JP4800084B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 5
- 101100119059 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ERG25 gene Proteins 0.000 description 5
- 101100484930 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) VPS41 gene Proteins 0.000 description 5
- 101150079361 fet5 gene Proteins 0.000 description 5
- 101150015217 FET4 gene Proteins 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 101150073536 FET3 gene Proteins 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Description
10a 第1単体FET
11 第1FETのソースフィンガ電極(第1フィンガ電極)
12 第1FETのゲートフィンガ電極
16 第1FETソースバスライン(第1バスライン)
17 第1FETゲートバスライン
20 第2FET
20a 第2単体FET
21 第2FETのソースフィンガ電極(第2フィンガ電極)
22 第2FETのゲートフィンガ電極
23 第2FETのドレインフィンガ電極(第2フィンガ電極)
26 第2FETソースバスライン(第2バスライン)
27 第2FETゲートバスライン
28 第2FETドレインバスライン(第2バスライン)
30、31 共通フィンガ電極
32 共通バスライン
40 フィンガ部
42 バスライン部
Claims (6)
- ゲートフィンガ電極の両側に設けられた第1フィンガ電極および第2フィンガ電極を有する第1単位FETが複数並列に接続されて構成された第1FETと、
ゲートフィンガ電極の両側に設けられた第1フィンガ電極および第2フィンガ電極を有する第2単位FETが複数並列に接続されて構成された第2FETと、を具備し、
前記複数の第1単位FETのそれぞれの前記第2フィンガ電極と前記複数の第2単位FETのそれぞれの第1フィンガ電極とはそれぞれ共通フィンガ電極を構成し、
前記共通フィンガ電極は、前記第1FETのソースフィンガ電極および前記第2FETのドレインフィンガ電極であり、
前記第1単位FETの前記第1フィンガ電極、前記第2単位FETの前記第2フィンガ電極および前記共通フィンガ電極は前記第1FETおよび前記第2FETのゲート長方向に配置されてなることを特徴とする半導体装置。 - 前記第1FETの第1フィンガ電極は、前記第1フィンガ電極が接続される第1バスライン側が太く形成されており、
前記第2FETの第2フィンガ電極は、前記第2フィンガ電極が接続される第2バスライン側が太く形成されており、
前記共通フィンガ電極は、前記共通フィンガ電極が接続される共通バスライン側が太く形成されていることを特徴とする請求項1記載の半導体装置。 - 前記共通バスラインは、前記第1FETの前記第1フィンガ電極、前記第2FETの前記第2フィンガ電極および前記共通フィンガ電極に対し、前記第1バスラインおよび前記第2バスラインとは反対側に設けられることを特徴とする請求項2記載の半導体装置。
- ゲートフィンガ電極の両側に設けられた第1フィンガ電極および第2フィンガ電極を有する第1単位FETが複数並列に接続されて構成された第1FETと、ゲートフィンガ電極の両側に設けられた第1フィンガ電極および第2フィンガ電極を有する第2単位FETが複数並列に接続されて構成された第2FETと、を具備する半導体装置の製造方法において、
前記第1FETのゲートフィンガ電極および前記第2FETのゲートフィンガ電極を形成する工程と、
前記複数の第1単位FETのそれぞれの前記第2フィンガ電極と前記複数の第2単位FETのそれぞれの第1フィンガ電極とはそれぞれ共通フィンガ電極を構成し、前記共通フィンガ電極は、前記第1FETのソースフィンガ電極および前記第2FETのドレインフィンガ電極であり、前記第1FETの前記第1フィンガ電極、前記第2FETの前記第2フィンガ電極および前記共通フィンガ電極が前記第1FETおよび前記第2FETのゲート長方向に配置されるように、前記第1FETの第1フィンガ電極および第2フィンガ電極並びに前記第2FETの第1フィンガ電極および第2フィンガ電極を形成する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記第1FETの前記第1フィンガ電極は、前記第1フィンガ電極が接続される第1バスライン側が太く形成し、
前記第2FETの前記第2フィンガ電極は、前記第2フィンガ電極が接続される第2バスライン側が太く形成し、
前記共通フィンガ電極は、前記共通フィンガ電極が接続される共通バスライン側が太く形成することを特徴とする請求項4記載の半導体装置の製造方法。 - 前記共通バスラインは、前記第1FETの前記第1フィンガ電極、前記第2FETの前記第2フィンガ電極および前記共通フィンガ電極に対し、前記第1バスラインおよび前記第2バスラインとは反対側に形成されるように、前記共通バスライン、前記第1バスラインおよび前記第2バスラインを形成する工程を有することを特徴とする請求項5記載の半導体装置の製造方法。
Priority Applications (2)
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JP2006101123A JP4800084B2 (ja) | 2006-03-31 | 2006-03-31 | 半導体装置およびその製造方法 |
US11/727,962 US7560346B2 (en) | 2006-03-31 | 2007-03-29 | Semiconductor device and method of manufacturing the same |
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JP2006101123A JP4800084B2 (ja) | 2006-03-31 | 2006-03-31 | 半導体装置およびその製造方法 |
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JP2007273918A JP2007273918A (ja) | 2007-10-18 |
JP4800084B2 true JP4800084B2 (ja) | 2011-10-26 |
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JP (1) | JP4800084B2 (ja) |
Families Citing this family (31)
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US7982243B1 (en) * | 2006-05-05 | 2011-07-19 | Rf Micro Devices, Inc. | Multiple gate transistor architecture providing an accessible inner source-drain node |
JP2009054632A (ja) * | 2007-08-23 | 2009-03-12 | Fujitsu Ltd | 電界効果トランジスタ |
US8680579B2 (en) * | 2007-09-20 | 2014-03-25 | International Rectifier Corporation | Individually controlled multiple III-nitride half bridges |
JP5439727B2 (ja) * | 2008-03-06 | 2014-03-12 | 住友電気工業株式会社 | 半導体装置 |
WO2010070824A1 (ja) * | 2008-12-19 | 2010-06-24 | 株式会社アドバンテスト | 半導体装置、半導体装置の製造方法およびスイッチ回路 |
