JP4996345B2 - アンテナ装置及び情報端末装置 - Google Patents
アンテナ装置及び情報端末装置 Download PDFInfo
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- JP4996345B2 JP4996345B2 JP2007144030A JP2007144030A JP4996345B2 JP 4996345 B2 JP4996345 B2 JP 4996345B2 JP 2007144030 A JP2007144030 A JP 2007144030A JP 2007144030 A JP2007144030 A JP 2007144030A JP 4996345 B2 JP4996345 B2 JP 4996345B2
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- ground
- antenna
- substrate
- main surface
- frequency circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Support Of Aerials (AREA)
- Details Of Aerials (AREA)
- Transceivers (AREA)
Description
次に、上述のように構成された本実施の形態の作用を説明する。実施例1と異なる点は、高周波回路であるICチップ58が多層基板75内に完全に内蔵されており、周囲を樹脂72で満たされている点であるが、作用・効果は実施例1と同様であり、重複した説明を省略する。
Claims (5)
- 絶縁基板の所定の主面に形成された導体パターンで形成されるアンテナエレメント部及びこのアンテナエレメント部と電気的に接続され前記絶縁基板の前記主面に形成されるグランドパターン部を有するアンテナ基板と、
前記アンテナ基板に形成された前記グランドパターン部の所定の主面に形成され、主面側に内層に形成された配線パターンが露出する開口を有し、前記グランドパターン部に一端が電気的に接続されるよう前記一主面から内層を貫通するように形成されるスルーホールが前記開口を囲うように複数配設され、前記スルーホールの複数の他端を電気的に連絡するとともに前記開口との間に前記配線パターンを挟む位置に設けられたグランドパターン層を有する多層配線基板と、を具備し、
前記アンテナ基板と前記多層配線基板とが、前記グランドパターン部と前記スルーホールの複数の他端とにおいて、電気的に接合されていることを特徴とするアンテナ装置。 - 前記配線パターンには、前記アンテナエレメント部で受信した受信信号を増幅する増幅器と、前記アンテナエレメント部に送信する送信信号を伝達して出力する送信経路又は前記増幅器を介して受信信号を出力する受信経路のいずれかの信号経路を選択するスイッチとを有するアクティブ回路が形成されたことを特徴とする請求項1記載のアンテナ装置。
- 前記配線パターンには、所定の周波数帯の搬送波を用いて信号の変調又は復調の少なくとも一方を行う無線通信制御部が形成されたことを特徴とする請求項1記載のアンテナ装置。
- アンテナエレメントと前記アンテナエレメントに接続されるグランド部とを有するアンテナ基板と、
前記アンテナ基板に形成された前記グランド部の所定の主面に形成され、高周波回路を内蔵するとともに、グランド層と複数のグランドビアとを有する多層基板とを備え、
前記グランド部は、前記高周波回路を挟んで前記グランド層に対向する位置に配置され、
前記複数のグランドビアは、前記多層基板を貫通して前記グランド部と前記グランド層とを電気的に接続するとともに、前記高周波回路を囲うように配置されることを特徴とするアンテナ装置。 - 請求項1乃至請求項4のいずれか1項記載のアンテナ装置と表示部とを内蔵する第1筐体部と、前記表示部に表示する情報を生成する処理部を内蔵する第2筐体部と、前記第1筐体部と前記第2筐体部とを相対的に回動可能に結合する連結部とを具備することを特徴とする情報端末装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007144030A JP4996345B2 (ja) | 2007-05-30 | 2007-05-30 | アンテナ装置及び情報端末装置 |
US12/129,087 US7728780B2 (en) | 2007-05-30 | 2008-05-29 | Antenna device and information terminal device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007144030A JP4996345B2 (ja) | 2007-05-30 | 2007-05-30 | アンテナ装置及び情報端末装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008301105A JP2008301105A (ja) | 2008-12-11 |
JP4996345B2 true JP4996345B2 (ja) | 2012-08-08 |
Family
ID=40087565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007144030A Active JP4996345B2 (ja) | 2007-05-30 | 2007-05-30 | アンテナ装置及び情報端末装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7728780B2 (ja) |
JP (1) | JP4996345B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324656A (ja) * | 2006-05-30 | 2007-12-13 | Nippon Sheet Glass Co Ltd | 車載用アンテナ装置 |
