JP4312435B2 - Method and apparatus for applying treatment liquid to substrate - Google Patents

Method and apparatus for applying treatment liquid to substrate Download PDF

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JP4312435B2
JP4312435B2 JP2002234652A JP2002234652A JP4312435B2 JP 4312435 B2 JP4312435 B2 JP 4312435B2 JP 2002234652 A JP2002234652 A JP 2002234652A JP 2002234652 A JP2002234652 A JP 2002234652A JP 4312435 B2 JP4312435 B2 JP 4312435B2
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substrate
roller
application
coating
application roller
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JP2004073925A (en
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謙作 鈴木
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、レジスト膜が形成された基板に対する現像液の塗布等に使用可能な処理液の塗布方法及び装置に関する。
【0002】
【従来の技術】
液晶ディスプレイ等の表示装置に使用されるカラーフィルタのガラス製基板にフォトリソグラフィプロセスを利用してパターンを形成する場合、基板側へのパターンの転写に先立って基板上にはレジスト膜が形成される。レジスト膜は本来均一な厚さに形成されるべきであるが、レジスト剤の塗布方法による制約から、基板上の特定部分の膜厚が他の部分に比べて厚くなることがある。例えば、基板を回転させてレジスト剤を塗布するスピンコート法を利用した場合には、回転に伴う遠心力の影響で基板の周辺部の膜厚が増加する。ダイコータを利用して塗布した場合には塗布開始位置と終了位置においてレジスト剤が多めに供給されてそれらの部分の膜厚が増加する。ところが、露光後の現像工程では正常な膜厚を基準として処理時間等が定められているので、上記のように膜厚が大きい特定部分ではレジスト膜が除去し切れない。しかし、残留した一部のレジスト膜を放置すると、その後に形成されるレジスト膜の均一性に影響が生じたり、残留したレジスト膜がその後の工程で剥離し、これが異物となって欠陥が引き起こされる。
【0003】
そこで、パターンの現像に先立って膜厚の大きい特定部分に予め現像液を塗布してその部分のレジスト膜に現像液を十分に膨潤させ、その後のパターンの現像により、特定部分のレジスト膜も確実に除去するようにした基板の洗浄方法及びそのための洗浄装置が提案されている。例えば、特開平7−27917号公報に記載された洗浄装置では、基板をその一辺と平行な方向に搬送するラインの途中で基板を一時的に停止させ、その停止した基板の搬送方向と直交する二辺に塗布ローラを接触させ、このローラを搬送方向と直交する方向に移動させて上記二辺に現像液を塗布している。その後、基板を停止位置から下流側へ搬送し、その搬送途中で基板の搬送方向と平行な二辺に別の塗布ローラを接触させて残りの二辺にも現像液を塗布している。
【0004】
【発明が解決しようとする課題】
従来の塗布方法は基板の一辺の一端から他端まで単一の塗布ローラを移動させて現像液を塗布している。また、塗布中は基板と塗布ローラとの間ですべりが生じないように、基板の外周における接線方向の速度と基板の搬送速度とを一致させている。従って、基板の搬送速度を過度に高く設定すれば塗布ローラが高速で回転し、その回転に伴う遠心力により塗布ローラから基板に現像液が飛散し、これが後の工程で欠陥を生じさせる原因となることがある。そこで、現像液の塗布中は塗布ローラから現像液の飛散が生じない範囲に基板の搬送速度を制限する必要がある。しかし、現像液の塗布時において搬送装置の搬送速度を制限すれば、その搬送速度がネックとなってカラーフィルタの生産ライン全体の効率が低下するおそれがある。
【0005】
そこで、本発明は、現像液等の処理液の飛散を防止しつつ、その処理液の塗布作業の効率を改善できる処理液の塗布方法及び塗布装置を提供することを目的とする。
【0006】
【課題を解決するための手段】
以下、本発明について説明する。なお、本発明の理解を容易にするために添付図面の参照符号を括弧書きにて付記するが、それにより本発明が図示の形態に限定されるものではない。
【0007】
請求項1の発明は、一方向に直列に一定のピッチで配置された複数の塗布ローラ(10,20)のそれぞれを基板(5)と接触させた状態で、前記複数の塗布ローラを前記基板に対して前記一方向に相対的に移動させつつ各塗布ローラと前記基板との接触位置ですべりが生じないように各塗布ローラを回転させることにより、各塗布ローラに含まれた所定の処理液を、基板上における各塗布ローラの塗布範囲が前記ピッチに所定の余裕を加えた長さとなるように、かつ前記一方向に連続するようにして前記基板に塗布する基板への処理液の塗布方法により、上述した課題を解決する。
【0008】
この塗布方法によれば、複数の塗布ローラが分担して処理液を塗布するので、単一の塗布ローラを使用する場合と比較して各塗布ローラが接触する長さを短縮することができる。従って、塗布作業に要する時間を短縮して作業効率を向上させることができる。塗布ローラからの処理液の飛散を抑えるべく基板と塗布ローラとの間の相対的な移動の速度を制限したとしても、その制限された速度で作業を行うべき時間も短縮される。
【0009】
なお、「直列」の用語は、複数の塗布ローラを同一直線上で転がるように前後して配置した状態を意味する。「すべりが生じない」状態は、塗布ローラと基板との接触位置において両者の相対速度が0の状態を意味する。つまり、基板との接触位置における塗布ローラの線速度の大きさ及び方向が基板の接触位置における速度及びその方向と一致していればよい。塗布ローラは、基板との接触によって基板から受ける力を利用して回転させてもよいし、モータ等の駆動装置を利用して回転させてもよい。基板と塗布ローラとの相対的な移動は基板又は塗布ローラの少なくともいずれか一方を一方向に移動させて実現される。
【0010】
請求項2の発明では、請求項1の塗布方法において、前記基板を前記一方向に搬送しつつ前記塗布ローラと接触させて各塗布ローラから前記基板に処理液を塗布する。この発明によれば、基板を停止させることなく塗布作業を行うことができる。
【0011】
請求項3の発明は、請求項2の塗布方法において、前記塗布ローラ(10)を真円状の外周を有する円筒体形状に形成し、その塗布ローラを前記基板と接触する位置と前記基板から上方に離れた位置との間で移動させることにより、各塗布ローラによる塗布範囲を調整する。この方法によれば、塗布ローラの上下動によって各塗布ローラと基板との接触範囲を必要最小限に抑えて塗布作業の効率を向上させることができる。なお、塗布ローラは基板から上方に離れた位置に移動できればよく、上方に離れた位置で停止し、又は基板から一旦上方に離れ、その後、さらに側方等へ移動してもよい。基板の斜め上方への移動もここにいう基板から上方に離れた位置への移動の概念に含まれる。
【0012】
請求項4の発明は、請求項2の塗布方法において、前記塗布ローラ(20)を、真円の一部を構成する円弧部(20a)とその円弧部の両端を結ぶ切欠部(20b)とを有する形状に形成し、各塗布ローラの前記円弧部の周方向の長さを、前記基板の搬送方向に関して上流側に隣接する塗布ローラまでの距離(P)以上に設定するとともに、前記円弧部が前記基板と接触するようにして各塗布ローラを基板上で一回転させることにより各塗布ローラの塗布範囲を前記一方向に連続させる。この方法によれば、塗布ローラを一回転させると、各塗布ローラの円弧部による処理液の塗布範囲が上流側の塗布ローラによる塗布範囲と連続する。塗布ローラの切欠部を基板側に向けることにより、塗布ローラを基板に対して非接触の状態にすることができる。従って、塗布ローラを基板から離すためにこれを基板に対して上下に移動させる必要がなくなる。なお、搬送方向に関して最も上流側に位置する塗布ローラの円弧部については、基板の塗布範囲の搬送方向に関する後端の位置に応じて適宜に定めてよい。全ての塗布ローラを同形同大に形成する場合には各塗布ローラの搬送方向に関する距離(ピッチ)を互いに等しくし、かつ円弧部の周方向の長さを塗布ローラ間の距離以上に設定すればよい。
【0013】
請求項5の発明は、請求項2〜4のいずれかの塗布方法において、前記基板の搬送速度を前記塗布ローラと接触していない間よりも接触中において遅くする。このように塗布ローラとの接触中に搬送速度を遅くすることにより、基板と接触する際の塗布ローラの回転速度を塗布ローラからの処理液の飛散を防止できる範囲に制限しつつ、非接触時には搬送速度を高めて生産ライン全体としての作業効率を向上させることができる。
【0022】
請求項の発明は、基板(5)の搬送装置(2)と、真円状の外周を有する円筒体形状に形成され、前記搬送装置の搬送方向に直列に配置されて所定の処理液を前記基板に塗布可能な複数の塗布ローラ(10)と、前記複数の塗布ローラを前記基板に接触する位置と前記基板の上方に離れた位置との間で移動させるローラ位置切替手段(11)と、前記搬送装置の所定位置に前記基板が達すると各塗布ローラが前記基板と接触する位置に移動し、各塗布ローラと前記基板との接触後、各塗布ローラによる前記処理液の塗布範囲が前記基板上で前記搬送方向に連続するまで前記基板が搬送されると前記塗布ローラが前記基板から離れる位置に移動するように、前記ローラ位置切替手段の動作を制御する制御装置(6)と、を備えた基板への処理液の塗布装置(1A)により、上述した課題を解決する。
【0023】
この塗布装置によれば、基板を搬送しつつ塗布ローラを基板に対して上下させることにより、上述した請求項3の塗布方法を実現することができる。なお、「直列」の用語は、複数の塗布ローラを同一直線上で転がるように前後して配置した状態を意味する。塗布ローラは、基板との接触によって基板から受ける力を利用して回転させてもよいし、モータ等の駆動装置を利用して回転させてもよい。ローラ位置切替手段は、塗布ローラを基板から上方に離れた位置に移動させるものであればよく、塗布ローラを基板の上方に離れた位置で停止させ、又は基板から一旦上方に離し、その後、さらに側方等へ移動させるものでもよい。基板から斜め上方へ塗布ローラを移動させてもよい。
【0024】
