JP4965393B2 - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置 Download PDFInfo
- Publication number
- JP4965393B2 JP4965393B2 JP2007223725A JP2007223725A JP4965393B2 JP 4965393 B2 JP4965393 B2 JP 4965393B2 JP 2007223725 A JP2007223725 A JP 2007223725A JP 2007223725 A JP2007223725 A JP 2007223725A JP 4965393 B2 JP4965393 B2 JP 4965393B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin substrate
- semiconductor element
- bonding wire
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
具体的には、樹脂基板には、切欠き部が形成され、半導体素子はこの切欠き部に配置されている。
このように、半導体素子を切欠き部に配置することで、切欠き部を構成する縁辺と半導体素子の端辺を対向させることができ、半導体素子と樹脂基板の導電部を接続するボンディングワイヤを短くすることができる。
Claims (2)
- 複数のリードと支持部を有するリードフレームと、
前記支持部に載せられ、ボンディングワイヤによって前記リードと接続される半導体素子と、
前記支持部に載せられ、前記半導体素子の少なくとも2つの端辺と対向する縁辺を備える共に、ボンディングワイヤが接続せれる導電部、及び制御回路素子が設けられた樹脂基板と、
前記樹脂基板、及び前記半導体素子を封止するモールド樹脂と、を備え、
前記樹脂基板には切欠き部が形成され、前記半導体素子が前記切欠き部に配置されることで前記半導体素子の2つの端辺と前記樹脂基板の縁辺が対向することを特徴とする樹脂封止型半導体装置。 - 前記樹脂基板には開口部が形成され、前記半導体素子は前記開口部に配置されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007223725A JP4965393B2 (ja) | 2007-08-30 | 2007-08-30 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007223725A JP4965393B2 (ja) | 2007-08-30 | 2007-08-30 | 樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009059759A JP2009059759A (ja) | 2009-03-19 |
JP4965393B2 true JP4965393B2 (ja) | 2012-07-04 |
Family
ID=40555271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007223725A Expired - Fee Related JP4965393B2 (ja) | 2007-08-30 | 2007-08-30 | 樹脂封止型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4965393B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024013998A1 (ja) * | 2022-07-15 | 2024-01-18 | 日立Astemo株式会社 | 半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160154A (ja) * | 1984-01-30 | 1985-08-21 | Nec Kansai Ltd | Hic |
JPS63244747A (ja) * | 1987-03-31 | 1988-10-12 | Toshiba Corp | 樹脂封止型集積回路装置及びその製造方法 |
JP3226672B2 (ja) * | 1993-07-09 | 2001-11-05 | 新電元工業株式会社 | 混成集積回路装置 |
JP2003309224A (ja) * | 2002-04-18 | 2003-10-31 | Hitachi Ltd | 半導体装置 |
JP3898156B2 (ja) * | 2003-06-02 | 2007-03-28 | 三菱電機株式会社 | 半導体パワーモジュール |
JP4244235B2 (ja) * | 2006-10-10 | 2009-03-25 | 株式会社日立製作所 | 電子回路装置 |
-
2007
- 2007-08-30 JP JP2007223725A patent/JP4965393B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2009059759A (ja) | 2009-03-19 |
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