JP4545062B2 - 基板対基板コネクタ - Google Patents
基板対基板コネクタ Download PDFInfo
- Publication number
- JP4545062B2 JP4545062B2 JP2005224859A JP2005224859A JP4545062B2 JP 4545062 B2 JP4545062 B2 JP 4545062B2 JP 2005224859 A JP2005224859 A JP 2005224859A JP 2005224859 A JP2005224859 A JP 2005224859A JP 4545062 B2 JP4545062 B2 JP 4545062B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- terminal
- board
- protrusion
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 76
- 230000037431 insertion Effects 0.000 claims description 76
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 230000013011 mating Effects 0.000 claims description 6
- 239000010931 gold Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/42—Securing in a demountable manner
- H01R13/428—Securing in a demountable manner by resilient locking means on the contact members; by locking means on resilient contact members
- H01R13/432—Securing in a demountable manner by resilient locking means on the contact members; by locking means on resilient contact members by stamped-out resilient tongue snapping behind shoulder in base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
- H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Description
11 第1ハウジング
11a 底板部
12、33 凹溝部
13 凸条部
14 側壁部
14a 被把持部
14b ハウジング基準面
14c 係合部
15 第1端子収容キャビティ
16 第1端子収容溝
17 第1端子固定孔
21 第1端子
22 把持部
22a 第1脚部
22b 端子基準面
22c 第2脚部
22d 係合突起
22e、43 ソルダーテール部
22f 結合部
24 第1接続部
24a 第1立設部
24b 第1突出部
24c 第2立設部
24d 第2突出部
30 第2コネクタ
31 第2ハウジング
32 挿入凸部
41 第2端子
44 第2接続部
44a 先端部
44b 当接部
51、52 回路基板
302 端子
303 中間部
304 テール部
305 接続部
306 接続突起
307 凹部
308 固定部
309 固定用突起
Claims (5)
- (a)第1端子(21)が配設された挿入凹部(12)、及び、該挿入凹部(12)の一方の側面に隣接する側壁部(14)を備える第1コネクタ(10)と、
(b)前記第1端子(21)と接触する第2端子(41)が配設され、前記挿入凹部(12)に挿入される挿入凸部(32)を備え、前記第1コネクタ(10)と嵌合する第2コネクタ(30)とを有する基板対基板コネクタであって、
(c)前記側壁部(14)は、前記挿入凹部(12)側の部位に形成され、前記挿入凸部(32)の挿入方向に延在する第1端子固定孔(17)、及び、該第1端子固定孔(17)の前記挿入凹部(12)と反対側の面を含み、前記挿入凸部(32)の挿入方向に延在するハウジング基準面(14b)を備え、
(d)前記第1端子(21)は、
(d−1)前記挿入凹部(12)の、側壁部(14)と反対側に配設される第1突出部(24b)が形成された第1立設部(24a)、及び、前記挿入凹部(12)の、側壁部(14)側に配設される第2突出部(24d)が形成された第2立設部(24c)を備えるU字状の第1接続部(24)と、
(d−2)前記挿入凸部(32)の挿入方向に延在し、前記第2立設部(24c)と一体的に接続され、前記第2立設部(24c)の反対側に形成されて前記ハウジング基準面(14b)に接触する端子基準面(22b)、先端部が前記第1端子固定孔(17)に圧入される第1脚部(22a)、及び、前記挿入凸部(32)の挿入方向に延在し、前記第1脚部(22a)と協働して側壁部(14)を把持する第2脚部(22c)を備える倒立したU字状の把持部(22)とから成り、
(d−3)前記挿入凸部(32)の挿入方向に圧入されて第1コネクタ(10)に取付けられることを特徴とする基板対基板コネクタ。 - 前記第2脚部(22c)は係合突起(22d)を備え、前記側壁部(14)は、挿入凹部(12)と反対側の面に形成され前記係合突起(22d)と係合する係合部(14c)を備える請求項1に記載の基板対基板コネクタ。
- 前記第2脚部(22c)は先端に形成されたソルダーテール部(22e)を備える請求項1又は2に記載の基板対基板コネクタ。
- 前記第1端子(21)は、前記第2コネクタ(30)の挿入凸部(32)が挿入されると弾性変形して押広げられ、前記第1突出部(24b)及び第2突出部(24d)によって前記挿入凸部(32)を挟込む請求項1〜3のいずれか1項に記載の基板対基板コネクタ。
- (a)前記第1コネクタ(10)は前記第1端子(21)を収容する溝(15、16)を備え、
(b)前記第1端子(21)は、前記挿入凸部(32)の挿入方向に圧入されて、前記溝(15、16)内に収容される請求項1〜4のいずれか1項に記載の基板対基板コネクタ。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005224859A JP4545062B2 (ja) | 2005-08-03 | 2005-08-03 | 基板対基板コネクタ |