請求項の発明は、基板(5)の搬送装置(2)と、真円の一部を構成する円弧部(20a)とその円弧部の両端を結ぶ切欠部(20b)とを有する形状に形成され、前記搬送装置の搬送方向に直列に配置されて前記円弧部から所定の処理液を前記基板に塗布可能な複数の塗布ローラ(20)と、前記複数の塗布ローラを、前記切欠部が前記基板側を向く初期位置から前記円弧部と前記基板との接触位置ですべりが生じないように一回転させて前記初期位置に復帰させるローラ回転駆動手段(21)と、前記搬送装置の所定位置に前記基板が達するまでは前記塗布ローラを前記初期位置に保持し、前記基板が所定位置に達すると前記塗布ローラが前記初期位置から一回転するように前記ローラ回転駆動手段の動作を制御する制御装置(6)と、を備え、各塗布ローラの前記円弧部の周方向の長さが、前記基板の搬送方向に関して上流側に隣接する塗布ローラまでの距離以上に設定されている基板への処理液の塗布装置(1B)により、上述した課題を解決する。
【0025】
この塗布装置によれば、基板を搬送しつつ塗布ローラを初期位置から一回転させることにより、上述した請求項4の塗布方法を実現することができる。なお、「直列」の用語は、複数の塗布ローラを同一直線上で転がるように前後して配置した状態を意味する。搬送方向に関して最も上流側に位置する塗布ローラの円弧部については、基板の塗布範囲の搬送方向に関する後端の位置に応じて適宜に定めてよい。全ての塗布ローラを同形同大に形成する場合には各塗布ローラの搬送方向に関する距離(ピッチ)を互いに等しくし、かつ円弧部の周方向の長さを塗布ローラ間の距離以上に設定すればよい。「すべりが生じない」状態は、塗布ローラと基板との接触位置において両者の相対速度が0の状態を意味する。つまり、基板との接触位置における塗布ローラの線速度の大きさ及び方向が基板の接触位置における速度及びその方向と一致していればよい。
【0026】
請求項の発明は、請求項又はの塗布装置において、前記制御装置は、前記塗布ローラが前記基板から離れた位置にあるときは前記搬送装置による搬送速度を所定の第1速度(V1)に設定し、前記塗布ローラが前記基板に接触する位置にあるときは前記搬送装置の搬送速度を前記第1速度よりも遅い第2速度(V2)に設定する。この場合には、搬送速度を第2速度に設定することによって塗布ローラからの処理液の飛散を防止し、塗布ローラが基板から離れているときは搬送速度を第1速度に高めて効率を改善することができる。
【0031】
【発明の実施の形態】
(第1の実施形態)
図1は本発明の第1の実施形態の塗布装置1Aを示し、(a)は側面図、(b)は平面図である。塗布装置1Aは搬送装置2と塗布ユニット3とを備えている。搬送装置2は搬送方向に一定のピッチで設けられた複数の搬送ローラ4…4の回転によって基板(ワーク)5を水平に搬送する周知のローラコンベアである。塗布装置1Aに導かれる基板5は液晶ディスプレイ表示装置に組み込まれるカラーフィルタ用のガラス製基板であり、その表面にはレジスト膜が形成されてパターンが露光されている。
【0032】
塗布ユニット3は、直列に配置された複数の塗布ローラ10…10と、これらの塗布ローラ10を昇降させるローラ位置切替手段としての昇降装置11とを備えている。塗布ローラ10は真円状の外周を有する円筒体形状に形成されている。塗布ローラ10は基板5の搬送方向(矢印A方向)と平行な端部5a、5aと位置を合わせて二列設けられている。各列には搬送方向に一定のピッチで3個の塗布ローラ10が設けられている。塗布ローラ10のピッチは搬送ローラ4のピッチと等しく、しかも、搬送方向に関して搬送ローラ4と塗布ローラ10とは位置を合わせて設けられているP(図3(b)参照)。従って、昇降装置11によって塗布ローラ10を下降させることにより、基板5を搬送ローラ4と塗布ローラ10とによって挟むことができる。各塗布ローラ10の表面には不図示の供給管によりレジスト膜に対する現像液が供給される。塗布ローラ10はスポンジのように現像液を吸収し得る材料にて構成されている。塗布ローラ10の回転により各塗布ローラ10の外周には全周に亘って略均質に現像液が含浸される。昇降装置11はエアーシリンダ等のアクチュエータ12,12によって塗布ローラ10が取り付けられた支持体13を昇降させる。塗布ローラ10は支持体13により回転自在に支持され、基板5との接触時に基板5から力を受けて回転する。但し、モータ等の駆動源を利用して塗布ローラ10を基板5との接触位置にすべりが生じない速度、つまり塗布ローラ10の外周において基板5の搬送速度と同一の線速度が得られる角速度で回転させてもよい。
【0033】
次に、図2及び図3を参照して塗布装置1Aの動作を説明する。なお、図2は制御装置6が実行する塗布制御処理の手順を示すフローチャート、図3はその塗布制御処理によって実現される塗布装置1Aの各部の動作を示す図である。
【0034】
図2の処理において、制御装置6は、搬送装置2の搬送経路に設置されたセンサ7(図1(b)参照)からの出力信号に基づいて塗布ユニット3の直下の所定位置に基板5が達したか否か判断する(ステップS11)。図3(a)に示すように基板5が所定位置に達すると、制御装置6は、搬送装置2の搬送速度を通常時速度(第1速度)V1からそれよりも遅い塗布時速度(第2速度)V2に減速し(ステップS12)、かつ塗布ローラ10を下降させる(ステップS13)。
【0035】
これにより、図3(b)に示すように基板5と塗布ローラ10とが接触し、基板5の搬送に伴って塗布ローラ10が基板5と同期した速度で回転して基板5の搬送方向と平行な端部5a、5aに塗布ローラ10から現像液が塗布される。なお、塗布時速度V2は塗布ローラ10の回転に伴う遠心力で塗布ローラ10から現像液が飛散しない範囲に設定される。塗布ローラ10を下降させる時期は、搬送方向に関して最も下流側に配置された塗布ローラ10が基板5の搬送方向の先頭に接することができるように定められる。
【0036】
この後、制御装置6は塗布ローラ10による現像液の塗布に関する終了時期か否かを判断する(ステップS14)。図3(b)に示すように塗布ローラ10の並ぶピッチをPとしたとき、終了時期は各塗布ローラ10による塗布範囲が塗布ローラ10のピッチPに所定の余裕を加えた長さに達する時期である。終了時期に達するまで塗布ローラ10を基板5と接触させることにより、各塗布ローラ10による塗布範囲が搬送方向に連続する。なお、基板5の搬送方向の全長をN個の塗布ローラ10によって処理する場合、塗布ローラ10のピッチPは基板5の搬送方向の全長の1/Nに設定すればよい。このように設定すれば、終了時期には図3(c)に示すように搬送方向に関して最も上流側に配置された塗布ローラ10が少なくとも基板5の後端に達する。
【0037】
終了時期に達したか否かは、各塗布ローラ10が塗布範囲に相当する距離を基板5に対して相対的に移動するのに必要な時間を搬送速度V2から特定し、塗布ローラ10を下降させてからの経過時間がその搬送速度V2から特定された時間に達したか否かにより判断できる。塗布ローラ10と基板5との接触を開始した後の搬送ローラ4や塗布ローラ10の回転量から終了時期か否かを判断してもよい。
【0038】
そして、終了時期と判断されると、制御装置6は図3(d)に示すように塗布ローラ10を基板5から上方に離れた待機位置へ移動させ(ステップS15)、かつ、搬送速度を通常時の速度V1に復帰させる(ステップS16)。
【0039】
以上の実施形態によれば、各塗布ローラ10はピッチPに多少の余裕を加えた距離だけ基板5と接していればよく、搬送速度を塗布時速度V2に維持すべき時間は基板5の全長を単一の塗布ローラ10で処理する場合のおよそ1/3に短縮される。従って、搬送速度を一時的に塗布時速度V2に低下させたとしてもその影響は低減され、塗布作業の効率が改善される。
【0040】
なお、塗布ローラ10の直径は特に限定しないが、一枚の基板5に現像液を塗布する際の各塗布ローラ10の回転量を360°以内に制限するならば、各塗布ローラ10の直径は、ピッチPを円周率πで除した値(P/π)以上に設定するとよい。
【0041】
(第2の実施形態)
図4は本発明の第2の実施形態の塗布装置1Bを示している。この塗布装置1Bでは、図1の円筒状の塗布ローラ10に代えて塗布ローラ20が使用されている。塗布ローラ20は、真円の一部を構成する円弧部20aと、その円弧部20aの両端を結ぶ弦となる切欠部20bとを組み合わせた形状を有している。換言すれば、塗布ローラ20は円弧部20aを含む完全な円筒体の一部を切り欠いて切欠部20bを形成したものである。切欠部20bは直線状に限らず、円弧部20aを延長した円弧よりも中心側に後退して基板5と接触不能とされている限り、その形状は問わない。
【0042】
図6(b)に示すように、各塗布ローラ20は搬送方向に互いに等しいピッチPで直列に配置されている。基板5の搬送方向の全長をN個の塗布ローラ20によって処理する場合、塗布ローラ20のピッチPは基板5の搬送方向の全長の1/Nに設定される。各塗布ローラ20の円弧部20aの周方向の長さは、塗布ローラ20のピッチPを塗布ローラ20の個数Nで除した値(P/N)に対して所定の余裕を加えた値に設定される。塗布ローラ20を一回転させることにより、各塗布ローラ20に割り当てられた塗布範囲の搬送方向に関する距離(P/N)を円弧部20aにて処理できるようにするためである。
【0043】
また、塗布ユニット3は塗布ローラ20を回転駆動するモータ等の駆動装置(ローラ回転駆動手段)21をさらに備えている。駆動装置21は塗布ローラ20の回転位置を把握してその回転速度及び停止位置を制御できるものが望ましい。例えば、ステッピングモータとロータリーエンコーダとを組み合わせた周知の回転制御機構を駆動装置21として使用することができる。なお、各塗布ローラ20は駆動装置21によってその円弧部20aが基板5と接し得る高さに支持されており、昇降装置11は省略されている。但し、塗布装置1Bにおいては、基板5の厚さの変化に応じて塗布ローラ20の高さを調整する機構を備えてもよい。
【0044】
なお、塗布ローラ20は基板5の搬送方向(矢印A方向)と平行な端部5a、5aと位置を合わせて二列設けられている。塗布ローラ20の材質は塗布ローラ10と同様でよい。搬送装置2は図1の例と同じでよい。
【0045】
次に、図5及び図6を参照して塗布装置1Bの動作を説明する。なお、図5は制御装置6が実行する塗布制御処理の手順を示すフローチャート、図6はその塗布制御処理によって実現される塗布装置1Bの各部の動作を示す図である。
【0046】
図5の処理において、制御装置6は、搬送装置2の搬送経路に設置されたセンサ7(図4(b)参照)からの出力信号に基づいて塗布ユニット3の直下の所定位置に基板5が達したか否か判断する(ステップS21)。このとき、図6(a)に示すように、塗布ローラ20はその切欠部20bを基板5側に向けた初期位置に保持される。基板5が所定位置に達すると、制御装置6は、搬送装置2の搬送速度を通常時速度V1からそれよりも遅い塗布時速度V2に減速し(ステップS22)、かつ塗布ローラ20の回転を開始させる(ステップS23)。このときの回転方向及び速度は基板5と円弧部20aとの間にすべりが生じないように定められる。塗布ローラ20の回転を開始するタイミングは、基板5の搬送方向に関して最も下流側に配置された塗布ローラ20の円弧部20aの回転方向に関する先端部が基板5の搬送方向の先頭に接することができるように定められる。塗布時速度V2は塗布ローラ20の回転に伴う遠心力で塗布ローラ20から現像液が飛散しない範囲に設定される。
【0047】
以上のように塗布ローラ20を回転させることにより、基板5と塗布ローラ20の円弧部20aとが接触し、基板5の搬送方向と平行な端部5a、5aに塗布ローラ20の円弧部20aから現像液が塗布される。
