CN106475651A - 微波器件焊接基体及微波器件 - Google Patents
微波器件焊接基体及微波器件 Download PDFInfo
- Publication number
- CN106475651A CN106475651A CN201611047335.4A CN201611047335A CN106475651A CN 106475651 A CN106475651 A CN 106475651A CN 201611047335 A CN201611047335 A CN 201611047335A CN 106475651 A CN106475651 A CN 106475651A
- Authority
- CN
- China
- Prior art keywords
- microwave device
- matrix
- welding groove
- welding
- welds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
- Arc Welding In General (AREA)
Abstract
Description
Claims (11)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611047335.4A CN106475651A (zh) | 2016-11-23 | 2016-11-23 | 微波器件焊接基体及微波器件 |
US16/463,443 US20190319370A1 (en) | 2016-11-23 | 2017-04-26 | Welding base for a microwave device and microwave device |
BR112019010605A BR112019010605A2 (pt) | 2016-11-23 | 2017-04-26 | base de soldagem para um dispositivo de micro-ondas e dispositivo de micro-ondas |
PCT/CN2017/081978 WO2018094965A1 (zh) | 2016-11-23 | 2017-04-26 | 微波器件焊接基体及微波器件 |
EP17873013.1A EP3546102A4 (en) | 2016-11-23 | 2017-04-26 | BASIC WELDING BODY OF MICROWAVE DEVICE AND MICROWAVE DEVICE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611047335.4A CN106475651A (zh) | 2016-11-23 | 2016-11-23 | 微波器件焊接基体及微波器件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106475651A true CN106475651A (zh) | 2017-03-08 |
Family
ID=58274246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611047335.4A Pending CN106475651A (zh) | 2016-11-23 | 2016-11-23 | 微波器件焊接基体及微波器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190319370A1 (zh) |
EP (1) | EP3546102A4 (zh) |
CN (1) | CN106475651A (zh) |
BR (1) | BR112019010605A2 (zh) |
WO (1) | WO2018094965A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107154808A (zh) * | 2017-05-17 | 2017-09-12 | 京信通信***(中国)有限公司 | 射频器件的封装结构及射频器件 |
WO2018094965A1 (zh) * | 2016-11-23 | 2018-05-31 | 京信通信技术(广州)有限公司 | 微波器件焊接基体及微波器件 |
WO2019100976A1 (zh) * | 2017-11-23 | 2019-05-31 | 温州宏丰电工合金股份有限公司 | 一种长条银石墨电接触材料与焊料带材快速复合制备方法 |
CN112271462A (zh) * | 2020-10-15 | 2021-01-26 | 皇裕精密冲件(昆山)有限公司 | 一种电容与母排的焊接连接结构 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021132574B3 (de) * | 2021-12-09 | 2022-11-24 | Telegärtner Karl Gärtner GmbH | Koaxialverbinder |
CN116408580B (zh) * | 2023-04-18 | 2023-09-19 | 武汉高能激光设备制造有限公司 | 一种开放式管道全位置焊接装置 |
Citations (6)
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JP2003197284A (ja) * | 2001-12-27 | 2003-07-11 | Nec Tokin Corp | Icモジュール接合方法及びそれを用いた非接触通信媒体 |
CN201596866U (zh) * | 2009-12-30 | 2010-10-06 | 恒昌行精密工业有限公司 | 固定装置的防溢锡结构 |
CN102714095A (zh) * | 2009-12-24 | 2012-10-03 | 三菱电机株式会社 | 电子元器件装置 |
CN104037475A (zh) * | 2014-01-28 | 2014-09-10 | 京信通信技术(广州)有限公司 | 腔体式微波器件 |
CN105470662A (zh) * | 2015-12-31 | 2016-04-06 | 京信通信技术(广州)有限公司 | 一种电缆焊接件、焊接结构及焊接方法 |
CN206200283U (zh) * | 2016-11-23 | 2017-05-31 | 京信通信技术(广州)有限公司 | 微波器件焊接基体及微波器件 |
Family Cites Families (16)
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CH283891A (fr) * | 1950-04-21 | 1952-06-30 | Genevoise Degrossissage D Or | Dispositif auto-soudant. |
DE3377097D1 (en) * | 1982-11-24 | 1988-07-21 | Huber+Suhner Ag | Pluggable connector and method of connecting it |
EP0241597B1 (en) * | 1982-12-01 | 1992-04-22 | Metcal Inc. | Electrical circuit containing fusible material and having intrinsic temperature control |
US4662703A (en) * | 1985-08-14 | 1987-05-05 | Amp Incorporated | Coaxial connector with improved retention of a center contact |
JP3132985B2 (ja) * | 1995-06-12 | 2001-02-05 | ソニー株式会社 | コンタクトにおける接続端子部構造 |
US6225206B1 (en) * | 1999-05-10 | 2001-05-01 | International Business Machines Corporation | Flip chip C4 extension structure and process |
