JP3347888B2 - Printed circuit board holding structure - Google Patents
Printed circuit board holding structureInfo
- Publication number
- JP3347888B2 JP3347888B2 JP18951094A JP18951094A JP3347888B2 JP 3347888 B2 JP3347888 B2 JP 3347888B2 JP 18951094 A JP18951094 A JP 18951094A JP 18951094 A JP18951094 A JP 18951094A JP 3347888 B2 JP3347888 B2 JP 3347888B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frame
- holding structure
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器等のプリント
基板をシールド板を兼ねた金属製の枠体に内挿し固定す
るプリント基板保持構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board holding structure for inserting and fixing a printed circuit board of an electronic device or the like into a metal frame also serving as a shield plate.
【０００２】[0002]
【従来の技術】電子機器等のプリント基板をシールド板
を兼ねた金属製の枠体に内挿し固定する構造では、例え
ば、図９（ａ），（ｂ）に示すように、枠体１周囲の一
部から枠体１の内方に突出させて形成した複数の爪部
２，２をそれぞれ内側（プリント基板３の方）に折り曲
げて、プリント基板３を保持していた。この従来のプリ
ント基板保持構造にあっては、枠体１の一部から切り欠
いて突出形成した爪部２の長さ（首４の部分）が短い構
造となっていて、図９（ｂ）に示すように、爪部２を曲
げ倒して、プリント基板３側と半田付けされていた。５
は半田部である。BACKGROUND OF THE INVENTION structure of a printed circuit board such as an electronic apparatus to interpolate fixed in a metal frame which also serves as a shield plate, for example, as shown in FIG. 9 (a), (b) , the frame 1 around by bending the protruding inwardly of the frame 1 from a portion formed by a plurality of claw portions 2 on the inner side, respectively (towards the printed circuit board 3), it retained the printed board 3. This is the conventional printed circuit board holding structure, and the length of the pawl portion 2 protruding formed by cutting a part of the frame 1 (the neck 4) has become a short structure, and FIG. 9 (b) As shown in (1), the claws 2 were bent down and soldered to the printed circuit board 3 side. 5
Denotes a solder part.
【０００３】[0003]
【発明が解決しようとする課題】ところが、前記従来技
術では、例えば、ＴＶやＶＴＲセット機器等に搭載した
場合において、例えば使用環境温度が−20℃〜＋60℃の
ように大きく温度が変化した（特に、冬期間においてＴ
ＶやＶＴＲセット機器の電源を入れる前と後ではセット
機器内部の温度が大きく変化する）場合には、その温度
差の影響を受けると枠体１の爪部２とプリント基板３の
熱収縮率が違うために、その枠体１の爪部２とプリント
基板３との間にストレスが生じ、そのストレスを受けて
枠体１の爪部２とプリント基板３との間の半田部５にハ
ンダクラックが生じてしまうという問題があった。However, in the prior art, when mounted on, for example, a TV or a VTR set device, the temperature of the operating environment greatly changes, for example, from -20 ° C to + 60 ° C ( In particular, T
In the case where the temperature inside the set device greatly changes before and after the power of the V or VTR set device is turned on), the thermal shrinkage of the claw portion 2 of the frame 1 and the printed board 3 is affected by the temperature difference. Therefore, stress is generated between the claw portion 2 of the frame 1 and the printed circuit board 3, and the solder is applied to the solder portion 5 between the claw portion 2 of the frame 1 and the printed circuit board 3 due to the stress. There is a problem that cracks occur.
【０００４】 また、爪部２が短かく、プリント基板３の
アース箇所（図示せず）と枠体１内面までの距離がなか
ったので、熱ストレスの影響が大きくて、熱ストレスを
吸収しきれず不利であった。また、アース用として爪部
２の片面のみに半田付けしていたため、温度変化により
ハンダクラックが発生しやすかった。また、アース用の
爪部２を曲げ倒す寸法にバラツキが生じ、プリント基板
３の浮きが発生しやすかった。また、爪部２はアース用
の機能のみであるので、プリント基板３を枠体１内で支
えるプリント基板受け部（図示せず）を枠体１に別に設
けなければならなかった。 In addition, since the claw portion 2 is short and there is no distance between the ground portion (not shown) of the printed circuit board 3 and the inner surface of the frame 1, the influence of the thermal stress is large, and the thermal stress cannot be absorbed. Was disadvantageous. In addition, since soldering was performed only on one side of the claw portion 2 for grounding, solder cracks were easily generated due to a temperature change. In addition, the dimensions for bending down the grounding claw portion 2 varied, and the printed circuit board 3 was likely to float. Further, since the claw portion 2 has only the function of grounding, a printed board receiving portion (not shown) for supporting the printed board 3 in the frame 1 has to be separately provided on the frame 1.
