JP4441886B2 - 高周波モジュール - Google Patents
高周波モジュール Download PDFInfo
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- JP4441886B2 JP4441886B2 JP2006099064A JP2006099064A JP4441886B2 JP 4441886 B2 JP4441886 B2 JP 4441886B2 JP 2006099064 A JP2006099064 A JP 2006099064A JP 2006099064 A JP2006099064 A JP 2006099064A JP 4441886 B2 JP4441886 B2 JP 4441886B2
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- conductor layer
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- 239000004020 conductor Substances 0.000 claims description 594
- 239000000758 substrate Substances 0.000 claims description 86
- 230000005540 biological transmission Effects 0.000 claims description 45
- 238000000926 separation method Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 138
- 238000010897 surface acoustic wave method Methods 0.000 description 104
- 230000008054 signal transmission Effects 0.000 description 38
- 230000009977 dual effect Effects 0.000 description 33
- 239000003989 dielectric material Substances 0.000 description 13
- 238000004088 simulation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000001413 cellular effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Transceivers (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (3)
- 交互に積層された複数の誘電体層および複数の導体層と、積層方向における両側に配置された第1および第2の面と、前記第1の面に配置された端子とを有する積層基板と、
フィルタと、
前記フィルタと前記端子とに接続された、前記端子に接続される外部回路と前記フィルタとのインピーダンス整合のための整合用素子とを備え、
前記フィルタと整合用素子は前記第2の面に搭載され、
前記複数の導体層は、前記フィルタと整合用素子を接続するための第1の導体層と、前記第1の導体層よりも前記第1の面に近い位置に配置され、前記端子に接続された第2の導体層とを含み、
前記積層基板は、更に、それぞれ積層基板内に設けられた1つ以上のスルーホールを用いて構成され、前記第1の導体層と第2の導体層とを接続する並列の複数の信号経路と、前記第2の導体層と前記端子とを接続するための1つ以上のスルーホールとを有することを特徴とする高周波モジュール。 - アンテナに接続されるアンテナ端子と、
受信信号を出力する受信信号端子と、
送信信号が入力される送信信号端子と、
前記アンテナ端子と前記受信信号端子および送信信号端子との間に配置され、前記受信信号と送信信号を分離する分離回路と、
前記分離回路と前記受信信号端子との間に設けられたフィルタと、
前記フィルタと前記受信信号端子とに接続された、前記受信信号端子に接続される外部回路と前記フィルタとのインピーダンス整合のための整合用素子と、
上記各要素を一体化する積層基板とを備えた高周波モジュールであって、
前記積層基板は、交互に積層された複数の誘電体層および複数の導体層と、積層方向における両側に配置された第1および第2の面とを有し、
前記受信信号端子は前記第1の面に配置され、
前記フィルタと整合用素子は前記第2の面に搭載され、
前記複数の導体層は、前記フィルタと整合用素子を接続するための第1の導体層と、前記第1の導体層よりも前記第1の面に近い位置に配置され、前記受信信号端子に接続された第2の導体層とを含み、
前記積層基板は、更に、それぞれ積層基板内に設けられた1つ以上のスルーホールを用いて構成され、前記第1の導体層と第2の導体層とを接続する並列の複数の信号経路と、前記第2の導体層と前記受信信号端子とを接続するための1つ以上のスルーホールとを有することを特徴とする高周波モジュール。 - 前記フィルタは、弾性波素子を用いて構成されていることを特徴とする請求項2記載の高周波モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006099064A JP4441886B2 (ja) | 2006-03-31 | 2006-03-31 | 高周波モジュール |
US11/723,359 US7612634B2 (en) | 2006-03-31 | 2007-03-19 | High frequency module utilizing a plurality of parallel signal paths |
EP07005727A EP1841297B1 (en) | 2006-03-31 | 2007-03-20 | High frequency module |
DE602007004372T DE602007004372D1 (de) | 2006-03-31 | 2007-03-20 | Hochfrequenzmodul |
CNA2007100921478A CN101047398A (zh) | 2006-03-31 | 2007-04-02 | 高频模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006099064A JP4441886B2 (ja) | 2006-03-31 | 2006-03-31 | 高周波モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007274471A JP2007274471A (ja) | 2007-10-18 |
JP4441886B2 true JP4441886B2 (ja) | 2010-03-31 |
Family
ID=38282115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006099064A Expired - Fee Related JP4441886B2 (ja) | 2006-03-31 | 2006-03-31 | 高周波モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US7612634B2 (ja) |