【0048】
この後、制御装置6は塗布ローラ20による現像液の塗布に関する終了時期か否かを判断する(ステップS24)。終了時期は各塗布ローラ20による塗布範囲が塗布ローラ20のピッチPに所定の余裕を加えた長さに達する時期である。終了時期に達するまで塗布ローラ20を基板5と接触させることにより、各塗布ローラ20による塗布範囲が搬送方向に連続する。そして、終了時期においては、図6(c)に示すように、塗布ローラ20の円弧部20aの回転方向に関する後端部が基板5と接視、特に搬送方向の最上流側に配置された塗布ローラ20の円弧部20aの後端部は基板5の搬送方向に関する後端部と接する。
【0049】
終了時期に達したか否かは、各塗布ローラ20が塗布範囲に相当する距離を基板5に対して相対的に移動するのに必要な時間を搬送速度V2から特定し、塗布ローラ20を下降させてからの経過時間がその搬送速度V2から特定された時間に達したか否かにより判断できる。塗布ローラ20と基板5との接触を開始した後の搬送ローラ4や塗布ローラ20の回転量から終了時期か否かを判断してもよい。
【0050】
そして、終了時期と判断されると、制御装置6は図6(d)に示すように塗布ローラ20を初期位置に戻してその回転を停止させ(ステップS25)、かつ、搬送速度を通常時の速度V1に復帰させる(ステップS26)。
【0051】
以上の通り、本実施形態においても基板5に対して複数の塗布ローラ20により分担して現像液を塗布しているので、搬送速度を塗布時速度V2に維持すべき時間が単一のローラで現像液を塗布する場合と比較して短縮される。従って、搬送速度を一時的に塗布時速度V2に低下させたとしてもその影響は低減され、作業効率が改善される。しかも、塗布ローラ20を昇降させる必要がなく、昇降装置を省略できる利点がある。
【0052】
なお、本実施形態では塗布ローラ20を互いに等しいものとしたが、一部の塗布ローラ20を他の塗布ローラ20に対して異なる大きさとしてもよい。各塗布ローラ20の塗布範囲を連続させるためには、各塗布ローラ20(但し、搬送方向において最も上流側に位置するものを除く)の円弧部20aの周方向の長さを、搬送方向に関して上流側に隣接する塗布ローラ20までの距離以上に設定すればよい。搬送方向において最も上流側に位置する塗布ローラ20の円弧部20aの長さは、基板5の搬送方向の後端まで塗布範囲に含まれるように定めればよい。但し、基板5の途中まで現像液を塗布すればよい場合にはこの限りではない。
【0053】
(第参考例
図7は本発明の第参考例の塗布装置1Cを示している。この塗布装置1Cは、図1の塗布ローラ10に代え、基板5の端部5a、5aと対応させて2列にプーリ30,30を設け、それらのプーリ30,30に塗布ベルト31,31を巻き掛けたものである。従って、塗布ベルト31は基板5の搬送方向と同一方向に周回する。
【0054】
塗布ベルト31の表面部分は塗布ローラ10と同様に現像液を吸収し得る材料にて構成され、その表面には不図示の供給管から現像液が供給される。従って、塗布ベルト31の走行によりその表面には全長に亘って略均質に現像液が含浸される。なお、塗布ベルト31はモータ等の駆動装置を利用して基板5と同一方向に同一速度で走行させてもよいし、基板5と塗布ベルト31との接触時に基板5から受ける力によって塗布ベルト31を走行させてもよい。この参考例において、昇降装置11はベルト位置切替手段として機能する。
【0055】
次に、図8及び図9を参照して塗布装置1Cの動作を説明する。なお、図8は制御装置6が実行する塗布制御処理の手順を示すフローチャート、図9はその塗布制御処理によって実現される塗布装置1Cの各部の動作を示す図である。
【0056】
図8の処理において、制御装置6は、搬送装置2の搬送経路に設置されたセンサ7(図7(b)参照)からの出力信号に基づいて塗布ユニット3の直下の所定位置に基板5が達したか否か判断する(ステップS31)。図9(a)に示すように基板5が所定位置に達すると、制御装置6は、搬送装置2の搬送速度を通常時速度V1からそれよりも遅い塗布時速度V2に減速し(ステップS32)、かつ塗布ベルト31を下降させる(ステップS33)。
【0057】
これにより、図9(b)に示すように基板5と塗布ベルト31とが接触し、基板5の搬送に伴って塗布ベルト31が基板5と同期した速度で走行して基板5の搬送方向と平行な端部5a、5aに塗布ベルト31から現像液が塗布される。なお、塗布時速度V2は塗布ベルト31の走行に伴う遠心力、特にプーリ30に巻き掛けられている部分で塗布ベルト31から現像液が飛散しない範囲に設定される。塗布ベルト31を下降させる時期は、塗布ベルト31が基板5の搬送方向の先頭に接することができるように定められる。
【0058】
この後、制御装置6は塗布ベルト31による現像液の塗布に関する終了時期か否かを判断する(ステップS34)。終了時期は、図9(b)に示すように基板5の搬送方向に関する後端まで塗布ベルト31が到達する時期又はそれよりも幾らか余裕を含んで遅い時期に定められる。終了時期に達したか否かは、塗布ベルト31を下降させてからの経過時間や、搬送ローラ4やプーリ30の回転量から判断することができる。要は、基板5の端部5a、5aの各位置に必要十分な量の現像液が浸透するのに必要な時間だけ基板5と塗布ベルト31とが接触していればよい。
【0059】
そして、終了時期と判断されると、制御装置6は図9(d)に示すように塗布ベルト31を基板5から上方に離れた待機位置へ移動させ(ステップS35)、かつ、搬送速度を通常時の速度V1に復帰させる(ステップS36)。
【0060】
この参考例においては、塗布ベルト31が搬送方向に関して一度に広い範囲に亘って基板5と密着しているので、単一の塗布ローラを使用して基板5の各位置に順に現像液を塗布する場合と比較して、塗布時速度V2を維持すべき時間を短縮し、塗布作業の効率を改善することができる。
【0061】
しかも、塗布ベルト31を使用した場合には、塗布ローラを使用する場合よりも塗布時速度V2それ自体を高く設定できることがある。すなわち、図10に示すように基板5の搬送速度に関して現像液が飛散する速度領域の下限値をV0としたとき、塗布ローラにて基板5の各位置に十分な量の現像液を塗布できる速度領域の上限値V2aが下限値V0よりも低いことがある。基板5の塗布範囲を微小領域の集合と考えたとき、各微小領域における現像液の塗布量は各微小領域が塗布ローラと接触していた時間に相関し、接触時間が長いほど各微小領域における現像液の塗布量も増加する。しかし、塗布ローラと基板5とは搬送方向に関してほぼ線接触とみなせる程度の狭い範囲で接触しているため、基板5の塗布時速度V2を十分に下げないと各微小領域の塗布ローラにおける接触時間が極めて短くなり、各微小領域には十分な現像液が塗布されないことになる。しかし、塗布ベルト31を使用した場合には基板5と塗布ベルト31とが比較的広い範囲で同時に接触するため、塗布時速度V2を上昇させても各微小領域は十分な時間に渡って塗布ベルト31と接触する。従って、図10に示すように、現像液が十分に塗布できる速度領域の上限値をV2aからV2bへ上昇させることができる。これにより、搬送速度を通常時速度V1から塗布時速度V2に低下させることによる作業効率の低下を抑えることができる。
【0062】
なお、塗布ベルト31を使用する場合には、図10に示した搬送方向下流側のプーリ30に代え、図11に示すように、小径の複数のプーリ32,32によって塗布ベルト31を搬送方向上流側に折り返すようにしてもよい。このような構成によれば、塗布ベルト31が基板5から離れる位置における角度θが大径のプーリ30を使用するよりも小さくなり、現像液の飛散防止効果が高まる。塗布ベルト31の折り返し位置に飛散防止用の覆い部33を追加すればさらに好適である。
【0063】
(第参考例
図12は本発明の第参考例の塗布装置1Dを示している。この塗布装置1Dは、図1の塗布ローラ10に代えて塗布パッド40を設けたものである。塗布パッド40は塗布ローラ10と同様に現像液を吸収し得る材料にて構成される、塗布パッド40は、基板5の搬送方向に沿った端部5a、5aのみならず、搬送方向と直交する端部5b、5bを含む全周と一度に接触し得るような矩形の枠状に形成されている。そして、塗布パッド40には不図示の供給管から現像液がその全周に渡ってほぼ均質に供給される。この参考例では、昇降装置11がパッド位置切替手段として機能する。
【0064】
次に、図13及び図14を参照して塗布装置1Dの動作を説明する。なお、図13は制御装置6が実行する塗布制御処理の手順を示すフローチャート、図14はその塗布制御処理によって実現される塗布装置1Dの各部の動作を示す図である。
【0065】
図13の処理において、制御装置6は、搬送装置2の搬送経路に設置されたセンサ7(図12(b)参照)からの出力信号に基づいて塗布ユニット3の直下の所定位置に基板5が達したか否か判断する(ステップS41)。図14(a)に示すように基板5が所定位置に達すると、制御装置6は、搬送装置2を停止させ(ステップS42)、かつ塗布パッド40を下降させる(ステップS43)。
【0066】
これにより、図14(b)に示すように基板5と塗布パッド40とが接触し、基板5の全周に塗布パッド40から現像液が塗布される。
【0067】
この後、制御装置6は塗布パッド40と基板5との接触状態が所定時間継続したか否かを判断する(ステップS44)。この場合の所定時間は基板5の端部5a、5a、5b、5bに必要な量の現像液が浸透する時間として予め設定されている。そして、所定時間継続したと判断されると、制御装置6は図14(c)に示すように塗布パッド40を基板5から上方に離れた待機位置へ移動させ(ステップS45)、かつ、搬送装置2を起動して通常時速度V1による基板5の搬送を再開する(ステップS46)。
【0068】
以上の参考例によれば、基板5の四辺に同時に現像液を塗布するので、各辺に沿って単一の塗布ローラを移動させて現像液を塗布する場合と比較すれば、極めて短時間で現像液の塗布を終えることができる。従って、基板5の搬送を塗布ユニット3の直下で一時的に停止させたとしてもその停止がカラーフィルタの生産ラインの効率に与える影響は小さい。なお、本発明は塗布パッド40を基板5の四辺に同時に押し付ける例に限らず、例えば端部5a、5aと平行に配置された塗布パッドと、端部5b、5bと平行に配置された他の塗布パッドとを利用して基板5の四辺に現像液を塗布してもよい。
【0069】
以上の第1〜第の実施形態及び第1〜第2の参考例では、カラーフィルタ用のガラス製基板にレジスト膜の現像液を塗布する例を説明したが、本発明はこれに限定されず、各種の処理液を基板に塗布する場合に適用可能である。塗布位置も基板の端部に限定されず、様々な位置への処理液の塗布に本発明を適用してよい。
【0070】
【発明の効果】
以上に説明したように、本発明によれば、塗布ローラよって基板に処理液を塗布する際の基板と塗布ローラの間の相対的な速度を低下させて現像液等の処理液の飛散を防止しつつ、単一の塗布ローラにて基板に処理液を塗布する場合と比較して、塗布ローラ基板とが接触している時間を短縮して塗布作業の効率を改善することができる。
【図面の簡単な説明】
【図1】 本発明の第1の実施形態における塗布装置の概要を示す図。
