JP4739198B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4739198B2 JP4739198B2 JP2006520504A JP2006520504A JP4739198B2 JP 4739198 B2 JP4739198 B2 JP 4739198B2 JP 2006520504 A JP2006520504 A JP 2006520504A JP 2006520504 A JP2006520504 A JP 2006520504A JP 4739198 B2 JP4739198 B2 JP 4739198B2
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
2 電極端子
4 配線
4a 電極パッド
6 第1の樹脂層
7 バリアメタル層
8 ハンダコア
9 第2の樹脂層
10 ハンダバンプ
Claims (1)
- (a)半導体基板の一面である表面に電子回路を形成し、該電子回路の電極端子を前記半導体基板上で配線を介して分散することにより再配置された電極パッドを形成する工程と、
(b)該半導体基板の他面である裏面側を研削する工程と、
(c)該半導体基板の研削した面に第1の樹脂層を形成する工程と、
(d)該第1の樹脂層を形成した後に、前記電極パッド上に、無電解メッキによりバリアメタル層を形成する工程と、
(e)該バリアメタル層上に、ハンダペーストを印刷し熱処理をすることにより、ハンダコアを形成する工程と、
(f)前記半導体基板の該ハンダコアを形成した表面側に第2の樹脂層を形成する工程と、
(g)該第2の樹脂層を研削して前記ハンダコアを露出させる工程と、
(h)前記露出したハンダコア上に、さらにハンダペーストを印刷し熱処理をすることにより、ハンダバンプを形成する工程
とを含み、
前記(c)工程を、前記半導体基板の切削した面に、有機溶液により溶解し得る樹脂からなり、前記半導体基板より大きい樹脂シートを貼り付け、該樹脂シートが貼り付けられた前記半導体基板を回転させながら、該半導体基板の表面側から有機溶剤を滴下させて、前記半導体基板と接着していない部分の前記樹脂シートを溶解して除去することにより、前記半導体基板の裏面全面に前記樹脂シートを貼り付け、該樹脂シートを硬化させることにより前記第1の樹脂層を形成することを特徴とする半導体装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/000586 WO2006077630A1 (ja) | 2005-01-19 | 2005-01-19 | 半導体装置の製造方法 |
Publications (2)
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JPWO2006077630A1 JPWO2006077630A1 (ja) | 2008-06-12 |
JP4739198B2 true JP4739198B2 (ja) | 2011-08-03 |
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Country Status (3)
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US (1) | US7326638B2 (ja) |
JP (1) | JP4739198B2 (ja) |
WO (1) | WO2006077630A1 (ja) |
Cited By (1)
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KR101844635B1 (ko) * | 2014-10-01 | 2018-04-02 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 구조물 및 이의 제조 방법 |
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---|---|---|---|---|
GB2444775B (en) * | 2006-12-13 | 2011-06-08 | Cambridge Silicon Radio Ltd | Chip mounting |
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JP2015018958A (ja) * | 2013-07-11 | 2015-01-29 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 実装構造体および実装構造体製造方法 |
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JP2001223232A (ja) * | 2000-02-08 | 2001-08-17 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2003338515A (ja) * | 2002-05-20 | 2003-11-28 | New Japan Radio Co Ltd | 半導体装置の製造方法 |
JP2004235612A (ja) * | 2003-01-08 | 2004-08-19 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
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JP3455948B2 (ja) | 2000-05-19 | 2003-10-14 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
JP4634045B2 (ja) * | 2003-07-31 | 2011-02-16 | 富士通株式会社 | 半導体装置の製造方法、貫通電極の形成方法、半導体装置、複合半導体装置、及び実装構造体 |
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JP2001223232A (ja) * | 2000-02-08 | 2001-08-17 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2003338515A (ja) * | 2002-05-20 | 2003-11-28 | New Japan Radio Co Ltd | 半導体装置の製造方法 |
JP2004235612A (ja) * | 2003-01-08 | 2004-08-19 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
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KR101844635B1 (ko) * | 2014-10-01 | 2018-04-02 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 구조물 및 이의 제조 방법 |
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WO2006077630A1 (ja) | 2006-07-27 |
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US7326638B2 (en) | 2008-02-05 |
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