JP4338545B2 - コンデンサシート - Google Patents
コンデンサシート Download PDFInfo
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- JP4338545B2 JP4338545B2 JP2004042877A JP2004042877A JP4338545B2 JP 4338545 B2 JP4338545 B2 JP 4338545B2 JP 2004042877 A JP2004042877 A JP 2004042877A JP 2004042877 A JP2004042877 A JP 2004042877A JP 4338545 B2 JP4338545 B2 JP 4338545B2
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- 239000003990 capacitor Substances 0.000 title claims description 231
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
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- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
C=εo×εr×S/d ・・・ 式(1)
εo=8.854×10-12 (真空中の比誘電率)
εr=材料の比誘電率
d=電極間距離
S=電極間の面積
すなわち、キャパシタンスCは、誘電体ブロック1の比誘電率εrと真空中の誘電率εoと電極間距離dと電極間面積Sとで決まることが示されている。従って電極間距離dを短くすればするほどキャパシタンスCは増大することが分かる。また、キャパシタンスCは、誘電体ブロック1の材料として高い比誘電率のものを用いても同様に大きくすることが可能である。
スルーホール電極を内包する誘電体を挟んで該スルーホール電極から離れた位置に設けたアース電極を有する第1のコンデンサブロックと、
スルーホール電極を内包する誘電体を挟んで該スルーホール電極から離れた位置に設けたアース電極を備え、該両電極間を電気的に接続した第2のコンデンサブロックとを有し、
該第1のコンデンサブロックのアース電極と該第2のコンデンサブロックのアース電極とが電気的に接続されたことを特徴とするコンデンサシート。
(付記2)付記1において、
各コンデンサブロックが立方体又は直方体であり、該スルーホール電極が該立方体又は直方体の2面のほぼ中央部を貫通するように設けられ、該スルーホール電極とは交差しない該立方体又は直方体の対向する2面に該アース電極が設けられていることを特徴としたコンデンサシート。
(付記3)付記2において、
隣接するコンデンサブロック同士を、互いに同じ方向で結合しても、それぞれのコンデンサブロックのアース電極が電気的に接続されるように該アース電極がコンデンサブロックに設けられていることを特徴としたコンデンサシート。
(付記4)付記2おいて、
各コンデンサブロックが立方体の場合、隣接するコンデンサブロック同士を、互いに90°回転させて結合してもそれぞれのコンデンサブロックのアース電極が電気的に接続されるように該アース電極がコンデンサブロックに設けられていることを特徴としたコンデンサシート。
(付記5)付記1おいて、
該第1コンデンサブロックのスルーホール電極は、該アース電極と共に形成されるキャパシタンスが所望の値になるような直径及び長さを有する円筒形を有していることを特徴としたコンデンサシート。
(付記6)付記5おいて、
該直径が異なるスルーホール電極を有する複数個のコンデンサブロックを、所望のキャパシタンスに合わせて配置したことを特徴としたコンデンサシート。
(付記7)付記5おいて、
該第1のコンデンサブロックが、所望のキャパシタンスに合わせたサイズの立方体又は直方体であることを特徴としたコンデンサシート。
(付記8)付記1おいて、
該第1のコンデンサブロックが、所望の特性インピーダンスを与える直径のスルーホール電極を有していることを特徴としたコンデンサシート。
(付記9)付記1おいて、
全てのアース電極同士、又は一部のアース電極同士が電気的に接続されるように各コンデンサブロックが配置されていることを特徴としたコンデンサシート。
(付記10)付記1おいて、
該回路基板の内の一枚がBGAで、もう一枚がプリント配線板であり、該スルーホール電極の一端を、その上に設けたフットプリントを介して該BGAに接続すると共に、該スルーホール電極の他端を、その上に設けたバンプを介して該プリント配線板に接続することを特徴としたコンデンサシート。
2, 2_1〜2_3 スルーホール電極
3 アース電極
4 パターン配線
10 信号・電源用コンデンサブロック
11 アース用コンデンサブロック
12 コンデンサシート
21 BGA(ボール・グリッド・アレイ)
141, 212 アース用バンプ(電極)
142, 212 信号・電源用バンプ
131, 221 アース用フットプリント
132, 222 信号・電源用フットプリント
31 I/O電源用電極
32 コア用電極
41 I/O電源用スルーホール電極
42 コア用スルーホール電極
101 電源電極用コンデンサブロック
102 信号電極用コンデンサブロック
110 アース電極用コンデンサブロック
図中、同一符号は同一又は相当部分を示す。
Claims (5)
- スルーホール電極を内包する誘電体を挟んで該スルーホール電極から離れた位置に設けたアース電極を有する第1のコンデンサブロックと、
スルーホール電極を内包する誘電体を挟んで該スルーホール電極から離れた位置に設けたアース電極を備え、該両電極間を電気的に接続した第2のコンデンサブロックとを有し、
該第1のコンデンサブロックのアース電極と該第2のコンデンサブロックのアース電極とが電気的に接続されたことを特徴とするコンデンサシート。 - 請求項1において、
各コンデンサブロックが立方体又は直方体であり、該スルーホール電極が該立方体又は直方体の2面のほぼ中央部を貫通するように設けられ、該スルーホール電極とは交差しない該立方体又は直方体の対向する2面に該アース電極が設けられていることを特徴としたコンデンサシート。 - 請求項2において、
隣接するコンデンサブロック同士を、互いに同じ方向で結合しても、それぞれのコンデンサブロックのアース電極が電気的に接続されるように該アース電極がコンデンサブロックに設けられていることを特徴としたコンデンサシート。 - 請求項2おいて、
