201210919 六、發明說明： 【發明所屬之技術領域】 本發明關於液晶基板之基板貼合系統，特別是，關於 實現縮短貼合完成爲止之時間之同時，儘可能減少系統中 之機器人對於基板之收送作業的基板搬送裝置以及基板傾 斜補正。 【先前技術】 、 液晶顯示面板之製造係具有，係使設有透明電極或薄 膜電晶體陣列之2片玻璃基板，隔開約數十μηι之極爲接近 之間隔，藉由設於基板周緣部之接著劑（以下亦稱密封劑 )予以貼合（以下稱貼合後之基板爲液晶顯示面板），在 如此形成之基板間之空間密封液晶之工程。 該液晶之密封方法有，以不設置注入口的方式對實施 密封劑封閉之圖案進行描繪而成爲一方基板，在該一方基 板上滴下液晶，於真空腔室內將另一方基板配置於該一方 基板上，使彼等上下之基板近接而貼合之方法等。 作爲該液晶基板之貼合方法之一習知方法，係於真空 腔室內設置用於進行基板之搬出入的預備室，設定真空腔 室內成爲和預備室同一環境而進行基板之搬出入的方法（ 例如參照專利文獻1 )。 於該專利文獻1另外皆是，將上基板與下基板載置於 搬送治具，由預備室至貼合室而搬送至輸送機（conveyor )上。 -5- 201210919 作爲另一習知例有，使下基板由第1裝載室經由間隔 物散布裝置、密封材塗布裝置、液晶注入裝置及第1預備 整列裝置而搬送至組裝裝置，使上基板由第2裝載室經由 第2預備整列室及預備室而搬送至組裝裝置，於組裝裝置 進行該2片基板之貼合後，經由密封材硬化裝置、熱處理 裝置及基板切斷裝置而將該貼合後之基板搬送至卸載裝置 之系統（參照例如專利文獻2 )。 又，作爲另一習知例被提案者有印刷基板搬送輸送機 ，其具備藉由機械方式進行基板之定位或傾斜補正的機構 (參照例如專利文獻3 )。 〔習知技術文獻〕 〔專利文獻〕 專利文獻1 :特開200 1 -3 〇5 5 63號公報 專利文獻2 :特開2 003 - 1 5 1 0 1號公報 專利文獻3 :特開平1 0-3 1 0220號公報 【發明內容】 (發明所欲解決之課題） 上述專利文獻1揭示之技術，於液晶基板組裝系統中 ，在貼合基板之貼合室（真空腔室）進行基板之搬出入時 ，爲能設定貼合室內成爲和預備室同一環境，而常時設定 貼合室內成爲真空狀態，將大氣狀態被貼合之2片基板搬 入設於該貼合室之一側的一方之預備室內，搬入終了後， 設定該預備室成爲真空狀態，將彼等2片基板由該預備室 -6- 201210919 «送至貼合室內。於該貼合室，將彼等基板保持於上平台 與下平台，使上平台下降至保持於下平台之下基板上，而 進行彼等上下2片基板之貼合。於貼合室，彼等2片基板之 貝占合,終了後，彼等被貼合後之基板，係由設於該貼合室另 側之另一預備室予以排出。專利文獻i揭示之裝置，係 成爲該構成，因此裝置成爲長的構造，需要大的設置面積 〇 另外，需要設定各個預備室或貼合室成爲真空狀態， 需要配置該目的之裝置，而且設爲真空狀態亦需要時間， 作業時間之縮短上有其限制。另外，於上述專利文獻1並 未揭示和其前置工程之關係。又，使用搬送治具進行上下 基板由預備室至貼合室之搬送，搬送治具對基板之交付/ 受取等需要時間，此亦爲其問題。 於上述專利文獻2僅揭示，在各裝置間藉由移動手段 移動基板，但對於使用何種搬送手段來搬送基板，以及對 各裝置之交付/受取並未有任何揭示。 藉由滾筒輸送機（roller conver)方式搬送基板時， 將基板載置於滾筒輸送機上時或滾筒輸送機之急速停止等 ’會導致搬送中之基板對其之搬送方向呈某種角度傾斜。 於上述專利文獻3雖揭示基板傾斜補正方法，但以該 方法進行基板之傾斜補正時，須使基板停止於特定位置之 後，由橫向按壓停止之基板以解消其之傾斜，因此傾斜之 補正需要時間，需要進行該動作之各種機械式機構，裝置 變爲大型化之問題存在。 201210919 本發明目的在於解決上述問題，提供基板搬送裝置及 基板傾斜補正方法，其可於移動該基板之狀態下進行基板 之傾斜補正，可以縮短傾斜之補正所要時間，而且可實現 裝置全體之小型化，可使基板在無傾斜狀態下搬送至搬送 目的地之機構部。 (用以解決課題的手段） 爲達成上述目的，本發明之基板搬送裝置，其特徵爲 具備：在基板搬送方向之左右方向配置左側輸送機與右側 輸送機而成的輸送機，藉由驅動左側輸送機以及右側輸送 機，而使該基板以定常速度進行搬送者：設有：基板檢測 感測器，係在左側輸送機與右側輸送機，在基板搬送方向 之垂直方向隔開間隔被配置，用於檢測被搬送之基板；及 控制手段，其由左側輸送機之基板檢測感測器與右側輸送 機之基板檢測感測器對於基板之檢測時序之時間差，求出 被搬送之基板對其之搬送方向之傾斜角，對應於傾斜角而 將左側輸送機對基板之搬送速度與右側輸送機對基板之搬 送速度設定成爲不同：設定左側輸送機對基板之搬送速度 與右側輸送機對基板之搬送速度成爲不同，而使基板於左 側輸送機與右側輸送機之面內旋轉，據以補正基板之傾斜 〇 另外，輸送機，係使左側輸送機與右側輸送機所構成 之複數個區間輸送機，配列於基板之搬送方向而成；對應 於每一個區間輸送機檢測出基板之傾斜角，對應於檢測出 -8- 201210919 之傾斜角使基板旋轉，據以補正基板之傾斜者爲其特徵》 於輸送機，係藉由增速右側輸送機與左側輸送機之其 中之一方’而將以定常速度搬送之基板之一方之邊部側之 移動速度，設爲快於或慢於該定常速度而進行移動，使基 板旋轉者爲其特徵。 爲達成上述目的，本發明之基板傾斜補正方法，其特 徵爲：在基板搬送方向之左右方向配置左側輸送機與右側 輸送機，藉由驅動左側輸送機以及右側輸送機，而使基板 以定常速度進行搬送的輸送機對基板之傾斜補正方法者； 在左側輸送機與右側輸送機，藉由互相在基板搬送方向之 垂直方向被配置的基板檢測感測器來檢測該基板，依據該 檢測結果而檢測出該基板之傾斜；對應於檢測出之基板之 傾斜，而將左側輸送機對基板之搬送速度與右側輸送機對 基板之搬送速度設定成爲不同，於左側輸送機、右側輸送 機上使基板以定常速度搬送之同時，旋轉而補正基板之傾 斜。 本發明之特徵在於，輸送機，係使左側輸送機與右側 輸送機所構成之複數個區間輸送機，配列於基板搬送方向 而成；對應於該每一個區間輸送機檢測出基板之傾斜角， 對應於檢測出之傾斜角使基板以定常速度搬送之同時’旋 轉而補正基板之傾斜。 本發明之特徵在於，於輸送機，係藉由增速右側輸送 機與左側輸送機之其中之一方，而將以定常速度搬送之基 板之一方之邊部側之移動速度，設爲快於或慢於該定常速 -9- 201210919 度而進行移動，使基板旋轉。 【實施方式】 以下依據圖面說明本發明之實施形態。 圖1表示具備本發明之基板搬送裝置及基板傾斜補正 方法的液晶基板組裝系統之全體配置平面圖。1爲下基板 ，2爲上基板，3爲基板搬入機器人，4爲整列機構，5爲第 1搬送線（主線），6爲第2搬送線（副線），7爲糊塗布機 (密封劑分布器），8爲短路電極形成用塗布機，9爲液晶 滴下裝置，10爲第1檢測室，11爲基板反轉裝置，12爲移 載室，13爲機器手臂，14爲前處理室，15爲基板貼合室（ 真空腔室），16爲後處理室，17爲紫外線照射室，18爲第 2檢測室（面板檢測室），19爲貼合基板（液晶基板）， 20爲第3搬送線。 於該圖設置：第1搬送線（主線）5，用於搬送下基板 1 ;及第2搬送線（副線）6，用於搬送形成有TFT (薄膜電 晶體）等之上基板2。搬送洗淨後之上基板2及下基板1的 第1搬送線5及第2搬送線6，係由滾筒以1列配列於搬送方 向的滾筒輸送機（roller conveyor)或帶狀輸送機（belt conveyor)構成。2個滾筒輸送機或帶狀輸送機，係於基 板移動方向之左右方向被分割而配置，分別藉由個別之驅 動機構進行驅動控制。以下說明滾筒輸送機之構成。上下 基板1、2分別搬送於滾筒輸送機上。 於第1搬送線5之前側設置：基板搬入機器人3，用於 -10- 201210919 將洗淨後之下基板1搬入該系統；及整列機構4，用於由基 板搬入機器人3進行下基板1之整列。第1搬送線5係由整列 機構4受取下基板1，以下基板1之貼合面朝上而使第1搬送 線5上朝箭頭方向移動。於該第1搬送線5之中途設置糊塗 布機（密封分散器）7，可於下基板1上將密封劑（接著劑 )塗布成爲環狀（閉迴路狀）。和該糊塗布機7呈串列式 (亦即於下流側）配置短路電極形成用塗布機8，用於將 導電糊塗布成爲點狀。 於短路電極形成用塗布機8之下流側配置液晶滴下裝 置9，可將所要量之液晶滴至如上述被塗布之密封劑之迴 路內。於液晶滴下裝置9之下流側配置第1檢測室1 〇 ’用於 檢測所塗布之密封劑或低下之液晶等之狀態。該第1檢測 室10所檢測過之下基板1，係藉由設於移載室12之機器手 臂13，被搬送至設於前處理室14與第2檢測室U之間的第3 搬送線20。第3搬送線20亦由滾筒輸送機形成。藉由第3搬 送線20，首先，使下基板1被搬送至基板搬入側之前處理 室14內》另外，經由第2搬送線6被搬送來的上基板2’係 於基板反轉裝置11被反轉表背面之後，藉由設於移載室12 之機器手臂13，被搬入前處理室14內。 於前處理室14亦設有：保持上基板2而將其搬入基板 貼合室（真空腔室）15的機器手臂（未圖示）：及用於搬 送下基板1的滾筒輸送機（未圖示）。另外’於前處理室 1 4設置使滾筒輸送機伸縮的輸送機伸縮機構（未圖示）’ 當設於前處理室14與基板貼合室15之間的閘閥（未圖示） -11 - 201210919 打開時，藉由該輸送機伸縮機構可使滾筒輸送機越過閘閥 而可以連接於基板貼合室15之滾筒輸送機。 上下基板1、2被搬入前處理室14之後’設於前處理室 14之基板搬入側之入口的閘閥（未圖示）被關閉，藉由真 空泵（未圖示）使前處理室Μ內被排氣至特定真空度（約 150Torr:以下稱此爲半真空）。前處理室14成爲半真空 狀態後，其和基板貼合室1 5之間之閘閥被打開，滾筒輸送 機藉由輸送機伸縮機構延伸至基板貼合室15側而連接於基 板貼合室15之滾筒輸送機。下基板1於該滾筒輸送機上移 動而被搬入基板貼合室15內，另外，藉由機器手臂將上基 板2搬入基板貼合室15內。此時基板貼合室15內成爲半真 空狀態。於前處理室14設置：受取下基板1並搬送至基板 貼合室15之下平台之成爲第3搬送線20的滾筒輸送機；及 受取上基板2並將其移至基板貼合室15之上平台（加壓板 )31 (圖4)的機器手臂28 (圖4)。基板貼合室15之基板 1、2之受取之詳細如後述說明。 基板貼合室1 5之兩基板1、2之交付/受取終了後，彼 等上下基板1、2分別被保持於該上下兩平台46、47 (圖4 )時，由前處理室14所言深知滾筒輸送機係收縮至前處理 室1 4內，上述閘閥被關閉。之後，基板貼合室1 5被排氣至 高真空（約5x1 〇·3Torr )爲止。之後，進行上下兩基板1、 2之定位之同時，下降上平台進行上基板2對下基板1之貼 合。該貼合終了後，基板貼合室1 5內回復半真空狀態，基 板貼合室1 5與後處理室1 6間之閘閥（未圖示）被開放。此 -12- 201210919 時，後處理室1 6成爲半真空狀態。 於後處理室16亦設置輸送機伸縮機構（未圖示）。當 其與基板貼合室15之間的閘閥打開時，設於後處理室16的 該輸送機伸縮機構會動作，滾筒輸送機由後處理室16延伸 而連接於基板貼合室15之滾筒輸送機，上下基板1、2被貼 合而成的貼合基板（亦即液晶基板）1 9將被搬入後處理室 16。貼合基板19被搬入後處理室16之後，滾筒輸送機被收 縮至後處理室16內，設於後處理室16與基板貼合室15之間 的閘閥被關閉，後處理室1 6內被設爲大氣狀態。後處理室 1 6內成爲大氣狀態之後，後處理室1 6與紫外線照射室1 7之 間之閘閥（未圖示）被打開，藉由設於後處理室1 6之輸送 機伸縮機構（未圖示），而被連接於紫外線照射室1 7之滾 筒輸送機。液晶基板19於該滾筒輸送機上移動而被搬入紫 外線照射室1 7內。於此，密封劑被照射紫外線而使密封劑 硬化。密封劑之硬化結束後，液晶基板1 9被搬送至滾筒輸 送機上，被搬送至第2檢測室（面板檢測室）1 8進行檢測 如上述說明，將各處理室1 4〜1 8並列爲大略直線狀， 一部分使用機器手臂，但是因爲基板之搬送大致全體使用 滾筒輸送機之構成，可抑制裝置之設置面積於最小限。 另外，藉由上述之系統構成來製造貼合基板（亦即液 晶基板）1 9，於該液晶基板貼合系統’基板1、2之搬送大 部分藉由滾筒輸送機進行，和習知使用機器手臂搬送比較 ，上下基板1、2之搬送方向於順時針方向或逆時針方向之 -13- 201210919 旋轉傾斜、定位精確度有可能降低。因此，需要防止搬送 路上停止時產生之傾斜，以使上下基板1、2傳遞至各處理 裝置上時之位置偏移。因此，於該實施形態中，在第1搬 送線5或第2搬送線6之滾筒輸送機將基板1、2傳遞至各處 理部之前側，配置進行定位（亦即檢測出上下基板1、2之 旋轉（傾斜），補正該傾斜）用的檢測感測器。 圖2表示圖1所示液晶基板組裝系統之中之本發明之基 板搬送裝置及基板傾斜補正方法的一實施形態之槪略構成 圖。圖2(a)表示基板（此爲下基板1之例）以正常姿勢 搬送之狀態，圖2(b)表示基板以旋轉（傾斜）狀態搬送 之狀態，5L爲左側滾筒輸送機，5R爲右側滾筒輸送機， 21a、21b爲滾筒，22a、22b爲動力傳動軸，23a、23b爲驅 動馬達，24a、24b爲基板檢測感測器，對應於上述圖面之 部分附加同一符號而省略重複說明。於此雖對第1搬送線5 加以說明，但第2搬送線6亦同樣。另外，雖對下基板1加 以說明，但上基板2亦同樣。 該圖中，於滾筒輸送機構成之第1搬送線5,於其左右 分別配置滾筒21a、2 lb之列，介由動力傳動軸22a、2 2b而 連接於驅動左右滾筒21a、21b的驅動馬達23a、23b»驅動 馬達23a、23b之驅動力係介由動力傳動軸22a、22b被傳遞 至滾筒21a、21b，如此而旋轉驅動滾筒21a、21b。於下基 板1載置於彼等滾筒21a、21b上之狀態下’旋轉驅動彼等 滾筒21a、21b可使下基板1朝箭頭方向搬送。 滾筒21 a之列、動力傳動軸22a、及驅動馬達23a係形 -14 - 201210919 成左側滾筒輸送機5L，滾筒21b之列、動力傳動軸22b、及 驅動馬達2 3 b係形成右側滾筒輸送機5 R，左側滾筒輸送機 5 L對於下基板1之搬送方向（白色箭頭所示）配置於左側 ，右側滾筒輸送機5R被配置於右側，而且以使下基板1之 左側邊部載置於左側滾筒輸送機5L之滾筒21a之列上，下 基板1之右側邊部載置於右側滾筒輸送機5L之滾筒2 1 b之列 上的方式，將左側滾筒輸送機5L與右側滾筒輸送機5L之間 隔予以保持。 在使用左側滾筒輸送機5L與右側滾筒輸送機5R構成之 滾筒輸送機的第1搬送線5，係於搬送方向之直角方向（左 右方向）配置基板檢測感測器24a、24b，用於檢測下基板 1之左右兩邊部之通過。下基板1被搬送至糊塗布機7(圖1 )之平台（未圖示）前側時，藉由設於第1搬送線5之基板 檢測感測器24a、24b檢測出下基板1之左右兩邊部（於圖2 表示下基板1通過基板檢測感測器24a、24b後之狀態）。 左右各側之基板檢測感測器24a、24b之其中之一方檢測出 下基板1之邊部時，藉由控制手段（未圖示）進行控制， 而停止檢測出之側之驅動馬達23 a或23b。如圖2 ( a)所示 ，基板檢測感測器24a、24b同時檢測出下基板1之各邊部 之前端時，控制手段判斷下基板1未傾斜而以正確狀態被 搬送，繼續旋轉驅動驅動馬達23a、23 b而搬送下基板1。 如圖2(b)所示，假設下基板1由進行方向看時（以 下同樣）朝逆時針旋轉方向旋轉（傾斜）而被搬送（亦即 下基板1之左邊部側較左邊部側較慢被搬送），如此則， -15- 201210919 配置於左側滾筒輸送機5L與右側滾筒輸送機5R之基板檢測 感測器24a、24b無法同時檢測出下基板1，首先，右側滾 筒輸送機5R之基板檢測感測器24b (以下稱爲右側基板檢 測感測器24b )檢測出下基板1，之後，左側滾筒輸送機5 L 之基板檢測感測器24a (以下稱爲左側基板檢測感測器24a )檢測出下基板1，在右側基板檢測感測器24b檢測出下基 板1至左側基板檢測感測器24a檢測出下基板1之期間，係 維持該時之移動速度（以下稱奇爲定常速度）而搬送下基 板1。之後，當左側基板檢測感測器24a檢測出下基板1時 ，增速左側驅動馬達23 a而使下基板1之左邊部側較左邊部 側（亦即較定常速度）快的移動速度（以下稱其爲傾斜補 正速度）予以搬送。如此則，下基板1被搬送之同時，朝 逆時針方向旋轉，而使該下基板1之傾斜被補正。 如上述說明，爲補正下基板1之傾斜，而藉由控制部 (未圖示）求出，自右側基板檢測感測器24b檢測出下基 板1之左邊部側至左側基板檢測感測器24a檢測出下基板1 之左邊部側爲止之時間，依據該時間求出下基板1之傾斜 方向及傾斜量，依據彼等而算出移動事先決定之特定距離 時該下基板1之傾斜被補正用的下基板1之移動速度，以其 作爲傾斜補正速度，依據該傾斜補正速度使下基板1之左 邊部移動，如此而設定左側之驅動馬達23a之旋轉速度。 如此則，下基板1之左邊部以該傾斜補正速度移動，下基 板1之左邊部以定常速度移動，下基板1被搬送之同時朝逆 時針旋轉方向旋轉，而使逆時針方向之旋轉引起之傾斜被 -16- 201210919 補正。 如上述說明，於滾筒輸送機上無須停止下基板1之搬 送，可以補正下基板1之傾斜，因此，於圖1之糊塗布機7 或液晶滴下裝置9、基板貼合室15等平台載置下基板1時， 無須進行下基板1之定位，可縮短作業時間。 於上述各裝置設置進行各種處理之平台，於各平台具 備基板定位機構用於界定下基板1之停止位置。該定位機 構，係由在基板搬送方向之直角方向界定下基板1之左右 兩邊部側之進行的上下移動之2個制動銷構成。下基板1於 滾筒輸送機上被搬送至裝置內時，該制動銷變爲較滾筒輸 送機更突出於上方，以停止下基板1之移動，而阻止該下 基板1之進行。 圖3表示圖1所示液晶基板組裝系統之中之本發明之基 板搬送裝置及基板傾斜補正方法的另一實施形態之槪略構 成圖。圖3 ( a )表示基板（此爲下基板1之例）由傾斜姿 勢被補正爲正常姿勢之傾斜補正過程，圖3(b)表示下基 板1之移動速度變化，21ai〜21a3、211η〜211)3爲滾筒， 22ai〜22a3、22b〗〜22b3爲動力傳動軸，23a丨〜23a3、23b, 〜23b3爲驅動馬達，24a,〜24a3、24b, ~ 24b3爲基板檢測 感測器，25,〜2 5 3爲區間滾筒輸送機，對應於上述圖面之 部分附加同一符號而省略重複說明。於此雖對第1搬送線5 加以說明，但第2搬送線6亦同樣。另外，雖對下基板1加 以說明，但上基板2亦同樣。 於圖2之實施形態中，係於滾筒輸送機之1處位置配置 -17- 201210919 基板檢測感測器24a、24b，於圖3之實施形態中，裝置間 之基板搬送路較長時，可將搬送路於其搬送方向分割爲複 數區間，對應於每一區間配置滾筒輸送機（於此說明配置 3個區間滾筒輸送機25 !〜253之例，但不限定於此），對應 於每一區間滾筒輸送機可以變化搬送速度，而設置驅動裝 置。 於圖3(a)，該實施形態，係將裝置間之距離長的下 基板1之搬送路分割爲3個區間，對應於每一區間配置左側 滾筒輸送機與右側滾筒輸送機構成之區間滾筒輸送機25i 、252、253»於各個區間滾筒輸送機25!、252、253，係於 其左側之滾筒輸送機（亦即左側滾筒輸送機）之始端側配 置基板檢測感測器24a!、24a2、24a3，於其右側之滾筒輸 送機（亦即右側滾筒輸送機）之始端側配置基板檢測感測 器24bi、24b2、24b3，下基板1係以一定之定常速度被搬送 於彼等區間滾筒輸送機25i、2 5 2、2 5 3，當下基板1有傾斜 時，於區間滾筒輸送機251係藉由基板檢測感測器24a,、 241m檢測該傾斜，於區間滾筒輸送機2 5 2係藉由基板檢測感 測器24a2、24b2檢測該傾斜，於區間滾筒輸送機2 5 3係藉由 基板檢測感測器24a3、24b3檢測該傾斜，下基板1之傾斜係 在區間滾筒輸送機25i、252、253被搬送時進行補正》 區間滾筒輸送機2 5 ^係由以下構成：左側滾筒輸送機 ，其由配列於下基板1之搬送方向的滾筒2 1 a!之列與驅動 馬達23 ai以及將該驅動馬達23 a,之旋轉驅動力分別傳遞至 各個滾筒21a!的動力傳動軸22a!構成；及右側滾筒輸送機 -18- 201210919 ，其由配列於下基板1之搬送方向的滾筒21b之列與驅動 馬達23 b!以及將該驅動馬達23b,之旋轉驅動力分別傳遞至 各個滾筒21b!的動力傳動軸22bi構成；同樣，區間滾筒輸 送檢2 5 2係由以下構成：左側滾筒輸送機，其由配列於下 基板1之搬送方向的滾筒21a2之列與驅動馬達23a2以及將該 驅動馬達23 a2之旋轉驅動力分別傳遞至各個滾筒21 a2的動 力傳動軸22 a2構成；及右側滾筒輸送機，其由配列於下基 板1之搬送方向的滾筒21b2之列與驅動馬達23b2以及將該驅 動馬達23 b2之旋轉驅動力分別傳遞至各個滾筒21 b2的動力 傳動軸22b2構成；同樣，區間滾筒輸送機2 53係由以下構成 :左側滾筒輸送機，其由配列於下基板1之搬送方向的滾 筒21a3之列與驅動馬達23a3以及將該驅動馬達23a3之旋轉 驅動力分別傳遞至各個滾筒2〗a3的動力傳動軸22 a3構成； 及右側滾筒輸送機，其由配列於下基板1之搬送方向的滾 筒21b3之列與驅動馬達23b3以及將該驅動馬達23b3之旋轉 驅動力分別傳遞至各個滾筒21b3的動力傳動軸22b3構成。 