【図2】 図1の塗布装置における塗布制御の手順を示すフローチャート。
【図3】 図1の塗布装置の動作を示す図。
【図4】 本発明の第2の実施形態における塗布装置の概要を示す図。
【図5】 図4の塗布装置における塗布制御の手順を示すフローチャート。
【図6】 図4の塗布装置の動作を示す図。
【図7】 本発明の第参考例における塗布装置の概要を示す図。
【図8】 図7の塗布装置における塗布制御の手順を示すフローチャート。
【図9】 図7の塗布装置の動作を示す図。
【図10】 第参考例による効果を説明するための図。
【図11】 第参考例に対する変形例を示す図。
【図12】 本発明の第参考例における塗布装置の概要を示す図。
【図13】 図12の塗布装置における塗布制御の手順を示すフローチャート。
【図14】 図12の塗布装置の動作を示す図。
【符号の説明】
1A,1B,1C,1D 塗布装置
2 搬送装置
3 塗布ユニット
4 搬送ローラ
5 基板
5a,5b 基板の端部
6 制御装置
10 塗布ローラ
11 昇降装置(ローラ位置切替手段、ベルト位置切替手段、パッド位置切替
手段)
20 塗布ローラ
20a 円弧部
20b 切欠部
21 駆動装置(ローラ回転駆動手段)
31 塗布ベルト
40 塗布パッド
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing liquid coating method and apparatus that can be used for coating a developer on a substrate on which a resist film is formed.
[0002]
[Prior art]
When a pattern is formed on a glass substrate of a color filter used in a display device such as a liquid crystal display using a photolithography process, a resist film is formed on the substrate prior to the transfer of the pattern to the substrate side. . The resist film should originally be formed to have a uniform thickness, but due to restrictions imposed by the resist agent application method, the film thickness of a specific portion on the substrate may be thicker than other portions. For example, when a spin coating method in which a resist agent is applied by rotating the substrate is used, the film thickness in the peripheral portion of the substrate increases due to the centrifugal force that accompanies the rotation. When coating is performed using a die coater, a large amount of resist agent is supplied at the coating start position and end position, and the film thickness of those portions increases. However, since the processing time and the like are determined based on the normal film thickness in the development process after exposure, the resist film cannot be completely removed at the specific portion where the film thickness is large as described above. However, if a part of the remaining resist film is left unaffected, the uniformity of the resist film to be formed thereafter is affected, or the remaining resist film is peeled off in a subsequent process, which becomes a foreign substance and causes a defect. .
[0003]
Therefore, prior to the development of the pattern, a developing solution is applied in advance to a specific portion having a large film thickness, and the developing solution is sufficiently swollen in the resist film in that portion. A substrate cleaning method and a cleaning apparatus therefor have been proposed. For example, in the cleaning apparatus described in Japanese Patent Application Laid-Open No. 7-27917, the substrate is temporarily stopped in the middle of a line for transporting the substrate in a direction parallel to one side thereof, and is orthogonal to the transport direction of the stopped substrate. An application roller is brought into contact with two sides, and this roller is moved in a direction perpendicular to the conveying direction to apply the developer to the two sides. Thereafter, the substrate is transported from the stop position to the downstream side, and another coating roller is brought into contact with two sides parallel to the substrate transport direction in the middle of the transport to apply the developer to the remaining two sides.
[0004]
[Problems to be solved by the invention]
In the conventional coating method, a developer is applied by moving a single coating roller from one end to the other end of one side of the substrate. In addition, the tangential speed on the outer periphery of the substrate and the substrate transport speed are matched so that no slip occurs between the substrate and the coating roller during coating. Therefore, if the substrate conveyance speed is set too high, the application roller rotates at a high speed, and the developer is scattered from the application roller to the substrate by the centrifugal force accompanying the rotation, which causes a defect in a later process. May be. Therefore, during the application of the developer, it is necessary to limit the conveyance speed of the substrate so that the developer does not scatter from the application roller. However, if the transport speed of the transport device is limited during application of the developer, the transport speed becomes a bottleneck and the efficiency of the entire color filter production line may be reduced.
[0005]
Therefore, an object of the present invention is to provide a processing liquid coating method and a coating apparatus that can improve the efficiency of the processing liquid coating operation while preventing scattering of the processing liquid such as a developer.
[0006]
[Means for Solving the Problems]
The present invention will be described below. In order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are appended in parentheses, but the present invention is not limited to the illustrated embodiment.