【０００５】本発明の目的は、温度が大きく変化する環
境温度で使用されるＴＶやＶＴＲ等の電子機器に使用し
ても枠体の爪部とプリント基板との半田付部にハンダク
ラックが生じることのなく、また、アース機能とプリン
ト基板受け（支え）とプリント基板浮き防止の３つの機
能を持たせることができるプリント基板保持構造を提供
することにある。本発明の他の目的は、ストレスが吸収
できて外部から内部方向への押圧に対して強くなり、よ
って半田割れを妨げるプリント基板保持構造を提供する
ことにある。本発明の他の目的は、機械的に強固な固定
とすることができ、温度変化によるストレスがハンダに
加わりにくくなって、ハンダクラックの防止ができ、ま
た、プリント基板の浮きを防止できるプリント基板保持
構造を提供することにある。 [0005] The purpose of the present invention, the solder cracks in soldered portions between the claw portion and the printed circuit board of the TV or VTR, etc. even frame used in electronic devices that are used at ambient temperature the temperature changes greatly Without the occurrence of earth function and pudding
Board support (support) and printed board floating prevention machine
It is an object of the present invention to provide a printed circuit board holding structure capable of providing functions. Another object of the present invention is to absorb stress
It is strong against pressure from outside to inside,
To provide a printed circuit board holding structure that prevents solder cracking . Another object of the present invention may be a mechanically rigid fixation, so the stress is hardly applied to the solder due to temperature changes, can prevent solder cracks, or <br/>, of the PCB An object of the present invention is to provide a printed circuit board holding structure capable of preventing floating .
【０００６】[0006]
【課題を解決するための手段】上記目的は、側板を有
し、上下に開口した枠体と、透孔とこの透孔の周囲に半
田付パターンを形成したプリント基板と、前記側板から
折り曲げされて、前記枠体に突出した受け部と、この受
け部の端部の上方、又は下方に延びる爪部とを有し、前
記受け部は、一端が前記側板に連結された根本部と、前
記爪部が設けられ、前記根本部の他端から折り曲げされ
て前記枠体内に突出する突出部とを有し、前記受け部の
根本部は、その両側に前記側板の略板厚以上の深さの切
り込み部を設けて、前記側板と同一平面内に位置した状
態で前記側板の面方向に延びて形成され、前記プリント
基板の透孔には、前記爪部が挿通されて、前記プリント
基板が前記突出部で受けられると共に、前記爪部と前記
半田付用パターンとが半田付された第１の手段により達
成される。上記目的は、第１の手段において、前記根本
部の両側に設けられた前記切り欠き部が前記枠体の上下
方向に対して直交する方向に設けられて、前記突出部が
前記枠体の上下方向に直立状態で配設され、前記突出部
の端面で前記プリント基板 を受けるようにした第２の手
段により達成される。上記目的は、第１の手段におい
て、前記根本部の両側に設けられた前記切り欠き部が前
記枠体の上下方向と同方向に設けられて、前記突出部が
前記枠体の上下方向に垂直状態で配設され、前記突出部
の平面で前記プリント基板を受けるようにした第３の手
段により達成される。上記目的は、第１の手段または第
２の手段または第３の手段において、前記透孔に挿入さ
れた前記爪部の先端を、前記プリント基板方向に折り曲
げ、又はねじって前記プリント基板を前記受け部に固定
させた第４の手段により達成される。In order to solve the problems] on the Symbol purpose it is, have a side plate
And an opening and a frame member vertically, and a printed circuit board forming the solder Tsukepa turn around through hole and the through hole, from the side plates
A receiving portion which is bent and protrudes from the frame ,
Upper digits of the end, or have an extending beauty Ru claw portion downwardly, before
The recording part includes a base part having one end connected to the side plate, and a front part.
A nail portion is provided and bent from the other end of the root portion.
And a projecting portion projecting into the frame body.
Root part is provided with a cut portion of the depth of the substantially plate Atsu以 of the side plates on both sides, like positioned within said side plate in the same plane
The print is formed so as to extend in the surface direction of the side plate in a state.
The claw portion is inserted into the through hole of the board, and the printed portion is formed.
Together with the substrate is received by the projecting portion, and the pattern the soldering and the claw portion is achieved by the first means being soldered. Upper Symbol purpose, in the first means, the fundamental
The notch provided on both sides of the frame
The projection is provided in a direction orthogonal to the direction,
The frame is disposed upright in the vertical direction, and the
This is achieved by a second means for receiving the printed circuit board at the end face thereof. Upper Symbol purpose is first hand stage at <br/> Te, the notch portions provided on both sides of the base portion is pre
The projection is provided in the same direction as the vertical direction of the frame,
The protrusion is disposed vertically in the up-down direction of the frame, and
This is achieved by a third means for receiving the printed circuit board in a plane . Upper Symbol purpose, in the first means or the second means or third means, of insertion into the through hole
The bent tip of the claw is bent toward the printed circuit board.
Fixed the printed circuit board to the receiving part
This is achieved by the fourth means.
【０００７】[0007]
【作用】第１の手段にあっては、根本部があることで枠
体から爪部の長さを十分に長くできるので、根本部が容
易に撓んで枠体とプリント基板との熱収縮のストレスを
吸収することができるので、温度が大きく変化する環境
温度で使用されるＴＶやＶＴＲ等の電子機器に使用して
も枠体の爪部とプリント基板との半田付部にハンダクラ
ックが生じることはなく、また、外部から内部方向への
押圧に対して強くなり、よって半田割れを妨げる。ま
た、アース機能とプリント基板受け（支え）とプリント
基板浮き防止の３つの機能を持たせることができる。第
２，３の手段にあっては、突出部の端面でプリント基板
を受けるようにし、または突出部の平面でプリント基板
を受けるようにしたため、ストレスが吸収できて外部か
ら内部方向への押圧に対して強くなり、よって半田割れ
を妨げる。第４の手段にあっては、爪部を折り曲げ、又
はねじり、プリント基板を固定したため、機械的に強固
な固定とすることができ、温度変化によるストレスがハ
ンダに加わりにくくなるので、ハンダクラックの防止と
なり、また、爪部をプリント基板の透孔に引っ掻けるこ
とができ、プリント基板の浮きを防止できる。 According to the first means, the presence of the root portion makes the frame
Since the length of the nail from the body can be sufficiently long, the root
Since it can easily bend and absorb the thermal shrinkage stress between the frame and the printed circuit board, it can be used for electronic devices such as TVs and VTRs that are used at environmental temperatures where the temperature changes greatly. never solder cracks in the soldered portions between the parts and the printed circuit board, also become strong against pressure from the external to the internal direction, thus interfering with the solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided . No.
