JP4664675B2 - 密封封止 - Google Patents
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- JP4664675B2 JP4664675B2 JP2004532307A JP2004532307A JP4664675B2 JP 4664675 B2 JP4664675 B2 JP 4664675B2 JP 2004532307 A JP2004532307 A JP 2004532307A JP 2004532307 A JP2004532307 A JP 2004532307A JP 4664675 B2 JP4664675 B2 JP 4664675B2
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- 230000003287 optical effect Effects 0.000 claims description 41
- 238000004320 controlled atmosphere Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000011261 inert gas Substances 0.000 claims description 10
- 239000005387 chalcogenide glass Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 9
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- 125000006850 spacer group Chemical group 0.000 claims description 8
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 description 30
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
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- 238000007872 degassing Methods 0.000 description 10
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/068—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling parameters other than temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Radiation Pyrometers (AREA)
Description
(i) 電子装置を前記第1ハウジング部材(4)に固定するステップと、
(ii) 前記第1と第2のハウジング部材をそれらの間に気密シールが形成されるよう係合するステップとを有し、前記係合ステップは、制御された雰囲気中で行われることを特徴とする。
好ましくは、前記第1と第2のハウジング部材は、それらの間の締まり嵌めにより係合状態に保持される。
4 第1ハウジング部材
6 第2ハウジング部材
4,6 第1と第2のハウジング部材
8 電子装置
10 ベース部分
12 外部接続体
14 フィードスルー
16 シール
18 リング
20 光学素子
22 第2光学素子
Claims (29)
- 電子装置(8)を、互いに係合可能な第1と第2のハウジング部材(4,6)を含む包囲体(2)内に密封収納する方法において、
(i)電子装置(8)を前記第1ハウジング部材(4)に固定するステップと、
(ii)前記第1と第2のハウジング部材(4,6)の間にシール手段(16)を配置するステップと、
(iii)前記シール手段に隣接してスペーサ手段(18)を配置するステップと、
(iv)制御された雰囲気中で、前記第1と第2のハウジング部材(4,6)を、第1と第2のハウジング部材を締まり嵌めにより相互に係合し、それらの間に、前記シール手段によって気密シールが形成されるよう係合するステップと、
を有し、
前記スペーサ手段(18)は、係合するステップの間、前記シール手段の過剰圧縮を排除することを特徴とする電子装置を包囲体に密封包装する方法。 - 前記シール手段(16)は、金属、共融合金、エラストマ、接着剤の少なくとも1つを含むことを特徴とする請求項1に記載の方法。
- 前記シール手段(16)は、インディウム製シールを含むことを特徴とする請求項2記載の方法。
- 前記シール手段(16)は、圧縮性のエラストマリングを含むことを特徴とする請求項2に記載の方法。
- 前記第1と第2のハウジング部材(4,6)を係合する前に(iv)前記シール手段(16)を、前記第1と第2のハウジング部材(4,6)の少なくとも一方に形成する中間ステップを更に有することを特徴とする請求項1乃至4のいずれか一項に記載の方法。
- 前記包囲体(2)は、シール手段(16)を保持するために、シール手段(16)に隣接して配置された保持手段を有することを特徴とする請求項1乃至5のいずれか一項に記載の方法。
- 前記第2ハウジング部材(6)は、透過性の第1光学素子(20)と、第1ハウジング部材(4)に係合するよう適合した係合部分とを有することを特徴とする請求項1乃至6のいずれか一項に記載の方法。
- 前記気密シールは、第1ハウジング部材(4)と第1光学素子(20)との間でシール手段(16)を介して行われることを特徴とする請求項7に記載の方法。
- 前記第2ハウジング部材(6)は、透過性の第2光学素子(22)を収納することを特徴とする請求項7または8に記載の方法。
- 前記制御された雰囲気は、不活性ガスを含むことを特徴とする請求項1乃至9のいずれか一項に記載の方法。
- 前記制御された雰囲気は、真空を含むことを特徴とする請求項1乃至10のいずれか一項に記載の方法。
- 前記第1と第2のハウジング部材(4,6)を係合するステップは、前記ハウジング部材を接合するステップを含むことを特徴とする請求項1乃至11のいずれか一項に記載の方法。
- 前記接合するステップは、摩擦溶接、摩擦はんだの内の一方を含むことを特徴とする請求項12に記載の方法。
- 前記第1と第2のハウジング部材(4,6)は、円形の断面を有する金属製シリンダを含むことを特徴とする請求項1乃至13のいずれか一項に記載の方法。
- 内部が制御された雰囲気となった密封収納体(2)内に収納された電子素子(8)と第1ハウジング部材(4)と第2ハウジング部材(6)とを有し、
