JP3837429B2 - 振動子用表面実装ベース及びこれを用いた水晶振動子 - Google Patents
振動子用表面実装ベース及びこれを用いた水晶振動子 Download PDFInfo
- Publication number
- JP3837429B2 JP3837429B2 JP2005010135A JP2005010135A JP3837429B2 JP 3837429 B2 JP3837429 B2 JP 3837429B2 JP 2005010135 A JP2005010135 A JP 2005010135A JP 2005010135 A JP2005010135 A JP 2005010135A JP 3837429 B2 JP3837429 B2 JP 3837429B2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- sealing glass
- base
- vibrator
- frame wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013078 crystal Substances 0.000 title claims description 32
- 239000005394 sealing glass Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 19
- 230000005284 excitation Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000011521 glass Substances 0.000 description 12
- 230000000149 penetrating effect Effects 0.000 description 12
- 239000006060 molten glass Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
上記実施例では絶縁ベース4は環状枠壁として貫通孔7は単一としたが、例えば第4図の平面図に示したように、絶縁ベース4の強度を高めるために中央部分に橋絡部12を設けてもよい。
Claims (7)
- 貫通孔を有する枠壁からなる絶縁ベースと、前記貫通孔に充填されて前記絶縁ベースの一主面側に空間部を形成する封着ガラスと、前記封着ガラスを挿通して前記枠壁の内面及び外面を狭持し、前記絶縁ベースの一主面側となる前記封着ガラスの表面上に水晶片の保持部を有して前記封着ガラスの底面から突出して前記枠壁の内面側から先端面を経て外面側に延出する凹状に屈曲した先端部を有し、前記先端部が半田付けされるJリード端子とを備えた振動子用表面実装ベースであって、前記封着ガラスの底面から前記Jリード端子の根元部を突出させて前記先端部の内面を前記封着ガラスの底面から少なくとも前記Jリード端子の厚み以上に離間したことを特徴とする振動子用表面実装ベース。
- 請求項1において、前記枠壁の先端面が前記封着ガラスの底面から突出した振動子用表面実装ベース。
- 請求項1において、前記枠壁の先端面に突出部が設けられ、前記突出部が前記封着ガラスの底面から突出した振動子用表面実装ベース。
- 請求項1において、前記枠壁の先端面と前記Jリード端子の先端部とが離間した振動子用表面実装ベース。
- 請求項1において、前記貫通孔が単一である振動子用表面実装ベース。
- 請求項1において、前記絶縁ベースの一主面側となる前記枠壁が、前記封着ガラスよりも高く、かつ、前記水晶片を保持する空間部を有する請求項1の振動子用表面実装ベース。
- 請求項1の前記水晶片の保持部に励振電極からの引出電極が延出した水晶片の外周部が保持され、前記振動子用表面実装ベースにカバーを被せて前記水晶片を密閉封入したことを特徴とする水晶振動子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005010135A JP3837429B2 (ja) | 2004-07-30 | 2005-01-18 | 振動子用表面実装ベース及びこれを用いた水晶振動子 |
US11/188,414 US7190235B2 (en) | 2004-07-30 | 2005-07-25 | Surface mounted crystal unit |
EP05254717A EP1622263A1 (en) | 2004-07-30 | 2005-07-28 | Surface mounted crystal unit |
KR1020050069936A KR20060048980A (ko) | 2004-07-30 | 2005-07-29 | 표면 실장 수정 진동자 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004223152 | 2004-07-30 | ||
JP2005010135A JP3837429B2 (ja) | 2004-07-30 | 2005-01-18 | 振動子用表面実装ベース及びこれを用いた水晶振動子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006066377A JP2006066377A (ja) | 2006-03-09 |
JP2006066377A5 JP2006066377A5 (ja) | 2006-06-15 |
JP3837429B2 true JP3837429B2 (ja) | 2006-10-25 |
Family
ID=35149397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005010135A Expired - Fee Related JP3837429B2 (ja) | 2004-07-30 | 2005-01-18 | 振動子用表面実装ベース及びこれを用いた水晶振動子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7190235B2 (ja) |
EP (1) | EP1622263A1 (ja) |
JP (1) | JP3837429B2 (ja) |
KR (1) | KR20060048980A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006270944A (ja) * | 2005-02-25 | 2006-10-05 | Kyocera Corp | 圧電部品 |
US10368682B2 (en) * | 2012-01-24 | 2019-08-06 | Bunn-O-Matic Corporation | Brewer |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08279725A (ja) | 1995-04-05 | 1996-10-22 | Nec Kansai Ltd | 表面実装型セラミックパッケージ |
JPH1131939A (ja) | 1997-07-14 | 1999-02-02 | Matsushita Electric Ind Co Ltd | 表面実装型水晶振動子およびその製造方法 |
JP3926002B2 (ja) | 1997-09-26 | 2007-06-06 | シチズン電子株式会社 | 圧電振動子とその製造方法 |
JP2000286661A (ja) | 1999-03-31 | 2000-10-13 | Kinseki Ltd | 表面実装型電子部品 |
JP2003297453A (ja) | 2002-03-29 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 表面実装型気密端子とそれを用いた水晶振動子 |
JP3980954B2 (ja) * | 2002-07-15 | 2007-09-26 | 日本電波工業株式会社 | 表面実装水晶発振器 |
US7076870B2 (en) * | 2004-08-16 | 2006-07-18 | Pericom Semiconductor Corp. | Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank |
-
2005
- 2005-01-18 JP JP2005010135A patent/JP3837429B2/ja not_active Expired - Fee Related
- 2005-07-25 US US11/188,414 patent/US7190235B2/en not_active Expired - Fee Related
- 2005-07-28 EP EP05254717A patent/EP1622263A1/en not_active Withdrawn
- 2005-07-29 KR KR1020050069936A patent/KR20060048980A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1622263A1 (en) | 2006-02-01 |
JP2006066377A (ja) | 2006-03-09 |
US7190235B2 (en) | 2007-03-13 |
US20060022557A1 (en) | 2006-02-02 |
KR20060048980A (ko) | 2006-05-18 |
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