以下使用圖3 ( a )說明該實施形態之動作。 如圖所示，下基板1以傾斜Θ角度之狀態由區間滾筒 輸送機25!開始被搬送。於區間滾筒輸送機25! ’首先’基 板檢測感測器24ai、24b,之中之基板檢測感測器24b !檢測 出下基板1之左邊部通過（圖3(b)之時刻ΤΊ)。下基板1 係於圖3 ( b )之時刻TQ以加速度!開始搬送’時刻T!之 下基板1之移動速度，如圖3 (b)所示，爲定常速度之νι (例如Vi= 750mm/sec)。以該定常速度Vifj進距離^^之 -19- 201210919 後，基板檢測感測器24a!檢測出下基板1之左邊部（圖3 ( b )之時刻T2 )，該檢測出之後，控制部（未圖示）由下 基板1之彼等基板檢測感測器24b !、24ai之檢測時間差（ T2-T!)、下基板1之搬送速度V!、以及基板檢測感測器 24ai、24bds1之距離K，求出下基板1之傾斜角0 (Mar^V, •((TVTO/K)。 求出下基板1之傾斜量0之後（圖3 ( b )亦爲時刻T2 )，控制部對區間滾筒輸送機25 i之驅動馬達23&1下達指令 以加速度α ,增速至傾斜補正速度V2，於時間tl使區間滾筒 輸送機25i之左側滾筒輸送機之滾筒21a,增速至傾斜補正速 度V2。使增速之一方之下基板1之邊部（亦即左邊部）以 該傾斜補正速度V2移動t2時間後（其引起之移動距離ADi ，此時，下基板1之右邊部以定常速度V!移動），以減速 度α 2減速，而設爲定常速度Vi。該滾筒輸送機（亦即該 第1搬送線5 (圖1 ))所搬送之下基板1之間隔設爲1時， 以使由時刻ΤΊ至時刻（Ti+q+h+h)爲止移動之距離X 成爲x= lsin0的方式，使傾斜補正速度V2增速（但是， 區間滾筒輸送機25!、2 5 2、2 5 3之間隔設爲大於該距離X者 )° 藉由以上處理，下基板1之傾斜被補正，其之傾斜角 0成爲0或變小，之後，下基板1被搬送距離ΔΙ^，進入次 一區間滾筒輸送機2 5 2，於其之基板檢測感測器24a2、24b2 進行同樣之下基板1之邊部之檢測（圖3 ( b )之時刻T3、 Τ4)，該下基板1存在傾斜時，和區間滾筒輸送機251同樣 -20- 201210919 進行傾斜方向或傾斜角之檢測，進行該傾斜角之補正。於 圖3 ( b )，於區間滾筒輸送機2 52，自時刻T4起增速至和 該時檢測出之傾斜角0對應之傾斜補正速度V3，而僅移動 距離AD!，如此而進行該檢測出之傾斜角0之補正。另外 ，於區間滾筒輸送機2 53，自時刻T6起增速至和該時檢測 出之傾斜角0對應之傾斜補正速度V4，而僅移動距離AD3 ，如此而進行該檢測出之傾斜角0之補正。 又，於區間滾筒輸送機25i藉由傾斜角之補正，而於 下基板1不存在傾斜時，於區間滾筒輸送機2 52、2 5 3未被檢 測出傾斜，因此，不進行傾斜角之補正，下基板1全體以 定常速度乂！被搬送，另外，於區間滾筒輸送機252藉由傾 斜角之補正，而於下基板1不存在傾斜時，於區間滾筒輸 送機2 5 3未被檢測出傾斜，因此，不進行傾斜角之補正， 下基板1全體以定常速度乂>被搬送。 圖3 ( b )更詳細說明如下，上述控制部，係由檢測出 之應補正之傾斜量，對應於傾斜方向，求出左側/右側滾 筒輸送機之其中之一方之增速之速度。其中，區間滾筒輸 送機2 5 i之傾斜量之補正量未到達檢測出之傾斜量，因此 ，於該區間滾筒輸送機25!被實施補正處理的下基板1，會 殘留傾斜量，因此和區間滾筒輸送機25 ,同樣，於區間滾 筒輸送機252亦進行下基板1之傾斜角之檢測，而進行其之 補正處理。但是，區間滾筒輸送機252檢測出之傾斜量， 係小於區間滾筒輸送機25 !檢測出之傾斜量，因此，由該 區間滾筒輸送機252之定常速度乂1被增速之傾斜補正速度 -21 - 201210919 ，係如圖3 ( b )所示，設爲較V3及區間滾筒輸送機25 !被 增速之傾斜補正速度V2爲小。將加速度之値設爲和區間滾 筒輸送機25i之加速度〇:|相等，設爲較被增速之傾斜補正 速度V2小的傾斜補正速度V3者。以該傾斜補正速度V3使區 間滾筒輸送機2 52行進特定距離AD2之後，設爲藉由和區間 滾筒輸送機25,相同之減速度α 2由該傾斜補正速度V3減速 之定常速度V!移動之狀態。 於區間滾筒輸送機252之另一側之滾筒輸送機，使下 基板1以一定之定常速度V|移動。如此則，因爲傾斜而較 慢之下基板1之側變爲行進較快，被補正成爲爲傾斜狀態 ，但是加速度之狀態亦有可能無法成爲理想値，而使傾斜 無閥成爲容許値。因此，藉由區間滾筒輸送機2 53之基板 檢測感測器24a3、24b3檢測出下基板1之傾斜。該檢測結果 之動作係和區間滾筒輸送機25i之情況同樣進行。亦即， 如圖3 ( b )所示，藉由區間滾筒輸送機2 5 3之後檢測出（ 時刻T6 )下基板1之側之滾筒輸送機使下基板1之該側增速 而進行傾斜補正。此情況下之增速之傾斜補正速度V4，係 成爲較區間滾筒輸送機25之增速之傾斜補正速度V3小之速 度。 藉由該傾斜補正使下基板1之傾斜成爲容許範圍內， 停止於特定位置。又，如此而使下基板1最終停止時，如 圖3(b)所示，係使移動速度減速至速度V5，定位於事先 決定之停止位置而停止。另外，該停止位置，係如上述說 明，上下移動至較滾筒輸送機之高度位置更高的位置而設 -22- 201210919 爲制動銷之位置，藉由該制動銷使基板1停止亦可。 又，針對上基板2亦和上述同樣。 如上述說明，基板之傾斜補正可以在不停止基板之移 動下進行，可以大幅縮短基板之搬送時間之同時，無須設 置傾斜補正所要時間》 又，於圖3之實施形態係說明，藉由滾筒輸送機使之 後檢測出之側之基板之邊部增速至傾斜補正速度，而進行 基板之傾斜補正。但是，同一滾筒輸送機之2個檢測感測 器之中，使之後檢測出之側之基板之邊部之搬送速度保持 一定，使先前檢測出之側之基板之邊部由定常速度減速， 如此而進行基板之傾斜補正，亦可獲得和上述同樣效果。 但是，圖1之上述裝置之各平台，係構成爲可藉由驅 動機構（未圖示）上下移動，藉由滾筒輸送機使下基板1 被搬送至該平台上而停止滾筒輸送機時，藉由該平台之上 升可使下基板1由滾筒輸送機傳遞至平台面上。另外，在 設於平台之滾筒輸送機設置上下移動機構，使滾筒輸送機 移動至平台面之下而進行基板之傳遞亦可。 圖4表示圖1之基板貼合室15之一具體例及於該基板貼 合室15之基板之由前處理室14之搬入以及基板對後處理室 16之搬出動作之縱斷面圖。26爲輸送機伸縮機構，27爲滾 筒輸送機，28爲機器手臂，29爲指部，30爲吸附焊墊，31 爲上平台，32爲黏著銷，33爲閘閥，34爲下平台，35爲基 板交付/受取用之滾筒輸送機，3 6爲閘閥，3 7爲輸送機伸 縮機構，38爲滾筒輸送機，和圖1對應之部分附加同一符 -23- 201210919 號而省略同一說明。 於該圖，於前處理室14(圖1)，於其之下側設有： 具備伸縮之輸送機伸縮機構26的滾筒輸送機27，於其之天 井側設置機器手臂28。於基板貼合室15與前處理室14之間 設有閘閥33，基板貼合室15內通常被保持於特定真空度。 另外，於基板貼合室1 5與後處理室1 6 (圖1 )之間設有閘 閥36。基板貼合室15，如圖所示，係成爲真空腔室，於其 中設置保持下基板1的下平台34及保持上基板2的上平台31 〇 於前處理室14之滾筒輸送機27設置輸送機伸縮機構26 ，當設於基板貼合室15與前處理室14之間的閘閥33打開時 ，藉由該輸送機伸縮機構26可使前處理室14之滾筒輸送機 27伸縮連接於基板貼合室15之滾筒輸送機，而將下基板1 搬至下平台34上。基板之貼合時，係藉由驅動機構（未圖 示）使上平台31下降至下平台34側而可以進行下基板1與 上基板2之貼合。_ 在設於前處理室14的機器手臂28之指部29，設有複數 個吸附焊墊30。另外，如上述說明，於前處理室14之上平 台31側，亦設置複數個伸縮自如之黏著焊墊（吸附銷）32 ，使上平台31側之黏著焊墊32下降至機器手臂28之指部29 之間而可以吸附保持上基板2。於彼等吸附焊墊3 〇、3 2， 設置對其中心部供給負壓的供給口（未圖示）’藉由對該 供給口供給負壓而吸附上基板2。另外’關於負壓源或供 給配管之圖示被省略。 -24- 201210919 如上述說明，於上基板2之交付/受取時’係以可以藉 由負壓進行吸附的方式，將前處理室14及基板貼合室15內 設爲半真空狀態，供給至吸附焊墊30、32之負壓係設爲較 其更高之真空度。 由上基板2之前處理室14至基板貼合室15之交付/受取 時，係於機器手臂28側之吸附焊墊30與上平台31側之黏著 焊墊32之兩方保持上基板2之後，停止對機器手臂2 8側之 吸附焊墊30之負壓供給，使機器手臂2 8及伸長之滾筒輸送 機27退縮至前處理室14»之後，藉由黏著焊墊32將上基板 2上推至上平台31之面上，而且可以藉由彼等複數個黏著 焊墊32予以保持。因此，即使提升真空度時，亦可藉由黏 著力量使上基板2保持於上平台31而不會掉落。 下基板1與上基板2之貼合終了後，在上基板2被按壓 至上平台31之狀態下，將黏著焊墊32上推至較上平台31之 面更上側，而可由上基板2之面剝離黏著焊墊32。另外， 此時，由設於黏著焊墊32中央部之負壓供給口吹出正壓氣 體，而可以容易剝離黏著焊墊32。 又，於下平台34設有黏著片（黏著構件）（未圖示） 及複數個負壓供給口，使下基板1被保持而不會移動。由 下基板1剝離該黏著構件時，可以使下平台34不移動’由 設於黏著片中央部之負壓供給口供給壓縮氣體而予以剝離 。另外，亦可於負壓供給口中央部設置上下銷，藉由上下 銷推舉下基板1，而由下基板1將黏著構件予以剝離。 設於前處理室14之滾筒輸送機27，其構造爲可以藉由 -25- 201210919 伸縮機構26而伸縮至基板貼合室15側，在前處理室14與基 板貼合室15之間之閘閥33關閉時係縮至前處理室14側，在 閘閥33打開而可以搬送下基板1至基板貼合室15內時，係 伸長至基板貼合室15側，針對設於基板貼合室15之基板交 付/受取用之滾筒輸送機3 5進行監控，以使下基板1可以圓 滑地交付/受取於基板貼合室15之下平台34。下平台34係 設於作爲受取輸送機的如圖2所示構成之滾筒輸送機35之 左右側之區間滾筒輸送機之間，以可以上下移動的方式， 設置驅動機構。 於後處理室16設置，藉由設於其之輸送機伸縮機構37 而可以伸縮於基板貼合室15側的滾筒輸送機38，第1裝載 室與上基板2之貼合終了後，後處理室1 6與基板貼合室1 5 之間之閘閥36打開時，滾筒輸送機38伸長至基板貼合室15 側而連接於基板交付/受取用之滾筒輸送機35，由該滾筒 輸送機35介由滾筒輸送機38，使經由基板貼合完成之液晶 基板19由基板貼合室15被搬出，被搬送至後處理室16。 又，於此可以大略同時進行上下基板1、2之搬入基板 貼合室1 5以及載置保持於上下平台3 1、34，如此則，可以 大幅縮短貼合基扳1 9之組裝時間。 如上述說明，上下基板1、2由前處理室14分別被保持 於基板貼合室15之上平台31、下平台34時，閘閥33被關閉 。基板貼合室15與後處理室16之間之閘閥36是先輩關閉。 閘閥3 3關閉後，使基板貼合室1 5由半真空狀態切換爲高真 空狀態而進行上下基板1、2之貼合。雖未圖示，於基板貼 -26- 201210919 合室15之室外’設置使上平台31上下移動之驅動機構或使 黏著焊墊32上下移動之驅動機構，設於彼等驅動機構之動 力傳動軸係連結於上平台31或黏著焊墊32，藉由座動該驅 動機構而使黏著焊墊32或上平台31上下移動，而進行上下 基板1、2之貼合。於該貼合時係使上平台31移動至下平台 3 4側。 上下基板1、2之貼合終了後，如上述說明，設定基板 貼合室15內成爲半真空狀態，將事先設爲半真空狀態之後 處理室16設爲高真空狀態。當基板貼合室15內成爲半真空 狀態時，閘閥36被打開，滾筒輸送機38由後處理室16伸長 至基板貼合室15內，基板交付/受取用之滾筒輸送機35上 之上下基板1、2被貼合而成爲液晶基板19的製成物將被搬 送後處理室1 6。液晶基板1 9被搬入後處理室1 6之後，閘閥 3 6被關閉，後處理室16內回復大氣狀態。藉由後處理室16 之回復大氣狀態，使貼合基板19全體被均勻施加大氣壓， 而使上下基板1、2間之間隔成爲正常間隔。之後，於圖1 ，藉由構成第3搬送線20之滾筒輸送機將液晶基板1 9搬送 至紫外線照射室1 7。於此，藉由照射紫外線使密封劑硬化 。密封劑之硬化終了後，同樣藉由滾筒輸送機將液晶基板 1 9搬送至面板檢測室1 8，檢測其狀態而搬送至次一工程。 如上述說明，於該具體例之構成中，於圖4中爲將基 板貼合室1 5內之狀態重複設爲半真空狀態與高真空狀態， 而於前後設置前處理室1 4與後處理室1 6，於彼等側分別設 置閘閥3 3、3 6而進行開/閉，進行上下基板1、2之受取及 -27- 201210919 貼合後之液晶基板19之送出。如上述說明，藉由重複將基 板貼合室1 5內之狀態切換爲半真空狀態與高真空狀態，而 可以達成基板貼合室15內設爲真空狀態之時間之短縮之同 時，可防止基板貼合室15內之潔淨度之降低。 另外，大略同時將上下基板1、2搬入基板貼合室15內 ，而保持於上平台31與下平台34，因此，和習知分別搬入 之情況下比較可以縮短貼合所要時間。 另外，將進行基板貼合前之工程之各處理室之配置配 置爲大略直線狀，而構成爲使用滾筒輸送機進行上下基板 1、2之搬送，因此各處理裝置之平台構成可設爲大略同一 構成，而且可縮小裝置之設置面積，可縮短作業時間。 另外，基板係於滾筒輸送機或帶狀輸送機上被搬送， 而且基板之水平方向之傾斜補正，可於搬送中、而且無須 停止基板之移動狀態下進行，因此無須於平台上進行傾斜 補正，可提升作業時間。 (發明效果） 依據本發明，可將自塗布基板貼合用之密封劑的塗布 裝置至貼合裝置或密封劑硬化裝置（紫外線照射裝置）等 以大略串聯予以配置之同時，針對下基板或貼合完了之液 晶基板之搬送，則使用左右個別驅動方式之滾筒輸送機進 行搬送，可於各裝置之前進行基板傾斜之補正，而且可將 上下基板同時搬入貼合裝置或貼合室，可以大幅縮短液晶 基板之製造時間，而且於各裝置之前進行基板傾斜之補正 -28- 201210919 ，因此可以大幅提升塗布或貼合精確度。 【圖式簡單說明】 圖1表示具備本發明之基板搬送裝置及基板傾斜補正 方法的液晶基板組裝系統之全體配置平面圖。 圖2表示圖1所示液晶基板組裝系統之中之本發明之基 板搬送裝置及基板傾斜補正方法的一實施形態之槪略構成 圖。 圖3表示圖1所示液晶基板組裝系統之中之本發明之基 板搬送裝置及基板傾斜補正方法的另一實施形態之槪略構 成圖。 圖4表示圖1之基板貼合室之一具體例及於該基板貼合 室之基板之由前處理室之搬入以及基板對後處理室之搬出 動作之縱斷面圖。 【主要元件符號說明】 1 :下基板 2 :上基板 3 :基板搬入機器人 4 :整列機構 5 :第1搬送線 5L :左側滾筒輸送機 5R :右側滾筒輸送機 6 :第2搬送線 -29- 201210919 7 :糊塗布機 8:短路電極形成用塗布機 9 :液晶滴下裝置 I 〇 :第1檢測室 II :基板反轉裝置 12 :移載室 13 :機器手臂 1 4 :前處理室 15:基板貼合室（真空腔室） 1 6 :後處理室 1 7 :紫外線照射室 18 :第2檢測室（面板檢測室） 1 9 :貼合基板（液晶基板） 20 :第3搬送線 2 1a： 21b ： 2 1 ai ~ 2 1 a3 ： 21bi 〜21b3:滾筒 22a: 22b: 22a丨〜22a3: 22b丨〜22b3:動力傳動軸 23a: 23b: 23ai〜23a3:驅動馬達 243:241>:24&丨〜2433:2415丨〜241)3:基板檢測感測 器 25i〜2 5 3 :區間滾筒輸送機 26 :輸送機伸縮機構 27 :滾筒輸送機 28 :機器手臂 29 :指部 -30- 201210919 3 0 :吸附焊墊 3 1 :上平台 3 2 :黏著焊墊 3 3 :聞閥 34 :下平台 35:基板交付/受取用之滾筒輸送機 3 6 :聞閥 3 7 :輸送機伸縮機構 3 8 :滾筒輸送機 -31 -201210919 VI. Description of the invention: [Technical Field of the Invention] The present invention relates to a substrate bonding system for a liquid crystal substrate, especially, About achieving the time to shorten the fit, The substrate transfer device and the substrate tilt correction for the substrate transfer operation by the robot in the system are minimized. [Prior Art], The manufacturing layer of the liquid crystal display panel has Two glass substrates provided with a transparent electrode or a thin film transistor array are provided. Separated by an interval of about several tens of μηι, It is bonded by an adhesive (hereinafter also referred to as a sealant) provided on the peripheral edge portion of the substrate (hereinafter, the bonded substrate is a liquid crystal display panel). The process of sealing the liquid crystal in the space between the substrates thus formed. The liquid crystal sealing method is The pattern in which the sealant is sealed is drawn so as not to be provided with an injection port, and becomes a substrate. Dropping liquid crystal on the substrate of the one side, Disposing another substrate on the one substrate in the vacuum chamber, A method in which the upper and lower substrates are brought into close contact with each other. As a conventional method of bonding the liquid crystal substrate, Providing a preliminary chamber for carrying in and out of the substrate in the vacuum chamber. In the vacuum chamber, a method of moving the substrate in and out of the same environment as the preliminary chamber is performed (see, for example, Patent Document 1). In addition, Patent Document 1 is, The upper substrate and the lower substrate are placed on the transport jig, It is transferred from the preparation chamber to the bonding chamber to the conveyor. -5- 201210919 As another custom example, Lowering the lower substrate from the first loading chamber via the spacer spreading device, Sealing material coating device, The liquid crystal injection device and the first preliminary