウム水溶液(25℃)に2時間浸漬する試験を行い、浸漬試験後の各試料の表面(単層試料ではAl膜の表面であり、積層試料ではITO膜が形成されていないAl膜の表面である)を、光学顕微鏡にて倍率1000倍で3視野観察(観察範囲:8600μm2程度)した。耐塩化ナトリウム溶液腐食性の判断は、腐食による変色がAl膜表面の全面積のうち10%未満であるものを○、10%以上で発生したものを×として評価した。これらの結果を表1に記載した。
上記の積層試料について、ITO膜の結晶化熱処理後のAl膜表面に形成されたヒロックの密度を測定した。詳細には、光学顕微鏡で、ITO膜が形成されていないAl膜表面を観察(観察箇所:任意の3箇所、視野:120×160μm)し、直径0.1μm以上のヒロックの個数をカウントした(直径とはヒロックの最も長いところを計ったもの)。そして、ヒロック密度が1×109個未満のものを○、1×109個以上のものを×と評価した。これらの結果を表1(耐熱性)に併記した。
本実施例では、前述した実施例1で用いた表1のNo.1〜33に示すAl膜を用いて、(ウ)の積層試料:基板上に、基板側から順にITO膜(下)およびAl膜(上)が順次成膜された積層試料(ITO−Alの積層試料)、(エ)の積層試料:基板上に、基板側から順にITO膜(下)、高融点金属膜(中間、Mo膜またはTi膜)、およびAl膜(上)が順次成膜された積層試料(ITO−高融点金属−Alの積層試料)、(オ)の積層試料:基板上に、基板側から順にITO膜(下)、Al膜(中間)、および高融点金属膜(上、Mo膜またはTi膜)が順次成膜された積層試料(ITO−Al−高融点金属の積層試料)を作製して、前述した実施例1と同様にして耐塩化ナトリウム溶液腐食性を評価した。
本実施例では、前述した実施例1で用いた表1のNo.1〜33に示すAl膜を用い、基板上にAl膜およびITO膜が順次成膜された積層試料(Al−ITO)を作製して耐ITOピンホール腐食性(ITOピンホール腐食密度低減効果)を調べた。
各試料について、上述したような輸送・保管状態を模擬して、60℃×90%RHの湿潤環境に500時間曝露するピンホール腐食試験を行い、この試験後の表面を、光学顕微鏡にて倍率1000倍で観察(観察範囲:8600μm2程度)し、存在する黒点の数をカウントして1mm2あたりの個数を算出し(任意の10視野の平均値)、試験後の黒点密度(ITOピンホール腐食密度)を求め、表3に併記した。
Claims (20)
- 基板上に配線膜または反射膜に用いられるAl合金膜を有し、
前記Al合金膜は、Taおよび/またはTi:0.01〜0.5原子%と、希土類元素:0.05〜2.0原子%と、を含有することを特徴とするAl合金膜。 - 前記希土類元素が、Nd、La、およびGdよりなる群から選択される少なくとも1種の元素である請求項1に記載のAl合金膜。
- 前記Al合金膜を1%の塩化ナトリウム水溶液に25℃で2時間浸漬した後、前記Al合金膜の表面を1000倍の光学顕微鏡で観察したとき、Al合金膜表面全面積に対するAl合金膜表面の腐食面積は10%以下に抑制されたものである請求項1または2に記載のAl合金膜。
- 基板上に、請求項1または2に記載のAl合金膜と、透明導電膜と、を有する配線構造において、基板側から、
前記Al合金膜および前記透明導電膜がこの順序で形成されているか、または
前記透明導電膜および前記Al合金膜がこの順序で形成されているものである配線構造。 - 前記Al合金膜と前記透明導電膜とは、直接接続されているものである請求項4に記載の配線構造。
- 基板側から順に、前記Al合金膜上の一部に、直接または高融点金属膜を介して、前記透明導電膜が形成されたAl−透明導電膜の積層試料について、1%の塩化ナトリウム水溶液に25℃で2時間浸漬した後における、透明導電膜が形成されていないAl合金膜の表面を1000倍の光学顕微鏡で観察したとき、前記透明導電膜が形成されていないAl合金膜表面全面積に対する、前記Al合金膜表面の腐食面積は10%以下に抑制されたものである請求項5に記載の配線構造。
- 基板側から順に、前記透明導電膜上に、直接若しくは高融点金属膜を介して、前記Al合金膜が形成されているか;または、前記透明導電膜上に、前記Al合金膜、および前記Al合金膜上の一部に高融点金属膜が順次形成された透明導電膜−Alの積層試料について、1%の塩化ナトリウム水溶液に25℃で2時間浸漬した後における前記Al合金膜の表面を1000倍の光学顕微鏡で観察したとき、前記Al合金膜表面全面積に対する、前記Al合金膜表面の腐食面積は10%以下に抑制されたものである請求項5に記載の配線構造。
