KR20070004452A - 전자 디바이스용 패키지 및 전자 디바이스의 제조 방법 - Google Patents
전자 디바이스용 패키지 및 전자 디바이스의 제조 방법 Download PDFInfo
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- KR20070004452A KR20070004452A KR20060062256A KR20060062256A KR20070004452A KR 20070004452 A KR20070004452 A KR 20070004452A KR 20060062256 A KR20060062256 A KR 20060062256A KR 20060062256 A KR20060062256 A KR 20060062256A KR 20070004452 A KR20070004452 A KR 20070004452A
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 6
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/3025—Electromagnetic shielding
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (5)
- 실장용 단자 이외에 외부 단자를 구비하는 전자 디바이스의 패키지로서,상기 실장 단자 이외의 외부 단자와 전기적으로 접속된 내부 단자와, 상기 내부 단자와 선택적으로 접속되는 그라운드 접속용의 외부 실장 단자에 접속된 내부 단자를 패키지 내에 배치한 것을 특징으로 하는 전자 디바이스용 패키지.
- 청구항 1에 있어서, 상기 실장 단자 이외의 외부 단자와 전기적으로 접속된 내부 단자와 상기 그라운드 접속용의 외부 실장 단자에 접속된 내부 단자와의 접속에 금속 와이어를 사용한 것을 특징으로 하는 전자 디바이스용 패키지.
- 실장용 단자 이외에 외부 단자를 구비하는 전자 디바이스의 패키지로서,상기 실장 단자 이외의 외부 단자와 전기적으로 접속된 내부 단자와, 그라운드 접속용의 외부 실장 단자에 접속된 내부 단자에 선택적으로 분할되는 1개의 내부 단자를 패키지 내에 배치한 것을 특징으로 하는 전자 디바이스용 패키지.
- 청구항 1 내지 청구항 3 중 어느 한 항에 있어서, 상기 실장 단자 이외의 외부 단자를 패키지의 뚜껑체로 한 것을 특징으로 하는 전자 디바이스용 패키지.
- 청구항 1 내지 청구항 3 중 어느 한 항에 기재된 전자 디바이스용 패키지를 사용해 전자 디바이스를 제조하는 방법으로서,패키지 내부에 탑재하는 전자 부품의 사양에 따라,전자 부품과 상기 실장 단자 이외의 외부 단자와 전기적으로 접속된 내부 단자와의 전기적 접속과, 상기 실장 단자 이외의 외부 단자와 전기적으로 접속된 내부 단자와 상기 그라운드 접속용의 외부 실장 단자에 접속된 내부 단자와의 전기적 접속을 선택적으로 실행하는 것을 특징으로 하는 전자 디바이스의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194646A JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
JPJP-P-2005-00194646 | 2005-07-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070004452A true KR20070004452A (ko) | 2007-01-09 |
KR100890074B1 KR100890074B1 (ko) | 2009-03-24 |
Family
ID=37588462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20060062256A KR100890074B1 (ko) | 2005-07-04 | 2006-07-04 | 전자 디바이스용 패키지 및 전자 디바이스의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7317246B2 (ko) |
JP (1) | JP5007494B2 (ko) |
KR (1) | KR100890074B1 (ko) |
CN (1) | CN100464406C (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5326400B2 (ja) | 2007-08-17 | 2013-10-30 | セントラル硝子株式会社 | 光学活性α−フルオロカルボン酸エステルの精製方法 |
JP5747574B2 (ja) | 2011-03-11 | 2015-07-15 | セイコーエプソン株式会社 | 圧電デバイス及び電子機器 |
JP2014036081A (ja) * | 2012-08-08 | 2014-02-24 | Seiko Epson Corp | 電子デバイスの製造方法、電子デバイス、電子機器、および移動体 |
JP2017022473A (ja) * | 2015-07-08 | 2017-01-26 | セイコーエプソン株式会社 | 振動子及びその製造方法、発振器、電子機器、並びに、移動体 |
US12009285B2 (en) * | 2019-04-22 | 2024-06-11 | Kyocera Corporation | Substrate having a recessed portion for an electronic component |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3487414B2 (ja) * | 1998-05-29 | 2004-01-19 | 富士通株式会社 | 弾性表面波フィルタ装置 |
JP3842444B2 (ja) * | 1998-07-24 | 2006-11-08 | 富士通株式会社 | 半導体装置の製造方法 |
JP3406846B2 (ja) | 1998-08-31 | 2003-05-19 | 京セラ株式会社 | 温度補償型水晶発振器 |
JP2003318653A (ja) * | 2002-04-24 | 2003-11-07 | Daishinku Corp | 圧電振動デバイス |
JP4045181B2 (ja) * | 2002-12-09 | 2008-02-13 | 沖電気工業株式会社 | 半導体装置 |
JP4251070B2 (ja) | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | 圧電発振器、電子部品、及び圧電発振器の製造方法 |
JP4244865B2 (ja) * | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
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2005
- 2005-07-04 JP JP2005194646A patent/JP5007494B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-29 US US11/427,570 patent/US7317246B2/en active Active
- 2006-07-04 CN CNB2006100957808A patent/CN100464406C/zh not_active Expired - Fee Related
- 2006-07-04 KR KR20060062256A patent/KR100890074B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100464406C (zh) | 2009-02-25 |
CN1893036A (zh) | 2007-01-10 |
JP5007494B2 (ja) | 2012-08-22 |
KR100890074B1 (ko) | 2009-03-24 |
US20070001288A1 (en) | 2007-01-04 |
JP2007013020A (ja) | 2007-01-18 |
US7317246B2 (en) | 2008-01-08 |
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