JP4222086B2 - 熱処理装置 - Google Patents

熱処理装置 Download PDF

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Publication number
JP4222086B2
JP4222086B2 JP2003103458A JP2003103458A JP4222086B2 JP 4222086 B2 JP4222086 B2 JP 4222086B2 JP 2003103458 A JP2003103458 A JP 2003103458A JP 2003103458 A JP2003103458 A JP 2003103458A JP 4222086 B2 JP4222086 B2 JP 4222086B2
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JP
Japan
Prior art keywords
cover member
mounting table
heat treatment
opaque
treatment apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003103458A
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English (en)
Japanese (ja)
Other versions
JP2004307939A (ja
JP2004307939A5 (zh
Inventor
裕雄 川崎
輝夫 岩田
学 網倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003103458A priority Critical patent/JP4222086B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to EP04726281A priority patent/EP1612854A4/en
Priority to US10/552,267 priority patent/US7718930B2/en
Priority to CNB2004800092949A priority patent/CN100477087C/zh
Priority to PCT/JP2004/005036 priority patent/WO2004090960A1/ja
Priority to KR1020057019032A priority patent/KR100744860B1/ko
Publication of JP2004307939A publication Critical patent/JP2004307939A/ja
Publication of JP2004307939A5 publication Critical patent/JP2004307939A5/ja
Application granted granted Critical
Publication of JP4222086B2 publication Critical patent/JP4222086B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Chemical Vapour Deposition (AREA)
JP2003103458A 2003-04-07 2003-04-07 熱処理装置 Expired - Fee Related JP4222086B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003103458A JP4222086B2 (ja) 2003-04-07 2003-04-07 熱処理装置
US10/552,267 US7718930B2 (en) 2003-04-07 2004-04-07 Loading table and heat treating apparatus having the loading table
CNB2004800092949A CN100477087C (zh) 2003-04-07 2004-04-07 放置台结构以及具有该放置台结构的热处理装置
PCT/JP2004/005036 WO2004090960A1 (ja) 2003-04-07 2004-04-07 載置台構造及びこの載置台構造を有する熱処理装置
EP04726281A EP1612854A4 (en) 2003-04-07 2004-04-07 LOADING TABLE AND HEAT TREATMENT DEVICE WITH LOADING TABLE
KR1020057019032A KR100744860B1 (ko) 2003-04-07 2004-04-07 탑재대 구조체 및 이 탑재대 구조체를 갖는 열처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003103458A JP4222086B2 (ja) 2003-04-07 2003-04-07 熱処理装置

Publications (3)

Publication Number Publication Date
JP2004307939A JP2004307939A (ja) 2004-11-04
JP2004307939A5 JP2004307939A5 (zh) 2005-10-13
JP4222086B2 true JP4222086B2 (ja) 2009-02-12

Family

ID=33466553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003103458A Expired - Fee Related JP4222086B2 (ja) 2003-04-07 2003-04-07 熱処理装置

Country Status (2)

Country Link
JP (1) JP4222086B2 (zh)
CN (1) CN100477087C (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110266274A1 (en) * 2006-11-27 2011-11-03 Toshiki Ebata Quartz encapsulated heater assembly
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置
JP5029435B2 (ja) * 2008-03-11 2012-09-19 東京エレクトロン株式会社 載置台構造及び熱処理装置
JP2009242835A (ja) * 2008-03-28 2009-10-22 Tokyo Electron Ltd 成膜方法及び成膜装置
JP5439771B2 (ja) 2008-09-05 2014-03-12 東京エレクトロン株式会社 成膜装置
KR101122719B1 (ko) 2009-05-27 2012-03-23 (주)티티에스 기판 가열 장치 및 이의 제조 방법 그리고, 이를 포함하는 기판 처리 장치
JP2011054838A (ja) * 2009-09-03 2011-03-17 Tokyo Electron Ltd 載置台構造及び処理装置
JP2011061040A (ja) * 2009-09-10 2011-03-24 Tokyo Electron Ltd 載置台構造及び処理装置
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
US9719169B2 (en) * 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
JP5942380B2 (ja) * 2011-10-20 2016-06-29 住友電気工業株式会社 半導体製造装置用ウエハ保持体
CN104600000A (zh) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 一种基板周边吸附烘烤结构
JP6396818B2 (ja) * 2015-01-29 2018-09-26 京セラ株式会社 試料保持具
CN104911544B (zh) * 2015-06-25 2017-08-11 沈阳拓荆科技有限公司 控温盘
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
US11127605B2 (en) 2016-11-29 2021-09-21 Sumitomo Electric Industries, Ltd. Wafer holder
US20230130756A1 (en) * 2021-10-22 2023-04-27 Applied Materials, Inc. Bottom cover plate to reduce wafer planar nonuniformity

Also Published As

Publication number Publication date
CN1833312A (zh) 2006-09-13
JP2004307939A (ja) 2004-11-04
CN100477087C (zh) 2009-04-08

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