alignment device are transported to the assembly device. The upper substrate is transferred from the second loading chamber to the assembly device via the second preliminary alignment chamber and the preliminary chamber. After the bonding of the two substrates is performed on the assembly device, Through the sealing material hardening device, The heat treatment apparatus and the substrate cutting device transport the bonded substrate to the unloading device (see, for example, Patent Document 2). also, As another conventional example, the proponent has a printed substrate transport conveyor. This includes a mechanism for mechanically positioning or tilting the substrate (see, for example, Patent Document 3). [Prior Art Document] [Patent Document] Patent Document 1: JP-A-200 1 -3 〇5 5 63 Patent Document 2: Japanese Patent Publication No. 2 003 - 1 5 1 0 1 Patent Document 3: Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei. No. Hei. In the liquid crystal substrate assembly system, When the substrate is moved in and out in the bonding chamber (vacuum chamber) of the bonded substrate, In order to be able to set the fitting room to become the same environment as the preparation room, And often set the fitting room to become a vacuum state, Two substrates bonded together in an atmospheric state are placed in a preparation room provided on one side of the bonding chamber. After the move in, Setting the preparation chamber to a vacuum state, The two substrates are sent from the preparation room -6- 201210919 «to the fitting room. In the fitting room, Keeping their substrates on the upper platform and the lower platform, Lowering the upper platform to remain on the substrate below the lower platform, The bonding of the two upper and lower substrates is performed. In the fitting room, They share the two substrates, After the end, The substrates after they are attached, It is discharged by another preparation chamber provided on the other side of the fitting chamber. The device disclosed in Patent Document i, Become the composition, Therefore the device becomes a long structure, Need a large setting area 〇 In addition, It is necessary to set each of the preparation rooms or the bonding chamber to be in a vacuum state. Need to configure the device for this purpose, And it takes time to set it to a vacuum state. There is a limit to the shortening of the working time. In addition, The above Patent Document 1 does not disclose the relationship with its predecessor. also, Use the transport jig to carry the upper and lower substrates from the preparation room to the bonding room. It takes time to transport the jig to the delivery/receipt of the substrate, This is also a problem for him. Only disclosed in the above Patent Document 2, Moving the substrate between the devices by moving means, However, what kind of transport means is used to transport the substrate, There is no disclosure of the delivery/receipt of the devices. When the substrate is transported by a roller conveyor, When the substrate is placed on the roller conveyor or the rapid stop of the roller conveyor, etc., the substrate in the conveyance is inclined at an angle to the conveyance direction. In the above Patent Document 3, a method of correcting the substrate tilt is disclosed. However, when the tilt correction of the substrate is performed by this method, After the substrate has to be stopped at a specific location, The substrate is stopped by lateral pressing to cancel the tilt thereof, Therefore, it takes time to correct the tilt. Various mechanical mechanisms that require this action, There is a problem that the device becomes large. 201210919 The present invention aims to solve the above problems, Providing a substrate transfer device and a substrate tilt correction method, It can perform tilt correction of the substrate while moving the substrate. Can shorten the time required for the correction of the tilt, Moreover, the miniaturization of the entire device can be achieved. The substrate can be transported to the mechanism portion of the transport destination without tilting. (means to solve the problem) To achieve the above objectives, The substrate transfer device of the present invention, It is characterized by: A conveyor in which a left conveyor and a right conveyor are disposed in the left-right direction of the substrate conveyance direction, By driving the left conveyor and the right conveyor, And the substrate is transported at a constant speed: Featuring: Substrate detection sensor, It is on the left conveyor and the right conveyor. Arranged at intervals in the vertical direction of the substrate transport direction, Used to detect the substrate being transported; And control means, The time difference between the detection timing of the substrate detection sensor and the substrate of the right conveyor by the substrate of the left conveyor and the detection timing of the substrate, Find the tilt angle of the substrate to be transported in the direction in which it is transported, The transport speed of the left conveyor to the substrate is set differently from the transport speed of the right conveyor to the substrate in accordance with the tilt angle: Setting the transport speed of the left conveyor to the substrate is different from the transport speed of the right conveyor to the substrate. And rotating the substrate in the plane of the left conveyor and the right conveyor, According to the inclination of the substrate, 〇 Conveyor, A plurality of interval conveyors formed by the left conveyor and the right conveyor. Arranged in the direction of transport of the substrate; Corresponding to the inclination angle of the substrate detected by each of the interval conveyors, Corresponding to detecting the tilt angle of -8-201210919, the substrate is rotated, According to the principle of correcting the tilt of the substrate, the conveyor is The speed of movement of the side of one of the substrates conveyed at a constant speed by increasing one of the right side conveyor and the left side conveyor, Set to move faster or slower than the constant speed, Make the base plate rotateer a feature. In order to achieve the above objectives, The substrate tilt correction method of the present invention, Its characteristics are: The left side conveyor and the right side conveyor are arranged in the left and right direction of the substrate conveying direction. By driving the left conveyor and the right conveyor, And the method of correcting the tilt of the substrate to the substrate by transporting the substrate at a constant speed; On the left conveyor and the right conveyor, The substrate is detected by a substrate detecting sensor disposed in a direction perpendicular to the substrate transport direction. The tilt of the substrate is detected based on the detection result; Corresponding to the tilt of the detected substrate, The transport speed of the left conveyor to the substrate is set differently from the transport speed of the right conveyor to the substrate. On the left conveyor, While the substrate is being transported at a constant speed on the right conveyor, Rotate to correct the tilt of the substrate. The invention is characterized in that Conveyor, a plurality of interval conveyors formed by the left conveyor and the right conveyor. Arranged in the substrate transport direction; Corresponding to each of the interval conveyors detecting the tilt angle of the substrate, The tilt of the substrate is corrected by rotating the substrate at a constant speed in response to the detected tilt angle. The invention is characterized in that On the conveyor, By increasing the speed of one of the right conveyor and the left conveyor, And the moving speed of the side of one side of the substrate that is conveyed at a constant speed, Set to move faster or slower than the constant speed -9- 201210919 degrees, Rotate the substrate. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a plan view showing the entire arrangement of a liquid crystal substrate assembly system including the substrate transfer apparatus and the substrate tilt correction method of the present invention. 