KR1020087004993A KR20080040745A (ko) | 2005-08-03 | 2006-08-03 | 회로 기판에 장착되는 기판 대 기판 커넥터 |
KR1020107017527A KR20100101007A (ko) | 2005-08-03 | 2006-08-03 | 회로 기판에 장착되는 기판 대 기판 커넥터 |
SE0800482A SE0800482L (sv) | 2005-08-03 | 2006-08-03 | Kort-till-kort-kontaktdon för montering på ett kretskort |
CN200680036919XA CN101305502B (zh) | 2005-08-03 | 2006-08-03 | 安装于电路板上的板对板连接器 |
US11/989,703 US7833024B2 (en) | 2005-08-03 | 2006-08-03 | Board-to-board connector for mounting on a circuit board |
PCT/US2006/030620 WO2007016706A2 (en) | 2005-08-03 | 2006-08-03 | Board-to-board connector for mounting on a circuit board |
FI20085168A FI20085168L (fi) | 2005-08-03 | 2008-02-25 | Piirilevylle asennettavien levyjen välinen liitin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005224859A JP4545062B2 (ja) | 2005-08-03 | 2005-08-03 | 基板対基板コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007042410A JP2007042410A (ja) | 2007-02-15 |
JP4545062B2 true JP4545062B2 (ja) | 2010-09-15 |
Family
ID=37547474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005224859A Active JP4545062B2 (ja) | 2005-08-03 | 2005-08-03 | 基板対基板コネクタ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7833024B2 (ja) |
JP (1) | JP4545062B2 (ja) |
KR (2) | KR20100101007A (ja) |
CN (1) | CN101305502B (ja) |
FI (1) | FI20085168L (ja) |
SE (1) | SE0800482L (ja) |
WO (1) | WO2007016706A2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4454036B2 (ja) * | 2007-06-06 | 2010-04-21 | ヒロセ電機株式会社 | 回路基板用雄電気コネクタ及び電気コネクタ組立体 |
JP4911735B2 (ja) * | 2009-08-18 | 2012-04-04 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
JP5486885B2 (ja) | 2009-09-14 | 2014-05-07 | モレックス インコーポレイテド | 電気コネクタおよびコネクタ |
DE102009056171A1 (de) * | 2009-11-27 | 2011-06-16 | Ept Gmbh & Co. Kg | Steckverbinder für elektrische und elektronische Schaltelemente |
JP5732250B2 (ja) * | 2010-12-28 | 2015-06-10 | 日本航空電子工業株式会社 | コネクタユニット及びコネクタ装置 |
US8888506B2 (en) * | 2013-01-29 | 2014-11-18 | Japan Aviation Electronics Industry, Limited | Connector |
KR20150084563A (ko) * | 2014-01-14 | 2015-07-22 | 삼성디스플레이 주식회사 | 커넥터 어셈블리 및 이를 갖는 표시장치 |
JP6327973B2 (ja) * | 2014-06-30 | 2018-05-23 | モレックス エルエルシー | コネクタ |
US9728872B2 (en) * | 2014-09-22 | 2017-08-08 | Xiaomi Inc | Connector plug, connector socket, and connector |
JP6537890B2 (ja) * | 2014-09-26 | 2019-07-03 | 日本航空電子工業株式会社 | コネクタ |
JP6591251B2 (ja) * | 2015-10-01 | 2019-10-16 | 日本航空電子工業株式会社 | コネクタ |
KR102606247B1 (ko) * | 2018-07-30 | 2023-11-27 | 삼성전자주식회사 | 도전성 핀의 적어도 일부를 지지하기 위한 지지 부분을 포함하는 커넥터 및 이를 포함하는 전자 장치 |
JP7353123B2 (ja) * | 2019-10-11 | 2023-09-29 | モレックス エルエルシー | コネクタ及びコネクタ組立体 |
KR102494901B1 (ko) * | 2020-05-13 | 2023-02-06 | 니혼 고꾸 덴시 고교 가부시끼가이샤 | 커넥터 조립체 및 커넥터 |