[0007]
The invention of claim 1 is in series in one direction. At a constant pitch Each application roller while moving each of the plurality of application rollers relative to the substrate in the one direction with each of the plurality of application rollers (10, 20) in contact with the substrate (5). By rotating each application roller so that no slip occurs at the contact position with the substrate, a predetermined processing liquid contained in each application roller is applied to the application range of each application roller on the substrate. So as to be a length obtained by adding a predetermined margin to the pitch, and The above-described problems are solved by a method of applying a treatment liquid to a substrate that is applied to the substrate so as to be continuous in the one direction.
[0008]
According to this application method, since a plurality of application rollers share and apply the processing liquid, the length of contact of each application roller can be shortened compared to the case where a single application roller is used. Therefore, it is possible to improve the work efficiency by shortening the time required for the coating work. Even if the relative movement speed between the substrate and the application roller is limited in order to suppress the scattering of the processing liquid from the application roller, the time for performing the operation at the limited speed is also shortened.
[0009]
The term “in series” means a state where a plurality of application rollers are arranged back and forth so as to roll on the same straight line. The “slip does not occur” state means that the relative speed between the application roller and the substrate is 0 at the contact position. That is, it is only necessary that the magnitude and direction of the linear velocity of the application roller at the contact position with the substrate match the speed and direction at the contact position of the substrate. The application roller may be rotated using a force received from the substrate by contact with the substrate, or may be rotated using a driving device such as a motor. The relative movement between the substrate and the application roller is realized by moving at least one of the substrate and the application roller in one direction.
[0010]
According to a second aspect of the present invention, in the coating method according to the first aspect, the substrate is brought into contact with the application roller while being conveyed in the one direction, and the processing liquid is applied to the substrate from each application roller. According to the present invention, the coating operation can be performed without stopping the substrate.
[0011]
According to a third aspect of the present invention, in the coating method according to the second aspect, the coating roller (10) is formed in a cylindrical shape having a perfect circular outer periphery, and the coating roller is brought into contact with the substrate and the substrate. The application range by each application roller is adjusted by moving between the positions separated upward. According to this method, the range of contact between each application roller and the substrate can be minimized by the vertical movement of the application roller, and the efficiency of the application operation can be improved. The application roller only needs to be able to move to a position away from the substrate. The application roller may stop at a position away from the substrate, or may temporarily move away from the substrate and then move further to the side. The movement of the substrate obliquely upward is also included in the concept of movement to a position away from the substrate.
[0012]
According to a fourth aspect of the present invention, in the coating method of the second aspect, the coating roller (20) includes an arc portion (20a) constituting a part of a perfect circle and a notch portion (20b) connecting both ends of the arc portion. The circumferential length of the arc portion of each application roller is set to be equal to or greater than the distance (P) to the application roller adjacent to the upstream side in the substrate transport direction, and the arc portion The application range of each application roller is made continuous in the one direction by rotating each application roller once on the substrate so as to be in contact with the substrate. According to this method, when the application roller is rotated once, the application range of the processing liquid by the arc portion of each application roller is continuous with the application range by the upstream application roller. By directing the notch of the application roller to the substrate side, the application roller can be brought into a non-contact state with respect to the substrate. Therefore, it is not necessary to move the applicator roller up and down with respect to the substrate in order to separate it from the substrate. Note that the arc portion of the coating roller located on the most upstream side in the transport direction may be appropriately determined according to the position of the rear end in the transport direction of the coating range of the substrate. When all the application rollers are formed in the same shape and the same size, the distance (pitch) in the conveyance direction of each application roller should be equal to each other, and the circumferential length of the arc portion should be set to be greater than the distance between the application rollers. That's fine.
[0013]
According to a fifth aspect of the present invention, in the coating method according to any one of the second to fourth aspects, the conveyance speed of the substrate is made slower during contact than when not in contact with the coating roller. Thus, by reducing the conveyance speed during the contact with the application roller, the rotation speed of the application roller when contacting the substrate is limited to a range in which the processing liquid from the application roller can be prevented from being scattered, and at the time of non-contact. The work speed of the entire production line can be improved by increasing the conveyance speed.
[0022]
Claim 6 According to the present invention, the transfer device (2) for the substrate (5) is formed in a cylindrical shape having a perfect circular outer periphery, and is arranged in series in the transfer direction of the transfer device so that a predetermined processing liquid is applied to the substrate. A plurality of coating rollers (10) capable of coating, a roller position switching means (11) for moving the plurality of coating rollers between a position in contact with the substrate and a position spaced above the substrate, and the transport When the substrate reaches a predetermined position of the apparatus, each application roller moves to a position where it comes into contact with the substrate. After the contact between each application roller and the substrate, the application range of the processing liquid by each application roller is changed on the substrate. A control device (6) for controlling the operation of the roller position switching means so that the application roller moves to a position away from the substrate when the substrate is transported until it continues in the transport direction. Treatment liquid application The location (1A), to solve the problems described above.
[0023]
According to this coating apparatus, the coating method according to claim 3 described above can be realized by moving the coating roller up and down with respect to the substrate while transporting the substrate. The term “in series” means a state where a plurality of application rollers are arranged back and forth so as to roll on the same straight line. The application roller may be rotated using a force received from the substrate by contact with the substrate, or may be rotated using a driving device such as a motor. The roller position switching means may be any means as long as it moves the coating roller to a position away from the substrate, and stops the coating roller at a position away from the substrate, or once lifts away from the substrate, and then further It may be moved to the side or the like. The application roller may be moved obliquely upward from the substrate.
[0024]
Claim 7 The invention is formed in a shape having a transfer device (2) for the substrate (5), an arc part (20a) constituting a part of a perfect circle, and a notch part (20b) connecting both ends of the arc part, A plurality of application rollers (20) arranged in series in the conveyance direction of the conveyance device and capable of applying a predetermined treatment liquid to the substrate from the arc portion, and the plurality of application rollers, the notch being on the substrate side A roller rotation driving means (21) for returning to the initial position by making one rotation so that no slip occurs at the contact position between the arc portion and the substrate from the initial position facing the substrate, and the substrate at a predetermined position of the transport device Until the position reaches the initial position, the control unit (6) controls the operation of the roller rotation driving means so that the application roller rotates once from the initial position when the substrate reaches the predetermined position. ), And With the application device (1B) of the processing liquid to the substrate in which the circumferential length of the arc portion of each application roller is set to be equal to or greater than the distance to the application roller adjacent to the upstream side in the transport direction of the substrate, Solve the above-mentioned problems.
[0025]
According to this coating apparatus, the coating method of claim 4 described above can be realized by rotating the coating roller once from the initial position while transporting the substrate. The term “in series” means a state where a plurality of application rollers are arranged back and forth so as to roll on the same straight line. The arc portion of the coating roller located on the most upstream side in the transport direction may be appropriately determined according to the position of the rear end in the transport direction of the coating range of the substrate. When all the application rollers are formed in the same shape and the same size, the distance (pitch) in the conveyance direction of each application roller should be equal to each other, and the circumferential length of the arc portion should be set to be greater than the distance between the application rollers. That's fine. The “slip does not occur” state means that the relative speed between the application roller and the substrate is 0 at the contact position. That is, it is only necessary that the magnitude and direction of the linear velocity of the application roller at the contact position with the substrate match the speed and direction at the contact position of the substrate.
[0026]
Claim 8 The invention of claim 6 Or 7 In the coating apparatus, the control device sets the transport speed by the transport apparatus to a predetermined first speed (V1) when the coating roller is at a position away from the substrate, and the coating roller is applied to the substrate. When in the contact position, the transport speed of the transport device is set to a second speed (V2) that is slower than the first speed. In this case, the processing speed is prevented from scattering from the coating roller by setting the transport speed to the second speed, and the efficiency is improved by increasing the transport speed to the first speed when the coating roller is away from the substrate. can do.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
FIG. 1 shows a coating apparatus 1A according to a first embodiment of the present invention, in which (a) is a side view and (b) is a plan view. The coating apparatus 1 </ b> A includes a transport device 2 and a coating unit 3. The conveying device 2 is a well-known roller conveyor that horizontally conveys a substrate (workpiece) 5 by rotation of a plurality of conveying rollers 4... 4 provided at a constant pitch in the conveying direction. The substrate 5 guided to the coating apparatus 1A is a glass substrate for a color filter incorporated in a liquid crystal display device, and a resist film is formed on the surface of the substrate 5 to expose the pattern.
[0032]
The coating unit 3 includes a plurality of coating rollers 10... 10 arranged in series and a lifting device 11 as a roller position switching unit that lifts and lowers the coating rollers 10. The application roller 10 is formed in a cylindrical shape having a perfect circular outer periphery. The application roller 10 is provided in two rows in alignment with the end portions 5a and 5a parallel to the conveyance direction of the substrate 5 (arrow A direction). Each row is provided with three application rollers 10 at a constant pitch in the transport direction. The pitch of the applying roller 10 is equal to the pitch of the conveying roller 4, and the conveying roller 4 and the applying roller 10 are provided in the same position in the conveying direction P (see FIG. 3B). Therefore, the substrate 5 can be sandwiched between the transport roller 4 and the application roller 10 by lowering the application roller 10 by the elevating device 11. A developing solution for the resist film is supplied to the surface of each coating roller 10 through a supply pipe (not shown). The application roller 10 is made of a material that can absorb the developer, such as a sponge. As the application roller 10 rotates, the outer periphery of each application roller 10 is impregnated with the developer substantially uniformly over the entire periphery. The lifting device 11 lifts and lowers the support 13 to which the application roller 10 is attached by actuators 12 and 12 such as air cylinders. The application roller 10 is rotatably supported by a support 13 and rotates upon receiving a force from the substrate 5 when in contact with the substrate 5. However, at a speed at which the application roller 10 does not slip at the contact position with the substrate 5 using a driving source such as a motor, that is, an angular speed at which the linear velocity equal to the conveyance speed of the substrate 5 is obtained on the outer periphery of the application roller 10. It may be rotated.