In the case of the means ( 2) and (3 ) , a printed circuit board is
Or printed circuit board in the plane of the protrusion
To be able to absorb stress and
Resistance to inward pressure, and therefore solder cracking
Hinder. In the fourth means, the claw is bent, and
Is mechanically strong due to twisting and fixing the printed circuit board.
Fixed due to temperature changes.
To prevent solder cracking.
Also, be careful not to scratch the nails into the through holes on the printed circuit board.
And the floating of the printed circuit board can be prevented.
【０００８】[0008]
【実施例】以下、本発明の実施例を説明する。まず、本
発明の第１の実施例を図１ないし図４を参照して説明す
る。図１は実施例に係るプリント基板保持構造のプリン
ト基板取り付け前の斜視図、図２（ａ），（ｂ），
（ｃ）は実施例に係るプリント基板保持構造のプリント
基板取り付け状態の正面図，縦断面図，及び平面図、図
３は第１の実施例の変形例を示す説明図、図４は第１の
実施例の別の変形例を示す説明図である。Embodiments of the present invention will be described below. First, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a printed circuit board holding structure according to an embodiment before the printed circuit board is attached, and FIGS.
FIG. 3C is a front view, a longitudinal sectional view, and a plan view of the printed circuit board holding structure according to the embodiment when the printed circuit board is mounted, FIG. 3 is an explanatory view showing a modification of the first embodiment, and FIG. It is explanatory drawing which shows another modified example of the Example.
【０００９】これらの図において、１０は上下に開口す
る枠体であって、枠体１０は例えば４つの側板１１，１
１…により四角筒状に構成されている。この枠体１０に
は、その側板１１を切り欠いて受け部１２及び爪部１３
が折り曲げ形成されている。これら受け部１２及び爪部
１３はＬ字状に一体に形成され、受け部１２の先端に爪
部１３が配設されている。この受け部１２には、一端が
側板１１に連結された根本部１２ａと、この根本部１２
ａの他端から折り曲げられて枠体１０内に突出する突出
部１２ｂを有する。 そして、根本部１２ａは、側板１１
の一部に所定の幅をもってその両側を切り欠いて形成さ
れ、また、突出部１２ｂは、枠体１０の側板１１内面か
ら内方にほぼ垂直に突出するように折り曲げ形成されて
おり、受け部１２の突出部１２ｂの端面１４は後述する
プリント基板１７を受けるようになっている。すなわ
ち、受け部１２の突出部１２ｂは図１で上下方向に直立
状態で配置されている。また、受け部１２は、根本部１
２ａの両側に枠体１０の略板厚またはそれ以上の深さの
切り込み部１６，１６が設けられていると共に、この切
り込み部１６，１６は、枠体１０の上下方向に対して直
交する方向に形成されている。また、受け部１２の根本
部１２ａは、側板１１と同一平面内に位置した状態で側
板１１の面方向に延びて形成されている。爪部１３は受
け部１２の先端から上方向（または下方向）に延設され
ており、かつ枠体１０の略板厚分の幅で形成されてい
る。[0009] In these figures, reference numeral 10 denotes a frame body that opens vertically, and the frame body 10 includes, for example, four side plates 11, 1.
Are formed in the shape of a square tube. The frame 10, by cutting the side plate 11 receiving portion 12 and the claw portion 13
Are bent. The receiving portion 12 and the claw portion 13 are integrally formed in an L-shape, and the claw portion 13 is disposed at the tip of the receiving portion 12. One end of the receiving portion 12
A root portion 12a connected to the side plate 11;
a that is bent from the other end of a and protrudes into the frame 10
It has a portion 12b. And the root part 12a is the side plate 11
Part missing stomach is formed off the both sides with a predetermined width
Further, the protruding portion 12b is formed by bending so as to protrude inward from the inner surface of the side plate 11 of the frame body 10 substantially vertically, and the end surface 14 of the protruding portion 12b of the receiving portion 12 I am going to receive it. That is, the protruding portion 12b of the receiving portion 12 is upright in the vertical direction in FIG.
It is arranged in a state . In addition, the receiving part 12 is the base part 1.
2a notch portions 16 of the substantially plate thickness or more of the depth of the frame body 10 on both sides together with provided, this switching
The insertion portions 16, 16 are aligned with the vertical direction of the frame 10.
It is formed in the direction of intersection . Also, the root of the receiving part 12
The part 12a is located on the same plane as the side plate 11
It is formed to extend in the surface direction of the plate 11. The claw portion 13 extends upward (or downward) from the tip of the receiving portion 12 and has a width substantially equal to the thickness of the frame body 10.
【００１０】プリント基板１７には、図１及び図２
（ｃ）に示すように、楕円孔状の透孔１８が穿設されて
おり、この透孔１８の周囲のプリント基板１７の上面１
７ａに半田付用パターン１９が形成されている。なお、
透孔１８は楕円孔状に限らず、丸孔または長孔状であっ
てもよい。なお、２８は受け部１２の端面の一部に切欠
きを設けて形成した隙間で、この隙間２８により温度変
化によるストレスを逃す。FIG. 1 and FIG.