US8446334B2 (en) * | 2009-05-22 | 2013-05-21 | Galtronics Corporation Ltd. | Multi-antenna multiband system |
TWI432124B (zh) * | 2009-11-13 | 2014-03-21 | Advanced Int Multitech Co Ltd | A method of forming a notebook computer case and a product thereof |
KR101736862B1 (ko) * | 2010-06-29 | 2017-05-17 | 엘지전자 주식회사 | 이동 단말기의 케이스, 이를 구비하는 이동 단말기 및 이동 단말기의 케이스 제조 방법 |
DE102010063245A1 (de) * | 2010-12-16 | 2012-06-21 | Semikron Elektronik Gmbh & Co. Kg | Leiterplatte mit Schirmung |
JP5221729B2 (ja) | 2011-09-30 | 2013-06-26 | 株式会社東芝 | 電子機器 |
CN202917625U (zh) * | 2012-10-26 | 2013-05-01 | 中怡(苏州)科技有限公司 | 具有天线及屏蔽罩一体成型的通讯装置 |
US9839168B2 (en) * | 2015-01-30 | 2017-12-05 | Digi International Inc. | Systems and methods for serviceable EMI shielding |
WO2018016624A1 (ja) * | 2016-07-22 | 2018-01-25 | 京セラ株式会社 | Rfidタグ用基板、rfidタグおよびrfidシステム |
JP6807809B2 (ja) * | 2017-06-26 | 2021-01-06 | 京セラ株式会社 | Rfidタグ用基板、rfidタグおよびrfidシステム |
JP6913622B2 (ja) * | 2017-12-19 | 2021-08-04 | 京セラ株式会社 | Rfidタグ用基板、rfidタグおよびrfidシステム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0870216A (ja) * | 1994-08-26 | 1996-03-12 | Aisin Seiki Co Ltd | 平面アンテナ |
JP3783447B2 (ja) * | 1998-03-18 | 2006-06-07 | 株式会社村田製作所 | アンテナ装置及びそれを用いた携帯無線機 |
JP2001016027A (ja) * | 1999-06-30 | 2001-01-19 | Kyocera Corp | 積層型開口面アンテナ |
EP1126522A1 (en) * | 2000-02-18 | 2001-08-22 | Alcatel | Packaged integrated circuit with radio frequency antenna |
JP3630622B2 (ja) * | 2000-08-31 | 2005-03-16 | シャープ株式会社 | パターンアンテナ及びそれを備えた無線通信装置 |
JP3469880B2 (ja) * | 2001-03-05 | 2003-11-25 | ソニー株式会社 | アンテナ装置 |
JP2004335155A (ja) * | 2003-04-30 | 2004-11-25 | Hitachi Cable Ltd | アンテナ装置 |
JP2004363392A (ja) * | 2003-06-05 | 2004-12-24 | Hitachi Ltd | プリント配線基板および無線通信装置 |
JP4137724B2 (ja) * | 2003-07-04 | 2008-08-20 | 株式会社東芝 | アンテナ装置及び無線装置 |
JP2005086603A (ja) * | 2003-09-10 | 2005-03-31 | Tdk Corp | 電子部品モジュールおよびその製造方法 |
JP4241524B2 (ja) * | 2004-06-25 | 2009-03-18 | セイコーエプソン株式会社 | 無線通信端末 |
JP3898714B2 (ja) * | 2004-07-12 | 2007-03-28 | 株式会社東芝 | 無線装置 |
US7372408B2 (en) * | 2006-01-13 | 2008-05-13 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas |
JP2007243559A (ja) * | 2006-03-08 | 2007-09-20 | Mitsumi Electric Co Ltd | アンテナモジュール及びアンテナ装置 |
-
2007
- 2007-05-30 JP JP2007144030A patent/JP4996345B2/ja active Active
-
2008
- 2008-05-29 US US12/129,087 patent/US7728780B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7728780B2 (en) | 2010-06-01 |
JP2008301105A (ja) | 2008-12-11 |
US20080297422A1 (en) | 2008-12-04 |
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