JP4866582B2 - 圧着機構 - Google Patents
圧着機構 Download PDFInfo
- Publication number
- JP4866582B2 JP4866582B2 JP2005253471A JP2005253471A JP4866582B2 JP 4866582 B2 JP4866582 B2 JP 4866582B2 JP 2005253471 A JP2005253471 A JP 2005253471A JP 2005253471 A JP2005253471 A JP 2005253471A JP 4866582 B2 JP4866582 B2 JP 4866582B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- flat plate
- flat
- sample
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002788 crimping Methods 0.000 title claims description 17
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
2・・・・・基板
3・・・・・ソルダパタン層
4・・・・・メタルバンプ
5・・・・・ガイド機構
6・・・・・圧着用上部プレート
7・・・・・ヒータ
8・・・・・圧着用ベースプレート
9・・・・・シリンダ
10・・・・・圧着機構
11・・・・・加圧ピストン
12・・・・・ピストンヘッド
13、30・・・・・加圧ライン
20・・・・・可変角ヘッド
21・・・・・可動中心軸線
31・・・・・圧力調整器
32・・・・・自動バルブ
Claims (2)
- 相対して平行配置された二体の圧着用平板の間に2枚の平板試料を配置し、一方の上記圧着用平板の少なくとも上記平板試料を押圧すべき領域内に複数本の加圧ピストンを設け、更に、上記複数本の加圧ピストンの先端面と上記平板試料との間に、変形が容易なシートを挿入し、上記シートを介して上記複数本の加圧ピストンと対向する側の圧着用平板と上記複数本の加圧ピストンとにより、上記の2枚の平板試料を押圧して圧着接合することを特徴とする圧着機構。
- 相対して平行配置された二体の圧着用平板の間に2枚の平板試料を配置し、一方の上記
圧着用平板の少なくとも上記平板試料を押圧すべき領域内に複数本の加圧ピストンを設け、更に、上記加圧ピストンの先端部分に可変角ヘッドを設け、
上記可変角ヘッドと対向する側の圧着用平板と上記可変角ヘッドとにより、2枚の上記平板試料を押圧して圧着接合する圧着機構であって、
上記可変角ヘッドが上記平板試料に接触した際には、平板試料面の傾斜角に倣って可変角ヘッド面と上記加圧ピストンの可動軸線とのなす角度が全方位的に可変できる「アオリ機構」を有する可変角ヘッドであることを特徴とする圧着機構。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005253471A JP4866582B2 (ja) | 2005-09-01 | 2005-09-01 | 圧着機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005253471A JP4866582B2 (ja) | 2005-09-01 | 2005-09-01 | 圧着機構 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007067273A JP2007067273A (ja) | 2007-03-15 |
JP2007067273A5 JP2007067273A5 (ja) | 2008-09-25 |
JP4866582B2 true JP4866582B2 (ja) | 2012-02-01 |
Family
ID=37929092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005253471A Active JP4866582B2 (ja) | 2005-09-01 | 2005-09-01 | 圧着機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4866582B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI550680B (zh) | 2009-09-28 | 2016-09-21 | 尼康股份有限公司 | Substrate pressurization device and its control method |
JP2013062431A (ja) * | 2011-09-14 | 2013-04-04 | Tokyo Electron Ltd | 接合装置、接合方法、接合システム、プログラム及びコンピュータ記憶媒体 |
JP5814805B2 (ja) * | 2012-01-18 | 2015-11-17 | 株式会社東芝 | 半導体装置の製造システムおよび製造方法 |
JP2013187393A (ja) * | 2012-03-08 | 2013-09-19 | Tokyo Electron Ltd | 貼り合わせ装置及び貼り合わせ方法 |
US10522385B2 (en) * | 2017-09-26 | 2019-12-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer table with dynamic support pins |
KR20210150035A (ko) * | 2020-06-03 | 2021-12-10 | 주식회사 엘지에너지솔루션 | 유체를 포함하는 가압장치 및 이를 이용한 전극 및 전극 및 전극조립체 제조방법 |
CN114466740A (zh) * | 2020-07-27 | 2022-05-10 | 株式会社 Lg新能源 | 加压设备、电池模块的制造装置及制造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10106907A (ja) * | 1996-10-01 | 1998-04-24 | Canon Inc | 固相接合方法 |
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2005
- 2005-09-01 JP JP2005253471A patent/JP4866582B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2007067273A (ja) | 2007-03-15 |
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