[0033]
Next, the operation of the coating apparatus 1A will be described with reference to FIGS. 2 is a flowchart showing the procedure of the application control process executed by the control device 6, and FIG. 3 is a diagram showing the operation of each part of the application apparatus 1A realized by the application control process.
[0034]
In the process of FIG. 2, the control device 6 causes the substrate 5 to be placed at a predetermined position directly below the coating unit 3 based on an output signal from a sensor 7 (see FIG. 1B) installed in the transport path of the transport device 2. It is determined whether or not it has been reached (step S11). When the substrate 5 reaches a predetermined position as shown in FIG. 3A, the control device 6 changes the transport speed of the transport apparatus 2 from the normal speed (first speed) V1 to the application speed (second speed) lower than that. The speed is reduced to V2 (step S12), and the application roller 10 is lowered (step S13).
[0035]
As a result, as shown in FIG. 3B, the substrate 5 and the application roller 10 come into contact with each other, and the application roller 10 rotates at a speed synchronized with the substrate 5 along with the conveyance of the substrate 5. The developing solution is applied from the application roller 10 to the parallel end portions 5a and 5a. The application speed V2 is set in a range in which the developer does not scatter from the application roller 10 due to the centrifugal force accompanying the rotation of the application roller 10. The time when the coating roller 10 is lowered is determined so that the coating roller 10 arranged on the most downstream side in the transport direction can contact the top of the substrate 5 in the transport direction.
[0036]
Thereafter, the control device 6 determines whether or not it is the end time related to the application of the developer by the application roller 10 (step S14). As shown in FIG. 3B, when the arrangement pitch of the application rollers 10 is P, the end time is the time when the application range by each application roller 10 reaches the length obtained by adding a predetermined margin to the pitch P of the application rollers 10. It is. By bringing the application roller 10 into contact with the substrate 5 until the end time is reached, the application range by each application roller 10 continues in the transport direction. When the entire length in the transport direction of the substrate 5 is processed by the N coating rollers 10, the pitch P of the coating roller 10 may be set to 1 / N of the total length in the transport direction of the substrate 5. With this setting, at the end time, as shown in FIG. 3C, the application roller 10 arranged on the most upstream side in the transport direction reaches at least the rear end of the substrate 5.
[0037]
Whether or not the end time has been reached is determined by determining the time required for each coating roller 10 to move a distance corresponding to the coating range relative to the substrate 5 from the conveyance speed V2, and lowering the coating roller 10 It can be determined whether or not the elapsed time from the time has reached the time specified from the conveyance speed V2. It may be determined whether or not it is the end time from the rotation amount of the transport roller 4 and the application roller 10 after the contact between the application roller 10 and the substrate 5 is started.
[0038]
When it is determined that the end time is reached, the control device 6 moves the application roller 10 to the standby position away from the substrate 5 as shown in FIG. 3D (step S15), and the conveyance speed is set to normal. Return to the hour speed V1 (step S16).
[0039]
According to the embodiment described above, each coating roller 10 only needs to be in contact with the substrate 5 by a distance obtained by adding a slight margin to the pitch P, and the time for maintaining the conveyance speed at the coating speed V2 is the total length of the substrate 5. Is reduced to about 1/3 of the case where the single coating roller 10 is used. Therefore, even if the conveyance speed is temporarily reduced to the application speed V2, the influence is reduced, and the efficiency of the application work is improved.
[0040]
The diameter of the application roller 10 is not particularly limited. If the rotation amount of each application roller 10 when applying the developer to one substrate 5 is limited to 360 ° or less, the diameter of each application roller 10 is The pitch P may be set to a value (P / π) or more obtained by dividing the pitch P by the circumference ratio π.
[0041]
(Second Embodiment)
FIG. 4 shows a coating apparatus 1B according to the second embodiment of the present invention. In this coating apparatus 1B, a coating roller 20 is used instead of the cylindrical coating roller 10 of FIG. The application roller 20 has a shape in which an arc portion 20a constituting a part of a perfect circle and a notch portion 20b serving as a string connecting both ends of the arc portion 20a are combined. In other words, the application roller 20 is formed by notching a part of a complete cylindrical body including the arc portion 20a to form the notch portion 20b. The shape of the notch 20b is not limited to a straight line, and the shape of the notch 20b is not limited as long as the notch 20b is set back from the arc extending from the arc 20a and cannot contact the substrate 5.
[0042]
As shown in FIG. 6B, the application rollers 20 are arranged in series at the same pitch P in the transport direction. When the entire length of the substrate 5 in the transport direction is processed by N coating rollers 20, the pitch P of the coating roller 20 is set to 1 / N of the total length of the substrate 5 in the transport direction. The circumferential length of the arc portion 20a of each application roller 20 is set to a value obtained by adding a predetermined margin to a value (P / N) obtained by dividing the pitch P of the application roller 20 by the number N of application rollers 20. Is done. This is because the distance (P / N) in the transport direction of the coating range assigned to each coating roller 20 can be processed by the arc portion 20a by rotating the coating roller 20 once.
[0043]
The coating unit 3 further includes a driving device (roller rotation driving means) 21 such as a motor that rotationally drives the coating roller 20. The driving device 21 is preferably capable of grasping the rotational position of the application roller 20 and controlling the rotational speed and stop position thereof. For example, a known rotation control mechanism that combines a stepping motor and a rotary encoder can be used as the drive device 21. Each application roller 20 is supported by a driving device 21 at a height at which the arc portion 20a can contact the substrate 5, and the lifting device 11 is omitted. However, the coating apparatus 1B may include a mechanism that adjusts the height of the coating roller 20 in accordance with a change in the thickness of the substrate 5.
[0044]
The application roller 20 is provided in two rows in alignment with the end portions 5a and 5a parallel to the conveyance direction (arrow A direction) of the substrate 5. The material of the application roller 20 may be the same as that of the application roller 10. The conveyance device 2 may be the same as the example of FIG.
[0045]
Next, the operation of the coating apparatus 1B will be described with reference to FIGS. FIG. 5 is a flowchart showing the procedure of the application control process executed by the controller 6, and FIG. 6 is a diagram showing the operation of each part of the application apparatus 1B realized by the application control process.
[0046]
In the process of FIG. 5, the control device 6 causes the substrate 5 to be placed at a predetermined position directly below the coating unit 3 based on an output signal from a sensor 7 (see FIG. 4B) installed in the transport path of the transport device 2. It is determined whether or not it has been reached (step S21). At this time, as shown in FIG. 6A, the application roller 20 is held at an initial position with the notch 20b facing the substrate 5 side. When the substrate 5 reaches a predetermined position, the control device 6 decelerates the transport speed of the transport device 2 from the normal speed V1 to the slower application speed V2 (step S22), and starts the rotation of the application roller 20 (Step S23). The rotation direction and speed at this time are determined so that no slip occurs between the substrate 5 and the arc portion 20a. The timing of starting the rotation of the coating roller 20 can be such that the tip of the arcuate portion 20a of the coating roller 20 arranged on the most downstream side in the transport direction of the substrate 5 is in contact with the top of the transport direction of the substrate 5. It is determined as follows. The application speed V2 is set in a range in which the developer is not scattered from the application roller 20 due to the centrifugal force accompanying the rotation of the application roller 20.
[0047]
By rotating the application roller 20 as described above, the substrate 5 and the arc portion 20a of the application roller 20 come into contact with each other, and the end portions 5a and 5a parallel to the conveyance direction of the substrate 5 are brought into contact with the arc portion 20a of the application roller 20. A developer is applied.
[0048]
Thereafter, the control device 6 determines whether or not it is the end time related to the application of the developer by the application roller 20 (step S24). The end time is the time when the application range by each application roller 20 reaches the length obtained by adding a predetermined margin to the pitch P of the application roller 20. By bringing the application roller 20 into contact with the substrate 5 until the end time is reached, the application range by each application roller 20 continues in the transport direction. Then, at the end time, as shown in FIG. 6C, the rear end portion of the application roller 20 with respect to the rotation direction of the arc portion 20a is in contact with the substrate 5, in particular, arranged on the most upstream side in the transport direction. The rear end portion of the circular arc portion 20 a of the roller 20 is in contact with the rear end portion in the conveyance direction of the substrate 5.
[0049]
Whether or not the end time has been reached is determined from the conveyance speed V2 by determining the time required for each coating roller 20 to move a distance corresponding to the coating range relative to the substrate 5, and the coating roller 20 is lowered. It can be determined whether or not the elapsed time from the time has reached the time specified from the conveyance speed V2. It may be determined whether or not it is the end time from the rotation amount of the transport roller 4 and the application roller 20 after the contact between the application roller 20 and the substrate 5 is started.
[0050]
When it is determined that the end time is reached, the control device 6 returns the application roller 20 to the initial position and stops its rotation as shown in FIG. 6D (step S25), and the conveyance speed is set to the normal time. The speed is returned to V1 (step S26).
