JP4234444B2 - 電子部品の冷却装置、および電子部品の冷却方法 - Google Patents
電子部品の冷却装置、および電子部品の冷却方法 Download PDFInfo
- Publication number
- JP4234444B2 JP4234444B2 JP2002590415A JP2002590415A JP4234444B2 JP 4234444 B2 JP4234444 B2 JP 4234444B2 JP 2002590415 A JP2002590415 A JP 2002590415A JP 2002590415 A JP2002590415 A JP 2002590415A JP 4234444 B2 JP4234444 B2 JP 4234444B2
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- Prior art keywords
- airflow
- heat sink
- electronic components
- fan
- board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (11)
- ファンからの気流によって、ボード上に第1電子部品と、前記ボード上の第1ラインに沿って配置された第1の複数電子部品と、及び前記第1ラインに対して角度関係を有する前記ボード上の第2ラインに沿って配置された第2の複数電子部品とを含む電子部品を冷却する装置であって、
前記ファンが搭載される表面を有するヒートシンクを具え、該ヒートシンクは前記第1電子部品に取付け可能であると共に、前記第1の複数電子部品と前記第2の複数電子部品の両方に隣接し、
冷却空気を前記ヒートシンクに接触させるための1本以上のダクトを具え、該1本以上のダクトは、トップ部材、および前記ヒートシンクの有する複数のフィンで形成され、且つ前記ファンに連通しており、且つ前記気流を前記ヒートシンクを介して実質的に前記第1の複数電子部品と前記第2の複数電子部品に向けるように構成され、
前記ヒートシンクの前記複数のフィンは、前記第1の複数電子部品および前記第2の複数電子部品の上に配置された複数の周辺ヒートシンクに前記ファンからの気流を指向させるために、サイズおよび向きが調整され、
前記トップ部材は、前記複数の周辺ヒートシンク上に前記気流を指向させるために、前記複数の周辺ヒートシンクの少なくとも一部の上まで延在する、電子部品の冷却装置。 - 前記1本以上のダクトが複数のダクトであり、該複数のダクトのそれぞれが、第1端と第2端を有する細長いダクトであり、前記指向気流が前記第1端群から前記第2端群に向かう請求項1に記載の装置。
- 前記ヒートシンクが、表面から突出している複数のフィンを有する表面を有し、前記複数のダクトが前記トップ部材と、前記表面と、前記複数のフィンとで形成されている請求項2に記載の装置。
- 前記トップ部材が、前記ファンが搭載される前記表面に隣接した孔を有し、提供された前記気流が該孔を通じて前記複数のダクトの方に更に向けられる請求項3に記載の装置。
- 前記トップ部材は、該トップ部材が前記複数の周辺ヒートシンクを完全に覆うように、前記第1の複数電子部品の少なくとも一部と、前記第2の複数電子部品の少なくとも一部の上まで延在し、前記トップ部材は前記気流を前記第1の複数電子部品の少なくとも一部と、前記第2の複数電子部品の少なくとも一部に向けるように構成されている請求項1に記載の装置。
- 前記第1電子部品がグラフィックプロセッサであり、前記第1の複数電子部品が第1の複数のメモリチップであり、前記第2の複数電子部品が第2の複数のメモリチップである請求項1に記載の装置。
- 前記ボードが、空気入口ポートを有するコンピュータハウジングの中に設置され、更に、該空気入口ポートと前記ファンに連通して、前記ハウジングの外の空気を前記ヒートシンクに提供する導管を具えている請求項6に記載の装置。
- 前記角度関係が垂直である請求項1に記載の装置。
- 第1のコンピュータチップと、プリント回路基板上で角度関係を有するコンピュータチップの二つの配列を形成している複数のコンピュータチップと、をファンからの気流によって冷却する方法であって、
前記気流を第1ヒートシンクに供給し、ここで該第1ヒートシンクは前記第1コンピュータチップに熱的に接触しており、該第1ヒートシンクは突出した複数のフィンを有し、トップ部材が前記複数のフィンをカバーして複数の細長いダクトを形成しており、
前記複数のダクトを通じて、気流を前記ヒートシンクを介して実質的に前記複数のコンピュータチップの方に向けて、前記複数の補助コンピュータチップのそれぞれをほぼ均一な温度まで充分に冷却するステップを含み、
前記ヒートシンクの前記複数のフィンは、前記第1の複数電子部品および前記第2の複数電子部品の上に配置された複数の周辺ヒートシンクに前記ファンからの気流を指向させるために、サイズおよび向きが調整され、
前記トップ部材は、前記複数の周辺ヒートシンク上に前記気流を指向させるために、前記複数の周辺ヒートシンクの少なくとも一部の上まで延在する、方法。 - 更に、前記プリント回路基板の入っているハウジングの外の空気を、前記ハウジングから前記プリント回路基板に導くステップを含む請求項9に記載の方法。
- 前記角度関係が垂直である請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/858,823 US6778390B2 (en) | 2001-05-15 | 2001-05-15 | High-performance heat sink for printed circuit boards |
PCT/US2002/015186 WO2002093643A1 (en) | 2001-05-15 | 2002-05-13 | High performance heat sink for printed circuit boards |
Related Child Applications (1)
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JP2008133558A Division JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
Publications (2)
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JP2004526332A JP2004526332A (ja) | 2004-08-26 |
JP4234444B2 true JP4234444B2 (ja) | 2009-03-04 |
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JP2002590415A Expired - Lifetime JP4234444B2 (ja) | 2001-05-15 | 2002-05-13 | 電子部品の冷却装置、および電子部品の冷却方法 |
JP2008133558A Pending JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
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JP2008133558A Pending JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
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US (1) | US6778390B2 (ja) |
EP (1) | EP1393369A4 (ja) |
JP (2) | JP4234444B2 (ja) |
TW (1) | TWI230578B (ja) |
WO (1) | WO2002093643A1 (ja) |
Cited By (1)
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US9750126B2 (en) | 2012-10-22 | 2017-08-29 | Thomson Licensing | Electronic device with combination heat sink/blower or fan assembly having air duct |
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-
2002
- 2002-05-13 EP EP02736806A patent/EP1393369A4/en not_active Ceased
- 2002-05-13 WO PCT/US2002/015186 patent/WO2002093643A1/en active Application Filing
- 2002-05-13 JP JP2002590415A patent/JP4234444B2/ja not_active Expired - Lifetime
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2008
- 2008-05-21 JP JP2008133558A patent/JP2008235932A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
WO2002093643A1 (en) | 2002-11-21 |
EP1393369A4 (en) | 2006-08-23 |
JP2008235932A (ja) | 2008-10-02 |
EP1393369A1 (en) | 2004-03-03 |
TWI230578B (en) | 2005-04-01 |
US6778390B2 (en) | 2004-08-17 |
US20020172008A1 (en) | 2002-11-21 |
JP2004526332A (ja) | 2004-08-26 |
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