JP4247555B2 - 放電型サージ吸収素子 - Google Patents
放電型サージ吸収素子 Download PDFInfo
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- JP4247555B2 JP4247555B2 JP2003289678A JP2003289678A JP4247555B2 JP 4247555 B2 JP4247555 B2 JP 4247555B2 JP 2003289678 A JP2003289678 A JP 2003289678A JP 2003289678 A JP2003289678 A JP 2003289678A JP 4247555 B2 JP4247555 B2 JP 4247555B2
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- discharge
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- 239000006096 absorbing agent Substances 0.000 title 1
- 239000000919 ceramic Substances 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 17
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 16
- 230000035939 shock Effects 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000004115 Sodium Silicate Substances 0.000 description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 5
- 229910052911 sodium silicate Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- JAAGVIUFBAHDMA-UHFFFAOYSA-M rubidium bromide Chemical compound [Br-].[Rb+] JAAGVIUFBAHDMA-UHFFFAOYSA-M 0.000 description 4
- WFUBYPSJBBQSOU-UHFFFAOYSA-M rubidium iodide Chemical compound [Rb+].[I-] WFUBYPSJBBQSOU-UHFFFAOYSA-M 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000638 solvent extraction Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 description 2
- 229910001626 barium chloride Inorganic materials 0.000 description 2
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 2
- 229910001632 barium fluoride Inorganic materials 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- BROHICCPQMHYFY-UHFFFAOYSA-N caesium chromate Chemical compound [Cs+].[Cs+].[O-][Cr]([O-])(=O)=O BROHICCPQMHYFY-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- BZRRQSJJPUGBAA-UHFFFAOYSA-L cobalt(ii) bromide Chemical compound Br[Co]Br BZRRQSJJPUGBAA-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- AAQNGTNRWPXMPB-UHFFFAOYSA-N dipotassium;dioxido(dioxo)tungsten Chemical compound [K+].[K+].[O-][W]([O-])(=O)=O AAQNGTNRWPXMPB-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- MMKQUGHLEMYQSG-UHFFFAOYSA-N oxygen(2-);praseodymium(3+) Chemical compound [O-2].[O-2].[O-2].[Pr+3].[Pr+3] MMKQUGHLEMYQSG-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910003447 praseodymium oxide Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- JKNHZOAONLKYQL-UHFFFAOYSA-K tribromoindigane Chemical compound Br[In](Br)Br JKNHZOAONLKYQL-UHFFFAOYSA-K 0.000 description 1
- 229940105963 yttrium fluoride Drugs 0.000 description 1
- RBORBHYCVONNJH-UHFFFAOYSA-K yttrium(iii) fluoride Chemical compound F[Y](F)F RBORBHYCVONNJH-UHFFFAOYSA-K 0.000 description 1
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- Thermistors And Varistors (AREA)
Description
尚、電極塗布材に、臭化物(臭化コバルト(CoBr2)、臭化セシウム(CsBr)、臭化鉄(FeBr2、FeBr3)、臭化インジウム(InBr3)、臭化ニッケル(NiBr2)、臭化ルビジウム(RbBr)等)を添加すると、より一層、放電開始電圧の安定化を図ることができる。
更に、上記臭化物と共に、あるいは上記臭化物以外に塩化バリウム(BaCl)、フッ化バリウム(BaF)、クロム酸セシウム(Cs2CrO4)、モリブデン酸カリウム(K2MoO4)、チタン酸カリウム(K2Ti4O9)、タングステン酸カリウム(K2WO4)、酸化プラセオジウム(Pr6O11)、塩化イットリウム(YCl2)、フッ化イットリウム(YF3)、酸化イットリウム(Y2O3)を添加しても、放電開始電圧の安定化に効果がある。
(比較例1)
電極25は、同じく無酸素銅からなり、図5に示すごとく、縦2.6mm、横3.2mm、肉厚0.55mmの四角形状からなる鍔部26の一方側に、長円形状の凸段部27を設けるとともに、その中央部に円柱形状の放電部28を突設した形状を有している。そして、その鍔部26の他方側の端面には、上述した実施例1の凹部はなく、平坦な形状としている。
セラミック外囲器22と電極25を接続する銀ろう29は、板厚を0.05mmとする。このような構成からなる比較例1の放電型サージ吸収素子21について、前述同様に400℃と600℃から急冷する耐熱衝撃性の試験を行い、その結果を表1と表2に示す。
(比較例2)
(比較例3)
電極35は、同じく無酸素銅からなり、図7に示すごとく、縦2.6mm、横3.2mm、肉厚0.4mmの四角形状からなる鍔部36の一方側に、長円形状の凸段部37を設けるとともに、その中央部に円柱形状の放電部38を突設した形状を有している。そして、その鍔部26の他方側の端面には、鍔部36の肉厚と同等の0.4mmの深さで、縦0.85mm、横1.4mmの凹部39が、上記凸段部10との間の肉厚ができるだけ均一になるように周部にテーパー面を設けて長方形状もしくは長楕円形状に凹設されている。
セラミック外囲器32と電極35を接続する銀ろう40は、板厚を0.03mmとする。このような構成からなる比較例1の放電型サージ吸収素子31について、前述同様に400℃と600℃から急冷する耐熱衝撃性の試験を行い、その結果を表1と表2に示す。
2 セラミック外囲器
3 電極
4 銀ろう
5 角部
6 角部
7 メタライズ層
8 カーボントリガー線
9 鍔部
10 凸段部
11 放電部
12 凹部
13 凹部
14 仕切り用リブ
Claims (1)
- 角型のセラミックからなる絶縁性筒体の開口両端に外周面に熱膨張を吸収するための凹部を形成した角型の無酸素銅製の電極を放電間隙を設けて相対向して配置するとともに、前記電極の外周面に形成される凹部は、絶縁性筒体に当接する当該電極の鍔部の外側端面中央部に前記鍔部の厚さと同等の深さで、かつ、周部にテーパー面を設けて長方形状もしくは長楕円形状に凹設して形成し、前記絶縁性筒体内に不活性ガスと水素ガスの混合ガスを封入し、さらに前記絶縁性筒体における内周及び外周の角部の曲率をこの絶縁性筒体の肉厚の100〜133%としたことを特徴とする放電型サージ吸収素子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003289678A JP4247555B2 (ja) | 2003-08-08 | 2003-08-08 | 放電型サージ吸収素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003289678A JP4247555B2 (ja) | 2003-08-08 | 2003-08-08 | 放電型サージ吸収素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005063720A JP2005063720A (ja) | 2005-03-10 |
JP4247555B2 true JP4247555B2 (ja) | 2009-04-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003289678A Expired - Lifetime JP4247555B2 (ja) | 2003-08-08 | 2003-08-08 | 放電型サージ吸収素子 |
Country Status (1)
Country | Link |
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JP (1) | JP4247555B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4651434B2 (ja) * | 2005-03-31 | 2011-03-16 | 岡谷電機産業株式会社 | 放電管 |
DE102005036265A1 (de) * | 2005-08-02 | 2007-02-08 | Epcos Ag | Funkenstrecke |
JP5050777B2 (ja) * | 2006-10-30 | 2012-10-17 | 三菱マテリアル株式会社 | サージアブソーバ |
KR100817485B1 (ko) | 2007-08-28 | 2008-03-31 | 김선호 | 방전제어전극이 구비된 방전소자 및 그 제어회로 |
US11081319B2 (en) | 2017-05-29 | 2021-08-03 | Bourns, Inc. | Glass sealed gas discharge tubes |
-
2003
- 2003-08-08 JP JP2003289678A patent/JP4247555B2/ja not_active Expired - Lifetime
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