JP2023027599A (ja) * | 2021-08-17 | 2023-03-02 | I-Pex株式会社 | 電気コネクタ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001143801A (ja) * | 1999-11-11 | 2001-05-25 | Hirose Electric Co Ltd | 電気コネクタ |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3028199B2 (ja) | 1996-03-14 | 2000-04-04 | モレックス インコーポレーテッド | 電気コネクタのターミナル |
JP3617220B2 (ja) | 1996-11-26 | 2005-02-02 | 松下電工株式会社 | コネクタ |
TW428812U (en) | 1999-10-15 | 2001-04-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
CN2422738Y (zh) * | 2000-03-31 | 2001-03-07 | 富士康(昆山)电脑接插件有限公司 | 电连接器端子 |
JP2002008753A (ja) | 2000-06-16 | 2002-01-11 | Matsushita Electric Works Ltd | コネクタ |
US6729890B2 (en) | 2000-12-29 | 2004-05-04 | Molex Incorporated | Reduced-size board-to-board connector |
US6464515B1 (en) | 2001-11-28 | 2002-10-15 | Hon Hai Precision Ind. Co., Ltd. | High-speed board-to-board electrical connector |
JP3753687B2 (ja) | 2002-09-30 | 2006-03-08 | 日本航空電子工業株式会社 | コネクタ |
JP4116503B2 (ja) | 2002-11-01 | 2008-07-09 | モレックス インコーポレーテッド | 基板対基板型コネクタ |
TW559360U (en) | 2003-01-22 | 2003-10-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US6827588B1 (en) | 2003-06-12 | 2004-12-07 | Cheng Uei Precision Industry Co., Ltd. | Low profile board-to-board connector assembly |
US6793506B1 (en) | 2003-08-27 | 2004-09-21 | Molex Incorporated | Board-to-board electrical connector assembly |
US6764314B1 (en) * | 2003-09-24 | 2004-07-20 | Super Link Electronics Co., Ltd. | Multiple-contact micron connector |
JP3875677B2 (ja) | 2003-09-26 | 2007-01-31 | ヒロセ電機株式会社 | 電気コネクタ |
US7384274B1 (en) * | 2007-08-03 | 2008-06-10 | Cheng Uei Precision Industry Co., Ltd. | Board to board connector |
-
2005
- 2005-08-03 JP JP2005224859A patent/JP4545062B2/ja active Active
-
2006
- 2006-08-03 KR KR1020107017527A patent/KR20100101007A/ko not_active Application Discontinuation
- 2006-08-03 WO PCT/US2006/030620 patent/WO2007016706A2/en active Application Filing
- 2006-08-03 KR KR1020087004993A patent/KR20080040745A/ko not_active IP Right Cessation
- 2006-08-03 US US11/989,703 patent/US7833024B2/en active Active
- 2006-08-03 SE SE0800482A patent/SE0800482L/sv not_active Application Discontinuation
- 2006-08-03 CN CN200680036919XA patent/CN101305502B/zh not_active Expired - Fee Related
-
2008
- 2008-02-25 FI FI20085168A patent/FI20085168L/fi not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001143801A (ja) * | 1999-11-11 | 2001-05-25 | Hirose Electric Co Ltd | 電気コネクタ |
Also Published As
Publication number | Publication date |
---|---|
KR20100101007A (ko) | 2010-09-15 |
WO2007016706A3 (en) | 2007-04-12 |
CN101305502A (zh) | 2008-11-12 |
CN101305502B (zh) | 2012-05-30 |
US7833024B2 (en) | 2010-11-16 |
JP2007042410A (ja) | 2007-02-15 |
FI20085168L (fi) | 2008-02-25 |
US20090318029A1 (en) | 2009-12-24 |
KR20080040745A (ko) | 2008-05-08 |
SE0800482L (sv) | 2008-04-25 |
WO2007016706A2 (en) | 2007-02-08 |
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