JP3375835B2 - Liquid sealing resin composition and semiconductor product using the liquid sealing resin composition - Google Patents
Liquid sealing resin composition and semiconductor product using the liquid sealing resin compositionInfo
- Publication number
- JP3375835B2 JP3375835B2 JP28485296A JP28485296A JP3375835B2 JP 3375835 B2 JP3375835 B2 JP 3375835B2 JP 28485296 A JP28485296 A JP 28485296A JP 28485296 A JP28485296 A JP 28485296A JP 3375835 B2 JP3375835 B2 JP 3375835B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- sealing resin
- liquid sealing
- filler
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣ、ＬＳＩ等の
半導体素子を、外部からの化学的及び物理的な作用から
保護する液状封止樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid encapsulating resin composition for protecting semiconductor elements such as IC and LSI from external chemical and physical actions.
【０００２】[0002]
【従来の技術】近年のエレクトロニクス産業の発展に伴
い、トランジスタ、ＩＣ、ＬＳＩ、超ＬＳＩ等の半導体
製品の性能も著しく向上し、パッケージの形態もＤＩ
Ｐ、ＳＯＩＣといった少ピンのものから、ＱＦＰ等の多
ピンのものへ推移してきている。特に多ピンの製品にお
いては、ピン数が３００ピンを越えてくると、ピン間隔
が必然的に狭くなり、基板へのマウントが困難になって
きている。これに対し、ピングリッドアレイ（ＰＧＡ）
或いはボールグリッドアレイ（ＢＧＡ）といったパッケ
ージは、ピンの配列が２次元なので、同じピン数、同じ
パッケージサイズでもピン間隔を広くとることが可能な
ため、マウントが容易である。更に、グリッドアレイタ
イプのパッケージは、従来からセラミック基板を使用し
て生産されていたが、近年では、コスト削減、高周波数
の製品の場合は電気的な損失が少ないこと等の理由で、
プラスチック化が進んできている。このプラスチックピ
ングリッドアレイ（ＰＰＧＡ）或いはプラスチックボー
ルグリッドアレイ（ＰＢＧＡ）においては、成形材料を
用いトランスファーモールドにより封止するタイプのパ
ッケージと、液状の樹脂組成物をポッティングし封止す
るタイプのパッケージとに二分されるが、金型が不必要
で、設計変更及び製品化が容易である点で液状封止樹脂
組成物が有利であるため、近年急速に開発が進んでい
る。ここで、従来の液状封止樹脂組成物は、液状のエポ
キシ樹脂にシリカなどの無機充填材を分散させたものが
主流であるが、例えば、シリカの場合、真比重が約２．
２でありエポキシ樹脂等の液状樹脂の真比重１．０〜
１．２に比較して重いため、室温保管時及び／或いは加
熱硬化時にシリカの沈降が生じやすく、硬化物中でシリ
カが不均一となることがあった。室温保管時の沈降を防
ぐには、室温での粘度を高くするか、或いはチキソ性を
高くすればよいが、どちらの対策も塗布性及び広がり性
の悪化の原因となり、欠点がある。一方、硬化時の沈降
を防ぐには、硬化性を高めることで、加熱時に粘度の低
くなる時間を短くすればよいが、ポットライフが短くな
るという欠点がある。以上の様に、優れた作業性、ポッ
トライフ、及び硬化物中のフィラーの均一分散性をすべ
て満たす液状封止樹脂組成物はこれまでなかった。2. Description of the Related Art With the development of the electronics industry in recent years, the performance of semiconductor products such as transistors, ICs, LSIs, and VLSIs has been remarkably improved, and the package form has been changed to DI.
P and SOIC have few pins, and QFP has many pins. In particular, in the case of a product with a large number of pins, when the number of pins exceeds 300, the pin interval is inevitably narrowed, and mounting on a substrate becomes difficult. On the other hand, pin grid array (PGA)
Alternatively, since a package such as a ball grid array (BGA) has a two-dimensional arrangement of pins, it is possible to set a wide pin interval even with the same number of pins and the same package size, which facilitates mounting. Furthermore, grid array type packages have been conventionally produced using ceramic substrates, but in recent years, due to cost reduction and low electrical loss in the case of high frequency products,
Plasticization is progressing. In this plastic pin grid array (PPGA) or plastic ball grid array (PBGA), there are a type of package that is sealed by transfer molding using a molding material and a type of package that is potted and sealed with a liquid resin composition. Although it is divided into two parts, a liquid encapsulating resin composition is advantageous in that a mold is not necessary and design change and commercialization are easy. Therefore, development has been rapidly progressed in recent years. Here, the conventional liquid encapsulating resin composition is mainly a liquid epoxy resin in which an inorganic filler such as silica is dispersed. For example, in the case of silica, the true specific gravity is about 2.