As shown in (c), an elliptical hole 18 is formed, and the upper surface 1 of the printed circuit board 17 around the hole 18 is formed.
A soldering pattern 19 is formed on 7a. In addition,
The through hole 18 is not limited to an elliptical hole, but may be a round hole or a long hole. Incidentally, 28 is a gap which is formed by providing a notch in a part of the end face of the receiving portion 12, miss the stress due to more temperature changes in the gap 28.
【００１１】次に、前記第１の実施例の固定方法につい
て説明する。図１に示すように、プリント基板１７の半
田付用パターン１９が設けられた面１７ａと反対側の面
を爪部１３の先端側に向けた状態で、透孔１８に爪部１
３を挿入し、図２（ａ）〜（ｃ）に示すように、爪部１
３と半田付用パターン１９とを半田２０付して固定す
る。Next, the fixing method of the first embodiment will be described. As shown in FIG. 1, with the surface of the printed circuit board 17 opposite to the surface 17 a on which the soldering pattern 19 is provided facing the tip of the claw portion 13, the claw portion is 1
3 is inserted, and as shown in FIGS.
3 and the soldering pattern 19 are fixed by soldering 20.
【００１２】なお、図３に示す、前記第１の実施例の変
形例では、透孔１８に挿入された爪部１３の先端をプリ
ント基板方向にねじって（基板上面に突出した爪部１３
の先端をひねることを表わす。）プリント基板１７を受
け部１２に固定している。また、図４に示す、前記第１
の実施例の別の変形例では、透孔１８に挿入され、プリ
ント基板１７から突出した爪部１３の先端部分を折り曲
げてプリント基板１７を受け部１２に固定している。In the modification of the first embodiment shown in FIG. 3, the tip of the claw 13 inserted into the through hole 18 is twisted in the direction of the printed circuit board (the claw 13 protruding from the upper surface of the board).
Means twisting the tip of. ) The printed circuit board 17 is fixed to the receiving portion 12. Also, as shown in FIG.
In another modified example of the embodiment, the tip portion of the claw portion 13 inserted into the through hole 18 and protruding from the printed board 17 is bent to fix the printed board 17 to the receiving portion 12.
【００１３】このように構成された前記第１の実施例に
あっては、受け部１２は、枠体１０の側板を切り欠いて
折り曲げ形成した端面１４で構成されているため、爪部
１３が細く、さらに受け部１２があるため、ストレスが
吸収できて外部から内部方向への押圧に対して強くな
り、よって半田割れを妨げる。また、アース機能とプリ
ント基板受け（支え）とプリント基板浮き防止の３つの
機能を持たせることができる。さらに受け部１２の長さ
を長くすることにより熱収縮のストレス吸収の効果を増
大させることができる。In the first embodiment constructed as described above, the receiving portion 12 is constituted by the end face 14 formed by cutting out the side plate of the frame body 10 and forming it by bending. Because of the thinness and the presence of the receiving portion 12, the stress can be absorbed, and it becomes strong against the pressure from the outside to the inside, thereby preventing solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided. Further, by increasing the length of the receiving portion 12, the effect of absorbing the heat shrinkage stress can be increased.
【００１４】次に、本発明の第２の実施例を図５〜図８
を参照して説明する。図５は実施例に係るプリント基板
保持構造のプリント基板取り付け前の斜視図、図６は実
施例に係るプリント基板保持構造のプリント基板取り付
け状態の縦断面図、図７は実施例に係るプリント基板保
持構造の枠体の要部斜視図、図８（ａ），（ｂ）は図７
の平面図及び正面図である。Next, a second embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. FIG. 5 is a perspective view of the printed circuit board holding structure according to the embodiment before the printed circuit board is mounted, FIG. 6 is a longitudinal sectional view of the printed circuit board holding structure according to the example, and FIG. 7 is a printed circuit board according to the example. 8 (a) and 8 (b) are perspective views of a main part of the frame body of the holding structure.
3 is a plan view and a front view of FIG.
【００１５】これらの図において、３０は上下に開口す
る枠体であって、枠体３０は例えば４つの側板３１，３
１…により四角筒状に構成されている。この枠体３０に
は、一端が側板３１に連結された根本部３２ａと、この
根本部３２ａの他端から折り曲げられて枠体３０内に突
出する突出部３２ｂを有する。 そして、根本部３２ａ
は、側板３１に切り欠いて受け部３２及び爪部３３が折
り曲げ形成されている。これら受け部３２及び爪部３３
はＬ字状に一体に形成され、受け部３２の先端に爪部３
３が配設されている。この受け部３２は側板３１の一部
に所定の幅をもってその両側を切り欠いて形成され、ま
た、突出部３２ｂは、枠体３０の側板３１内面から内方
にほぼ垂直に突出するように折り曲げ形成されており、
受け部３２の突出部３２ｂの平面３４はプリント基板１
７を受けるようになっている。すなわち、受け部３２の
突出部３２ｂは図５で左右方向に水平状態で配置されて
いる。また、受け部３２は、図７，図８（ａ）に示すよ
うに、根本部３２ａの両側に枠体３０の略板厚またはそ
れ以上の深さａの切り込み部３６，３６が設けられてい
ると共に、この切り込み部３６，３６は、枠体３０の上
下方向と同方向に形成されている。この切り込み部３６
を設けることにより、枠体３０からプリント基板１７の
パターンと爪部３３の半田部２０までの距離を長くする
ことができるので、熱ストレス吸収が有利となり、ま
た、受け部３２を枠体３０内方向に曲げるときに曲げや
すい。また、受け部３２の根本部３２ａは、側板３１と
同一平面内に位置した状態で側板３１の面方向に延びて
形成されている。爪部３３は受け部３２の先端から上方
向（または下方向）に延設されており、かつ枠体３０の
略板厚分の幅で形成されている。In these figures, reference numeral 30 denotes a frame which opens vertically, and the frame 30 is made up of, for example, four side plates 31 and 3.
