JP4956609B2 - ファインピッチ電気接続アセンブリのための複合端子 - Google Patents
ファインピッチ電気接続アセンブリのための複合端子 Download PDFInfo
- Publication number
- JP4956609B2 JP4956609B2 JP2009501680A JP2009501680A JP4956609B2 JP 4956609 B2 JP4956609 B2 JP 4956609B2 JP 2009501680 A JP2009501680 A JP 2009501680A JP 2009501680 A JP2009501680 A JP 2009501680A JP 4956609 B2 JP4956609 B2 JP 4956609B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical connection
- connection assembly
- terminal
- housing
- composite terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connecting Device With Holders (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Description
52 複合端子
54 導電部材
56 ポリマー層
58 ポリマー層
60 第1インターフェース部分
62 第2インターフェース部分
66 係合特徴
70 はんだボール
Claims (27)
- 第1回路部材上の端子を第2回路部材上の端子に電気的に接続するための電気接続アセンブリであって、
電気接続アセンブリは、第1表面と第2表面の間に延在する多数の開口を有するハウジングと、多数の開口に位置決めされた多数の複合端子を有し、
複合端子は、中央部分及び少なくとも第1及び第2インターフェース部分を有する導電部材と、少なくとも中央部分の導電部材に沿って延在する1又は複数のポリマー層と、ハウジングに係合する1又は複数の連結特徴と、第1回路部材上の端子と機械的に連結するための第1インターフェース部分の近傍でポリマー層に形成された少なくとも1つの係合特徴とを有する、電気接続アセンブリ。 - ハウジングは、第1表面と第2表面の間に延在する多数の実質的に非成型の開口を形成する多数の層を有する、請求項1に記載の電気接続アセンブリ。
- ハウジングは、多数の実質的に非成型の開口を形成する多数の層を有し、少なくとも1つの複合端子は、少なくとも1つの実質的に非成型の開口とインターロッキング関係を形成する、請求項1に記載の電気接続アセンブリ。
- 圧縮力、はんだ、ウェッジ接合、導電接着剤、超音波接着、ワイヤボンディング、複合端子と第1回路部材との機械的連結、及び複合端子をハウジングに連結するオーバーモールド層の1又は複数を用いて、複合端子はハウジングの少なくとも1つの層に連結される、請求項1に記載の電気接続アセンブリ。
- 多数の開口は2次元アレーで配置される、請求項1に記載の電気接続アセンブリ。
- ハウジングは多数の層を有し、少なくとも1つの層は回路層を有する、請求項1に記載の電気接続アセンブリ。
- ハウジングは多数の層を有し、少なくとも1つの層は、少なくとも1つの複合端子に電気的に連結された回路層を有する、請求項1に記載の電気接続アセンブリ。
- ハウジングは多数の層を有し、少なくとも1つの層は、中央部分の近傍で少なくとも1つの複合端子に電気的に連結された回路層を有する、請求項1に記載の電気接続アセンブリ。
- 少なくとも1つの複合端子の連結特徴は、ハウジングとインターロッキング関係を形成する、請求項1に記載の電気接続アセンブリ。
- 少なくとも一部のハウジングはエラストマー材料からなる、請求項1に記載の電気接続アセンブリ。
- ハウジングの少なくとも1つの層は、多数の複合端子の周りに成型されたエラストマー材料からなる、請求項1に記載の電気接続アセンブリ。
- ポリマー層は導電部材を実質的に取り囲む、請求項1に記載の電気接続アセンブリ。
- 導電部材は対向するポリマー層の間に位置する、請求項1に記載の電気接続アセンブリ。
- 導電部材のサイドエッジの少なくとも一部は露出している、請求項1に記載の電気接続アセンブリ。
- 係合特徴は一組の対向するタブを有する、請求項1に記載の電気接続アセンブリ。
- 係合特徴は、第1回路部材上の端子に機械的に連結する穴、凹部、突起部又はとげの1つからなる、請求項1に記載の電気接続アセンブリ。
- 係合特徴は、第1回路部材上の端子とインターロッキング関係を形成する、請求項1に記載の電気接続アセンブリ。
- 係合特徴は、第1回路部材上の端子と圧縮関係を形成する、請求項1に記載の電気接続アセンブリ。
- 第1回路部材上の端子と、複合端子の第1インターフェース部分との機械的連結は、電気的連結の唯一の手段である、請求項1に記載の電気接続アセンブリ。
- 係合特徴は塑性変形し、第1回路部材上の端子と係合する、請求項1に記載の電気接続アセンブリ。
- 係合特徴は弾性変形し、第1回路部材上の端子と係合する、請求項1に記載の電気接続アセンブリ。
- 係合特徴は主にポリマー層からなる、請求項1に記載の電気接続アセンブリ。
- 第1回路部材上の端子ははんだ部材からなり、係合特徴ははんだ部材とインターロッキング係合を形成する、請求項1に記載の電気接続アセンブリ。
- 第2インターフェース部分はループを有する、請求項1に記載の電気接続アセンブリ。
- 複合端子は接地平面を有する、請求項1に記載の電気接続アセンブリ。
- 導電部材は、所定の機械的性質を与える形状を有する、請求項1に記載の電気接続アセンブリ。
- 複合端子の少なくとも中央部分を取り囲むスプリング部材を有する、請求項1に記載の電気接続アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US78403006P | 2006-03-20 | 2006-03-20 | |
US60/784,030 | 2006-03-20 | ||
PCT/US2007/064298 WO2007109608A2 (en) | 2006-03-20 | 2007-03-19 | Composite contact for fine pitch electrical interconnect assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009530797A JP2009530797A (ja) | 2009-08-27 |
JP4956609B2 true JP4956609B2 (ja) | 2012-06-20 |
Family
ID=38268726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009501680A Expired - Fee Related JP4956609B2 (ja) | 2006-03-20 | 2007-03-19 | ファインピッチ電気接続アセンブリのための複合端子 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8044502B2 (ja) |
JP (1) | JP4956609B2 (ja) |
KR (1) | KR101353650B1 (ja) |
DE (1) | DE112007000677T5 (ja) |
WO (1) | WO2007109608A2 (ja) |
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-
2007
- 2007-03-19 JP JP2009501680A patent/JP4956609B2/ja not_active Expired - Fee Related
- 2007-03-19 DE DE112007000677T patent/DE112007000677T5/de not_active Withdrawn
- 2007-03-19 KR KR1020087023049A patent/KR101353650B1/ko not_active IP Right Cessation
- 2007-03-19 WO PCT/US2007/064298 patent/WO2007109608A2/en active Application Filing
- 2007-03-19 US US12/293,499 patent/US8044502B2/en not_active Expired - Fee Related
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2011
- 2011-10-20 US US13/277,893 patent/US8232632B2/en active Active
Also Published As
Publication number | Publication date |
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DE112007000677T5 (de) | 2009-02-19 |
WO2007109608A2 (en) | 2007-09-27 |
JP2009530797A (ja) | 2009-08-27 |
KR20090017471A (ko) | 2009-02-18 |
KR101353650B1 (ko) | 2014-02-07 |
WO2007109608A3 (en) | 2007-11-15 |
US8232632B2 (en) | 2012-07-31 |
US8044502B2 (en) | 2011-10-25 |
US20090127698A1 (en) | 2009-05-21 |
US20120088378A1 (en) | 2012-04-12 |
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