密封収納体は、前記第1と第2のハウジング部材(4,6)、第1と第2のハウジング部材(4,6)の間に配置されたシール手段(16)、及び前記シール手段(16)に隣接して配置されたスペーサ手段(18)を含み、第1と第2のハウジング部材(4,6)は、締まり嵌めにより相互に係合して保持され、前記シール手段を介して第1と第2のハウジングの間に係合密封シールを提供し、スペーサ手段は、前記シール手段の過剰圧縮を防止するために配置されることを特徴とする電子装置。 - 熱検出装置(8)を備える請求項15に記載の電子装置。
- 前記係合密封シールは、第1と第2のハウジング部材(4,6)の間の摩擦溶接を含むことを特徴とする請求項15又は16に記載の電子装置。
- 前記シール手段(16)は、金属、共融合金、エラストマ、接着剤の少なくとも1つを含むことを特徴とする請求項15乃至17のいずれか一項に記載の電子装置。
- 前記シール手段(16)は、インディウム・シールを含むことを特徴とする請求項18に記載の電子装置。
- 前記シール手段(16)は、圧縮性のエラストマリングを含むことを特徴とする請求項18に記載の電子装置。
- 前記密封収納体(2)は、シール手段(16)を保持するためにシール手段(16)に隣接して配置された保持手段を有することを特徴とする請求項15乃至20のいずれか一項に記載の電子装置。
- 前記第2ハウジング部材(6)は、透過生の第1光学素子(20)と、第1ハウジング部材(4)に係合するよう適合した係合部分とを有することを特徴とする請求項15乃至21のいずれか一項に記載の電子装置。
- 前記第1光学素子(20)は、レンズを含むことを特徴とする請求項22に記載の電子装置。
- 前記第1光学素子(20)は、カルコゲニドガラス、シリコン、ゲルマニウムの少なくとも1つを含むことを特徴とする請求項22または23に記載の電子装置。
- 前記第2ハウジング部材(6)は、透過性の第2光学素子(22)を含むことを特徴とする請求項22乃至24のいずれか一項に記載の電子装置。
- 前記第2光学素子(22)は、カルコゲニドガラスを含むことを特徴とする請求項25に記載の電子装置。
- 前記制御された雰囲気は、不活性ガスを含むことを特徴とする請求項15乃至26のいずれか一項に記載の電子装置。
- 前記制御された雰囲気は、真空を含むことを特徴とする請求項15乃至27のいずれか一項に記載の電子装置。
- 係合ステップの間、第2のハウジング部材(6)を第1のハウジング部材(4)に対して移動させることによって生じる摩擦発熱は、前記摩擦溶接又は摩擦はんだ付けをするために使用される、請求項13又は14のいずれか一項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0220274A GB2392555A (en) | 2002-09-02 | 2002-09-02 | Hermetic packaging |
PCT/GB2003/003737 WO2004020961A1 (en) | 2002-09-02 | 2003-09-01 | Hermetic packaging |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005537473A JP2005537473A (ja) | 2005-12-08 |
JP2005537473A5 JP2005537473A5 (ja) | 2006-10-05 |
JP4664675B2 true JP4664675B2 (ja) | 2011-04-06 |
Family
ID=9943288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004532307A Expired - Fee Related JP4664675B2 (ja) | 2002-09-02 | 2003-09-01 | 密封封止 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7348203B2 (ja) |
EP (1) | EP1552258B1 (ja) |
JP (1) | JP4664675B2 (ja) |
AU (1) | AU2003260750A1 (ja) |
GB (1) | GB2392555A (ja) |
WO (1) | WO2004020961A1 (ja) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004020858A1 (de) * | 2004-04-28 | 2005-11-24 | Siemens Ag | Sensoranordnung und Verfahren zum Herstellen einer Sensoranordnung |
DE102004028022B4 (de) * | 2004-06-09 | 2006-11-16 | Perkinelmer Optoelectronics Gmbh & Co.Kg | Sensor |
US20060023107A1 (en) * | 2004-08-02 | 2006-02-02 | Bolken Todd O | Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers |
US7429494B2 (en) * | 2004-08-24 | 2008-09-30 | Micron Technology, Inc. | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
GB0424934D0 (en) | 2004-11-12 | 2004-12-15 | Qinetiq Ltd | Infrared detector |
JP4453546B2 (ja) * | 2004-12-22 | 2010-04-21 | 日産自動車株式会社 | パッケージ素子 |
US8143095B2 (en) | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
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Also Published As
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EP1552258A1 (en) | 2005-07-13 |
EP1552258B1 (en) | 2016-03-09 |
WO2004020961A1 (en) | 2004-03-11 |
GB0220274D0 (en) | 2002-10-09 |
AU2003260750A1 (en) | 2004-03-19 |
US20060166407A1 (en) | 2006-07-27 |
JP2005537473A (ja) | 2005-12-08 |
GB2392555A (en) | 2004-03-03 |
US7348203B2 (en) | 2008-03-25 |
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