JP6173528B1 - 電力変換器 - Google Patents
電力変換器 Download PDFInfo
- Publication number
- JP6173528B1 JP6173528B1 JP2016110701A JP2016110701A JP6173528B1 JP 6173528 B1 JP6173528 B1 JP 6173528B1 JP 2016110701 A JP2016110701 A JP 2016110701A JP 2016110701 A JP2016110701 A JP 2016110701A JP 6173528 B1 JP6173528 B1 JP 6173528B1
- Authority
- JP
- Japan
- Prior art keywords
- switching element
- power converter
- stub
- substrate
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000010355 oscillation Effects 0.000 claims abstract description 47
- 230000001629 suppression Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000007257 malfunction Effects 0.000 abstract description 6
- 230000003071 parasitic effect Effects 0.000 description 11
- 229910002601 GaN Inorganic materials 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000005549 size reduction Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/16—Modifications for eliminating interference voltages or currents
- H03K17/161—Modifications for eliminating interference voltages or currents in field-effect transistor switches
- H03K17/162—Modifications for eliminating interference voltages or currents in field-effect transistor switches without feedback from the output circuit to the control circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/1033—Gallium nitride [GaN]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inverter Devices (AREA)
- Electronic Switches (AREA)
- Semiconductor Integrated Circuits (AREA)
- Geometry (AREA)
Abstract
Description
以下、この発明の実施の形態1に係る電力変換器を図1から図3に基づいて説明する。
図1は実施の形態1の電力変換器に使用されるスイッチング素子の周辺の構成図を示し、インバータやコンバータなどの電力変換器は、複数のスイッチング素子11が正側電力端子と負側電力端子間にハーフブリッジ構成やフルブリッジ構成に接続されて構成される。
スイッチング素子11のドレイン端子Dに接続したスタブによる発振抑制原理を説明するため、まず、スタブがない場合の発振原理について説明する。
発振周波数fは、スイッチング素子11や基板パターン13等からなる回路一巡の寄生インダクタンス成分Lと、スイッチング素子11のドレインソース間の浮遊容量Cで決まり、以下の式(1)で求まる。
図3において、31はスタブ用の電線14(左端がスイッチング素子11との接続点、右端がスタブの先端部)、32は発振周波数の入射波、33は反射波である。また、スタブ用の電線14の長さは発振周波数の1/4波長とする。
このようにスタブ用の電線14は、スイッチング素子11の発振を抑制するので、発振抑制回路として機能する。
スタブ用の電線14は、上記ではドレイン端子Dに接続したが、スイッチング素子11のソース端子Sに接続してもよい。
以上のように、実施の形態1の発明は、スイッチング素子11のドレイン、ソース、ゲートのいずれかの端子に、スタブ用の電線14を有する発振抑制回路を接続するだけで、スナバ損失やスイッチング素子の損失を増やすことなく、スイッチング素子11の発振や
誤動作を抑制することができる。
次に、この発明の実施の形態2に係る電力変換器を図4から図6に基づいて説明する。
図4から図6は実施の形態2の電力変換器に使用されるスイッチング素子の周辺の各構成図を示し、インバータやコンバータなどの電力変換器は複数のスイッチング素子11が正側電力端子と負側電力端子間にブリッジ構成に接続されて構成される。なお、図4から図6において、図1と同じまたは相当する部分には同じ符号を付して、詳細な説明は省略する。
図4に示す通り、スタブ用の基板パターン44は、ドレイン端子Dが接続される基板パターン13から延長して渦巻き状に回路パターンを引くことで構成されている。
スタブ用の基板パターン44の先端は開放状態となっており、基板パターン44の長さは、発振周波数の1/4波長の奇数倍となっている。
このように構成することで、スタブ用の基板パターン44がスイッチング素子11の発振を抑制する発振抑制回路として機能し、また基板パターンの一部として構成されるので、回路基板12上の占有面積を抑制でき、電力変換器の小型化に効果的である。
なお、図4から図6においては、スタブ用の基板パターン44、54、64は、スイッチング素子11のドレイン端子Dが接続される基板パターン13に接続した例を示したが、実施の形態1でも説明したように、スイッチング素子11のソース端子Sまたはゲート端子Gが接続される基板パターン13に接続してもよい。