[0051]
As described above, also in this embodiment, since the developer is applied to the substrate 5 by the plurality of application rollers 20, the time for maintaining the conveyance speed at the application speed V2 is a single roller. It is shortened compared with the case of applying the developer. Therefore, even if the conveyance speed is temporarily reduced to the application speed V2, the influence is reduced and the working efficiency is improved. In addition, there is an advantage that the lifting device can be omitted without having to lift and lower the application roller 20.
[0052]
In the present embodiment, the application rollers 20 are equal to each other, but some of the application rollers 20 may be different in size from other application rollers 20. In order to make the coating range of each coating roller 20 continuous, the circumferential length of the arc portion 20a of each coating roller 20 (except for the most upstream side in the transport direction) is set to the upstream in the transport direction. What is necessary is just to set more than the distance to the application roller 20 adjacent to the side. The length of the arc portion 20a of the application roller 20 located on the most upstream side in the transport direction may be determined so as to be included in the application range up to the rear end of the substrate 5 in the transport direction. However, this is not the case when the developer may be applied partway through the substrate 5.
[0053]
(No. 1 of Reference example )
FIG. 7 shows the first aspect of the present invention. 1 of Reference example 1C is shown. 1C, instead of the application roller 10 of FIG. 1, pulleys 30 and 30 are provided in two rows corresponding to the end portions 5a and 5a of the substrate 5, and application belts 31 and 31 are provided on the pulleys 30 and 30, respectively. It is something that is wrapped around. Accordingly, the coating belt 31 circulates in the same direction as the transport direction of the substrate 5.
[0054]
The surface portion of the coating belt 31 is made of a material that can absorb the developer as with the coating roller 10, and the developer is supplied to the surface from a supply pipe (not shown). Therefore, the surface of the coating belt 31 is impregnated with the developer substantially uniformly over the entire length as the coating belt 31 travels. The application belt 31 may be driven at the same speed in the same direction as the substrate 5 by using a driving device such as a motor, or the application belt 31 by the force received from the substrate 5 when the substrate 5 and the application belt 31 are in contact with each other. May be allowed to travel. this Reference example The lifting device 11 functions as belt position switching means.
[0055]
Next, the operation of the coating apparatus 1C will be described with reference to FIGS. FIG. 8 is a flowchart showing the procedure of the application control process executed by the control device 6, and FIG. 9 is a diagram showing the operation of each part of the application apparatus 1C realized by the application control process.
[0056]
In the process of FIG. 8, the control device 6 causes the substrate 5 to be placed at a predetermined position directly below the coating unit 3 based on an output signal from a sensor 7 (see FIG. 7B) installed in the transport path of the transport device 2. It is determined whether or not it has been reached (step S31). When the substrate 5 reaches a predetermined position as shown in FIG. 9A, the control device 6 decelerates the transport speed of the transport device 2 from the normal speed V1 to the coating speed V2 that is slower than the normal speed V1 (step S32). The application belt 31 is lowered (step S33).
[0057]
As a result, the substrate 5 and the coating belt 31 come into contact with each other as shown in FIG. 9B, and the coating belt 31 travels at a speed synchronized with the substrate 5 as the substrate 5 is transported. The developing solution is applied from the application belt 31 to the parallel ends 5a and 5a. The application speed V2 is set in a range in which the developing solution does not scatter from the application belt 31 at the centrifugal force generated when the application belt 31 travels, particularly at the portion wound around the pulley 30. The time when the coating belt 31 is lowered is determined so that the coating belt 31 can come into contact with the top of the substrate 5 in the transport direction.
[0058]
Thereafter, the control device 6 determines whether or not it is the end time for application of the developer by the application belt 31 (step S34). As shown in FIG. 9B, the end time is determined as the time when the coating belt 31 reaches the rear end in the conveyance direction of the substrate 5 or the time later than that with some margin. Whether or not the end time has been reached can be determined from the elapsed time since the application belt 31 is lowered and the rotation amount of the transport roller 4 and the pulley 30. In short, it is only necessary that the substrate 5 and the coating belt 31 are in contact with each other for a time necessary for a necessary and sufficient amount of developer to permeate the positions of the end portions 5a and 5a of the substrate 5.
[0059]
When it is determined that the end time is reached, the control device 6 moves the application belt 31 to the standby position away from the substrate 5 as shown in FIG. 9D (step S35), and sets the transport speed to normal. Return to the current speed V1 (step S36).
[0060]
this Reference example In this case, the coating belt 31 is in close contact with the substrate 5 over a wide range in the transport direction at a time. Compared to the case where a single coating roller is used to sequentially apply the developer to each position of the substrate 5. Thus, the time for maintaining the coating speed V2 can be shortened, and the efficiency of the coating operation can be improved.
[0061]
In addition, when the application belt 31 is used, the application speed V2 itself may be set higher than when the application roller is used. That is, as shown in FIG. 10, when the lower limit value of the speed region where the developer scatters with respect to the conveying speed of the substrate 5 is V0, a speed at which a sufficient amount of developer can be applied to each position of the substrate 5 with the application roller. The upper limit value V2a of the region may be lower than the lower limit value V0. When the coating range of the substrate 5 is considered as a set of minute regions, the amount of developer applied in each minute region correlates with the time during which each minute region is in contact with the coating roller. The amount of developer applied also increases. However, since the coating roller and the substrate 5 are in contact with each other in a narrow range that can be regarded as almost linear contact in the transport direction, the contact time of the coating roller in each minute region is not reduced unless the coating speed V2 of the substrate 5 is sufficiently reduced. Becomes extremely short, and sufficient developer is not applied to each minute region. However, when the application belt 31 is used, the substrate 5 and the application belt 31 are in contact with each other in a relatively wide range at the same time. Therefore, even if the application speed V2 is increased, each minute region is applied for a sufficient time. 31 is contacted. Therefore, as shown in FIG. 10, the upper limit value of the speed region where the developer can be sufficiently applied can be increased from V2a to V2b. As a result, it is possible to suppress a decrease in work efficiency due to a decrease in the conveyance speed from the normal speed V1 to the application speed V2.
[0062]
When the application belt 31 is used, instead of the pulley 30 on the downstream side in the conveyance direction shown in FIG. 10, as shown in FIG. 11, the application belt 31 is moved upstream in the conveyance direction by a plurality of small diameter pulleys 32 and 32. It may be folded back to the side. According to such a configuration, the angle θ at the position where the coating belt 31 is separated from the substrate 5 becomes smaller than when the large-diameter pulley 30 is used, and the effect of preventing the developer from scattering is enhanced. It is more preferable to add a cover portion 33 for preventing scattering to the folding position of the coating belt 31.
[0063]
(No. 2 of Reference example )
FIG. 12 shows the present invention. 2 of Reference example 1D is shown. This coating apparatus 1D is provided with a coating pad 40 in place of the coating roller 10 of FIG. The coating pad 40 is made of a material that can absorb the developer as in the coating roller 10, and the coating pad 40 is orthogonal to the transport direction as well as the ends 5 a and 5 a along the transport direction of the substrate 5. It is formed in a rectangular frame shape that can contact the entire circumference including the end portions 5b and 5b at a time. The developing solution is supplied to the coating pad 40 from a supply pipe (not shown) almost uniformly over the entire circumference. this Reference example Then, the elevating device 11 functions as pad position switching means.
[0064]
Next, the operation of the coating apparatus 1D will be described with reference to FIGS. FIG. 13 is a flowchart showing the procedure of the application control process executed by the controller 6, and FIG. 14 is a diagram showing the operation of each part of the application apparatus 1D realized by the application control process.
[0065]
In the processing of FIG. 13, the control device 6 causes the substrate 5 to be placed at a predetermined position directly below the coating unit 3 based on an output signal from a sensor 7 (see FIG. 12B) installed in the transport path of the transport device 2. It is determined whether or not it has been reached (step S41). As shown in FIG. 14A, when the substrate 5 reaches a predetermined position, the control device 6 stops the transfer device 2 (step S42) and lowers the coating pad 40 (step S43).
[0066]
As a result, the substrate 5 and the coating pad 40 come into contact with each other as shown in FIG. 14B, and the developer is applied from the coating pad 40 to the entire periphery of the substrate 5.
[0067]
Thereafter, the control device 6 determines whether or not the contact state between the coating pad 40 and the substrate 5 has continued for a predetermined time (step S44). The predetermined time in this case is set in advance as a time required for a required amount of developer to permeate the end portions 5a, 5a, 5b, and 5b of the substrate 5. Then, when it is determined that the predetermined time has continued, the control device 6 moves the coating pad 40 to the standby position away from the substrate 5 as shown in FIG. 14C (step S45), and the transfer device. 2 is started and the conveyance of the substrate 5 at the normal speed V1 is resumed (step S46).
[0068]
More than Reference example According to the above, since the developer is applied to the four sides of the substrate 5 at the same time, the developer can be applied in an extremely short time compared to the case where the developer is applied by moving a single application roller along each side. Can finish. Therefore, even if the conveyance of the substrate 5 is temporarily stopped immediately below the coating unit 3, the effect on the efficiency of the color filter production line is small. The present invention is not limited to the example in which the coating pad 40 is pressed against the four sides of the substrate 5 at the same time. For example, the coating pad disposed in parallel with the end portions 5a and 5a and other components disposed in parallel with the end portions 5b and 5b. A developer may be applied to the four sides of the substrate 5 using an application pad.
[0069]
1st to 1st above 2 Embodiment of And first to second reference examples In the above, an example in which a resist film developer is applied to a glass substrate for a color filter has been described. However, the present invention is not limited to this, and the present invention can be applied when various processing solutions are applied to a substrate. The application position is not limited to the edge of the substrate, and the present invention may be applied to application of the treatment liquid to various positions.