2 and the true specific gravity of liquid resin such as epoxy resin is 1.0 to
Since it is heavier than 1.2, precipitation of silica is likely to occur during storage at room temperature and / or during heat curing, and silica may become non-uniform in the cured product. In order to prevent sedimentation during storage at room temperature, the viscosity at room temperature or the thixotropy may be increased, but both of these measures have a drawback in that they cause deterioration of coating properties and spreadability. On the other hand, in order to prevent sedimentation during curing, the curability may be increased to shorten the time during which the viscosity decreases during heating, but this has the drawback of shortening the pot life. As described above, no liquid encapsulating resin composition has hitherto been excellent in workability, pot life, and uniform dispersibility of the filler in the cured product.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、本発明は、
塗布作業性、広がり性に優れ、且つ硬化物中のフィラー
の均一分散性に優れた半導体用液状封止樹脂組成物及び
この液状封止樹脂組成物を用いた半導体製品提供するも
のである。The present invention is based on
It is intended to provide a liquid encapsulating resin composition for semiconductors which is excellent in coating workability and spreadability and is excellent in uniform dispersibility of a filler in a cured product, and a semiconductor product using the liquid encapsulating resin composition.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）液状エ
ポキシ樹脂、（Ｂ）硬化剤、（Ｃ）微粒状のフェノール
樹脂を７００℃以上で炭化処理したフィラー、及び
（Ｄ）無機充填材からなる液状封止樹脂組成物におい
て、全樹脂組成物中に（Ｃ）成分を１０〜８０重量％含
むことを特徴とする液状封止樹脂組成物である。The present invention provides (A) a liquid epoxy resin, (B) a curing agent, (C) a filler obtained by carbonizing a fine granular phenol resin at 700 ° C. or higher, and (D) an inorganic filler. A liquid encapsulating resin composition comprising a material, wherein the component (C) is contained in an amount of 10 to 80% by weight in the entire resin composition.
【０００５】[0005]
【発明の実施の形態】本発明で使用する液状エポキシ樹
脂としては、例えば、フェノール樹脂をグリシジルエー
テル化したもの、脂環式エポキシ、グリシジルエステル
型、グリシジルアミン型等が挙げられるが、構造につい
ては特に限定しない。又、ナトリウム、カリウム、塩素
等のイオン性不純物は極力少ないことが望ましい。本発
明で使用する硬化剤としては、例えば、フェノール系化
合物、有機酸無水物、アミン化合物等が挙げられるが、
構造については特に限定しない。又、エポキシ樹脂と同
様、イオン性不純物は極力少ないことが望ましい。BEST MODE FOR CARRYING OUT THE INVENTION The liquid epoxy resin used in the present invention includes, for example, glycidyl etherified phenol resin, alicyclic epoxy, glycidyl ester type and glycidyl amine type. There is no particular limitation. Further, it is desirable that the amount of ionic impurities such as sodium, potassium and chlorine is as small as possible. Examples of the curing agent used in the present invention include phenolic compounds, organic acid anhydrides, amine compounds, and the like.
The structure is not particularly limited. Further, like the epoxy resin, it is desirable that the amount of ionic impurities is as small as possible.
【０００６】本発明で使用する微粒状のフェノール樹脂
を７００℃以上で炭化処理したフィラーの真比重は、通
常のシリカより小さく、液状樹脂に配合した場合、通常
のシリカより沈降が起こりにくいという特徴がある。こ
のフィラーは、全液状封止樹脂組成物中に１０〜８０重
量％含まれることが好ましい。１０重量％未満だと、沈
降防止の効果が得られない。８０重量％を越えると、液
状封止樹脂組成物の粘度が高くなり過ぎ、塗布性、広が
り性が悪化するため好ましくない。又、微粒状のフェノ
ール樹脂を７００℃以上で炭化処理したフィラーの平均
粒径は、３〜３０μｍが好ましい。３μｍ未満だと、液
状封止樹脂組成物の粘度が高くなり過ぎ、塗布性、広が
り性が悪化する。３０μｍを越えると、塗布時のノズル
詰まり、或いは金線下部のボイドの原因となるので好ま
しくない。微粒状のフェノール樹脂を７００℃以上で炭
化処理したフィラーは、例えば、鐘紡（株）等から容易
に入手できる。The true specific gravity of the filler obtained by carbonizing the fine-grained phenolic resin used in the present invention at 700 ° C. or higher is smaller than that of ordinary silica, and when blended with a liquid resin, sedimentation is less likely to occur than ordinary silica. There is. This filler is preferably contained in the entire liquid encapsulating resin composition in an amount of 10 to 80% by weight. If it is less than 10% by weight, the effect of preventing sedimentation cannot be obtained. When it exceeds 80% by weight, the viscosity of the liquid encapsulating resin composition becomes too high, and the coatability and spreadability are deteriorated, which is not preferable. Further, the average particle size of the filler obtained by carbonizing the fine granular phenol resin at 700 ° C. or higher is preferably 3 to 30 μm. If it is less than 3 μm, the viscosity of the liquid encapsulating resin composition becomes too high, and the coatability and spreadability deteriorate. If it exceeds 30 μm, it may cause nozzle clogging during coating or cause voids under the gold wire, which is not preferable. The filler obtained by carbonizing a fine particulate phenol resin at 700 ° C. or higher is easily available from, for example, Kanebo Co., Ltd.
【０００７】本発明で使用する無機充填材としては、特
に限定しないが、例えば、球状シリカ、破砕シリカ等が
挙げられる。本発明の液状封止樹脂組成物は、（Ａ）〜
（Ｄ）成分の他、必要に応じて、アミン系、リン系等の
硬化促進剤、カップリング剤、レベリング剤、消泡剤、
低応力剤等の添加剤を加え、万能混合機で混合し、真空
チャンバー内で脱泡して製造することができる。The inorganic filler used in the present invention is not particularly limited, but examples thereof include spherical silica and crushed silica. The liquid encapsulating resin composition of the present invention comprises (A) to
In addition to the component (D), if necessary, an amine-based or phosphorus-based curing accelerator, a coupling agent, a leveling agent, a defoaming agent,
It can be manufactured by adding additives such as a low stress agent, mixing with a universal mixer, and defoaming in a vacuum chamber.
【０００８】[0008]
実施例１〜４
市販のビスフェノールＡ型エポキシ樹脂（エポキシ当量
＝１８５、加水分解性塩素量＝２０ｐｐｍ以下、２５℃
での粘度１３０ＣＰＳ、以下、エポキシＡという）、メ
チルテトラヒドロ無水フタル酸（水酸基当量＝１６６、
２５℃での粘度４０ＣＰＳ、以下、ＭＴＨＰＡとい
う）、硬化促進剤、微粒状のフェノール樹脂を２０００
℃で炭化処理したもの（平均粒径＝１８μｍ、以下、フ
ィラーＡという）、球状シリカ（真比重＝２．２、平均
粒径＝１１μｍ、以下、シリカという）、及び他の成分
を表１に示す割合で配合し、万能混合機を用いて混練
後、真空チャンバー内で脱泡し液状封止樹脂組成物を
得、以下の様に評価した。なお実施例４では、硬化促進
剤として、テトラフェニルホスホニウム・テトラフェニ
ルボレート（以下、ＴＰＰ−Ｋという）を使用した。Examples 1 to 4 Commercially available bisphenol A type epoxy resin (epoxy equivalent = 185, hydrolyzable chlorine amount = 20 ppm or less, 25 ° C.)
Viscosity 130 CPS, hereinafter referred to as Epoxy A), methyltetrahydrophthalic anhydride (hydroxyl equivalent = 166,
Viscosity of 40 CPS at 25 ° C, hereinafter referred to as MTHPA), curing accelerator, finely divided phenol resin 2000
Table 1 shows carbonization treatment at ℃ (average particle size = 18 μm, hereinafter referred to as filler A), spherical silica (true specific gravity = 2.2, average particle size = 11 μm, hereinafter referred to as silica), and other components. The ingredients were blended in the proportions shown, kneaded using a universal mixer, and then defoamed in a vacuum chamber to obtain a liquid encapsulating resin composition, which was evaluated as follows. In Example 4, tetraphenylphosphonium tetraphenylborate (hereinafter referred to as TPP-K) was used as the curing accelerator.
【０００９】評価方法
１．粘度：Ｅ型粘度計（３度コーン）を用いて、２５
℃、２．５rpmでの値を測定した。
２．保存性：２５℃で２４時間放置後、上記の粘度測定
法に準じて粘度を測定し、初期値と比較して変化率が１
２０％以下のものを合格とした。
３．ゲルタイム：液状封止樹脂組成物０．５ccを１５０
℃の熱板上に滴下し、ゲルタイムを測定した。
４．フィラー（炭化フェノール樹脂＋球状シリカ）沈降
性：液状封止樹脂組成物を試験管（内径＝約１０ｍｍ）
に高さ５０ｍｍになるように取り、
Ａ：２５℃で２４時間放置後、又は、
Ｂ：１５０℃で２時間加熱硬化後、
最上部及び最下部から試料を採取し、熱天秤（セイコー
電子工業（株）・製、ＴＧ／ＤＴＡ２２０）を用いて７
５０℃まで昇温し、恒量になるまで加熱して、フィラー
含有率（重量％）を求めた。最上部及び最下部のフィラ
ー含有率の差が１％以内のものを合格とした。５．硬化
物外観：液状封止樹脂組成物を直径約５０ｍｍのアルミ
カップに深さ約５ｍｍになるように採取し、１５０℃で
２時間加熱硬化後、目視で表面の凹凸、均一性等を確認
した。Evaluation method 1. Viscosity: 25 using an E-type viscometer (3 degree cone)
The value at 2.5 ° C. was measured. 2. Storability: After standing at 25 ° C for 24 hours, the viscosity was measured according to the above-mentioned viscosity measurement method, and the change rate was 1 compared with the initial value.
Those with 20% or less were accepted. 3. Gel time: 150 cc of liquid encapsulating resin composition
The gel time was measured by dropping on a hot plate at ℃. 4. Filler (carbonized phenolic resin + spherical silica) Sedimentability: Test tube for liquid encapsulating resin composition (inner diameter = about 10 mm)
To a height of 50 mm and left at A: 25 ° C. for 24 hours, or B: after heat curing at 150 ° C. for 2 hours, collect samples from the top and bottom, and use a thermobalance (Seiko Denshi Kogyo) TG / DTA220 manufactured by K.K.
The temperature was raised to 50 ° C. and heated to a constant weight to determine the filler content (% by weight). The case where the difference in filler content between the uppermost part and the lowermost part was within 1% was regarded as acceptable. 5. Appearance of cured product: A liquid encapsulating resin composition was sampled in an aluminum cup having a diameter of about 50 mm so as to have a depth of about 5 mm, and after being cured by heating at 150 ° C. for 2 hours, surface irregularities, uniformity, etc. were visually confirmed. .
【００１０】実施例５
実施例１のフィラーＡに代えて、微粒状のフェノール樹
脂を８００℃で炭化処理したもの（平均粒径＝１８μ
ｍ、以下、フィラーＢという）を使用した他は、実施例
１〜４と同様に液状封止樹脂組成物を作製し、評価し
た。
実施例６
実施例１のフィラーＡに代えて、微粒状のフェノール樹
脂を２０００℃で炭化処理したもの（平均粒径＝６μ
ｍ、以下、フィラーＣという）を使用した他は、実施例
１〜４と同様に液状封止樹脂組成物を作製し、評価し
た。Example 5 In place of the filler A of Example 1, a fine-grained phenol resin carbonized at 800 ° C. (average particle size = 18 μm)
m, hereinafter referred to as filler B), liquid encapsulating resin compositions were prepared and evaluated in the same manner as in Examples 1 to 4. Example 6 Instead of the filler A of Example 1, a fine particulate phenol resin carbonized at 2000 ° C. (average particle size = 6 μm)
m, hereinafter referred to as filler C), and a liquid encapsulating resin composition was prepared and evaluated in the same manner as in Examples 1 to 4.