14:スタブ用電線(発振抑制回路)、44:スタブ用基板パターン(発振抑制回路)、54:スタブ用基板パターン(発振抑制回路)、64:スタブ用基板パターン、
65:スタブ用別基板、D:ドレイン端子、S:ソース端子、G:ゲート端子
Claims (8)
- スイッチング素子と、このスイッチング素子の端子に電気的に接続されたスタブを有する発振抑制回路を備え、前記スタブは発振周波数の1/4波長の奇数倍の長さを持ち、先端が開放された基板パターンで構成され、前記基板パターンは、前記スイッチング素子が実装された回路基板とは別基板の上に構成されたことを特徴とする電力変換器。
- 前記発振抑制回路は、前記スイッチング素子のドレイン端子に電気的に接続したことを特徴とする請求項1に記載の電力変換器。
- 前記発振抑制回路は、前記スイッチング素子のソース端子に電気的に接続したことを特徴とする請求項1に記載の電力変換器。
- 前記発振抑制回路は、前記スイッチング素子のゲート端子に電気的に接続したことを特徴とする請求項1に記載の電力変換器。
- 前記基板パターンは、複数の層で構成されたことを特徴とする請求項1から請求項4のいずれか1項に記載の電力変換器。
- 前記別基板の基材は、前記スイッチング素子が実装された回路基板の基材より高い誘電率を持つことを特徴とする請求項1から請求項4のいずれか1項に記載の電力変換器。
- 前記別基板の基材は、前記スイッチング素子が実装された回路基板の基材より薄いことを特徴とする請求項1から請求項4、請求項6のいずれか1項に記載の電力変換器。
- 前記スイッチング素子は、ワイドバンドギャップ半導体であることを特徴とする請求項1から請求項7のいずれか1項に記載の電力変換器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016110701A JP6173528B1 (ja) | 2016-06-02 | 2016-06-02 | 電力変換器 |
PCT/JP2016/083070 WO2017208477A1 (ja) | 2016-06-02 | 2016-11-08 | 電力変換器 |
US16/301,499 US10886247B2 (en) | 2016-06-02 | 2016-11-08 | Power converter |
EP16904101.9A EP3467871A4 (en) | 2016-06-02 | 2016-11-08 | POWER CONVERTER |
CN201680085911.6A CN109155283A (zh) | 2016-06-02 | 2016-11-08 | 功率转换器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016110701A JP6173528B1 (ja) | 2016-06-02 | 2016-06-02 | 電力変換器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6173528B1 true JP6173528B1 (ja) | 2017-08-02 |
JP2017216412A JP2017216412A (ja) | 2017-12-07 |
Family
ID=59505262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016110701A Active JP6173528B1 (ja) | 2016-06-02 | 2016-06-02 | 電力変換器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10886247B2 (ja) |
EP (1) | EP3467871A4 (ja) |
JP (1) | JP6173528B1 (ja) |
CN (1) | CN109155283A (ja) |
WO (1) | WO2017208477A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04299815A (ja) * | 1991-03-28 | 1992-10-23 | Murata Mfg Co Ltd | 複合電子部品 |
JPH09275303A (ja) * | 1996-04-04 | 1997-10-21 | Toshiba Corp | マイクロ波スイッチ |
JPH11150126A (ja) * | 1997-11-18 | 1999-06-02 | Nec Corp | 高出力電界効果トランジスタ |
JP2005353728A (ja) * | 2004-06-09 | 2005-12-22 | Mitsubishi Electric Corp | 高周波デバイス |
JP2014073958A (ja) * | 2013-11-22 | 2014-04-24 | Mitsubishi Chemicals Corp | 自立基板、およびその製造方法 |
JP2015126342A (ja) * | 2013-12-26 | 2015-07-06 | ローム株式会社 | パワー回路およびパワーモジュール |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5760650A (en) * | 1994-09-26 | 1998-06-02 | Endgate Corporation | Coplanar waveguide amplifier |
JP2798051B2 (ja) | 1996-03-29 | 1998-09-17 | 日本電気株式会社 | 電界効果トランジスタ |
JP3175763B2 (ja) * | 1998-10-06 | 2001-06-11 | 日本電気株式会社 | マイクロ波発振器 |
JP3598933B2 (ja) | 2000-02-28 | 2004-12-08 | 株式会社日立製作所 | 電力変換装置 |
WO2011111130A1 (ja) * | 2010-03-09 | 2011-09-15 | パナソニック株式会社 | 半導体装置 |