1 is the lower substrate, 2 is the upper substrate, 3 is the substrate into the robot, 4 is the entire organization, 5 is the first conveyor line (main line), 6 is the second transfer line (secondary line), 7 is a paste coater (sealant distributor), 8 is a coating machine for forming a short-circuit electrode, 9 is a liquid crystal dropping device, 10 is the first test room, 11 is a substrate inversion device, 12 is the transfer room, 13 is the robot arm, 14 is the pre-treatment room, 15 is a substrate bonding chamber (vacuum chamber), 16 is the aftertreatment room, 17 is an ultraviolet irradiation room, 18 is the second detection room (panel detection room), 19 is a bonded substrate (liquid crystal substrate), 20 is the third transport line. Set in the diagram: The first transport line (main line) 5, Used to transport the lower substrate 1 ; And the second transfer line (secondary line) 6, The substrate 2 on which a TFT (Thin Film Electrode) or the like is formed is conveyed. The first transfer line 5 and the second transfer line 6 of the upper substrate 2 and the lower substrate 1 after washing are transferred, It is composed of a roller conveyor or a belt conveyor which are arranged in one row in the conveying direction by a drum. 2 roller conveyors or belt conveyors, It is divided and arranged in the left and right direction of the moving direction of the substrate. Drive control is performed by individual drive mechanisms. The configuration of the roller conveyor will be described below. Upper and lower substrate 1, 2 Transfer to the roller conveyor separately. Set on the front side of the first conveyor line 5: The substrate is carried into the robot 3, For -10- 201210919 to move the substrate 1 after washing into the system; And the entire organization 4, It is used to carry the robot 3 into the entire row of the lower substrate 1 by the substrate. The first transport line 5 receives the lower substrate 1 from the alignment mechanism 4, The bonding surface of the lower substrate 1 faces upward, and the first conveying line 5 is moved in the direction of the arrow. A paste coater (sealing disperser) 7 is provided in the middle of the first transfer line 5, The sealant (adhesive agent) can be applied to the lower substrate 1 in a ring shape (closed loop shape). The paste coater 7 is arranged in a tandem type (that is, on the downstream side), and the short-electrode-forming coater 8 is disposed. It is used to coat the conductive paste into dots. The liquid crystal dropping device 9 is disposed on the flow side below the short-circuit electrode forming coater 8, The desired amount of liquid crystal can be dropped into the loop of the sealant as described above. The first detection chamber 1 〇 ' is disposed on the flow side of the liquid crystal dropping device 9 for detecting the state of the applied sealant or the lowered liquid crystal or the like. The substrate 1 is detected by the first detecting chamber 10, By the robot arm 13 provided in the transfer chamber 12, It is conveyed to the 3rd conveyance line 20 provided between the pre-processing chamber 14 and the 2nd detection chamber U. The third transfer line 20 is also formed by a roller conveyor. With the third transport line 20, First of all, The lower substrate 1 is transported to the processing chamber 14 before the substrate loading side. The upper substrate 2' conveyed via the second transfer line 6 is after the substrate inverting device 11 is reversed from the front and back surfaces. By the robot arm 13 provided in the transfer chamber 12, It is carried into the pretreatment chamber 14. The pretreatment chamber 14 is also provided with: The robot arm (not shown) that holds the upper substrate 2 and carries it into the substrate bonding chamber (vacuum chamber) 15: And a roller conveyor (not shown) for conveying the lower substrate 1. In addition, a conveyor expansion mechanism (not shown) for expanding and contracting the roller conveyor is provided in the pretreatment chamber 14 as a gate valve (not shown) provided between the pretreatment chamber 14 and the substrate bonding chamber 15 - When 201210919 is turned on, The conveyor telescopic mechanism can connect the roller conveyor to the roller conveyor of the substrate bonding chamber 15 beyond the gate valve. Upper and lower substrates 1, 2, after being carried into the pretreatment chamber 14, the gate valve (not shown) provided at the inlet of the substrate loading side of the pretreatment chamber 14 is closed. The pretreatment chamber is evacuated to a specific degree of vacuum by a vacuum pump (not shown) (about 150 Torr: This is referred to below as a semi-vacuum). After the pretreatment chamber 14 is in a semi-vacuum state, The gate valve between the substrate and the substrate bonding chamber 15 is opened. The roller conveyor is connected to the roller conveyor of the substrate bonding chamber 15 by the conveyor telescopic mechanism extending to the side of the substrate bonding chamber 15. The lower substrate 1 is moved on the roller conveyor and carried into the substrate bonding chamber 15, In addition, The upper substrate 2 is carried into the substrate bonding chamber 15 by the robot arm. At this time, the inside of the substrate bonding chamber 15 is in a semi-empty state. Set in the pre-processing chamber 14: a roller conveyor that is removed from the substrate 1 and transported to the platform below the substrate bonding chamber 15 to become the third conveyor line 20; And taking the upper substrate 2 and moving it to the robot arm 28 (Fig. 4) of the platform (pressurizing plate) 31 (Fig. 4) above the substrate bonding chamber 15. The substrate of the substrate bonding chamber 15 The details of the acceptance of 2 are described later. Two substrates of the substrate bonding chamber 15 2 delivery / after receiving the end, Their upper and lower substrates 1, 2 are respectively held on the upper and lower platforms 46, 47 (Fig. 4), It is known from the pretreatment chamber 14 that the roller conveyor shrinks into the pretreatment chamber 14 and The above gate valve is closed. after that, The substrate bonding chamber 15 is evacuated to a high vacuum (about 5 x 1 〇 · 3 Torr). after that, Carrying up the upper and lower substrates 1, 2 while positioning, The upper stage is lowered to perform bonding of the upper substrate 2 to the lower substrate 1. After the fit is over, The substrate bonding chamber 15 returns to a semi-vacuum state, A gate valve (not shown) between the substrate bonding chamber 15 and the post-treatment chamber 16 is opened. This -12- 201210919, The post-treatment chamber 16 becomes a semi-vacuum state. A conveyor expansion mechanism (not shown) is also provided in the aftertreatment chamber 16. When the gate valve between the substrate and the substrate bonding chamber 15 is opened, The conveyor telescopic mechanism provided in the post-treatment chamber 16 operates. The roller conveyor is extended from the post-treatment chamber 16 to be connected to the roller conveyor of the substrate bonding chamber 15, Upper and lower substrates 1, The bonded substrate (i.e., liquid crystal substrate) 19 to be bonded is carried into the post-processing chamber 16. After the bonding substrate 19 is carried into the post-processing chamber 16, The roller conveyor is retracted into the aftertreatment chamber 16, The gate valve provided between the post-processing chamber 16 and the substrate bonding chamber 15 is closed. The inside of the post-treatment chamber 16 is set to an atmospheric state. After the post-processing chamber becomes atmospheric in the first 16 A gate valve (not shown) between the post-treatment chamber 16 and the ultraviolet irradiation chamber 17 is opened. By means of a conveyor telescopic mechanism (not shown) provided in the post-treatment chamber 16 The roller conveyor is connected to the ultraviolet irradiation chamber 17. The liquid crystal substrate 19 is moved on the roller conveyor and carried into the ultraviolet irradiation chamber 17. herein, The sealant is irradiated with ultraviolet rays to harden the sealant. After the hardening of the sealant, The liquid crystal substrate 19 is transported to the drum conveyor, It is transported to the second detection room (panel detection room) 18 for detection. The processing chambers 14 to 1 8 are arranged in a substantially straight line. Part of the use of the robot arm, However, since the substrate is conveyed substantially entirely by the structure of the roller conveyor, It can suppress the setting area of the device to a minimum. In addition, A bonded substrate (i.e., a liquid crystal substrate) is manufactured by the above-described system configuration. The liquid crystal substrate bonding system 'substrate 1, Most of the 2 transports are carried out by roller conveyors. Compared with the use of robotic arm transfer, Upper and lower substrates 1, 2 The conveying direction is clockwise or counterclockwise -13- 201210919 Rotating tilt, Positioning accuracy may be reduced. therefore, Need to prevent the tilt generated when the road stops, To make the upper and lower substrates 1, 2 The positional shift when it is transmitted to each processing device. therefore, In this embodiment, The roller conveyor on the first transfer line 5 or the second transfer line 6 sets the substrate 1, 2 passed to the front side of the management department, Configuration for positioning (ie, detecting the upper and lower substrates 1, 2 rotation (tilt), Correct the detector for the tilt). Fig. 2 is a schematic block diagram showing an embodiment of a substrate transfer apparatus and a substrate tilt correction method of the present invention in the liquid crystal substrate assembly system shown in Fig. 1. Fig. 2(a) shows a state in which the substrate (this is an example of the lower substrate 1) is transported in a normal posture. Fig. 2(b) shows a state in which the substrate is conveyed in a rotating (tilted) state. 