Are formed in the shape of a square tube. In the frame body 30
Is a root portion 32a having one end connected to the side plate 31,
It is bent from the other end of the root portion 32a and protrudes into the frame 30.
It has a protruding portion 32b that protrudes. And the root part 32a
The receiving part 32 and the claw part 33 are notched in the side plate 31 so as to be bent. These receiving part 32 and claw part 33
Are integrally formed in an L-shape, and a claw 3
3 are provided. The receiving portion 32 is formed to have missing off both sides with a part on a predetermined width of the side plate 31, or
In addition, the protruding portion 32b is bent and formed so as to protrude inward from the inner surface of the side plate 31 of the frame 30 substantially vertically.
The flat surface 34 of the projecting portion 32b of the receiving portion 32 is
7 That is, the receiving portion 32
The protruding portion 32b is arranged horizontally in the left-right direction in FIG. Also, receiving section 32, FIG. 7, as shown in FIG. 8 (a), the cut portions 36 of the substantially plate thickness or more depth a of the frame 30 on both sides is provided in the base portion 32a And the cuts 36, 36 are located above the frame 30.
It is formed in the same direction as the downward direction . This notch 36
Since the distance between the frame 30 and the pattern of the printed circuit board 17 and the solder portion 20 of the claw portion 33 can be lengthened, absorption of thermal stress becomes advantageous, and the receiving portion 32 is formed inside the frame 30. Easy to bend when bending in the direction. The base 32a of the receiving portion 32 is
Extending in the surface direction of the side plate 31 while being located in the same plane
Is formed. The claw portion 33 extends upward (or downward) from the distal end of the receiving portion 32 and has a width substantially equal to the thickness of the frame 30.
【００１６】１７はプリント基板で、このプリント基板
１７には楕円孔状の透孔１８が穿設されており、この透
孔１８の周囲のプリント基板１７の上面１７ａに半田付
用パターン１９が形成されている。なお、透孔１８は楕
円孔状に限らず、丸孔または長孔状であってもよい。Reference numeral 17 denotes a printed circuit board. The printed circuit board 17 has an elliptical hole 18 formed therein. A soldering pattern 19 is formed on the upper surface 17a of the printed circuit board 17 around the hole 18. Have been. The through hole 18 is not limited to an elliptical hole, but may be a round hole or a long hole.
【００１７】次に、前記第２の実施例の固定方法につい
て説明する。図５に示すように、プリント基板１７の半
田付用パターン１９が設けられた面１７ａと反対側の面
を爪部３３の先端側に向けた状態で、透孔１８に爪部３
３を挿入し、図６に示すように、爪部３３と半田付用パ
ターン１９とを半田２０付して固定する。Next, the fixing method of the second embodiment will be described. As shown in FIG. 5, with the surface of the printed circuit board 17 opposite to the surface 17 a on which the soldering pattern 19 is provided facing the distal end of the nail portion 33, the nail portion is inserted into the through hole 18. 3
3 is inserted, and the claws 33 and the soldering patterns 19 are fixed by soldering 20, as shown in FIG.
【００１８】このように構成された前記第１，第２の実
施例にあっては、受け部１２，３２は枠体１０，３０を
形成する側板１１，３１の一部に所定の幅をもってその
両側を切り欠いて折り曲げ形成し、受け部１２，３２の
根本部１２ａ、３２ａの両側に枠体１０，３０の略板厚
またはそれ以上の深さの切り込み部１６，１６，３６，
３６をそれぞれ設けたため、枠体１０，３０から爪部１
３，３３の長さを十分に長くすることができるので、振
動を吸収でき半田割れを防止できる。In the above-described first and second embodiments, the receiving portions 12, 32 have a predetermined width on a part of the side plates 11, 31 forming the frames 10, 30. The both sides are cut out and bent to form the receiving portions 12 and 32.
Base portion 12a, of the frame 10,3 0 on both sides of 32a RyakubanAtsu or more of the depth of the cut portion 16,16,36,
36, the claw portions 1 from the frame bodies 10 and 30 are provided.
Since the length of 3, 33 can be made sufficiently long, vibration can be absorbed and solder cracking can be prevented.
【００１９】また、前記第１，第２の実施例にあって
は、枠体１０，３０の一部から該枠体１０，３０の内方
に突出した、プリント基板１７を受ける受け部を備えた
ため、爪部１３，３３が細く、さらに受け部１２，３２
があるため、ストレスが吸収できて外部から内部方向へ
の押圧に対して強くなり、よって半田割れを妨げる。ま
た、アース機能とプリント基板受け（支え）とプリント
基板浮き防止の３つの機能を持たせることができる。さ
らに受け部１２，３２の長さを長くすることにより熱収
縮のストレス吸収の効果を増大させることができる。In the first and second embodiments, there is provided a receiving portion for receiving the printed circuit board 17, which protrudes from a part of the frames 10, 30 to the inside of the frames 10, 30. Therefore, the claws 13 and 33 are thin, and the receiving portions 12 and 32
As a result, stress can be absorbed, and resistance to pressure from the outside to the inside increases, thereby preventing solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided. Further, by increasing the lengths of the receiving portions 12 and 32, the effect of absorbing the heat shrinkage stress can be increased.
