JP4163098B2 - 電磁シールド型可撓性回路基板 - Google Patents

電磁シールド型可撓性回路基板 Download PDF

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Publication number
JP4163098B2
JP4163098B2 JP2003427432A JP2003427432A JP4163098B2 JP 4163098 B2 JP4163098 B2 JP 4163098B2 JP 2003427432 A JP2003427432 A JP 2003427432A JP 2003427432 A JP2003427432 A JP 2003427432A JP 4163098 B2 JP4163098 B2 JP 4163098B2
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
electromagnetic shield
type flexible
shield type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003427432A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005191076A (ja
Inventor
智 真 也 越
友 聡 住
野 容 史 星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Nippon Mektron KK
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK, Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Nippon Mektron KK
Priority to JP2003427432A priority Critical patent/JP4163098B2/ja
Priority to KR1020040095738A priority patent/KR100698496B1/ko
Priority to TW093138433A priority patent/TW200522858A/zh
Priority to CNB2004100816868A priority patent/CN1330227C/zh
Publication of JP2005191076A publication Critical patent/JP2005191076A/ja
Application granted granted Critical
Publication of JP4163098B2 publication Critical patent/JP4163098B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2003427432A 2003-12-24 2003-12-24 電磁シールド型可撓性回路基板 Expired - Fee Related JP4163098B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003427432A JP4163098B2 (ja) 2003-12-24 2003-12-24 電磁シールド型可撓性回路基板
KR1020040095738A KR100698496B1 (ko) 2003-12-24 2004-11-22 전자 실드형 가뇨성 회로기판
TW093138433A TW200522858A (en) 2003-12-24 2004-12-10 Electromagnetic masking flexible circuit substrate
CNB2004100816868A CN1330227C (zh) 2003-12-24 2004-12-24 电磁屏蔽型柔性电路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003427432A JP4163098B2 (ja) 2003-12-24 2003-12-24 電磁シールド型可撓性回路基板

Publications (2)

Publication Number Publication Date
JP2005191076A JP2005191076A (ja) 2005-07-14
JP4163098B2 true JP4163098B2 (ja) 2008-10-08

Family

ID=34786710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003427432A Expired - Fee Related JP4163098B2 (ja) 2003-12-24 2003-12-24 電磁シールド型可撓性回路基板

Country Status (4)

Country Link
JP (1) JP4163098B2 (zh)
KR (1) KR100698496B1 (zh)
CN (1) CN1330227C (zh)
TW (1) TW200522858A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100640659B1 (ko) * 2005-08-01 2006-11-01 삼성전자주식회사 가요성 인쇄회로 및 이의 제조방법
KR100737098B1 (ko) * 2006-03-16 2007-07-06 엘지이노텍 주식회사 전자파 차폐장치 및 그 제조 공정
JP4852442B2 (ja) * 2007-02-15 2012-01-11 日本オプネクスト株式会社 光送信モジュール
JP5161617B2 (ja) 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
JP5487477B2 (ja) * 2012-08-20 2014-05-07 タツタ電線株式会社 シールド層付リジッド配線基板及びその製造方法
CN104582246B (zh) * 2013-10-24 2017-09-15 信越聚合物株式会社 电磁波屏蔽膜以及带电磁波屏蔽膜的柔性印刷电路板
TWI653031B (zh) 2016-03-28 2019-03-11 鉅旺生技股份有限公司 無線壓力檢測儀
CN108738226B (zh) * 2018-05-04 2020-11-13 华显光电技术（惠州）有限公司 柔性电路板结构、背光组件与移动终端
CN110691500B (zh) * 2018-07-06 2024-04-26 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN113766095B (zh) * 2020-06-04 2023-08-15 三赢科技（深圳）有限公司 相机模组及电子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0363969U (zh) * 1989-10-25 1991-06-21
JPH04207099A (ja) * 1990-11-30 1992-07-29 Nitto Denko Corp 多層プリント基板
JPH05326644A (ja) * 1992-05-19 1993-12-10 Hitachi Cable Ltd 両面配線フィルムキャリア及びその製造方法
JP3203279B2 (ja) * 1993-01-27 2001-08-27 日本メクトロン株式会社 シ−ルド層を有する可撓性回路基板
JP3191517B2 (ja) * 1993-08-04 2001-07-23 富士ゼロックス株式会社 フレキシブル印刷配線板のシールド装置
JP3498386B2 (ja) * 1994-10-19 2004-02-16 住友電気工業株式会社 シールド付きフレキシブル配線板及びその製造方法
JPH11214805A (ja) * 1998-01-20 1999-08-06 Sony Corp フレキシブルプリント配線基板
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP2002033556A (ja) * 2000-07-18 2002-01-31 Nippon Mektron Ltd 可撓性回路基板
CN1391429A (zh) * 2001-06-07 2003-01-15 明碁电通股份有限公司 软性电路板的制造方法
JP2003007769A (ja) * 2001-06-26 2003-01-10 Toshiba Corp 半導体チップの実装構造

Also Published As

Publication number Publication date
JP2005191076A (ja) 2005-07-14
KR100698496B1 (ko) 2007-03-23
TW200522858A (en) 2005-07-01
CN1638618A (zh) 2005-07-13
CN1330227C (zh) 2007-08-01
TWI378764B (zh) 2012-12-01
KR20050065291A (ko) 2005-06-29

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