JP4882235B2 - 電池保護用モジュール - Google Patents
電池保護用モジュール Download PDFInfo
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- JP4882235B2 JP4882235B2 JP2005020213A JP2005020213A JP4882235B2 JP 4882235 B2 JP4882235 B2 JP 4882235B2 JP 2005020213 A JP2005020213 A JP 2005020213A JP 2005020213 A JP2005020213 A JP 2005020213A JP 4882235 B2 JP4882235 B2 JP 4882235B2
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- 238000001514 detection method Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 6
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 18
- 229910001416 lithium ion Inorganic materials 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
- H02J7/00309—Overheat or overtemperature protection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
- H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/007—Regulation of charging or discharging current or voltage
- H02J7/007188—Regulation of charging or discharging current or voltage the charge cycle being controlled or terminated in response to non-electric parameters
- H02J7/007192—Regulation of charging or discharging current or voltage the charge cycle being controlled or terminated in response to non-electric parameters in response to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Battery Mounting, Suspending (AREA)
- Protection Of Static Devices (AREA)
- Secondary Cells (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
基板と、
充電制御用FETチップと、
放電制御用FETチップと、
充電時に電池に過大電圧が印加されると前記充電制御用FETチップをオフにする過充電検出機能と、
放電時に前記電池の電圧が所定電圧以下に降下すると前記放電制御用FETチップをオフにする過放電検出機能と、
前記充電制御用FETチップ又は前記放電制御用FETチップの温度が上昇して所定温度に到ったことを検出する温度検出部を備え、且つ、該温度検出部が所定温度に到ったことを検出したときに前記充電制御用FETチップ及び前記放電制御用FETチップをオフにする電池保護ICチップとを有し、
前記基板上に前記充電制御用FETチップと前記放電制御用FETチップとが並んで実装してあり、前記電池保護ICチップが前記充電制御用FETチップ及び前記放電制御用FETチップに近接させて配置してあることを特徴とする電池保護用モジュールである。
図2及び図3に示すように、電池保護モジュール110は、両面構造であるCOB対応プリント基板111のZ1側の面に、電池保護ICチップであるコントロールICチップ120、第1のFET−SWチップ121、第2のFET−SWチップ122、抵抗チップ123、コンデンサチップ124を有する。
図10に示すように、コントロールICチップ120は、充電時に異常が発生してリチウムイオン電池201に過大電圧が印加されると第1のFET−SWチップ121をオフにする過充電検出機能、放電時にリチウムイオン電池201の電圧が所定電圧以下に降下すると第2のFET−SWチップ122をオフにする過放電検出機能、短絡して大電流が流れたときに第1のFET−SWチップ121をオフにする過電流検出機能に加えて、温度が上昇して所定温度に到ったことを検出する温度検出機能を備えた構成である。
図1に示すように、上記構成の電池保護モジュール110は、各コーナ部の端子101−1、102−1、103−1、105−1を対応する端子101−2、102−2、103−2、105−2と半田付けされて、ベースプリント基板150の電池保護モジュール実装部151に実装してある。また、コネクタ部材160は、コネクタ部材実装部152に接着してあり、電池パックマイナス出力端子103及び電池パックプラス出力端子104の他端部103a、104aが夫々端子103−3、104−1と半田付けしてある。
電池パック200は、図8に示すように、携帯機器に装着されて、電池パックマイナス出力端子103及び電池パックプラス出力端子104を介して携帯機器と電気的に接続されて使用される。リチウムイオン電池201の電圧が所定電圧以下に降下して過放電となると第2のFET−SWチップ122がオフとされる。短絡等して大電流が流れて過電流となると第1のFET−SWチップ121がオフとされる。
110、110A 電池保護モジュール
111 COB対応プリント基板
120 コントロールICチップ
121 第1のFET−SWチップ
122 第2のFET−SWチップ
123 抵抗チップ
124 コンデンサチップ
127 合成樹脂部
130 リチウムイオン電池保護回路
300 コントロールICチップモジュール
301 基板
310 合成樹脂部
Claims (4)
- 基板と、
充電制御用FETチップと、
放電制御用FETチップと、
充電時に電池に過大電圧が印加されると前記充電制御用FETチップをオフにする過充電検出機能と、
放電時に前記電池の電圧が所定電圧以下に降下すると前記放電制御用FETチップをオフにする過放電検出機能と、
前記充電制御用FETチップ又は前記放電制御用FETチップの温度が上昇して所定温度に到ったことを検出する温度検出部を備え、且つ、該温度検出部が所定温度に到ったことを検出したときに前記充電制御用FETチップ及び前記放電制御用FETチップをオフにする電池保護ICチップとを有し、