【００２０】また、前記第１，第２の実施例にあって
は、爪部１３，３３を受け部上に設けたため、爪部１
３，３３が細く、さらに受け部１２，３２があるため、
ストレスが吸収できて外部から内部方向への押圧に対し
て強くなり、よって半田割れを妨げる。また、アース機
能とプリント基板受け（支え）とプリント基板浮き防止
の３つの機能を持たせることができる。さらに受け部１
２，３２の長さを長くすることにより熱収縮のストレス
吸収の効果を増大させることができる。In the first and second embodiments, the claw portions 13 and 33 are provided on the receiving portion.
3 and 33 are thin and there are receiving parts 12 and 32,
The stress can be absorbed and becomes strong against the pressing from the outside to the inside, thereby preventing solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided. Receiving part 1
By increasing the length of 2, 32, the effect of absorbing heat shrinkage stress can be increased.
【００２１】また、前記第２の実施例にあっては、爪部
３３が細く、さらに受け部３２があり、受け部３２は、
枠体３０の側板を切り欠いて折り曲げ形成した突出部３
２ｂの平面３４でプリント基板１７を受けるように構成
されているため、ストレスが吸収できて外部から内部方
向への押圧に対して強くなり、よって半田割れを妨げ
る。また、アース機能とプリント基板受け（支え）とプ
リント基板浮き防止の３つの機能を持たせることができ
る。さらに受け部３２の長さを長くすることにより熱収
縮のストレス吸収の効果を増大させることができる。[0021] The In the second embodiment, thin claw portion 33, there are further receiving unit 32, the receiving portion 32,
Projection 3 formed by cutting and bending a side plate of frame 30
Since the printed circuit board 17 is configured to receive the printed circuit board 17 on the flat surface 2b , the stress can be absorbed and becomes strong against the pressing from the outside to the inside, thereby preventing solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided. Further, by increasing the length of the receiving portion 32, the effect of absorbing the heat shrinkage stress can be increased.
【００２２】[0022]
【発明の効果】請求項１に記載の発明によれば、受け部
は、一端が側板に連結された根本部と、前記爪部が設け
られ、根本部の他端から折り曲げされて枠体内に突出す
る突出部とを有し、受け部の根本部は、その両側に側板
の略板厚以上の深さの切り込み部を設けて、側板と同一
平面内に位置した状態で側板の面方向に延びて形成され
たため、根本部があることで枠体から爪部の長さを十分
に長くできるので、根本部が容易に撓んで枠体とプリン
ト基板との熱収縮のストレスを吸収することができて、
温度が大きく変化する環境温度で使用されるＴＶやＶＴ
Ｒ等の電子機器に使用しても枠体の爪部とプリント基板
との半田付部にハンダクラックが生じることはなく、ま
た、外部から内部方向への押圧に対して強くなりまた振
動を吸収できて、半田割れを妨げる。また、アース機能
とプリント基板受け（支え）とプリント基板浮き防止の
３つの機能を持たせることができる。請求項２，３に記
載の発明によれば、請求項１記載の発明による作用効果
に加えて、突出部の端面でプリント基板を受けるように
し、または突出部の平面でプリント基板を受けるように
したため、ストレスが吸収できて外部から内部方向への
押圧に対して強くなり、よって半田割れを妨げる。 請求
項４に記載の発明によれば、請求項１記載の発明による
作用効果に加えて、爪部を折り曲げ、又はねじり、プリ
ント基板を固定したため、機械的に強固な固定とするこ
とができ、温度変化によるストレスがハンダに加わりに
くくなるので、ハンダクラックの防止となり、また、爪
部をプリント基板の透孔に引っ掻けることができ、プリ
ント基板の浮きを防止できる。According to the first aspect of the present invention, the receiving portion is provided.
Is provided with a root portion having one end connected to the side plate and the claw portion.
Is bent from the other end of the root and protrudes into the frame.
The base of the receiving part has side plates on both sides.
With a notch with a depth of at least the thickness of the
It is formed to extend in the plane direction of the side plate while being located in the plane
Because of the base, the claw is sufficiently long from the frame
Since it long, can absorb stress thermal contraction of the frame and the printed circuit board flexes easily be root part,
TVs and VTs used at environmental temperatures where the temperature changes significantly
Never solder cracks in the soldered portion between the claw portion and the printed circuit board of the frame be used in electronic equipment such as R, or
In addition, it becomes stronger against external
It can absorb motion and prevent solder cracking. In addition, three functions of an earth function, a printed board receiver (support), and printed board floating prevention can be provided . According to the second and third aspects of the invention, the operation and effect of the first aspect of the invention are provided.
In addition to receiving the printed circuit board on the end face of the protrusion
Or receive the printed circuit board in the plane of the protrusion
For the, it becomes resistant to pressure on the internal direction from the external stress is able to absorb, thus interfering with the solder cracking. Claim
According to the invention described in claim 4, according to the invention described in claim 1,
In addition to the function and effect, since the nail part is bent or twisted and the printed circuit board is fixed, it can be mechanically firmly fixed, and stress due to temperature change is less likely to be applied to the solder, so that solder cracks are prevented, Further , the nail portion can be scratched by the through hole of the printed circuit board, and the floating of the printed circuit board can be prevented.
