JP4372182B2 - 基板支持機構及び減圧乾燥装置及び基板処理装置 - Google Patents
基板支持機構及び減圧乾燥装置及び基板処理装置 Download PDFInfo
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- JP4372182B2 JP4372182B2 JP2007201777A JP2007201777A JP4372182B2 JP 4372182 B2 JP4372182 B2 JP 4372182B2 JP 2007201777 A JP2007201777 A JP 2007201777A JP 2007201777 A JP2007201777 A JP 2007201777A JP 4372182 B2 JP4372182 B2 JP 4372182B2
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- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Solid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
46 減圧乾燥ユニット(VD)
106 チャンバ
108b 内部コロ搬送路のコロ
110 搬入口
112 搬出口
114,116 ゲート機構
120 搬送駆動源
126 基板リフト機構
128 リフトピン
128a ピン本体
128b ピン先部
128c 通気孔
130 ピンベース
132 シリンダ(昇降駆動源)
136 昇降軸
138 排気口
140 排気管
142 真空排気装置
152 冷却ガス供給管
170 筒状カバー
Claims (15)
- 被処理基板を支持ピンの先端に載せて支持する基板支持機構であって、
前記支持ピンを先端部が閉塞し、かつ側壁に通気孔が設けられた中空の筒体で構成し、
前記通気孔を通って前記筒体の中を温度調整のための所定のガスが流れるように、前記筒体の基端部にガス供給部またはバキューム源を接続してなる基板支持機構。 - 前記通気孔が、前記支持ピンの先端部に近い部位に設けられる請求項1に記載の基板支持機構。
- 前記通気孔が、前記支持ピンの軸方向で異なる部位に複数設けられる請求項1または請求項2に記載の基板支持機構。
- 前記通気孔が、前記支持ピンの周回方向で異なる部位に複数設けられる請求項1〜3のいずれか一項に記載の基板支持機構。
- 前記支持ピンが、前記筒体の先端部に取り付けられた樹脂製のピン先部を有する請求項1〜4のいずれか一項に記載の基板支持機構。
- 前記通気孔よりもピン先部側を塞いで前記筒体の外周面を隙間を空けて覆う筒状のカバー体を有し、
前記カバー体の基端部側に設けられた外気に通じる開口部と前記筒体の通気孔との間で前記カバー体の内側の隙間を介して前記ガスを流す請求項1〜5のいずれか一項に記載の基板支持機構。 - 前記支持ピンを水平面内で所定の間隔を空けて複数本配置し、各々の前記支持ピンを略鉛直に立てて支持するピン支持部材を有する請求項1〜6のいずれか一項に記載の基板支持機構。
- 前記ピン支持部材の中に、前記筒体の基端部と接続し、前記ガス供給部またはバキューム源に通じるガス流路が形成されている請求項7に記載の基板支持機構。
- 前記支持ピンを昇降移動させるために前記ピン支持部材を鉛直方向で移動させる昇降部を有する請求項7または請求項8に記載の基板支持機構。
- 基板上に塗布膜が形成された直後の被処理基板を出し入れ可能に収容する密閉可能なチャンバと、
前記チャンバ内で前記基板を前記支持ピンの先端に載せて支持する請求項1〜9のいずれか一項に記載の基板支持機構と、
前記基板上の塗布膜を減圧状態で乾燥させるために前記チャンバ内を真空排気する真空排気機構と
を有する減圧乾燥装置。 - 前記真空排気機構の真空排気動作を停止させている期間中に、前記支持ピンの内部を前記温度調整用のガスが流れるように前記基板支持機構の前記ガス供給部またはバキューム源を作動させる請求項10に記載の減圧乾燥装置。
- 前記真空排気機構の真空排気動作を止めた直後に前記チャンバ内にパージ用のガスを供給するパージガス供給部を有する請求項11に記載の減圧乾燥装置。
- 前記減圧乾燥の枚葉処理が一定のサイクルで繰り返し行われ、各回の処理が開始される直前には前記支持ピンのピン先部の温度が一定の基準温度付近まで戻る請求項11または請求項12に記載の減圧乾燥装置。
- 前記ガス供給部またはバキューム源を前記チャンバの外に配置し、前記チャンバの壁を通る真空封止された通気路を介して前記ガス供給部またはバキューム源と前記支持ピンの筒体の基端部とを接続する請求項10〜13のいずれか一項に記載の減圧乾燥装置。
- 被処理基板を出し入れ可能に収容するチャンバと、
前記チャンバ内で前記基板を前記支持ピンの先端に載せて支持する請求項1〜9のいずれか一項に記載の基板支持機構と、
前記チャンバ内で前記基板に雰囲気温度が変化する所定の処理を施す処理部と
を有する基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007201777A JP4372182B2 (ja) | 2007-08-02 | 2007-08-02 | 基板支持機構及び減圧乾燥装置及び基板処理装置 |
KR1020080075660A KR101299742B1 (ko) | 2007-08-02 | 2008-08-01 | 기판 지지 기구 및 감압 건조 장치 및 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007201777A JP4372182B2 (ja) | 2007-08-02 | 2007-08-02 | 基板支持機構及び減圧乾燥装置及び基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009038231A JP2009038231A (ja) | 2009-02-19 |
JP4372182B2 true JP4372182B2 (ja) | 2009-11-25 |
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JP2007201777A Expired - Fee Related JP4372182B2 (ja) | 2007-08-02 | 2007-08-02 | 基板支持機構及び減圧乾燥装置及び基板処理装置 |