前記基板上に前記充電制御用FETチップと前記放電制御用FETチップとが並んで実装してあり、前記電池保護ICチップが前記充電制御用FETチップ及び前記放電制御用FETチップに近接させて配置してあることを特徴とする電池保護用モジュール。 - 前記電池保護ICチップが前記充電制御用FETチップ及び前記放電制御用FETチップ上に重ねて搭載してある、請求項1に記載の電池保護用モジュール。
- 前記充電制御用FETチップ及び前記放電制御用FETチップとが並んで一体化されている構成である、請求項1又は2に記載の電池保護用モジュール。
- 前記電池保護ICチップの充電制御端子と前記充電制御用FETチップのゲート端子がワイヤにより接続され、
前記電池保護ICチップの放電制御端子と前記放電制御用FETチップのゲート端子がワイヤにより接続されている、請求項1から3のいずれか一項に記載の電池保護用モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005020213A JP4882235B2 (ja) | 2005-01-27 | 2005-01-27 | 電池保護用モジュール |
US11/181,060 US7592778B2 (en) | 2005-01-27 | 2005-07-14 | Battery protection IC chip |
KR1020050066581A KR101088768B1 (ko) | 2005-01-27 | 2005-07-22 | 전지보호ic칩 |
CN2005100871588A CN1812087B (zh) | 2005-01-27 | 2005-07-27 | 电池保护ic芯片 |
CN2009101180706A CN101527301B (zh) | 2005-01-27 | 2005-07-27 | 电池保护ic芯片模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005020213A JP4882235B2 (ja) | 2005-01-27 | 2005-01-27 | 電池保護用モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006210120A JP2006210120A (ja) | 2006-08-10 |
JP4882235B2 true JP4882235B2 (ja) | 2012-02-22 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005020213A Active JP4882235B2 (ja) | 2005-01-27 | 2005-01-27 | 電池保護用モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US7592778B2 (ja) |
JP (1) | JP4882235B2 (ja) |
KR (1) | KR101088768B1 (ja) |
CN (2) | CN101527301B (ja) |
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JP3534309B2 (ja) * | 2000-07-27 | 2004-06-07 | Necトーキン栃木株式会社 | 温度保護付き電池パック |
JP4566392B2 (ja) * | 2000-11-16 | 2010-10-20 | レノボ シンガポール プライヴェート リミテッド | 温度制御に伴うアクションレベルを決定する電池、電池パック、コンピュータ装置、電気機器、および電池の温度制御方法 |
JP4674401B2 (ja) * | 2001-01-23 | 2011-04-20 | パナソニック株式会社 | リチウムイオン電池の保護装置 |
JP4107881B2 (ja) * | 2002-05-30 | 2008-06-25 | 三洋電機株式会社 | パック電池 |
JP2004006524A (ja) | 2002-05-31 | 2004-01-08 | Mitsumi Electric Co Ltd | 温度センサ付きcobモジュール |
JP4186052B2 (ja) * | 2003-03-26 | 2008-11-26 | ミツミ電機株式会社 | 充電制御機能付き電池パック |
JP2004357440A (ja) * | 2003-05-29 | 2004-12-16 | Sanyo Electric Co Ltd | パック電池 |
US7274100B2 (en) * | 2003-06-23 | 2007-09-25 | International Rectifier Corporation | Battery protection circuit with integrated passive components |
-
2005
- 2005-01-27 JP JP2005020213A patent/JP4882235B2/ja active Active
- 2005-07-14 US US11/181,060 patent/US7592778B2/en active Active
- 2005-07-22 KR KR1020050066581A patent/KR101088768B1/ko active IP Right Grant
- 2005-07-27 CN CN2009101180706A patent/CN101527301B/zh active Active
- 2005-07-27 CN CN2005100871588A patent/CN1812087B/zh active Active
Also Published As
Publication number | Publication date |
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KR20060086804A (ko) | 2006-08-01 |
CN101527301B (zh) | 2011-01-26 |
KR101088768B1 (ko) | 2011-12-01 |
JP2006210120A (ja) | 2006-08-10 |
CN101527301A (zh) | 2009-09-09 |
US20060164041A1 (en) | 2006-07-27 |
US7592778B2 (en) | 2009-09-22 |
CN1812087A (zh) | 2006-08-02 |
CN1812087B (zh) | 2010-10-06 |
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