JP4761952B2 - Rfidタグ - Google Patents
Rfidタグ Download PDFInfo
- Publication number
- JP4761952B2 JP4761952B2 JP2005360851A JP2005360851A JP4761952B2 JP 4761952 B2 JP4761952 B2 JP 4761952B2 JP 2005360851 A JP2005360851 A JP 2005360851A JP 2005360851 A JP2005360851 A JP 2005360851A JP 4761952 B2 JP4761952 B2 JP 4761952B2
- Authority
- JP
- Japan
- Prior art keywords
- rfid tag
- antenna
- chip
- microwave oven
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Electric Ovens (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Details Of Aerials (AREA)
Description
前記ICチップが吸熱材中に埋め込まれた構造を有することを特徴とするRFIDタグ。
110 ICチップ
120 アンテナ
200 RFIDタグ
210 ICチップ
220 アンテナ
230 ローパスフィルタ
Claims (4)
- 吸熱材と、前記吸熱材中に埋め込まれ、情報を記憶するためのICチップと、無線通信をおこなうためのアンテナと、マグネトロンが発生させる電磁波に対して前記アンテナが共振し難くなるように、前記アンテナに差し込まれ、マグネトロンが発生させる周波数帯の電磁波を遮断するローパスフィルタとを有することを特徴とするRFIDタグ。
- 前記吸熱材は、シリコン樹脂とセラミック樹脂の混合材であることを特徴とする請求項1に記載のRFIDタグ。
- 前記吸熱材は、シリカゲルを含むことを特徴とする請求項2に記載のRFIDタグ。
- 前記アンテナは、一部が他の部分よりも細い形状となっていることを特徴とする請求項1〜3のいずれか一つに記載のRFIDタグ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005360851A JP4761952B2 (ja) | 2005-12-14 | 2005-12-14 | Rfidタグ |
US11/391,287 US20070132593A1 (en) | 2005-12-14 | 2006-03-29 | RFID tag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005360851A JP4761952B2 (ja) | 2005-12-14 | 2005-12-14 | Rfidタグ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007164528A JP2007164528A (ja) | 2007-06-28 |
JP4761952B2 true JP4761952B2 (ja) | 2011-08-31 |
Family
ID=38138731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005360851A Expired - Fee Related JP4761952B2 (ja) | 2005-12-14 | 2005-12-14 | Rfidタグ |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070132593A1 (ja) |
JP (1) | JP4761952B2 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008061313A1 (en) * | 2006-11-24 | 2008-05-29 | Mems-Id Pty Ltd | Tagging methods and apparatus |
US9122967B2 (en) | 2010-04-14 | 2015-09-01 | Technologies Roi, Llc | Radio frequency identification tags and methods employing ceramic components, which may be suitable for use in extreme environmental conditions |
CA2857950A1 (en) * | 2011-03-18 | 2012-09-27 | Aita Llc | Thermally-armored radio-frequency identification device and method of producing same |
US20120244489A1 (en) * | 2011-03-25 | 2012-09-27 | Carnahan Robert D | Ultrasonic orthodontal monitoring system and method |
CN103762418A (zh) * | 2014-01-09 | 2014-04-30 | 东莞晶汇半导体有限公司 | 天线溅镀在射频模组表面上工艺 |
BR112019012930A8 (pt) * | 2016-12-29 | 2023-02-28 | Avery Dennison Retail Information Services Llc | Etiquetas rfid com estrutura de proteção para incorporação em embalagem de produtos alimentícios utilizável em micro-ondas |
CN109313716B (zh) * | 2017-04-20 | 2022-04-01 | 株式会社村田制作所 | 无线通信设备 |
JP2021522571A (ja) | 2018-04-20 | 2021-08-30 | アベリー・デニソン・リテイル・インフォメーション・サービシズ・リミテッド・ライアビリティ・カンパニーAvery Dennison Retail Information Services, Llc | 上部導体及び下部導体を有するrfidストラップ |
BR112020021423A2 (pt) | 2018-04-20 | 2021-01-19 | Avery Dennison Retail Information Services, Llc | Método de uso de correias de rfid blindadas com projetos de etiqueta de rfid |
JP2021522573A (ja) * | 2018-04-20 | 2021-08-30 | アベリー・デニソン・リテイル・インフォメーション・サービシズ・リミテッド・ライアビリティ・カンパニーAvery Dennison Retail Information Services, Llc | 電子レンジ対応の食品包装に組み込むための遮蔽型rfidタグ |