US8236640B2 (en) * | 2009-12-18 | 2012-08-07 | Intel Corporation | Method of fabricating a semiconductor device having gate finger elements extended over a plurality of isolation regions formed in the source and drain regions |
US8399912B2 (en) | 2010-02-16 | 2013-03-19 | International Rectifier Corporation | III-nitride power device with solderable front metal |
JP5648356B2 (ja) * | 2010-07-27 | 2015-01-07 | 住友電気工業株式会社 | 半導体装置 |
US8519916B2 (en) * | 2010-08-11 | 2013-08-27 | Sarda Technologies, Inc. | Low interconnect resistance integrated switches |
US9236378B2 (en) | 2010-08-11 | 2016-01-12 | Sarda Technologies, Inc. | Integrated switch devices |
US8896034B1 (en) * | 2010-08-11 | 2014-11-25 | Sarda Technologies, Inc. | Radio frequency and microwave devices and methods of use |
US8653565B1 (en) * | 2010-08-11 | 2014-02-18 | Sarda Technologies, Inc. | Mixed mode multiple switch integration of multiple compound semiconductor FET devices |
JP5701684B2 (ja) * | 2011-05-23 | 2015-04-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置 |
KR101299799B1 (ko) * | 2011-10-24 | 2013-08-23 | 숭실대학교산학협력단 | 멀티 게이트 트랜지스터 |
JP5985282B2 (ja) * | 2012-07-12 | 2016-09-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2015032786A (ja) * | 2013-08-06 | 2015-02-16 | 株式会社東芝 | 半導体装置 |
US9741653B2 (en) | 2013-09-18 | 2017-08-22 | Skyworks Solutions, Inc. | Devices and methods related to radio-frequency switches having reduced-resistance metal layout |
JP2016063167A (ja) * | 2014-09-19 | 2016-04-25 | 株式会社東芝 | 半導体装置 |
US10734330B2 (en) * | 2015-01-30 | 2020-08-04 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor devices having an electro-static discharge protection structure |
JP6299665B2 (ja) * | 2015-04-30 | 2018-03-28 | 三菱電機株式会社 | 電界効果トランジスタ |
JP6555082B2 (ja) * | 2015-10-30 | 2019-08-07 | 富士通株式会社 | 半導体装置 |
US10153306B2 (en) * | 2016-02-29 | 2018-12-11 | Skyworks Solutions, Inc. | Transistor layout with low aspect ratio |
US10410957B2 (en) * | 2016-03-31 | 2019-09-10 | Skyworks Solutions, Inc. | Body contacts for field-effect transistors |
US9774322B1 (en) | 2016-06-22 | 2017-09-26 | Sarda Technologies, Inc. | Gate driver for depletion-mode transistors |
JP6812764B2 (ja) * | 2016-11-29 | 2021-01-13 | 日亜化学工業株式会社 | 電界効果トランジスタ |
US10084109B1 (en) * | 2017-12-11 | 2018-09-25 | Win Semiconductors Corp. | Semiconductor structure for improving the gate adhesion and Schottky stability |
US10629526B1 (en) * | 2018-10-11 | 2020-04-21 | Nxp Usa, Inc. | Transistor with non-circular via connections in two orientations |
JP7177660B2 (ja) * | 2018-10-26 | 2022-11-24 | 株式会社東芝 | 半導体装置 |
KR102149388B1 (ko) * | 2018-11-27 | 2020-08-28 | 삼성전기주식회사 | 스택된 전계효과트랜지스터(fet)를 갖는 반도체 디바이스 |
EP3817045B1 (en) | 2019-10-31 | 2024-02-07 | Infineon Technologies Austria AG | Semiconductor device and inverter |
CN112331646A (zh) * | 2020-10-19 | 2021-02-05 | 海光信息技术股份有限公司 | 用于降低电容的电路结构、静电保护电路和电子设备 |
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JPH088264B2 (ja) * | 1988-06-30 | 1996-01-29 | 株式会社東芝 | 半導体集積回路 |
JPH03270023A (ja) * | 1990-03-19 | 1991-12-02 | Nec Corp | 電界効果トランジスタ |
JPH04298052A (ja) * | 1991-03-27 | 1992-10-21 | Toshiba Corp | 半導体装置 |
JPH06196947A (ja) * | 1992-12-25 | 1994-07-15 | Sumitomo Electric Ind Ltd | 直流オフセット電圧補償回路 |
JP3853855B2 (ja) * | 1995-03-15 | 2006-12-06 | 三菱電機株式会社 | 移相器 |
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JP4770115B2 (ja) * | 2003-12-24 | 2011-09-14 | 住友電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
TWI229354B (en) * | 2003-12-31 | 2005-03-11 | Via Tech Inc | Capacitor pair structure for increasing the match thereof |
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US20070228424A1 (en) | 2007-10-04 |
JP2007273918A (ja) | 2007-10-18 |
US7560346B2 (en) | 2009-07-14 |
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