5L is the left roller conveyor, 5R is the right roller conveyor, 21a, 21b is a roller, 22a, 22b is the power transmission shaft, 23a, 23b is the drive motor, 24a, 24b is a substrate detecting sensor, The same reference numerals are given to portions corresponding to the above-described drawings, and overlapping description will be omitted. Here, the first transport line 5 will be described. However, the second transport line 6 is also the same. In addition, Although the lower substrate 1 is explained, However, the upper substrate 2 is also the same. In the figure, The first conveyor line 5 formed by the roller conveyor, The drum 21a is disposed on the left and right sides thereof, 2 lb, Via the power transmission shaft 22a, 2 2b is connected to the left and right rollers 21a, 21b drive motor 23a, 23b»drive motor 23a, The driving force of 23b is based on the power transmission shaft 22a, 22b is transferred to the drum 21a, 21b, Rotating the driving roller 21a in this manner, 21b. The lower substrate 1 is placed on the rollers 21a, In the state on 21b, 'rotately drives the rollers 21a, 21b allows the lower substrate 1 to be transported in the direction of the arrow. a row of rollers 21a, Power transmission shaft 22a, And the drive motor 23a is -14 - 201210919 into the left roller conveyor 5L, a row of rollers 21b, Power transmission shaft 22b, And the drive motor 2 3 b forms a right roller conveyor 5 R, The left roller conveyor 5 L is disposed on the left side with respect to the conveying direction of the lower substrate 1 (shown by a white arrow). The right roller conveyor 5R is disposed on the right side. Further, the left side portion of the lower substrate 1 is placed on the column 21a of the left side roller conveyor 5L, The right side portion of the lower substrate 1 is placed on the roller 2 1 b of the right roller conveyor 5L, The left roller conveyor 5L and the right roller conveyor 5L are held apart. The first conveyance line 5 of the roller conveyor constituted by the left side roller conveyor 5L and the right side roller conveyor 5R is used. The substrate detecting sensor 24a is disposed in a right angle direction (left and right direction) of the transport direction, 24b, It is used to detect the passage of the left and right sides of the lower substrate 1. When the lower substrate 1 is transferred to the front side of the platform (not shown) of the paste coater 7 (FIG. 1), The sensor 24a is detected by the substrate provided on the first transport line 5, 24b detects the left and right sides of the lower substrate 1 (the lower substrate 1 is shown in FIG. 2 through the substrate detecting sensor 24a, State after 24b). The substrate detecting sensor 24a on each of the left and right sides, When one of the 24b detects the side of the lower substrate 1, Controlled by a control means (not shown), The drive motor 23a or 23b on the side detected is stopped. As shown in Figure 2 (a), The substrate detecting sensor 24a, When 24b simultaneously detects the front end of each side of the lower substrate 1, The control means judges that the lower substrate 1 is not tilted and is transported in the correct state. Continue to rotate the drive motor 23a, 23 b and transport the lower substrate 1. As shown in Figure 2(b), It is assumed that the lower substrate 1 is rotated (tilted) in the counterclockwise direction when viewed in the forward direction (the same as below), that is, the left side of the lower substrate 1 is transported more slowly than the left side. So, -15- 201210919 The substrate detecting sensor 24a disposed on the left side roller conveyor 5L and the right side roller conveyor 5R, 24b cannot detect the lower substrate 1 at the same time, First of all, The substrate detecting sensor 24b of the right side roller conveyor 5R (hereinafter referred to as the right side substrate detecting sensor 24b) detects the lower substrate 1, after that, The substrate detecting sensor 24a of the left roller conveyor 5 L (hereinafter referred to as the left substrate detecting sensor 24a) detects the lower substrate 1, While the right substrate detecting sensor 24b detects that the lower substrate 1 is detected by the lower substrate 1 to the left substrate detecting sensor 24a, The lower substrate 1 is transported while maintaining the moving speed at this time (hereinafter referred to as the constant speed). after that, When the left substrate detecting sensor 24a detects the lower substrate 1, The left side drive motor 23a is increased in speed, and the left side of the lower substrate 1 is transported faster than the left side (i.e., the constant speed). So, While the lower substrate 1 is being transported, Rotate counterclockwise, The inclination of the lower substrate 1 is corrected. As explained above, To correct the tilt of the lower substrate 1, And by the control unit (not shown), The time from when the right substrate detecting sensor 24b detects the left side of the lower substrate 1 to when the left substrate detecting sensor 24a detects the left side of the lower substrate 1, According to the time, the tilt direction and the tilt amount of the lower substrate 1 are obtained. The moving speed of the lower substrate 1 for correcting the tilt of the lower substrate 1 when the specific distance determined in advance by the movement is calculated is calculated based on Using it as the tilt correction speed, The left side of the lower substrate 1 is moved according to the tilt correction speed, In this way, the rotational speed of the drive motor 23a on the left side is set. So, The left side of the lower substrate 1 moves at the tilt correction speed, The left side of the lower substrate 1 moves at a constant speed. The lower substrate 1 is rotated in the counterclockwise direction while being conveyed. The tilt caused by the rotation in the counterclockwise direction is corrected by -16-201210919. As explained above, It is not necessary to stop the conveyance of the lower substrate 1 on the roller conveyor, The tilt of the lower substrate 1 can be corrected, therefore, The paste coater 7 or the liquid crystal dropping device 9 of Fig. 1 When the lower substrate 1 is placed on a platform such as the substrate bonding chamber 15 There is no need to position the lower substrate 1, Can shorten the working time. A platform for performing various processes on each of the above devices, A substrate positioning mechanism is provided on each platform for defining a stop position of the lower substrate 1. The positioning mechanism, It is composed of two brake pins that move up and down in the direction perpendicular to the substrate transport direction to define the left and right sides of the lower substrate 1. When the lower substrate 1 is transported to the apparatus on the roller conveyor, The brake pin becomes more prominent above the drum conveyor, To stop the movement of the lower substrate 1, The lower substrate 1 is prevented from proceeding. Fig. 3 is a schematic view showing another embodiment of a substrate transfer apparatus and a substrate tilt correction method of the present invention in the liquid crystal substrate assembly system shown in Fig. 1. Fig. 3(a) shows a tilt correction process in which the substrate (this is an example of the lower substrate 1) is corrected from the tilt posture to the normal posture. Figure 3(b) shows the change in the moving speed of the lower substrate 1, 21ai~21a3, 211η~211)3 is a roller, 22ai~22a3, 22b〗 ~22b3 is the power transmission shaft, 23a丨~23a3, 23b, ~23b3 is the drive motor, 24a, ~24a3, 24b, ~ 24b3 is the substrate detection sensor, 25, ~2 5 3 is the interval roller conveyor, The same reference numerals are given to portions corresponding to the above-described drawings, and overlapping description will be omitted. Here, the first transport line 5 will be described. However, the second transport line 6 is also the same. In addition, Although the lower substrate 1 is explained, However, the upper substrate 2 is also the same. In the embodiment of Figure 2, It is placed at one position of the roller conveyor. -17- 201210919 Substrate detection sensor 24a, 24b, In the embodiment of Figure 3, When the substrate transfer path between devices is long, The transport path can be divided into multiple intervals in the direction of its transport. The roller conveyor is configured corresponding to each section (herein the configuration of 3 section roller conveyors 25! ~253 example, But not limited to this), The conveying speed can be changed corresponding to each section of the roller conveyor, Set the drive unit. In Figure 3(a), This embodiment, The transport path of the lower substrate 1 having a long distance between devices is divided into three sections. Corresponding to each section, a section roller conveyor 25i composed of a left roller conveyor and a right roller conveyor is arranged, 252, 253» Roller conveyor 25 in each section! , 252, 253, The substrate detecting sensor 24a is disposed on the beginning side of the roller conveyor (i.e., the left roller conveyor) on the left side thereof! , 24a2 24a3, The substrate detecting sensor 24bi is disposed on the start side of the drum conveyor (i.e., the right roller conveyor) on the right side thereof, 24b2 24b3, The lower substrate 1 is transported to the interval roller conveyor 25i at a constant constant speed. 