JP4523051B2 - 配線回路基板の製造方法 - Google Patents
配線回路基板の製造方法 Download PDFInfo
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- JP4523051B2 JP4523051B2 JP2008123613A JP2008123613A JP4523051B2 JP 4523051 B2 JP4523051 B2 JP 4523051B2 JP 2008123613 A JP2008123613 A JP 2008123613A JP 2008123613 A JP2008123613 A JP 2008123613A JP 4523051 B2 JP4523051 B2 JP 4523051B2
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- plating
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- insulating layer
- terminal
- base insulating
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- 238000000034 method Methods 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000007747 plating Methods 0.000 claims description 135
- 229910052751 metal Inorganic materials 0.000 claims description 96
- 239000002184 metal Substances 0.000 claims description 96
- 239000000758 substrate Substances 0.000 claims description 81
- 238000005530 etching Methods 0.000 claims description 55
- 239000004020 conductor Substances 0.000 claims description 26
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 131
- 239000002585 base Substances 0.000 description 83
- 239000010408 film Substances 0.000 description 29
- 239000000725 suspension Substances 0.000 description 21
- 229920001721 polyimide Polymers 0.000 description 18
- 239000004642 Polyimide Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 239000010409 thin film Substances 0.000 description 14
- 239000002243 precursor Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
この方法では、積層工程において、カバー絶縁層を形成することにより、端子部を露出し、第1エッチング工程において、めっきリードと同時に端子部を露出させ、めっき工程において、露出させた端子部に、めっきリードから給電してめっきした後、第2エッチング工程において、めっきリードをエッチングする。
そのため、金属支持基板から端子部を露出させ、端子部をフライングリードとして形成する工程と同時に、第1エッチング工程を実施して、めっきリードを露出させ、次いで、金属支持基板を外形加工する工程と同時に、第2エッチング工程を実施して、めっきリードをエッチングすることができる。
その結果、めっきリードを除去する工程を独立の工程として設ける必要がなく、工数を低減して、生産効率の向上を図ることができる。
まず、厚み20μmのステンレス箔からなる金属支持基板を準備した(図3(a)参照)。
8 ベース絶縁層
9 導体パターン
10 カバー絶縁層
14 端子
16 めっきリード
24 端子側凹部
25 リード側凹部
Claims (3)
- 金属支持基板と、前記金属支持基板の上に形成されるベース絶縁層と、前記ベース絶縁層の上に形成され、端子部、前記端子部から連続する配線、および、前記端子部から連続するめっきリードを備える導体層と、前記端子部および前記めっきリードを露出し、前記配線を被覆するように、前記ベース絶縁層の上に形成されるカバー絶縁層とを形成する積層工程と、
前記端子部および前記めっきリードに対応する前記金属支持基板の下面を、前記端子部および前記めっきリードに対応する前記ベース絶縁層の下面が露出されるようにエッチングした後、前記端子部および前記めっきリードに対応するベース絶縁層の下面を、前記端子部および前記めっきリードの下面が露出されるようにエッチングして、前記金属支持基板および前記ベース絶縁層から、前記端子部と前記めっきリードとを同時に露出させる第1エッチング工程と、
前記第1エッチング工程後に、露出させた前記端子部に、前記めっきリードから給電してめっきするめっき工程と、
前記めっき工程後に、前記金属支持基板を外形加工すると同時に、露出させた前記めっきリードをエッチングして、前記めっきリードを切断する第2エッチング工程と
を備えることを特徴とする、配線回路基板の製造方法。 - 前記第1エッチング工程では、層厚方向に投影したときに、前記ベース絶縁層が形成されている範囲の内側において、前記金属支持基板をエッチングすることを特徴とする、請求項1に記載の配線回路基板の製造方法。
- 前記ベース絶縁層は、前記ベース絶縁層の上面から下側に凹む段部を有し、前記めっきリードは、前記段部を被覆するように屈曲形成されていることを特徴とする、請求項1または2に記載の配線回路基板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008123613A JP4523051B2 (ja) | 2008-05-09 | 2008-05-09 | 配線回路基板の製造方法 |
US12/453,243 US8460563B2 (en) | 2008-05-09 | 2009-05-04 | Producing method of wired circuit board |
CN200910137178.XA CN101578011B (zh) | 2008-05-09 | 2009-05-08 | 布线电路基板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008123613A JP4523051B2 (ja) | 2008-05-09 | 2008-05-09 | 配線回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009272549A JP2009272549A (ja) | 2009-11-19 |