DE112014002405T5 (de) | 2013-05-16 | 2016-05-19 | Fuji Electric Co., Ltd | Halbleitervorrichtung |
-
2016
- 2016-06-02 JP JP2016110701A patent/JP6173528B1/ja active Active
- 2016-11-08 WO PCT/JP2016/083070 patent/WO2017208477A1/ja unknown
- 2016-11-08 US US16/301,499 patent/US10886247B2/en active Active
- 2016-11-08 EP EP16904101.9A patent/EP3467871A4/en active Pending
- 2016-11-08 CN CN201680085911.6A patent/CN109155283A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04299815A (ja) * | 1991-03-28 | 1992-10-23 | Murata Mfg Co Ltd | 複合電子部品 |
JPH09275303A (ja) * | 1996-04-04 | 1997-10-21 | Toshiba Corp | マイクロ波スイッチ |
JPH11150126A (ja) * | 1997-11-18 | 1999-06-02 | Nec Corp | 高出力電界効果トランジスタ |
JP2005353728A (ja) * | 2004-06-09 | 2005-12-22 | Mitsubishi Electric Corp | 高周波デバイス |
JP2014073958A (ja) * | 2013-11-22 | 2014-04-24 | Mitsubishi Chemicals Corp | 自立基板、およびその製造方法 |
JP2015126342A (ja) * | 2013-12-26 | 2015-07-06 | ローム株式会社 | パワー回路およびパワーモジュール |
Also Published As
Publication number | Publication date |
---|---|
US20190296735A1 (en) | 2019-09-26 |
WO2017208477A1 (ja) | 2017-12-07 |
EP3467871A1 (en) | 2019-04-10 |
JP2017216412A (ja) | 2017-12-07 |
US10886247B2 (en) | 2021-01-05 |
EP3467871A4 (en) | 2019-07-03 |
CN109155283A (zh) | 2019-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6909881B2 (ja) | フェライトビーズを有するスイッチング回路 | |
US9666569B2 (en) | Switch circuit of cascode type having high speed switching performance | |
JP4800084B2 (ja) | 半導体装置およびその製造方法 | |
JP5813781B2 (ja) | 半導体装置および電子機器 | |
JP6352555B1 (ja) | 半導体装置 | |
US10897249B1 (en) | Switching circuits having drain connected ferrite beads | |
KR20240017989A (ko) | 트랜지스터 레벨 입력 및 출력 고조파 종단들 | |
JP2020535701A (ja) | バイアスストリップを有するrf増幅器パッケージ | |
US20210408978A1 (en) | Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs | |
JP2018085613A (ja) | 半導体装置 | |
US11749578B2 (en) | Semiconductor module, power semiconductor module, and power electronic equipment using the semiconductor module or the power semiconductor module | |
JP6173528B1 (ja) | 電力変換器 | |
JP6164722B2 (ja) | 半導体装置 | |
JP2010199241A (ja) | 半導体装置 | |
CN108987379A (zh) | 具有集成谐波终止特征的半导体封装件 | |
WO2017043611A1 (ja) | パワーデバイス | |
JP6164721B2 (ja) | 半導体装置 | |
JP2008311527A (ja) | 高周波半導体回路 | |
WO2018181198A1 (ja) | 双方向スイッチ及びそれを備える双方向スイッチ装置 | |
JP2021069068A (ja) | 半導体装置 | |
TW202011674A (zh) | 緩衝器電路及功率半導體模組以及感應加熱用電源裝置 | |
JP5577296B2 (ja) | 半導体装置 | |
WO2021145133A1 (ja) | 電源装置、acfコンバータ、及びacアダプター | |
JP6352556B1 (ja) | 半導体装置 | |
KR102463221B1 (ko) | 전력용 반도체 모듈 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170606 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170704 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6173528 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |