JP4303679B2 - 熱交換装置 - Google Patents
熱交換装置 Download PDFInfo
- Publication number
- JP4303679B2 JP4303679B2 JP2004523796A JP2004523796A JP4303679B2 JP 4303679 B2 JP4303679 B2 JP 4303679B2 JP 2004523796 A JP2004523796 A JP 2004523796A JP 2004523796 A JP2004523796 A JP 2004523796A JP 4303679 B2 JP4303679 B2 JP 4303679B2
- Authority
- JP
- Japan
- Prior art keywords
- heat exchange
- substrate
- exchange device
- webs
- flow direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Power Steering Mechanism (AREA)
- Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Separation By Low-Temperature Treatments (AREA)
- Vehicle Body Suspensions (AREA)
Description
Claims (13)
- 1つの底部と1つの上部を含む1つの基板と、基板(1)の底部(2)と上部(3)に対して接線方向の1つの流れ方向(10)を有する1つの配向された流体流れを生成するための1つのユニット(9)と、基板(1)の上部(3)から突出する複数のウェブ(12)であって、流れ方向(10)中に逐次存在してその高さが流れ方向(10)において隣接する複数のウェブの間隔(PL)未満であり流れ方向(10)に対して垂直に配置される複数のウェブ(12)とを備える熱交換装置であって、基板(1)が、基板(1)を貫通して延長する規則的に配列された複数のチャネル(4)を備え、
複数のチャネル(4)が1つの矩形形状を有し、その長辺(5)が流れ方向(10)に対して平行に配向される事を特徴とする、熱交換装置。 - 複数のウェブ(12)が、基板(1)の幅(B)に渡って連続的に延長する事を特徴とする、請求項1に記載の熱交換装置。
- 複数のウェブ(12)が、複数のチャネル(4)の流れ方向(10)における前方に直接配列される事を特徴とする、請求項1または2に記載の熱交換装置。
- 基板(1)が1つの物体(11)上に複数のスペーサ(7)を介して載置され、複数のスペーサの高さ(KH)が複数のウェブ(12)の高さ(RH)より大きい事を特徴とする、請求項1乃至3のいずれかに記載の熱交換装置。
- 複数のスペーサ(7)の高さ(KH)が、流れ方向(10)において複数のチャネル(4)の長さ未満であり、好ましくは5mm未満である事を特徴とする、請求項4に記載の熱交換装置。
- 幾つかのスペーサ(7)が提供され、そのそれぞれが基板(1)の底部(2)から複数のチャネル(4)の間を突出し、長手方向の複数のチャネル(8)を形成するべく基板(1)の全長に渡って延長する事を特徴とする、請求項4または5に記載の熱交換装置。
- 複数のスペーサ(7)が熱伝導材料から成る事を特徴とする、請求項4乃至6のいずれかに記載の熱交換装置。
- 基板(1)が熱伝導材料から、特に金属から成るか、または熱伝導材料でコーティングされた1つの任意の材料から成る事を特徴とする、請求項1乃至7のいずれかに記載の熱交換装置。
- 1つのガイド・プレート(15)が基板(1)の流入側に配置される事を特徴とする、請求項1乃至8のいずれかに記載の熱交換装置。
- 1つのカバー・プレート(13)が基板(1)の上部(3)から一定の距離だけ離間して配置され、カバー・プレート(13)の基板(1)の上部(3)からの間隔(AP)が、複数のウェブ(12)の高さ(RH)の少なくとも2倍である事を特徴とする、請求項1乃至9のいずれかに記載の熱交換装置。
- カバー・プレート(13)が、基板(1)の上部(3)に対向する側に流れに対する複数の障害物を備え、具体的には、基板(1)の上部における複数のウェブ(12)に対応する複数のウェブ(14)を備える、請求項10に記載の熱交換装置。
- 幾つかの熱交換装置がモジュール式に並んで配列され、および(または)1つの熱交換装置が他の熱交換装置の上部に配列され、および(または)1つの熱交換装置が他の熱交換装置の背後に配置される事を特徴とする、請求項1乃至11のいずれかに記載の熱交換装置。
- 複数のウェブ(12)の流れ方向(10)に対して垂直に成された1つの流体流れ(19)が偏向されるように、複数のガイド・プレート(20、25)が配列される事を特徴とする、請求項1乃至12のいずれかに記載の熱交換装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10233736A DE10233736B3 (de) | 2002-07-24 | 2002-07-24 | Wärmetauschervorrichtung |
PCT/EP2003/008182 WO2004011867A1 (de) | 2002-07-24 | 2003-07-24 | Wärmetauschervorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005533992A JP2005533992A (ja) | 2005-11-10 |
JP4303679B2 true JP4303679B2 (ja) | 2009-07-29 |
Family
ID=30774931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004523796A Expired - Fee Related JP4303679B2 (ja) | 2002-07-24 | 2003-07-24 | 熱交換装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7458416B2 (ja) |
EP (1) | EP1525427B1 (ja) |
JP (1) | JP4303679B2 (ja) |
KR (1) | KR101029173B1 (ja) |
AT (1) | ATE474199T1 (ja) |
AU (1) | AU2003253316A1 (ja) |
DE (2) | DE10233736B3 (ja) |
WO (1) | WO2004011867A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10233736B3 (de) | 2002-07-24 | 2004-04-15 | N F T Nanofiltertechnik Gmbh | Wärmetauschervorrichtung |
DE20316334U1 (de) | 2003-10-22 | 2004-03-11 | Nft Nanofiltertechnik Gmbh | Wärmetauschervorrichtung |
DE102004030675A1 (de) * | 2004-06-24 | 2005-11-10 | Nft Nanofiltertechnik Gmbh | Kühleinrichtung für elektronische Bauelemente |
US7472741B2 (en) * | 2005-02-09 | 2009-01-06 | Raytheon Company | Foil slot impingement cooler with effective light-trap cavities |
DE102006011794B3 (de) * | 2006-03-15 | 2007-09-13 | Rittal Gmbh & Co. Kg | Wärmetauscher |
DE102006018709B3 (de) | 2006-04-20 | 2007-10-11 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
DE102006020502B4 (de) * | 2006-04-22 | 2008-05-08 | Rittal Gmbh & Co. Kg | Kühlgerät |
DE102006020499B4 (de) * | 2006-04-22 | 2008-05-08 | Rittal Gmbh & Co. Kg | Kühlgerät |
DE102006020503B4 (de) * | 2006-04-22 | 2008-05-08 | Rittal Gmbh & Co. Kg | Anordnung von Wärmetauscherelementen |
DE102006034487B4 (de) * | 2006-07-20 | 2008-05-08 | Rittal Gmbh & Co. Kg | Wärmetauscher |
DE202008003516U1 (de) | 2008-03-12 | 2008-07-03 | Nft Nanofiltertechnik Gmbh | Kühlgerät für elektronische Bauelemente |
DE102008013850B8 (de) * | 2008-03-12 | 2010-02-11 | Nft Nanofiltertechnik Gmbh | Klimatisierungseinrichtung für in einem Schaltschrank angeordnete elektronische Bauelemente und Anordnung zur Klimatisierung eines Schaltschrankes |
US20090321046A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Flow diverters to enhance heat sink performance |
WO2010021358A1 (ja) * | 2008-08-22 | 2010-02-25 | 三菱重工業株式会社 | 熱交換隔壁 |
US8826901B2 (en) * | 2010-01-20 | 2014-09-09 | Carrier Corporation | Primary heat exchanger design for condensing gas furnace |
DE102010050519A1 (de) | 2010-11-08 | 2012-05-10 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
JP5455962B2 (ja) * | 2011-04-06 | 2014-03-26 | 三菱重工業株式会社 | 冷却構造の製造方法 |
CN103249275A (zh) * | 2012-02-07 | 2013-08-14 | 鸿富锦精密工业(深圳)有限公司 | 散热*** |
US10766097B2 (en) * | 2017-04-13 | 2020-09-08 | Raytheon Company | Integration of ultrasonic additive manufactured thermal structures in brazements |
WO2019141513A1 (de) * | 2018-01-22 | 2019-07-25 | Linde Aktiengesellschaft | Verwirbelungsvorrichtung für einen plattenwärmeübertrager und plattenwärmeübertrager |
KR102429267B1 (ko) * | 2021-02-04 | 2022-08-03 | 하민호 | 폐수용 열교환장치 |
Family Cites Families (22)
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US4851965A (en) * | 1987-03-09 | 1989-07-25 | Unisys Corporation | Directed air management system for cooling multiple heat sinks |
US4859805A (en) | 1987-09-19 | 1989-08-22 | Nippon Cmk Corp. | Printed wiring board |
DE3822890A1 (de) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Kuehlanordnung fuer einen optischen zeichengenerator |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
DE3929004A1 (de) * | 1989-09-01 | 1991-03-07 | Behr Gmbh & Co | Waermetaeuscher |
JP2544497B2 (ja) * | 1990-02-28 | 1996-10-16 | 株式会社日立製作所 | コンピュ―タ冷却装置 |
US5428503A (en) * | 1992-03-24 | 1995-06-27 | Hitachi, Ltd. | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon |
JPH0824222B2 (ja) * | 1992-04-10 | 1996-03-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | エア・ミキサ冷却板を備えた冷却装置 |
JP3069819B2 (ja) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置 |
DE9214061U1 (de) * | 1992-10-17 | 1992-12-24 | Ets Claude Kremer S.a.r.l., Vianden | Kühlkörper |
JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
JP3497884B2 (ja) * | 1994-04-06 | 2004-02-16 | 昭和電工株式会社 | 放熱器の製造方法 |
FR2718836B1 (fr) * | 1994-04-15 | 1996-05-24 | Maurice Grenier | Echangeur de chaleur perfectionné à plaques brasées. |
US5576932A (en) * | 1995-08-31 | 1996-11-19 | At&T Global Information Solutions Company | Method and apparatus for cooling a heat source |
US5563768A (en) * | 1995-08-31 | 1996-10-08 | At&T Global Information Solutions Company | Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid |
DE19619060A1 (de) | 1996-05-13 | 1997-11-20 | Austerlitz Electronic Gmbh | Kühlkörper aus Metall für Elektronikmodule |
JPH11186762A (ja) * | 1997-12-19 | 1999-07-09 | Fujikura Ltd | ヒートシンク用カバー |
DE19813119A1 (de) * | 1998-03-25 | 1999-10-07 | Inst Energetik Und Umwelt Ggmb | Turbulenzwärmerückgewinner und Anwendungen desselben |
DE10041829B4 (de) * | 2000-08-25 | 2004-11-04 | N F T Nanofiltertechnik Gmbh | Kühlvorrichtung |
DE10233736B3 (de) | 2002-07-24 | 2004-04-15 | N F T Nanofiltertechnik Gmbh | Wärmetauschervorrichtung |
US6781834B2 (en) * | 2003-01-24 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | Cooling device with air shower |
JP2005079175A (ja) * | 2003-08-28 | 2005-03-24 | Toshiba Corp | 放熱装置 |
-
2002
- 2002-07-24 DE DE10233736A patent/DE10233736B3/de not_active Expired - Fee Related
-
2003
- 2003-07-24 EP EP03771098A patent/EP1525427B1/de not_active Expired - Lifetime
- 2003-07-24 WO PCT/EP2003/008182 patent/WO2004011867A1/de active Application Filing
- 2003-07-24 AT AT03771098T patent/ATE474199T1/de active
- 2003-07-24 KR KR1020057001279A patent/KR101029173B1/ko not_active IP Right Cessation
- 2003-07-24 JP JP2004523796A patent/JP4303679B2/ja not_active Expired - Fee Related
- 2003-07-24 AU AU2003253316A patent/AU2003253316A1/en not_active Abandoned
- 2003-07-24 US US10/522,206 patent/US7458416B2/en not_active Expired - Fee Related
- 2003-07-24 DE DE50312889T patent/DE50312889D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2004011867A1 (de) | 2004-02-05 |
DE50312889D1 (de) | 2010-08-26 |
US7458416B2 (en) | 2008-12-02 |
ATE474199T1 (de) | 2010-07-15 |
JP2005533992A (ja) | 2005-11-10 |
US20050252644A1 (en) | 2005-11-17 |
DE10233736B3 (de) | 2004-04-15 |
KR101029173B1 (ko) | 2011-04-12 |
KR20050021562A (ko) | 2005-03-07 |
EP1525427B1 (de) | 2010-07-14 |
AU2003253316A1 (en) | 2004-02-16 |
EP1525427A1 (de) | 2005-04-27 |
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