2 5 2 2 5 3, When the lower substrate 1 is tilted, The interval roller conveyor 251 detects the sensor 24a by the substrate, , 241m detects the tilt, The interval roller conveyor 2 5 2 is detected by the substrate detecting sensor 24a2. 24b2 detects the tilt, The interval roller conveyor 2 5 3 is detected by the substrate detecting sensor 24a3, 24b3 detects the tilt, The inclination of the lower substrate 1 is in the interval roller conveyor 25i, 252, 253 Correction when being transported" The section roller conveyor 2 5 ^ is composed of the following: Left roller conveyor, The roller 2 1 a is arranged in the conveying direction of the lower substrate 1! And the drive motor 23 ai and the drive motor 23 a, The rotational driving force is transmitted to each of the rollers 21a, respectively! Power transmission shaft 22a! Constitute And right roller conveyor -18- 201210919 , It is arranged in the row of the rollers 21b arranged in the transport direction of the lower substrate 1 and the drive motor 23b! And the drive motor 23b, The rotational driving force is transmitted to each of the rollers 21b, respectively! The power transmission shaft 22bi is configured; same, The section drum transport inspection 2 5 2 system consists of the following: Left roller conveyor, It is constituted by a row of rollers 21a2 arranged in the transport direction of the lower substrate 1, a drive motor 23a2, and a power transmission shaft 22a2 for transmitting the rotational driving force of the drive motor 23a2 to the respective rollers 21a2; And the right roller conveyor, It is composed of a row of rollers 21b2 arranged in the conveying direction of the lower substrate 1, a drive motor 23b2, and a power transmission shaft 22b2 for transmitting the rotational driving force of the drive motor 23b2 to the respective rollers 21b2; same, The section roller conveyor 2 53 is composed of the following: Left roller conveyor, It is constituted by a row of the rollers 21a3 arranged in the conveying direction of the lower substrate 1, a drive motor 23a3, and a power transmission shaft 22a3 that transmits the rotational driving force of the drive motor 23a3 to the respective rollers 2a3, respectively; And the right roller conveyor, It is composed of a row of rollers 21b3 arranged in the conveying direction of the lower substrate 1, a drive motor 23b3, and a power transmission shaft 22b3 that transmits the rotational driving force of the drive motor 23b3 to each of the rollers 21b3. The operation of this embodiment will be described below using Fig. 3 (a). as the picture shows, The lower substrate 1 is in the state of the inclined turn angle by the interval roller conveyor 25! Started to be transported. For the interval roller conveyor 25! 'First' substrate detection sensor 24ai, 24b, Among the substrate detection sensors 24b! The left side of the lower substrate 1 is detected to pass (the timing of Fig. 3(b)). The lower substrate 1 is at the time TQ at the time of Figure 3 (b) with acceleration! Start moving 'Time T! The moving speed of the lower substrate 1, As shown in Figure 3 (b), For constant speed νι (for example, Vi = 750mm/sec). After the constant speed Vifj enters the distance ^^ -19- 201210919, Substrate detection sensor 24a! The left side of the lower substrate 1 is detected (time T2 of FIG. 3(b)), After the detection, The control unit (not shown) detects the sensor 24b from the substrate of the lower substrate 1! , 24ai detection time difference (T2-T! ), Transfer speed of the lower substrate 1 V! , And a substrate detecting sensor 24ai, The distance of 24bds1 is K, Find the tilt angle 0 of the lower substrate 1 (Mar^V, • ((TVTO/K). After the inclination amount 0 of the lower substrate 1 is obtained (Fig. 3 (b) is also the time T2), Control unit to the drive motor 23 & of the section roller conveyor 25 i 1 Release command with acceleration α, Increase the speed to the tilt correction speed V2, At time t1, the drum 21a of the left roller conveyor of the interval roller conveyor 25i is caused, Increase the speed to the tilt correction speed V2. The side portion (i.e., the left side portion) of the substrate 1 below one of the increasing speeds is moved by the tilt correction speed V2 for a period of time t2 (which causes the moving distance ADi, at this time, The right side of the lower substrate 1 is at a constant speed V! mobile), Deceleration with deceleration α 2 , And set to the constant speed Vi. When the interval between the substrates 1 conveyed by the roller conveyor (that is, the first conveyance line 5 (Fig. 1)) is 1, The method of moving the distance X from the time ΤΊ to the time (Ti+q+h+h) to x=lsin0, Increase the tilt correction speed V2 (however, Zone roller conveyor 25! , 2 5 2 2 5 3 interval is set to be greater than the distance X) ° By the above processing, The inclination of the lower substrate 1 is corrected, Its inclination angle 0 becomes 0 or becomes smaller, after that, The lower substrate 1 is transported by a distance ΔΙ^, Enter the next interval roller conveyor 2 5 2, The substrate detecting sensor 24a2 24b2 performs the same detection of the side of the substrate 1 (at time T3 of Fig. 3 (b), Τ4), When the lower substrate 1 is tilted, Same as the interval roller conveyor 251 -20- 201210919 Check the tilt direction or tilt angle, The correction of the tilt angle is performed. In Figure 3 (b), For the interval roller conveyor 2 52, Since the time T4 is increased to the tilt correction speed V3 corresponding to the tilt angle 0 detected at that time, And only move distance AD! , In this way, the correction of the detected tilt angle 0 is performed. In addition, For the interval roller conveyor 2 53, Since the time T6 is increased to the tilt correction speed V4 corresponding to the tilt angle 0 detected at that time, And only move the distance AD3, In this way, the correction of the detected tilt angle 0 is performed. also, The interval roller conveyor 25i is corrected by the tilt angle, When the lower substrate 1 is not tilted, For the interval roller conveyor 2 52, 2 5 3 has not been detected, therefore, No correction of the tilt angle is performed, The entire lower substrate 1 is at a constant speed! Being transported, In addition, The interval roller conveyor 252 is corrected by the inclination angle, When there is no tilt on the lower substrate 1, The tilt is not detected in the interval roller conveyor 2 5 3 therefore, No correction of the tilt angle is performed, The entire lower substrate 1 is at a constant speed 乂> It is carried. Figure 3 (b) is explained in more detail below, The above control unit, Based on the detected amount of tilt that should be corrected, Corresponding to the tilt direction, Find the speed of one of the left/right roller conveyors. among them, The correction amount of the tilt amount of the interval roller conveyor 2 5 i does not reach the detected tilt amount, Therefore, In this section of the roller conveyor 25! The lower substrate 1 subjected to the correction processing, Will leave the amount of tilt, Therefore and the interval roller conveyor 25, same, The tilting angle of the lower substrate 1 is also detected by the interval roller conveyor 252. And carry out its correction processing. but, The amount of tilt detected by the interval roller conveyor 252, It is smaller than the interval roller conveyor 25! The amount of tilt detected, therefore, The tilting correction speed of the constant speed 乂1 of the interval roller conveyor 252 is increased by -21 - 201210919 , As shown in Figure 3 (b), Set to V3 and interval roller conveyor 25! The tilt correction speed V2 that is increased in speed is small. The acceleration 値 is set to the acceleration of the interval roller conveyor 25i 〇: |equal, It is set to the inclination correction speed V3 which is smaller than the inclination correction speed V2 of the speed increase. After the interval roller conveyor 2 52 is advanced by the tilting correction speed V3 by a certain distance AD2, Set with the interval roller conveyor 25, The same deceleration α 2 is decelerated by the tilt correction speed V3 at a constant speed V! The state of movement. a roller conveyor on the other side of the interval roller conveyor 252, The lower substrate 1 is moved at a constant constant