- 基板側から順に、前記Al合金膜上に直接、透明導電膜が形成されたAl−透明導電膜の積層試料について、60℃で、相対湿度が90%の湿潤環境に500時間暴露した後に透明導電膜中のピンホールを介して形成されるピンホール腐食密度が、1000倍光学顕微鏡観察視野内に、40個/mm2以下である請求項5に記載の配線構造。
- 前記透明導電膜が、ITOまたはIZOである請求項4〜8のいずれかに記載の配線構造。
- 前記透明導電膜の膜厚は20〜120nmである請求項4〜9のいずれかに記載の配線構造。
- 請求項4〜10のいずれかに記載の配線構造を備えた薄膜トランジスタ。
- 請求項4〜10のいずれかに記載の配線構造を備えた反射膜。
- 請求項4〜10のいずれかに記載の配線構造を備えた有機EL用反射アノード電極。
- 請求項1〜3のいずれかに記載のAl合金膜を備えたタッチパネルセンサー。
- 請求項11に記載の薄膜トランジスタを備えた表示装置。
- 請求項12に記載の反射膜を備えた表示装置。
- 請求項13に記載の有機EL用反射アノード電極を備えた表示装置。
- 請求項14に記載のタッチパネルセンサーを備えた表示装置。
- 表示装置用の配線膜若しくは反射膜、またはタッチパネルセンサー用の配線膜の製造に用いられるスパッタリングターゲットであって、
Taおよび/またはTi:0.01〜0.5原子%と、希土類元素:0.05〜2.0原子%含と、を含み、残部:Alおよび不可避的不純物であることを特徴とするスパッタリングターゲット。 - 前記希土類元素が、Nd、La、およびGdよりなる群から選択される少なくとも1種の元素である請求項19に記載のスパッタリングターゲット。
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JP2011127711A JP5032687B2 (ja) | 2010-09-30 | 2011-06-07 | Al合金膜、Al合金膜を有する配線構造、およびAl合金膜の製造に用いられるスパッタリングターゲット |
CN201180041104.1A CN103069042B (zh) | 2010-09-30 | 2011-09-26 | Al合金膜、具有Al合金膜的配线结构以及Al合金膜的制造中使用的溅射靶 |
PCT/JP2011/071912 WO2012043490A1 (ja) | 2010-09-30 | 2011-09-26 | Al合金膜、Al合金膜を有する配線構造、およびAl合金膜の製造に用いられるスパッタリングターゲット |
US13/813,816 US20130136949A1 (en) | 2010-09-30 | 2011-09-26 | Aluminum alloy film, wiring structure having aluminum alloy film, and sputtering target used in producing aluminum alloy film |
KR1020137008122A KR20130063535A (ko) | 2010-09-30 | 2011-09-26 | Al 합금막, Al 합금막을 갖는 배선 구조 및 Al 합금막의 제조에 사용되는 스퍼터링 타깃 |
TW100135616A TWI453285B (zh) | 2010-09-30 | 2011-09-30 | An aluminum alloy film, a wiring structure having an aluminum alloy film, and a sputtering target for manufacturing an aluminum alloy film |
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JP6116186B2 (ja) * | 2012-10-19 | 2017-04-19 | 株式会社ジャパンディスプレイ | 表示装置 |
WO2014080933A1 (ja) * | 2012-11-21 | 2014-05-30 | 株式会社コベルコ科研 | 表示装置または入力装置に用いられる電極、および電極形成用スパッタリングターゲット |
WO2015118947A1 (ja) * | 2014-02-07 | 2015-08-13 | 株式会社神戸製鋼所 | フラットパネルディスプレイ用配線膜 |
JP6574714B2 (ja) * | 2016-01-25 | 2019-09-11 | 株式会社コベルコ科研 | 配線構造およびスパッタリングターゲット |
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