JP7022005B2 (ja) * | 2018-04-27 | 2022-02-17 | 旭化成株式会社 | Rfidタグ |
CN213904378U (zh) | 2018-06-13 | 2021-08-06 | 株式会社村田制作所 | 无线通信器件 |
JP7037520B2 (ja) | 2018-06-27 | 2022-03-16 | エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー | 高周波帯域で動作するrfidタグ |
JP6658975B1 (ja) * | 2018-07-13 | 2020-03-04 | 株式会社村田製作所 | 無線通信デバイス |
CN213878432U (zh) | 2018-07-13 | 2021-08-03 | 株式会社村田制作所 | 无线通信设备 |
JP6691580B2 (ja) * | 2018-07-17 | 2020-04-28 | 日本無線株式会社 | Rfidタグ |
WO2020021767A1 (ja) * | 2018-07-24 | 2020-01-30 | 株式会社村田製作所 | 無線通信デバイス |
JP6614401B1 (ja) | 2018-07-24 | 2019-12-04 | 株式会社村田製作所 | 無線通信デバイス |
WO2020031419A1 (ja) | 2018-08-09 | 2020-02-13 | 株式会社村田製作所 | 無線通信デバイス |
CN215732214U (zh) * | 2018-08-09 | 2022-02-01 | 株式会社村田制作所 | 无线通信设备 |
JP2020181338A (ja) * | 2019-04-24 | 2020-11-05 | 国立大学法人 東京大学 | Rfidタグ |
EP4359995A1 (en) * | 2021-06-24 | 2024-05-01 | Avery Dennison Retail Information Services LLC | Microwave tolerant rfid system and components |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2236233A (en) * | 1989-09-04 | 1991-03-27 | Philips Electronic Associated | Communicating information by radio;preventing communication overlap |
JP2844005B2 (ja) * | 1990-01-24 | 1999-01-06 | 大成建設株式会社 | 鋼管コンクリート構造部材における無耐火被覆の耐火構造 |
TW294702B (ja) * | 1994-03-08 | 1997-01-01 | Sumitomo Bakelite Co | |
JPH09241043A (ja) * | 1996-03-06 | 1997-09-16 | Furukawa Electric Co Ltd:The | 光ファイバの被覆方法 |
JPH1044657A (ja) * | 1996-08-08 | 1998-02-17 | Seiko Epson Corp | カード型電子機器 |
US5973599A (en) * | 1997-10-15 | 1999-10-26 | Escort Memory Systems | High temperature RFID tag |
US6434194B1 (en) * | 1997-11-05 | 2002-08-13 | Wherenet Corp | Combined OOK-FSK/PPM modulation and communication protocol scheme providing low cost, low power consumption short range radio link |
JP2000348152A (ja) * | 1999-06-09 | 2000-12-15 | Hitachi Ltd | 非接触icカード |
JP2001317741A (ja) * | 2000-02-28 | 2001-11-16 | Dainippon Printing Co Ltd | 食品の自動調理システムと電子レンジ |
JP2002049905A (ja) * | 2000-08-03 | 2002-02-15 | Dainippon Printing Co Ltd | 非接触データキャリア付きパッケージと製品情報管理方法 |
US6648232B1 (en) * | 2000-10-24 | 2003-11-18 | Moore North America, Inc. | High temperature tag having enclosed transceiver |
US6884833B2 (en) * | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
US7133739B2 (en) * | 2001-11-01 | 2006-11-07 | Salton, Inc. | Intelligent microwave oven |
JP2004138331A (ja) * | 2002-10-18 | 2004-05-13 | Hitachi Ltd | 無線タグ付き容器および食品調理器 |
JP2004158987A (ja) * | 2002-11-05 | 2004-06-03 | Yoshikawa Rf System Kk | データキャリア、リーダ/ライタ装置及びデータキャリアシステム |
KR101270180B1 (ko) * | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 검사장치 및 검사방법과, 반도체장치 제작방법 |
US7157675B2 (en) * | 2004-04-28 | 2007-01-02 | Imura International U.S.A. Inc. | Radio frequency identification controlled heatable objects |
-
2005
- 2005-12-14 JP JP2005360851A patent/JP4761952B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-29 US US11/391,287 patent/US20070132593A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070132593A1 (en) | 2007-06-14 |
JP2007164528A (ja) | 2007-06-28 |
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