velocity V|. So, The side of the substrate 1 becomes traveling faster because it is inclined and slower, Corrected to be tilted, However, the state of acceleration may not be ideal. However, tilting without valve becomes an allowable flaw. therefore, The sensor 24a3 is detected by the substrate of the interval roller conveyor 2 53 , 24b3 detects the tilt of the lower substrate 1. The operation of this detection result is performed in the same manner as in the case of the section roller conveyor 25i. that is, As shown in Figure 3 (b), The roller conveyor on the side of the lower substrate 1 is detected (time T6) by the interval roller conveyor 2 5 3 to increase the speed of the lower substrate 1 to perform the inclination correction. In this case, the tilting speed of the speed increase is corrected by V4, It is a speed which is smaller than the inclination correction speed V3 of the speed increase of the interval roller conveyor 25. By the tilt correction, the tilt of the lower substrate 1 is within an allowable range. Stop at a specific location. also, When the lower substrate 1 is finally stopped, As shown in Figure 3(b), Slowing down the movement speed to speed V5, Stop at the stop position determined in advance. In addition, The stop position, As explained above, Move up and down to a position higher than the height of the roller conveyor and set -22- 201210919 as the position of the brake pin. The substrate 1 may be stopped by the brake pin. also, The same applies to the upper substrate 2 as described above. As explained above, The tilt correction of the substrate can be performed without stopping the movement of the substrate. Can greatly shorten the transfer time of the substrate, There is no need to set the time required for tilt correction. The embodiment of FIG. 3 is illustrated. The side of the substrate on the side detected by the roller conveyor is increased to the tilt correction speed by the roller conveyor. The tilt correction of the substrate is performed. but, Among the two detection sensors of the same roller conveyor, Keeping the conveying speed of the side of the substrate on the side after the detection to be constant, Decreasing the edge of the substrate on the previously detected side from the constant speed, In this way, the tilt correction of the substrate is performed, The same effect as described above can also be obtained. but, Figure 1, the platform of the above device, The system is configured to be movable up and down by a driving mechanism (not shown). When the lower substrate 1 is transported to the platform by the roller conveyor to stop the roller conveyor, The lower substrate 1 is transferred from the roller conveyor to the deck surface by the platform being lifted. In addition, The upper and lower moving mechanism is arranged on the roller conveyor provided on the platform, It is also possible to move the roller conveyor below the deck surface to transfer the substrate. Fig. 4 is a longitudinal cross-sectional view showing a specific example of the substrate bonding chamber 15 of Fig. 1 and the loading of the substrate of the substrate bonding chamber 15 by the pretreatment chamber 14 and the removal operation of the substrate from the post processing chamber 16. 26 is a conveyor telescopic mechanism, 27 is a roller conveyor, 28 is the robot arm, 29 is the finger, 30 is an adsorption pad, 31 is the upper platform, 32 is the adhesive pin, 33 is the gate valve, 34 is the next platform, 35 is a roller conveyor for the delivery/receiving of substrates, 3 6 is the gate valve, 3 7 is the conveyor stretching mechanism, 38 is a roller conveyor, The same reference numeral -23-201210919 is attached to the portion corresponding to Fig. 1, and the same description is omitted. In the picture, In the pre-treatment chamber 14 (Fig. 1), On the lower side of it: a roller conveyor 27 having a telescopic conveyor telescopic mechanism 26, A robot arm 28 is provided on the side of the well. A gate valve 33 is disposed between the substrate bonding chamber 15 and the pretreatment chamber 14 The inside of the substrate bonding chamber 15 is usually maintained at a specific degree of vacuum. In addition, A gate valve 36 is provided between the substrate bonding chamber 15 and the post-processing chamber 16 (Fig. 1). Substrate bonding chamber 15, as the picture shows, Become a vacuum chamber, A lower platform 34 for holding the lower substrate 1 and an upper platform 31 for holding the upper substrate 2, and a roller conveyor 27 for the pretreatment chamber 14 are provided with a conveyor telescopic mechanism 26, When the gate valve 33 provided between the substrate bonding chamber 15 and the pretreatment chamber 14 is opened, The roller conveyor 27 of the pretreatment chamber 14 can be telescopically coupled to the roller conveyor of the substrate bonding chamber 15 by the conveyor telescopic mechanism 26. The lower substrate 1 is moved to the lower stage 34. When the substrate is bonded, The lower substrate 1 and the upper substrate 2 can be bonded together by lowering the upper stage 31 to the lower stage 34 side by a driving mechanism (not shown). _ at the finger 29 of the robot arm 28 provided in the pre-treatment chamber 14, A plurality of adsorption pads 30 are provided. In addition, As explained above, On the side of the platform 31 above the pretreatment chamber 14, A plurality of self-adhesive adhesive pads (adsorption pins) 32 are also provided. The adhesive pad 32 on the upper stage 31 side is lowered between the fingers 29 of the robot arm 28 to adsorb and hold the upper substrate 2. For their adsorption pads 3 〇, 3 2, A supply port (not shown) for supplying a negative pressure to the center portion is provided to suck the upper substrate 2 by supplying a negative pressure to the supply port. Further, the illustration of the negative pressure source or the supply pipe is omitted. -24- 201210919 As explained above, When the delivery/receiving of the upper substrate 2 is performed, the adsorption can be performed by a negative pressure. The pretreatment chamber 14 and the substrate bonding chamber 15 are placed in a semi-vacuum state. Supply to the adsorption pad 30, The negative pressure of 32 is set to a higher vacuum. When the upper substrate 2 is delivered/received from the processing chamber 14 to the substrate bonding chamber 15, After the adsorption pad 30 on the side of the robot arm 28 and the adhesive pad 32 on the side of the upper stage 31 hold the upper substrate 2, Stop the negative pressure supply to the adsorption pad 30 on the side of the robot arm 28, After the robot arm 28 and the elongated roller conveyor 27 are retracted to the pretreatment chamber 14», The upper substrate 2 is pushed up onto the upper surface of the upper stage 31 by the adhesive pad 32, They can also be held by their plurality of adhesive pads 32. therefore, Even when the vacuum is raised, The upper substrate 2 can also be held on the upper stage 31 by adhesive force without falling. After the bonding of the lower substrate 1 and the upper substrate 2 is completed, In a state where the upper substrate 2 is pressed to the upper stage 31, Pushing the adhesive pad 32 up to the upper side of the upper platform 31, The adhesive pad 32 can be peeled off from the surface of the upper substrate 2. In addition, at this time, A positive pressure gas is blown from a negative pressure supply port provided at a central portion of the adhesive pad 32, The adhesive pad 32 can be easily peeled off. also, An adhesive sheet (adhesive member) (not shown) and a plurality of negative pressure supply ports are provided on the lower platform 34. The lower substrate 1 is held without moving. When the adhesive member is peeled off from the lower substrate 1, The lower stage 34 can be moved without being moved. The compressed gas is supplied from the negative pressure supply port provided at the central portion of the adhesive sheet to be peeled off. In addition, The upper and lower pins can also be arranged at the center of the negative pressure supply port. Pushing the lower substrate 1 by the upper and lower pins, The adhesive member is peeled off from the lower substrate 1. a roller conveyor 27 disposed in the front processing chamber 14, The structure is configured to be expandable and contractible to the substrate bonding chamber 15 side by the -25-201210919 telescopic mechanism 26, When the gate valve 33 between the pretreatment chamber 14 and the substrate bonding chamber 15 is closed, it is retracted to the front processing chamber 14 side. When the gate valve 33 is opened to transport the lower substrate 1 to the substrate bonding chamber 15, Stretches to the side of the substrate bonding chamber 15, Monitoring is performed on the roller conveyor 35 for delivery/receiving of the substrate provided in the substrate bonding chamber 15, The lower substrate 1 can be smoothly delivered/received to the platform 34 below the substrate bonding chamber 15. The lower stage 34 is disposed between the interval roller conveyors on the right and left sides of the roller conveyor 35 constructed as shown in Fig. 2 as the take-up conveyor. In a way that can move up and down, Set the drive mechanism. Set in the post-processing chamber 16, The roller conveyor 38 that can be stretched and contracted to the substrate bonding chamber 15 side by the conveyor telescopic mechanism 37 provided thereon, After the bonding between the first loading chamber and the upper substrate 2 is completed, When the gate valve 36 between the post-treatment chamber 16 and the substrate bonding chamber 15 is opened, The roller conveyor 38 is extended to the side of the substrate bonding chamber 15 and connected to the roller conveyor 35 for substrate delivery/receiving. By the roller conveyor 35 via the roller conveyor 38, The liquid crystal substrate 19 bonded through the substrate is carried out by the substrate bonding chamber 15, It is transported to the post-treatment chamber 16. also, Here, the upper and lower substrates can be roughly simultaneously performed. 