CN101605442B - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN101605442B CN101605442B CN200810067739.9A CN200810067739A CN101605442B CN 101605442 B CN101605442 B CN 101605442B CN 200810067739 A CN200810067739 A CN 200810067739A CN 101605442 B CN101605442 B CN 101605442B
- Authority
- CN
- China
- Prior art keywords
- fan
- radiator
- heat
- heat abstractor
- soaking plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 27
- 238000002791 soaking Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- 230000000994 depressogenic effect Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 241000264877 Hippospongia communis Species 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 239000003570 air Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810067739.9A CN101605442B (zh) | 2008-06-13 | 2008-06-13 | 散热装置 |
US12/200,878 US7755902B2 (en) | 2008-06-13 | 2008-08-28 | Heat dissipation device for computer add-on cards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810067739.9A CN101605442B (zh) | 2008-06-13 | 2008-06-13 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101605442A CN101605442A (zh) | 2009-12-16 |
CN101605442B true CN101605442B (zh) | 2013-01-23 |
Family
ID=41414558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810067739.9A Expired - Fee Related CN101605442B (zh) | 2008-06-13 | 2008-06-13 | 散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7755902B2 (zh) |
CN (1) | CN101605442B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101202529A (zh) * | 2006-12-11 | 2008-06-18 | 丹佛斯传动有限公司 | 电子装置及电动机变频器 |
CN101202528B (zh) * | 2006-12-11 | 2012-10-10 | 丹佛斯传动有限公司 | 电子装置及电动机变频器 |
US7990712B2 (en) * | 2008-12-31 | 2011-08-02 | Cooler Master Co., Ltd. | Heat sink used in interface card |
CN101873786A (zh) * | 2009-04-23 | 2010-10-27 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8018719B2 (en) * | 2009-05-26 | 2011-09-13 | International Business Machines Corporation | Vapor chamber heat sink with cross member and protruding boss |
CN102200807A (zh) * | 2010-03-25 | 2011-09-28 | 鸿富锦精密工业(深圳)有限公司 | 扩充卡隔热罩 |
US8159819B2 (en) * | 2010-05-14 | 2012-04-17 | Xfx Creation Inc. | Modular thermal management system for graphics processing units |
JP4929377B2 (ja) * | 2010-06-18 | 2012-05-09 | 株式会社東芝 | テレビジョン受像機、及び電子機器 |
CN102402263A (zh) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
US9075581B2 (en) | 2011-04-19 | 2015-07-07 | Germane Systems, Llc | Apparatus and method for cooling electrical components of a computer |
CN102449759B (zh) * | 2011-09-30 | 2013-08-28 | 华为技术有限公司 | 一种散热器 |
TWI531303B (zh) * | 2011-11-16 | 2016-04-21 | 宏碁股份有限公司 | 散熱模組 |
CN103140117B (zh) * | 2011-11-30 | 2015-08-26 | 宏碁股份有限公司 | 散热模块 |
US8767391B2 (en) * | 2012-08-27 | 2014-07-01 | Futurewei Technologies, Inc. | Chassis with adjustable baffle for cooling |
CN103796481B (zh) * | 2012-10-31 | 2016-07-13 | 英业达科技有限公司 | 电子装置 |
CN103903340B (zh) * | 2012-12-27 | 2016-10-12 | 鸿富锦精密工业(武汉)有限公司 | 自动售货机 |
US11006548B2 (en) * | 2013-02-01 | 2021-05-11 | Smart Embedded Computing, Inc. | Method and device to provide uniform cooling in rugged environments |
CN104349635B (zh) * | 2013-07-23 | 2017-04-12 | 奇鋐科技股份有限公司 | 手持式行动装置的散热结构 |
US9247034B2 (en) * | 2013-08-22 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure and handheld electronic device with the heat dissipation structure |
US9244504B2 (en) * | 2013-09-24 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure for hand-held mobile device |
US9622386B2 (en) * | 2014-06-02 | 2017-04-11 | Corsair Memory, Inc. | Graphics card cooler |
SG10201609616TA (en) | 2016-09-06 | 2018-04-27 | Apple Inc | Electronic device with cooling fan |
TWI617226B (zh) * | 2017-05-22 | 2018-03-01 | 奇鋐科技股份有限公司 | 電路板與風扇扇框結合結構 |
US10021775B1 (en) | 2017-06-19 | 2018-07-10 | Asia Vital Components Co., Ltd. | Circuit board and fan frame connection structure |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
CN108156791A (zh) * | 2017-11-07 | 2018-06-12 | 金湖芯磊电子有限公司 | 一种平板热管回路及其散热模块 |
JP7268608B2 (ja) * | 2020-01-07 | 2023-05-08 | 株式会社オートネットワーク技術研究所 | 端子台 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591845A (zh) * | 2003-09-04 | 2005-03-09 | 珍通科技股份有限公司 | 圆管型散热器结构 |
CN2909801Y (zh) * | 2006-05-19 | 2007-06-06 | 东莞连骏五金制品有限公司 | 散热片的改良结构 |
TW200808160A (en) * | 2006-07-21 | 2008-02-01 | Foxconn Tech Co Ltd | Heat dissipation device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6478082B1 (en) * | 2000-05-22 | 2002-11-12 | Jia Hao Li | Heat dissipating apparatus with nest wind duct |
US6778390B2 (en) * | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
US6438984B1 (en) * | 2001-08-29 | 2002-08-27 | Sun Microsystems, Inc. | Refrigerant-cooled system and method for cooling electronic components |
US6671177B1 (en) * | 2002-10-25 | 2003-12-30 | Evga.Com Corporation | Graphics card apparatus with improved heat dissipation |
TW545875U (en) * | 2002-11-13 | 2003-08-01 | Abit Comp Corp | Heat dissipating device of circuit board |
US7283364B2 (en) * | 2004-11-29 | 2007-10-16 | Ati Technologies Inc. | Thermal management apparatus |
US7551442B2 (en) * | 2005-12-05 | 2009-06-23 | Nvidia Corporation | Embedded heat pipe in a hybrid cooling system |
US7443672B2 (en) * | 2006-10-03 | 2008-10-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
US7626821B1 (en) * | 2006-12-12 | 2009-12-01 | Nvidia Corporation | Adaptor for graphics module |
US7529090B2 (en) * | 2007-08-29 | 2009-05-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090059525A1 (en) * | 2007-09-05 | 2009-03-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for computer add-on cards |
-
2008
- 2008-06-13 CN CN200810067739.9A patent/CN101605442B/zh not_active Expired - Fee Related
- 2008-08-28 US US12/200,878 patent/US7755902B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591845A (zh) * | 2003-09-04 | 2005-03-09 | 珍通科技股份有限公司 | 圆管型散热器结构 |
CN2909801Y (zh) * | 2006-05-19 | 2007-06-06 | 东莞连骏五金制品有限公司 | 散热片的改良结构 |
TW200808160A (en) * | 2006-07-21 | 2008-02-01 | Foxconn Tech Co Ltd | Heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
US20090310296A1 (en) | 2009-12-17 |
CN101605442A (zh) | 2009-12-16 |
US7755902B2 (en) | 2010-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RUGAO BAXIN CASING CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20141102 Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20141102 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226500 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141102 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: RUGAO BAXIN CASING Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd. Patentee before: Foxconn Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 |
|
CF01 | Termination of patent right due to non-payment of annual fee |