【００１１】比較例１〜４
表２に示す配合で、実施例と同様に液状封止樹脂組成物
を作製し、評価した。なお比較例４では、硬化促進剤と
して２−フェニル−４−メチルイミダゾール（以下、２
Ｐ４ＭＺという）を使用した。
比較例５
エポキシ樹脂としてビスフェノールＡ型エポキシ樹脂
（エポキシ当量＝１８５、加水分解性塩素量＝２０ｐｐ
ｍ以下、２５℃での粘度２００ＣＰＳ、以下、エポキシ
Ｂという）を使用した他は、実施例と同様に液状封止樹
脂組成物を作製し、評価した。
比較例６
実施例１のフィラーＡに代えて、微粒状のフェノール樹
脂（未炭化処理品、平均粒径＝１８μｍ、以下、フィラ
ーＤという）を使用した他は、実施例と同様に液状封止
樹脂組成物を作製し、評価した。結果を表１、表２に示
す。Comparative Examples 1 to 4 Liquid encapsulating resin compositions having the formulations shown in Table 2 were prepared and evaluated in the same manner as in Examples. In Comparative Example 4, 2-phenyl-4-methylimidazole (hereinafter referred to as 2
P4MZ) was used. Comparative Example 5 Bisphenol A type epoxy resin as epoxy resin (epoxy equivalent = 185, hydrolyzable chlorine amount = 20 pp
A liquid encapsulating resin composition was prepared and evaluated in the same manner as in Example, except that m or less, viscosity at 25 ° C. of 200 CPS, hereinafter referred to as epoxy B) was used. Comparative Example 6 Liquid sealing was carried out in the same manner as in Example 1 except that a fine granular phenol resin (uncarbonized product, average particle size = 18 μm, hereinafter referred to as filler D) was used instead of the filler A of Example 1. A resin composition was prepared and evaluated. The results are shown in Tables 1 and 2.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【表２】 [Table 2]
【００１４】[0014]
【発明の効果】本発明の液状封止樹脂組成物は、広がり
性に優れ、且つ硬化物中のフィラーの均一分散性に優れ
るものである。The liquid encapsulating resin composition of the present invention has excellent spreadability and uniform dispersibility of the filler in the cured product.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 23/31 (56)参考文献 特開 平６−96843（ＪＰ，Ａ) 特開 平８−198938（ＪＰ，Ａ) 特開 平８−67805（ＪＰ，Ａ) 特開 平４−68019（ＪＰ，Ａ) 特開 平２−311520（ＪＰ，Ａ) 特開 昭63−129006（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 63/00 - 63/10 C01B 31/02 C08K 3/04 H01L 23/29 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI H01L 23/31 (56) References JP-A-6-96843 (JP, A) JP-A-8-198938 (JP, A) Kaihei 8-67805 (JP, A) JP 4-68019 (JP, A) JP 2-311520 (JP, A) JP 63-129006 (JP, A) (58) Fields investigated (58) Int.Cl. 7 , DB name) C08L 63/00-63/10 C01B 31/02 C08K 3/04 H01L 23/29
Claims (3)
剤、（Ｃ）微粒状のフェノール樹脂を７００℃以上で炭
化処理したフィラー、及び（Ｄ）無機充填材からなる液
状封止樹脂組成物において、全樹脂組成物中に（Ｃ）成
分を１０〜８０重量％含むことを特徴とする液状封止樹
脂組成物。1. A liquid encapsulating resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a filler obtained by carbonizing a fine particulate phenolic resin at 700 ° C. or higher, and (D) an inorganic filler. A liquid encapsulating resin composition containing 10 to 80% by weight of the component (C) in the entire resin composition.
で炭化処理したフィラーの平均粒径が３〜３０μｍであ
る請求項１記載の液状封止樹脂組成物。2. The liquid encapsulating resin composition according to claim 1, wherein the average particle size of the filler obtained by carbonizing a fine particulate phenol resin at 700 ° C. or higher is 3 to 30 μm.
成物を用いたことを特徴とする半導体製品。3. A semiconductor product using the liquid encapsulating resin composition according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28485296A JP3375835B2 (en) | 1996-10-28 | 1996-10-28 | Liquid sealing resin composition and semiconductor product using the liquid sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28485296A JP3375835B2 (en) | 1996-10-28 | 1996-10-28 | Liquid sealing resin composition and semiconductor product using the liquid sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10130467A JPH10130467A (en) | 1998-05-19 |
| JP3375835B2 true JP3375835B2 (en) | 2003-02-10 |
Family
ID=17683872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28485296A Expired - Fee Related JP3375835B2 (en) | 1996-10-28 | 1996-10-28 | Liquid sealing resin composition and semiconductor product using the liquid sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3375835B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4614214B2 (en) * | 1999-12-02 | 2011-01-19 | 信越化学工業株式会社 | Hollow package for semiconductor device elements |
| KR101381483B1 (en) * | 2006-10-20 | 2014-04-04 | 에아.워타 가부시키가이샤 | Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| TWI709607B (en) * | 2019-05-07 | 2020-11-11 | 長春人造樹脂廠股份有限公司 | Resin composition and uses of the same |
-
1996
- 1996-10-28 JP JP28485296A patent/JP3375835B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10130467A (en) | 1998-05-19 |
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