US7553187B2 (en) * | 2006-01-31 | 2009-06-30 | 3M Innovative Properties Company | Electrical connector assembly |
US8044502B2 (en) * | 2006-03-20 | 2011-10-25 | Gryphics, Inc. | Composite contact for fine pitch electrical interconnect assembly |
US9320133B2 (en) * | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
TWI436710B (zh) * | 2011-02-09 | 2014-05-01 | Murata Manufacturing Co | Connection structure |
EP2705574B1 (en) * | 2011-05-03 | 2017-03-22 | CardioInsight Technologies, Inc. | High-voltage resistance cable termination |
DK2896270T4 (da) * | 2012-09-14 | 2020-06-08 | Saint Gobain | Rude med et elektrisk tilslutningselement |
CN203415727U (zh) * | 2013-08-30 | 2014-01-29 | 信维创科通信技术(北京)有限公司 | 同轴连接器及其连接端子 |
CN104882659B (zh) * | 2015-05-26 | 2017-11-28 | 摩比通讯技术(吉安)有限公司 | 腔体功分器及天线 |
CN105186253A (zh) * | 2015-08-20 | 2015-12-23 | 京信通信技术(广州)有限公司 | 可锡焊导体与非可锡焊基体焊接的实现方法、应用方法和连接结构 |
CN106475651A (zh) * | 2016-11-23 | 2017-03-08 | 京信通信技术(广州)有限公司 | 微波器件焊接基体及微波器件 |
-
2016
- 2016-11-23 CN CN201611047335.4A patent/CN106475651A/zh active Pending
-
2017
- 2017-04-26 EP EP17873013.1A patent/EP3546102A4/en not_active Withdrawn
- 2017-04-26 US US16/463,443 patent/US20190319370A1/en not_active Abandoned
- 2017-04-26 BR BR112019010605A patent/BR112019010605A2/pt not_active Application Discontinuation
- 2017-04-26 WO PCT/CN2017/081978 patent/WO2018094965A1/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197284A (ja) * | 2001-12-27 | 2003-07-11 | Nec Tokin Corp | Icモジュール接合方法及びそれを用いた非接触通信媒体 |
CN102714095A (zh) * | 2009-12-24 | 2012-10-03 | 三菱电机株式会社 | 电子元器件装置 |
CN201596866U (zh) * | 2009-12-30 | 2010-10-06 | 恒昌行精密工业有限公司 | 固定装置的防溢锡结构 |
CN104037475A (zh) * | 2014-01-28 | 2014-09-10 | 京信通信技术(广州)有限公司 | 腔体式微波器件 |
CN105470662A (zh) * | 2015-12-31 | 2016-04-06 | 京信通信技术(广州)有限公司 | 一种电缆焊接件、焊接结构及焊接方法 |
CN206200283U (zh) * | 2016-11-23 | 2017-05-31 | 京信通信技术(广州)有限公司 | 微波器件焊接基体及微波器件 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018094965A1 (zh) * | 2016-11-23 | 2018-05-31 | 京信通信技术(广州)有限公司 | 微波器件焊接基体及微波器件 |
CN107154808A (zh) * | 2017-05-17 | 2017-09-12 | 京信通信***(中国)有限公司 | 射频器件的封装结构及射频器件 |
CN107154808B (zh) * | 2017-05-17 | 2023-04-25 | 京信通信技术(广州)有限公司 | 射频器件的封装结构及射频器件 |
WO2019100976A1 (zh) * | 2017-11-23 | 2019-05-31 | 温州宏丰电工合金股份有限公司 | 一种长条银石墨电接触材料与焊料带材快速复合制备方法 |
US10818447B2 (en) | 2017-11-23 | 2020-10-27 | Wenzhou Hongfeng Electrical Alloy Co., Ltd | Preparation method of rapid composite of long silver-graphite electrical contact material and solder strip material |
CN112271462A (zh) * | 2020-10-15 | 2021-01-26 | 皇裕精密冲件(昆山)有限公司 | 一种电容与母排的焊接连接结构 |
CN112271462B (zh) * | 2020-10-15 | 2022-02-18 | 皇裕精密技术(苏州)有限公司 | 一种电容与母排的焊接连接结构 |
Also Published As
Publication number | Publication date |
---|---|
WO2018094965A1 (zh) | 2018-05-31 |
US20190319370A1 (en) | 2019-10-17 |
BR112019010605A2 (pt) | 2019-09-17 |
EP3546102A4 (en) | 2020-08-05 |
EP3546102A1 (en) | 2019-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200117 Address after: 510730 No. 6, layered Road, Guangzhou economic and Technological Development Zone, Guangdong Applicant after: Jingxin Communication Technology (Guangzhou) Co., Ltd. Address before: 510663 No. 6, layered Road, Guangzhou economic and Technological Development Zone, Guangdong Applicant before: Jingxin Communication Technology (Guangzhou) Co., Ltd. Applicant before: Jingxin Communication System (China) Co., Ltd. Applicant before: TIANJIN COMBA TELECOM SYSTEMS CO., LTD. |
|
TA01 | Transfer of patent application right | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170308 |
|
RJ01 | Rejection of invention patent application after publication |