[0070]
【The invention's effect】
As explained above, according to the present invention, the application roller In Therefore, the substrate and application roller when applying the processing liquid to the substrate When Compared with the case where the processing liquid is applied to the substrate with a single application roller while the relative speed between the two is reduced to prevent the processing liquid such as the developer from being scattered. When The time during which the substrate is in contact can be shortened to improve the efficiency of the coating operation.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of a coating apparatus according to a first embodiment of the present invention.
FIG. 2 is a flowchart showing the procedure of coating control in the coating apparatus of FIG.
FIG. 3 is a view showing the operation of the coating apparatus of FIG. 1;
FIG. 4 is a diagram showing an outline of a coating apparatus according to a second embodiment of the present invention.
FIG. 5 is a flowchart showing a procedure of coating control in the coating apparatus of FIG. 4;
6 is a view showing the operation of the coating apparatus of FIG. 4;
FIG. 7 shows the first of the present invention. 1 of Reference example The figure which shows the outline | summary of the coating device in.
FIG. 8 is a flowchart showing a procedure of coating control in the coating apparatus of FIG.
FIG. 9 is a view showing the operation of the coating apparatus of FIG. 7;
FIG. 10 1 of Reference example The figure for demonstrating the effect by.
FIG. 11 1 of Reference example The figure which shows the modification with respect to.
FIG. 12 shows the first of the present invention. 2 of Reference example The figure which shows the outline | summary of the coating device in.
13 is a flowchart showing the procedure of coating control in the coating apparatus of FIG.
14 is a view showing the operation of the coating apparatus of FIG.
[Explanation of symbols]
1A, 1B, 1C, 1D coating equipment
2 Transport device
3 Application unit
4 Transport roller
5 Substrate
5a, 5b Edge of substrate
6 Control device
10 Application roller
11 Lifting device (roller position switching means, belt position switching means, pad position switching
means)
20 Application roller
20a Arc part
20b Notch
21 Driving device (roller rotation driving means)
31 Coating belt
40 Application pad

Claims (8)

一方向に直列に一定のピッチで配置された複数の塗布ローラのそれぞれを基板と接触させた状態で、前記複数の塗布ローラを前記基板に対して前記一方向に相対的に移動させつつ各塗布ローラと前記基板との接触位置ですべりが生じないように各塗布ローラを回転させることにより、各塗布ローラに含まれた所定の処理液を、基板上における各塗布ローラの塗布範囲が前記ピッチに所定の余裕を加えた長さとなるように、かつ前記一方向に連続するようにして前記基板に塗布することを特徴とする基板への処理液の塗布方法。With each of the plurality of application rollers arranged in series in one direction at a constant pitch in contact with the substrate, each of the application rollers is moved relative to the substrate in the one direction. By rotating each application roller so that no slippage occurs at the contact position between the roller and the substrate, a predetermined processing liquid contained in each application roller is applied to the application range of each application roller on the substrate to the pitch. A method of applying a processing liquid to a substrate, wherein the substrate is applied to the substrate so as to have a length with a predetermined margin and to be continuous in the one direction. 前記基板を前記一方向に搬送しつつ前記塗布ローラと接触させて各塗布ローラから前記基板に処理液を塗布することを特徴とする請求項1に記載の処理液の塗布方法。  2. The process liquid coating method according to claim 1, wherein the process liquid is applied to the substrate from each application roller by bringing the substrate into contact with the application roller while transporting the substrate in the one direction. 前記塗布ローラを真円状の外周を有する円筒体形状に形成し、その塗布ローラを前記基板と接触する位置と前記基板から上方に離れた位置との間で移動させることにより、各塗布ローラによる塗布範囲を調整することを特徴とする請求項2に記載の処理液の塗布方法。  The application roller is formed in a cylindrical shape having a perfect circular outer periphery, and the application roller is moved between a position in contact with the substrate and a position away from the substrate, whereby each application roller The coating method of the treatment liquid according to claim 2, wherein the coating range is adjusted. 前記塗布ローラを、真円の一部を構成する円弧部とその円弧部の両端を結ぶ切欠部とを有する形状に形成し、各塗布ローラの前記円弧部の周方向の長さを、前記基板の搬送方向に関して上流側に隣接する塗布ローラまでの距離以上に設定するとともに、前記円弧部が前記基板と接触するようにして各塗布ローラを基板上で一回転させることにより各塗布ローラの塗布範囲を前記一方向に連続させることを特徴とする請求項2に記載の処理液の塗布方法。  The coating roller is formed in a shape having an arc portion that constitutes a part of a perfect circle and a notch that connects both ends of the arc portion, and the circumferential length of the arc portion of each coating roller is determined by the substrate. The application range of each application roller is set to be equal to or greater than the distance to the application roller adjacent to the upstream side in the transport direction, and the application roller is rotated once on the substrate so that the arc portion is in contact with the substrate. The process liquid coating method according to claim 2, wherein the process liquid is continuous in the one direction. 前記基板の搬送速度を前記塗布ローラと接触していない間よりも接触中において遅くすることを特徴とする請求項2〜4のいずれか1項に記載の処理液の塗布方法。  The method for coating a processing liquid according to any one of claims 2 to 4, wherein the substrate transport speed is made slower during contact than when not in contact with the coating roller. 基板の搬送装置と、
真円状の外周を有する円筒体形状に形成され、前記搬送装置の搬送方向に直列に配置されて所定の処理液を前記基板に塗布可能な複数の塗布ローラと、
前記複数の塗布ローラを前記基板に接触する位置と前記基板の上方に離れた位置との間で移動させるローラ位置切替手段と、
前記搬送装置の所定位置に前記基板が達すると各塗布ローラが前記基板と接触する位置に移動し、各塗布ローラと前記基板との接触後、各塗布ローラによる前記処理液の塗布範囲が前記基板上で前記搬送方向に連続するまで前記基板が搬送されると前記塗布ローラが前記基板から離れる位置に移動するように、前記ローラ位置切替手段の動作を制御する制御装置と、
を備えたことを特徴とする基板への処理液の塗布装置。
A substrate transfer device;
A plurality of application rollers formed in a cylindrical shape having a perfect circular outer periphery, arranged in series in the transfer direction of the transfer device, and capable of applying a predetermined treatment liquid to the substrate;
Roller position switching means for moving the plurality of application rollers between a position in contact with the substrate and a position away from the substrate;
When the substrate reaches a predetermined position of the transport device, each application roller moves to a position where it contacts the substrate. After the contact between each application roller and the substrate, the application range of the treatment liquid by each application roller is the substrate. A control device for controlling the operation of the roller position switching means so that the coating roller moves to a position away from the substrate when the substrate is transported until it continues in the transport direction above;
An apparatus for applying a treatment liquid onto a substrate, comprising:
基板の搬送装置と、
真円の一部を構成する円弧部とその円弧部の両端を結ぶ切欠部とを有する形状に形成され、前記搬送装置の搬送方向に直列に配置されて前記円弧部から所定の処理液を前記基板に塗布可能な複数の塗布ローラと、
前記複数の塗布ローラを、前記切欠部が前記基板側を向く初期位置から前記円弧部と前記基板との接触位置ですべりが生じないように一回転させて前記初期位置に復帰させるローラ回転駆動手段と、
前記搬送装置の所定位置に前記基板が達するまでは前記塗布ローラを前記初期位置に保持し、前記基板が所定位置に達すると前記塗布ローラが前記初期位置から一回転するように前記ローラ回転駆動手段の動作を制御する制御装置と、
を備え、
各塗布ローラの前記円弧部の周方向の長さが、前記基板の搬送方向に関して上流側に隣接する塗布ローラまでの距離以上に設定されている、
ことを特徴とする基板への処理液の塗布装置。
A substrate transfer device;
It is formed in a shape having an arc portion that constitutes a part of a perfect circle and a notch portion that connects both ends of the arc portion, and is arranged in series in the transport direction of the transport device, and a predetermined processing liquid is supplied from the arc portion A plurality of application rollers that can be applied to the substrate;
Roller rotation driving means for rotating the plurality of application rollers from the initial position where the notch portion faces the substrate side to return to the initial position by causing one rotation so that no slip occurs at the contact position between the arc portion and the substrate. When,
The roller rotation driving means holds the application roller at the initial position until the substrate reaches a predetermined position of the transport device, and rotates the application roller once from the initial position when the substrate reaches the predetermined position. A control device for controlling the operation of
With
The length in the circumferential direction of the arc portion of each application roller is set to be equal to or greater than the distance to the application roller adjacent to the upstream side in the conveyance direction of the substrate.
An apparatus for applying a treatment liquid onto a substrate.
前記制御装置は、前記塗布ローラが前記基板から離れた位置にあるときは前記搬送装置による搬送速度を所定の第1速度に設定し、前記塗布ローラが前記基板に接触する位置にあるときは前記搬送装置の搬送速度を前記第1速度よりも遅い第2速度に設定することを特徴とする請求項又はに記載の処理液の塗布装置。The control device sets a transport speed by the transport device to a predetermined first speed when the coating roller is at a position away from the substrate, and when the coating roller is at a position in contact with the substrate, treatment liquid coating apparatus according to claim 6 or 7, characterized in that for setting the conveying speed of the conveying device to the slower second rate than the first speed.
JP2002234652A 2002-08-12 2002-08-12 Method and apparatus for applying treatment liquid to substrate Expired - Fee Related JP4312435B2 (en)

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