JP4523051B2 true JP4523051B2 (ja) | 2010-08-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008123613A Active JP4523051B2 (ja) | 2008-05-09 | 2008-05-09 | 配線回路基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8460563B2 (ja) |
JP (1) | JP4523051B2 (ja) |
CN (1) | CN101578011B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5672911B2 (ja) * | 2010-01-25 | 2015-02-18 | 大日本印刷株式会社 | サスペンション用基板、外枠付サスペンション用基板、サスペンション用基板の製造方法、外枠付サスペンション用基板の製造方法、サスペンション、素子付サスペンションおよびハードディスクドライブ |
JP5528273B2 (ja) * | 2010-09-16 | 2014-06-25 | 日東電工株式会社 | 配線回路基板、配線回路基板集合体シートおよびその製造方法 |
JP6029835B2 (ja) * | 2012-03-02 | 2016-11-24 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP6139059B2 (ja) * | 2012-03-02 | 2017-05-31 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法 |
JP5273271B1 (ja) * | 2012-03-12 | 2013-08-28 | 大日本印刷株式会社 | 支持枠付サスペンション用基板 |
JP6280828B2 (ja) * | 2014-07-07 | 2018-02-14 | 日東電工株式会社 | 回路付サスペンション基板 |
WO2016143179A1 (ja) * | 2015-03-10 | 2016-09-15 | オリンパス株式会社 | 内視鏡用撮像装置 |
JP7072356B2 (ja) * | 2016-10-06 | 2022-05-20 | 日東電工株式会社 | 異方導電性シート |
JP6778585B2 (ja) * | 2016-11-02 | 2020-11-04 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP7481794B2 (ja) * | 2017-10-18 | 2024-05-13 | 日東電工株式会社 | ロール体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001251049A (ja) * | 2000-03-03 | 2001-09-14 | Mitsui Chemicals Inc | 金属ベース配線板の製造方法 |
JP2001358257A (ja) * | 2000-06-16 | 2001-12-26 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2003031915A (ja) * | 2001-07-17 | 2003-01-31 | Nitto Denko Corp | 配線回路基板 |
JP2003101195A (ja) * | 2001-09-26 | 2003-04-04 | Nec Toppan Circuit Solutions Inc | 半導体装置用基板及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1106788C (zh) * | 1996-02-13 | 2003-04-23 | 日东电工株式会社 | 电路基片 |
JPH10265572A (ja) | 1996-02-13 | 1998-10-06 | Nitto Denko Corp | 回路基板、回路付きサスペンション基板及びそれらの製造方法 |
CN1090200C (zh) * | 1996-02-13 | 2002-09-04 | 日东电工株式会社 | 电路基片,形成电路的支承基片及其生产方法 |
JP2002060490A (ja) * | 1999-12-10 | 2002-02-26 | Nitto Denko Corp | ポリアミド酸とそれより得られるポリイミド樹脂とそれらの回路基板への利用 |
JP4028477B2 (ja) * | 2003-12-04 | 2007-12-26 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
JP4187687B2 (ja) * | 2004-06-22 | 2008-11-26 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
JP4093258B2 (ja) * | 2005-09-06 | 2008-06-04 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
JP4843447B2 (ja) * | 2006-03-31 | 2011-12-21 | 株式会社東芝 | 半導体装置とそれを用いたメモリカード |
-
2008
- 2008-05-09 JP JP2008123613A patent/JP4523051B2/ja active Active
-
2009
- 2009-05-04 US US12/453,243 patent/US8460563B2/en active Active
- 2009-05-08 CN CN200910137178.XA patent/CN101578011B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001251049A (ja) * | 2000-03-03 | 2001-09-14 | Mitsui Chemicals Inc | 金属ベース配線板の製造方法 |
JP2001358257A (ja) * | 2000-06-16 | 2001-12-26 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2003031915A (ja) * | 2001-07-17 | 2003-01-31 | Nitto Denko Corp | 配線回路基板 |
JP2003101195A (ja) * | 2001-09-26 | 2003-04-04 | Nec Toppan Circuit Solutions Inc | 半導体装置用基板及びその製造方法 |
Also Published As
Publication number | Publication date |
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JP2009272549A (ja) | 2009-11-19 |
US20090277868A1 (en) | 2009-11-12 |
CN101578011A (zh) | 2009-11-11 |
US8460563B2 (en) | 2013-06-11 |
CN101578011B (zh) | 2013-02-13 |
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