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JP (1) | JP4372182B2 (ja) |
KR (1) | KR101299742B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014054859A1 (ko) * | 2012-10-05 | 2014-04-10 | 위아코퍼레이션 주식회사 | 다공질 세라믹 테이블 |
Families Citing this family (15)
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WO2011030607A1 (ja) * | 2009-09-10 | 2011-03-17 | シャープ株式会社 | 乾燥装置 |
KR101494924B1 (ko) | 2009-10-16 | 2015-02-23 | 도쿄엘렉트론가부시키가이샤 | 감압건조장치 및 감압건조방법 |
JP4975080B2 (ja) * | 2009-10-27 | 2012-07-11 | 東京エレクトロン株式会社 | 減圧乾燥装置及び減圧乾燥方法 |
US8613288B2 (en) * | 2009-12-18 | 2013-12-24 | Lam Research Ag | High temperature chuck and method of using same |
KR101311062B1 (ko) * | 2011-08-29 | 2013-09-24 | 현대제철 주식회사 | 슬라브 공랭 대기 장치 |
CN103388971A (zh) * | 2012-05-11 | 2013-11-13 | 四川汇利实业有限公司 | 采用空气进行冷却的干燥*** |
KR101547458B1 (ko) * | 2012-12-18 | 2015-08-26 | 주식회사 나래나노텍 | 개선된 기판 열처리 챔버 및 방법, 및 이를 구비한 기판 열처리 장치 |
CN103278966A (zh) * | 2013-04-22 | 2013-09-04 | 合肥京东方光电科技有限公司 | 一种取向膜预固化设备 |
JP6199638B2 (ja) * | 2013-07-16 | 2017-09-20 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US9859145B2 (en) * | 2013-07-17 | 2018-01-02 | Lam Research Corporation | Cooled pin lifter paddle for semiconductor substrate processing apparatus |
JP6579773B2 (ja) * | 2015-03-30 | 2019-09-25 | 株式会社Screenホールディングス | 減圧乾燥装置および減圧乾燥方法 |
KR101895933B1 (ko) * | 2016-06-30 | 2018-09-10 | 세메스 주식회사 | 기판 처리 장치 |
CN106516741B (zh) * | 2016-11-04 | 2018-01-02 | 深圳市龙锋泰自动化有限公司 | 用于全自动玻璃在线覆膜机的送料*** |
KR101994423B1 (ko) * | 2016-12-27 | 2019-07-01 | 세메스 주식회사 | 기판 처리 장치 |
KR102099883B1 (ko) * | 2019-05-24 | 2020-04-13 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (4)
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JP3934246B2 (ja) * | 1997-10-27 | 2007-06-20 | 大日本スクリーン製造株式会社 | 基板冷却装置および基板冷却方法 |
JP3456890B2 (ja) * | 1998-01-16 | 2003-10-14 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2006302980A (ja) * | 2005-04-18 | 2006-11-02 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
JP2006324559A (ja) * | 2005-05-20 | 2006-11-30 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置および基板乾燥方法 |
-
2007
- 2007-08-02 JP JP2007201777A patent/JP4372182B2/ja not_active Expired - Fee Related
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2008
- 2008-08-01 KR KR1020080075660A patent/KR101299742B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014054859A1 (ko) * | 2012-10-05 | 2014-04-10 | 위아코퍼레이션 주식회사 | 다공질 세라믹 테이블 |
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Publication number | Publication date |
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JP2009038231A (ja) | 2009-02-19 |
KR101299742B1 (ko) | 2013-08-23 |
KR20090013732A (ko) | 2009-02-05 |
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