各コンデンサブロックが立方体の場合、隣接するコンデンサブロック同士を、互いに90°回転させて結合してもそれぞれのコンデンサブロックのアース電極が電気的に接続されるように該アース電極がコンデンサブロックに設けられていることを特徴としたコンデンサシート。 - 請求項1おいて、
該第1コンデンサブロックのスルーホール電極は、該アース電極と共に形成されるキャパシタンスが所望の値になるような直径及び長さを有する円筒形を有していることを特徴としたコンデンサシート。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004042877A JP4338545B2 (ja) | 2004-02-19 | 2004-02-19 | コンデンサシート |
US10/878,919 US6859352B1 (en) | 2004-02-19 | 2004-06-28 | Capacitor sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004042877A JP4338545B2 (ja) | 2004-02-19 | 2004-02-19 | コンデンサシート |
Publications (2)
Publication Number | Publication Date |
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JP2005236008A JP2005236008A (ja) | 2005-09-02 |
JP4338545B2 true JP4338545B2 (ja) | 2009-10-07 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004042877A Expired - Fee Related JP4338545B2 (ja) | 2004-02-19 | 2004-02-19 | コンデンサシート |
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US (1) | US6859352B1 (ja) |
JP (1) | JP4338545B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829875B2 (en) * | 2006-03-31 | 2010-11-09 | Sandisk 3D Llc | Nonvolatile rewritable memory cell comprising a resistivity-switching oxide or nitride and an antifuse |
JP4283834B2 (ja) * | 2006-09-06 | 2009-06-24 | Tdk株式会社 | 積層コンデンサ |
JP5133813B2 (ja) * | 2008-08-11 | 2013-01-30 | レノボ・シンガポール・プライベート・リミテッド | 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板 |
JP2010258301A (ja) * | 2009-04-27 | 2010-11-11 | Shinko Electric Ind Co Ltd | インターポーザ及び半導体装置 |
US8633398B2 (en) | 2011-10-25 | 2014-01-21 | Hewlett-Packard Development Company, L.P. | Circuit board contact pads |
JP6323672B2 (ja) * | 2014-07-25 | 2018-05-16 | 株式会社ソシオネクスト | 半導体装置及びその製造方法 |
US10141277B2 (en) * | 2017-03-31 | 2018-11-27 | International Business Machines Corporation | Monolithic decoupling capacitor between solder bumps |
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JPH08181445A (ja) | 1994-12-22 | 1996-07-12 | Sumitomo Metal Ind Ltd | セラミックス多層基板 |
JP3475581B2 (ja) | 1995-06-27 | 2003-12-08 | 松下電工株式会社 | 電動歯ブラシ |
JPH09102432A (ja) | 1995-10-05 | 1997-04-15 | Canon Inc | バイパスコンデンサ及びその形成方法 |
JP3696341B2 (ja) * | 1996-08-30 | 2005-09-14 | ローム株式会社 | アレイ型固体電解コンデンサの構造及びその製造方法 |
JPH10322022A (ja) | 1997-05-19 | 1998-12-04 | Nec Corp | 多層プリント基板 |
JPH11307389A (ja) * | 1998-04-24 | 1999-11-05 | Mitsubishi Electric Corp | パターンコンデンサ |
US6625006B1 (en) * | 2000-09-05 | 2003-09-23 | Marvell International, Ltd. | Fringing capacitor structure |
JP2003124430A (ja) | 2001-10-16 | 2003-04-25 | Nec Corp | 集積回路装置および集積回路用コンデンサ |
US6614645B1 (en) * | 2002-11-12 | 2003-09-02 | National Semiconductor Corporation | Matched capacitor array |
-
2004
- 2004-02-19 JP JP2004042877A patent/JP4338545B2/ja not_active Expired - Fee Related
- 2004-06-28 US US10/878,919 patent/US6859352B1/en not_active Expired - Lifetime
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US6859352B1 (en) | 2005-02-22 |
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