EP (1) | EP1841297B1 (ja) |
JP (1) | JP4441886B2 (ja) |
CN (1) | CN101047398A (ja) |
DE (1) | DE602007004372D1 (ja) |
Families Citing this family (30)
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WO2009157283A1 (ja) * | 2008-06-25 | 2009-12-30 | 株式会社村田製作所 | 高周波モジュール |
JP5126011B2 (ja) * | 2008-11-17 | 2013-01-23 | Tdk株式会社 | 平衡出力型トリプレクサ |
JP5636662B2 (ja) * | 2009-10-07 | 2014-12-10 | 株式会社村田製作所 | 高周波モジュール |
JP5018858B2 (ja) * | 2009-10-27 | 2012-09-05 | 株式会社村田製作所 | 高周波モジュール |
US8289217B2 (en) * | 2010-06-04 | 2012-10-16 | GM Global Technology Operations LLC | In-vehicle antenna system and method |
JP4883250B2 (ja) | 2010-06-11 | 2012-02-22 | 株式会社村田製作所 | デュアルバンド弾性表面波フィルタ及び複合高周波部品 |
WO2012043429A1 (ja) * | 2010-09-29 | 2012-04-05 | 株式会社村田製作所 | 高周波モジュール |
CN103155427B (zh) * | 2010-09-29 | 2015-11-25 | 株式会社村田制作所 | 高频模块 |
JP5553116B2 (ja) * | 2011-02-04 | 2014-07-16 | 株式会社村田製作所 | デュプレクサモジュール |
JP5534107B2 (ja) * | 2011-07-25 | 2014-06-25 | 株式会社村田製作所 | ベアチップ実装構造の電子部品およびその製造方法並びにベアチップ実装構造の電子部品を備える複合モジュール並びにその製造方法 |
JP5933355B2 (ja) * | 2012-06-12 | 2016-06-08 | 太陽誘電株式会社 | フィルタ及びデュプレクサ |
JP5783186B2 (ja) * | 2013-01-21 | 2015-09-24 | 株式会社村田製作所 | 積層基板モジュール |
JP6250935B2 (ja) * | 2013-02-05 | 2017-12-20 | 太陽誘電株式会社 | 高周波モジュール |
WO2016010063A1 (ja) * | 2014-07-15 | 2016-01-21 | 株式会社村田製作所 | 高周波モジュール |
US10547336B2 (en) * | 2015-10-23 | 2020-01-28 | Qorvo Us, Inc. | Radio frequency circuitry for carrier aggregation |
JP6451605B2 (ja) * | 2015-11-18 | 2019-01-16 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
KR101638310B1 (ko) * | 2016-01-20 | 2016-07-12 | (주)에프원테크놀로지 | 3축 코일 안테나 및 그 제조방법 |
TWI683535B (zh) * | 2016-02-10 | 2020-01-21 | 日商村田製作所股份有限公司 | 雙工器 |
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US10560867B2 (en) | 2016-12-29 | 2020-02-11 | Qorvo Us, Inc. | Reducing intermodulation distortion in a radio frequency circuit |
WO2019188968A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社村田製作所 | 高周波モジュール及びそれを備える通信装置 |
KR102602697B1 (ko) | 2018-05-21 | 2023-11-16 | 삼성전자주식회사 | 베이스 기판을 가지는 전자 장치 |
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JP7288055B2 (ja) * | 2018-12-20 | 2023-06-06 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 少なくとも2つのビアと接続されたコンデンサを備える多層フィルタ |
CN113228503A (zh) | 2018-12-20 | 2021-08-06 | 阿维科斯公司 | 包括高精度电感器的多层电子装置 |
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CN113228504A (zh) | 2018-12-20 | 2021-08-06 | 阿维科斯公司 | 高频多层滤波器 |
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-
2006
- 2006-03-31 JP JP2006099064A patent/JP4441886B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-19 US US11/723,359 patent/US7612634B2/en active Active
- 2007-03-20 DE DE602007004372T patent/DE602007004372D1/de active Active
- 2007-03-20 EP EP07005727A patent/EP1841297B1/en not_active Expired - Fee Related
- 2007-04-02 CN CNA2007100921478A patent/CN101047398A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1841297B1 (en) | 2010-01-20 |
DE602007004372D1 (de) | 2010-03-11 |
EP1841297A1 (en) | 2007-10-03 |
JP2007274471A (ja) | 2007-10-18 |
US20070229189A1 (en) | 2007-10-04 |
US7612634B2 (en) | 2009-11-03 |
CN101047398A (zh) | 2007-10-03 |
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