JP5007494B2 - 電子デバイスの製造方法 - Google Patents
電子デバイスの製造方法 Download PDFInfo
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- JP5007494B2 JP5007494B2 JP2005194646A JP2005194646A JP5007494B2 JP 5007494 B2 JP5007494 B2 JP 5007494B2 JP 2005194646 A JP2005194646 A JP 2005194646A JP 2005194646 A JP2005194646 A JP 2005194646A JP 5007494 B2 JP5007494 B2 JP 5007494B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims (1)
- 電子部品を用意する工程と、
パッケージの内底面に備えられた第1の内部端子及び第2の内部端子と、前記第1の内部端子に接続された外部端子と、パッケージの外底面に備えられ前記第2の内部端子に接続された接地用の外部実装端子と、を有するパッケージを用意する工程と、
前記パッケージの内底面に前記電子部品を搭載する工程と、
前記第1の内部端子と前記電子部品の制御パッドとを接続する第1の接続工程、或いは前記第1の内部端子と前記第2の内部端子とを接続する第2の接続工程のうちいずれか一方を選択して実施する工程を備え、
前記電子部品が接地用パッド及び前記制御パッドを有するときに、前記第1の接続工程を実施し、
前記電子部品が前記接地用パッドを有し且つ前記制御パッドを有しないときに、前記第2の接続工程を実施することを特徴とする電子デバイスの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194646A JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
US11/427,570 US7317246B2 (en) | 2005-07-04 | 2006-06-29 | Package for electronic device and method for manufacturing electronic device |
KR20060062256A KR100890074B1 (ko) | 2005-07-04 | 2006-07-04 | 전자 디바이스용 패키지 및 전자 디바이스의 제조 방법 |
CNB2006100957808A CN100464406C (zh) | 2005-07-04 | 2006-07-04 | 电子器件用封装及电子器件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194646A JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007013020A JP2007013020A (ja) | 2007-01-18 |
JP5007494B2 true JP5007494B2 (ja) | 2012-08-22 |
Family
ID=37588462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005194646A Expired - Fee Related JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7317246B2 (ja) |
JP (1) | JP5007494B2 (ja) |
KR (1) | KR100890074B1 (ja) |
CN (1) | CN100464406C (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5326400B2 (ja) | 2007-08-17 | 2013-10-30 | セントラル硝子株式会社 | 光学活性α−フルオロカルボン酸エステルの精製方法 |
JP5747574B2 (ja) | 2011-03-11 | 2015-07-15 | セイコーエプソン株式会社 | 圧電デバイス及び電子機器 |
JP2014036081A (ja) * | 2012-08-08 | 2014-02-24 | Seiko Epson Corp | 電子デバイスの製造方法、電子デバイス、電子機器、および移動体 |
JP2017022473A (ja) * | 2015-07-08 | 2017-01-26 | セイコーエプソン株式会社 | 振動子及びその製造方法、発振器、電子機器、並びに、移動体 |
US12009285B2 (en) * | 2019-04-22 | 2024-06-11 | Kyocera Corporation | Substrate having a recessed portion for an electronic component |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3487414B2 (ja) * | 1998-05-29 | 2004-01-19 | 富士通株式会社 | 弾性表面波フィルタ装置 |
JP3842444B2 (ja) * | 1998-07-24 | 2006-11-08 | 富士通株式会社 | 半導体装置の製造方法 |
JP3406846B2 (ja) | 1998-08-31 | 2003-05-19 | 京セラ株式会社 | 温度補償型水晶発振器 |
JP2003318653A (ja) * | 2002-04-24 | 2003-11-07 | Daishinku Corp | 圧電振動デバイス |
JP4045181B2 (ja) * | 2002-12-09 | 2008-02-13 | 沖電気工業株式会社 | 半導体装置 |
JP4251070B2 (ja) | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | 圧電発振器、電子部品、及び圧電発振器の製造方法 |
JP4244865B2 (ja) * | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
-
2005
- 2005-07-04 JP JP2005194646A patent/JP5007494B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-29 US US11/427,570 patent/US7317246B2/en active Active
- 2006-07-04 CN CNB2006100957808A patent/CN100464406C/zh not_active Expired - Fee Related
- 2006-07-04 KR KR20060062256A patent/KR100890074B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100464406C (zh) | 2009-02-25 |
CN1893036A (zh) | 2007-01-10 |
KR100890074B1 (ko) | 2009-03-24 |
US20070001288A1 (en) | 2007-01-04 |
JP2007013020A (ja) | 2007-01-18 |
KR20070004452A (ko) | 2007-01-09 |
US7317246B2 (en) | 2008-01-08 |
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