【図１】本発明の第１の実施例に係るプリント基板保持
構造のプリント基板取り付け前の斜視図である。FIG. 1 is a perspective view of a printed circuit board holding structure according to a first embodiment of the present invention before a printed circuit board is attached.
【図２】本発明の第１の実施例に係るプリント基板保持
構造のプリント基板取り付け状態の正面図，縦断面図及
び平面図である。FIG. 2 is a front view, a longitudinal sectional view, and a plan view of a printed circuit board holding structure according to a first embodiment of the present invention in a state where the printed circuit board is mounted.
【図３】本発明の第１の実施例の変形例を示す説明図で
ある。FIG. 3 is an explanatory diagram showing a modification of the first embodiment of the present invention.
【図４】本発明の第１の実施例の別の変形例を示す説明
図である。FIG. 4 is an explanatory view showing another modification of the first embodiment of the present invention.
【図５】本発明の第２の実施例に係るプリント基板保持
構造のプリント基板取り付け前の斜視図である。FIG. 5 is a perspective view of a printed circuit board holding structure according to a second embodiment of the present invention before the printed circuit board is attached.
【図６】本発明の第２の実施例に係るプリント基板保持
構造のプリント基板取り付け状態の縦断面図である。FIG. 6 is a longitudinal sectional view of a printed circuit board holding structure according to a second embodiment of the present invention in a state where the printed circuit board is mounted.
【図７】本発明の第２の実施例に係るプリント基板保持
構造の枠体の要部斜視図である。FIG. 7 is a perspective view of a main part of a frame of a printed circuit board holding structure according to a second embodiment of the present invention.
【図８】（ａ），（ｂ）は図７の平面図及び正面図であ
る。FIGS. 8A and 8B are a plan view and a front view of FIG.
【図９】従来のプリント基板保持構造のプリント基板取
り付け状態の正面図及び縦断面図である。 FIG. 9 shows a printed circuit board holding structure of a conventional printed circuit board holding structure.
It is the front view and longitudinal section of the attachment state.
１０，３０ 枠体 １１，２１ 側板 １２，３２ 受け部１２ａ，３２ａ 根本部 １２ｂ，３２ｂ 突出部 １３，３３ 爪部 １４ 端面 １６，１６，３６，３６ 切り込み部 １７ プリント基板 １７ａ 上面 １８ 透孔 １９ 半田付用パターン ２０ 半田付部 ３４ 平面10,3 0 frame 11,2 first side plate 12, 32 receiving unit 12a, 32a base portion 12b, 32 b projecting portions 13,3 3 claw portion 14 end surface 16,16,36,36 cut portion 17 the printed circuit board 17a upper surface 18 Toru Hole 19 Soldering pattern 20 Soldering part 34 Plane
フロントページの続き (56)参考文献 特開 平６−104580（ＪＰ，Ａ) 特開 平３−215996（ＪＰ，Ａ) 特開 平７−122875（ＪＰ，Ａ) 実開 平２−76883（ＪＰ，Ｕ) 実開 昭62−73589（ＪＰ，Ｕ) 実開 平２−140887（ＪＰ，Ｕ) 実開 平４−127688（ＪＰ，Ｕ) 実開 昭63−197394（ＪＰ，Ｕ) 実開 昭57−61889（ＪＰ，Ｕ) 実開 昭52−161251（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/04 H05K 7/14 Continuation of the front page (56) References JP-A-6-104580 (JP, A) JP-A-3-215996 (JP, A) JP-A-7-122875 (JP, A) JP-A-2-76883 (JP) , U) Japanese Utility Model Showa 62-73589 (JP, U) Japanese Utility Model 2-140887 (JP, U) Japanese Utility Model 4-1127688 (JP, U) Japanese Utility Model Showa 63-197394 (JP, U) Japanese Utility Model Showa 57-61889 (JP, U) Japanese Utility Model 52-161251 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 7/04 H05K 7/14
Claims (4)
孔とこの透孔の周囲に半田付パターンを形成したプリン
ト基板と、前記側板から折り曲げされて、前記枠体に突
出した受け部と、この受け部の端部の上方、又は下方に
延びる爪部とを有し、前記受け部は、一端が前記側板に連結された根本部と、
前記爪部が設けられ、前記根本部の他端から折り曲げさ
れて前記枠体内に突出する突出部とを有し、 前記受け部
の根本部は、その両側に前記側板 の略板厚以上の深さの
切り込み部を設けて、前記側板と同一平面内に位置した
状態で前記側板の面方向に延びて形成され、 前記プリント基板の透孔には、前記爪部が挿通されて、
前記プリント基板が前記突出部で受けられると共に、 前
記爪部と前記半田付用パターンとが半田付されたことを
特徴とするプリント基板保持構造。1. A has a side plate, and opening the frame vertically, the printed circuit board forming the solder Tsukepa turn around through hole and the through hole, it is bent from the side plate, butt in the frame
A receiving unit that has issued, the upper end of the receiving portion, or downward
And a rolled beauty Ru claw portion, the receiving portion includes a base portion having one end connected to said side plates,
The claw portion is provided and bent from the other end of the root portion.