2, the substrate is moved into the bonding chamber 1 5 and placed on the upper and lower platforms 3 1 34, So, The assembly time of the bonding base plate can be greatly shortened. As explained above, Upper and lower substrates 1, 2 is held by the pre-processing chamber 14 on the platform 31 above the substrate bonding chamber 15, When the platform 34 is down, The gate valve 33 is closed. The gate valve 36 between the substrate bonding chamber 15 and the post-processing chamber 16 is closed by the ancestors. After the gate valve 3 3 is closed, The substrate bonding chamber 15 is switched from the semi-vacuum state to the high vacuum state to perform the upper and lower substrates 1. 2 fit. Although not shown, In the substrate -26-201210919, the outdoor unit of the room 15 is provided with a driving mechanism for moving the upper platform 31 up and down or a driving mechanism for moving the bonding pad 32 up and down. The power transmission shafts of the drive mechanisms are coupled to the upper platform 31 or the adhesive pads 32, The adhesive pad 32 or the upper stage 31 is moved up and down by the movement of the driving mechanism. And the upper and lower substrates 1, 2 fit. At the time of the bonding, the upper stage 31 is moved to the lower stage 34 side. Upper and lower substrates 1, After the end of the fit of 2, As explained above, Setting the substrate The inside of the bonding chamber 15 is in a semi-vacuum state. The processing chamber 16 is set to a high vacuum state after being set to a half vacuum state in advance. When the inside of the substrate bonding chamber 15 is in a semi-vacuum state, The gate valve 36 is opened, The roller conveyor 38 is extended from the post-treatment chamber 16 into the substrate bonding chamber 15, Substrate upper substrate 1 on the substrate conveyor/receiving roller conveyor 35 The finished product which is bonded to the liquid crystal substrate 19 is transported to the post-treatment chamber 16 . After the liquid crystal substrate 19 is carried into the post-treatment chamber 16 , The gate valve 3 6 is closed, The post-treatment chamber 16 returns to the atmospheric state. By returning to the atmospheric state of the post-treatment chamber 16, The entire laminated substrate 19 is uniformly applied with atmospheric pressure. And the upper and lower substrates 1, The interval between the two is a normal interval. after that, In Figure 1, The liquid crystal substrate 19 is transported to the ultraviolet irradiation chamber 17 by the roller conveyor constituting the third transfer line 20. herein, The sealant is hardened by irradiation of ultraviolet rays. After the hardening of the sealant, The liquid crystal substrate 19 is also transported to the panel detecting chamber 18 by a roller conveyor. The status is detected and transferred to the next project. As explained above, In the composition of this specific example, In Fig. 4, the state in the substrate bonding chamber 15 is repeatedly set to a semi-vacuum state and a high vacuum state. The front processing chamber 14 and the post processing chamber 16 are disposed before and after. Set the gate valve 3 3 on each side, 3 6 and open/close, Carrying the upper and lower substrates 1, 2 received and -27- 201210919 After the bonding of the liquid crystal substrate 19 is sent out. As explained above, By repeatedly switching the state in the substrate bonding chamber 15 to a semi-vacuum state and a high vacuum state, On the other hand, it is possible to achieve the shortening of the time in which the substrate bonding chamber 15 is in a vacuum state, The reduction in the cleanliness in the substrate bonding chamber 15 can be prevented. In addition, Generally, the upper and lower substrates will be simultaneously 2 moved into the substrate bonding chamber 15, And remaining on the upper platform 31 and the lower platform 34, therefore, In the case of moving in separately, it is possible to shorten the time required for fitting. In addition, The arrangement of each processing chamber in the process before the substrate bonding is arranged in a substantially straight line shape. And configured to use the roller conveyor to perform the upper and lower substrates 1, 2 transfer, Therefore, the platform configuration of each processing device can be set to be substantially the same. Moreover, the installation area of the device can be reduced, Can shorten the working time. In addition, The substrate is transported on a roller conveyor or a belt conveyor. And the tilt of the horizontal direction of the substrate is corrected, Can be transported, Moreover, it is not necessary to stop the movement of the substrate, Therefore, it is not necessary to perform tilt correction on the platform. Can improve working time. (Effect of the Invention) According to the present invention, The coating device for applying the sealant for bonding the substrate to the bonding device or the sealant curing device (ultraviolet irradiation device) or the like can be arranged in a large series. For the transfer of the lower substrate or the bonded liquid crystal substrate, Then use the roller conveyor of the left and right individual driving methods to carry it. The substrate tilt can be corrected before each device. Moreover, the upper and lower substrates can be simultaneously carried into the bonding device or the bonding chamber. The manufacturing time of the liquid crystal substrate can be greatly shortened. And the correction of the substrate tilt is performed before each device -28- 201210919 , Therefore, the coating or fitting accuracy can be greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the entire arrangement of a liquid crystal substrate assembly system including a substrate transfer apparatus and a substrate tilt correction method according to the present invention. Fig. 2 is a schematic block diagram showing an embodiment of a substrate transfer apparatus and a substrate tilt correction method of the present invention in the liquid crystal substrate assembly system shown in Fig. 1. Fig. 3 is a schematic view showing another embodiment of a substrate transfer apparatus and a substrate tilt correction method of the present invention in the liquid crystal substrate assembly system shown in Fig. 1. Fig. 4 is a longitudinal cross-sectional view showing a specific example of the substrate bonding chamber of Fig. 1 and a loading operation of the substrate in the substrate bonding chamber from the pretreatment chamber and the substrate to the post processing chamber. [Main component symbol description] 1 : Lower substrate 2 : Upper substrate 3 : The substrate is moved into the robot 4 : Inline organization 5 : The first conveyor line 5L: Left roller conveyor 5R : Right roller conveyor 6 : 2nd conveyor line -29- 201210919 7 : Paste coater 8: Short-circuit electrode forming coater 9 : Liquid crystal dropping device I 〇 : The first test room II: Substrate reversal device 12 : Transfer chamber 13 : Robot arm 1 4 : Pre-treatment room 15: Substrate bonding chamber (vacuum chamber) 1 6 : Aftertreatment room 1 7 : UV irradiation room 18 : 2nd detection room (panel detection room) 1 9 : Bonding substrate (liquid crystal substrate) 20 : Third transfer line 2 1a: 21b : 2 1 ai ~ 2 1 a3 : 21bi ~ 21b3: Roller 22a: 22b: 22a丨~22a3: 22b丨~22b3: Power transmission shaft 23a: 23b: 23ai~23a3: Drive motor 243: 241> : 24& 丨~2433: 2415丨~241) 3: Substrate detection sensor 25i~2 5 3 : Section roller conveyor 26 : Conveyor telescopic mechanism 27 : Roller conveyor 28 : Robot arm 29 : Finger -30- 201210919 3 0 : Adsorption pad 3 1 : Upper platform 3 2 : Adhesive pad 3 3 : Smell the valve 34: Lower platform 35: Roller conveyor for substrate delivery/receiving 3 6 : Smell the valve 3 7 : Conveyor telescopic mechanism 3 8 : Roller conveyor -31 -