It is and a protrusion protruding to the frame body in the receiving section
Root part of the is provided with a cut portion of the substantially plate Atsu以 on depth of the side plates on both sides and positioned in the side plate in the same plane
In the state, it is formed to extend in the surface direction of the side plate, and the claw portion is inserted into a through hole of the printed circuit board,
PCB holding structure, wherein the printed circuit board with is received at the protruding portion, and the pattern the soldering and the claw portion is soldered.
欠き部が前記枠体の上下方向に対して直交する方向に設
けられて、前記突出部が前記枠体の上下方向に直立状態
で配設され、前記突出部の端面で前記プリント基板を受
けるようにしたことを特徴とする請求項１記載のプリン
ト基板保持構造。2. The cutting device provided on both sides of the root portion.
The notch is set in a direction perpendicular to the vertical direction of the frame.
And the projecting portion is in an upright state in the vertical direction of the frame body.
And the printed circuit board is received at the end face of the protrusion.
The print substrate holding structure according to claim 1, wherein the print substrate holding structure is provided.
欠き部が前記枠体の上下方向と同方向に設けられて、前
記突出部が前記枠体の上下方向に垂直状態で配設され、
前記突出部の平面で前記プリント基板を受けるようにし
たことを特徴とする請求項１記載のプリント基板保持構
造。3. The cutout provided on both sides of the root portion.
The notch is provided in the same direction as the vertical direction of the frame,
The protrusion is disposed vertically in the up-down direction of the frame,
Receive the printed circuit board in the plane of the protrusion
PCB holding structure according to claim 1, wherein the a.
を、前記プリント基板方向に折り曲げ、又はねじって前
記プリント基板を前記受け部に固定させたことを特徴と
する請求項１から３のいずれか１つに記載のプリント基
板保持構造。4. The tip of the claw portion which is inserted before KiToruana, claim 1, wherein bending the printed circuit board direction or, characterized in that the printed circuit board was fixed to the receiving portion I screws 3. The printed circuit board holding structure according to any one of 3 .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18951094A JP3347888B2 (en) | 1994-08-11 | 1994-08-11 | Printed circuit board holding structure |
| CN95108657A CN1060008C (en) | 1994-08-11 | 1995-08-11 | Printed board retaining structure |
| DE1995129671 DE19529671A1 (en) | 1994-08-11 | 1995-08-11 | Framework construction for fixing circuit boards in television or video recorders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18951094A JP3347888B2 (en) | 1994-08-11 | 1994-08-11 | Printed circuit board holding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0856085A JPH0856085A (en) | 1996-02-27 |
| JP3347888B2 true JP3347888B2 (en) | 2002-11-20 |
Family
ID=16242482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18951094A Expired - Fee Related JP3347888B2 (en) | 1994-08-11 | 1994-08-11 | Printed circuit board holding structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3347888B2 (en) |
| CN (1) | CN1060008C (en) |
| DE (1) | DE19529671A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260884A (en) * | 1996-03-18 | 1997-10-03 | Alps Electric Co Ltd | Fixing structure of printed board |
| DE19730712C1 (en) * | 1997-07-17 | 1998-11-12 | Siemens Ag | Housing part of valve control device with contact pin e.g. for braking system control |
| FI114848B (en) | 1997-11-25 | 2004-12-31 | Filtronic Lk Oy | Frame structure, apparatus and method for manufacturing the apparatus |
| JP3446708B2 (en) | 2000-02-28 | 2003-09-16 | ミツミ電機株式会社 | Electronic equipment shield case |
| ITMI20010868A1 (en) * | 2001-04-24 | 2002-10-24 | Abb Ricerca Spa | BOARD ASSEMBLY DEVICE FOR PRINTED CIRCUITS |
| JP3842615B2 (en) * | 2001-10-30 | 2006-11-08 | 株式会社ケンウッド | Method for electrically connecting printed circuit board and connecting piece |
| KR100612278B1 (en) | 2004-05-18 | 2006-08-11 | 삼성에스디아이 주식회사 | Plasma display device |
| DE102005004104B3 (en) * | 2005-01-28 | 2006-06-14 | Fujitsu Siemens Computers Gmbh | Housing cage for accommodating installed modules e.g. for propulsion gear, has wall sections joined to wall of housing cage only at first side |
| JPWO2006106827A1 (en) * | 2005-03-31 | 2008-09-11 | パイオニア株式会社 | Case body and electrical equipment |
| DE102008016942B4 (en) | 2007-04-10 | 2022-01-27 | Sew-Eurodrive Gmbh & Co Kg | Electric motor, comprising a motor flange as a housing part and with a circuit board |
| JP2012009471A (en) | 2010-06-22 | 2012-01-12 | Mitsumi Electric Co Ltd | High-frequency device and printed board holding structure |
| JP5647015B2 (en) * | 2011-01-18 | 2014-12-24 | パナソニック株式会社 | Substrate holding device |
| DE102013208984B4 (en) * | 2013-05-15 | 2022-06-30 | Zf Friedrichshafen Ag | control unit |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1166857B (en) * | 1962-04-27 | 1964-04-02 | Telefunken Patent | Printed circuit board, which is provided on its edges with means to increase its strength |
| DE1195829C2 (en) * | 1962-11-28 | 1979-07-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | ELECTRICAL EQUIPMENT CHASSIS AND PROCESS FOR ITS MANUFACTURING |
| US3581160A (en) * | 1968-12-23 | 1971-05-25 | Gen Electric | Semiconductor rectifier assembly having high explosion rating |
| US4076165A (en) * | 1976-06-03 | 1978-02-28 | Motorola, Inc. | Mounting arrangement for chassis and printed circuit board with method of assembly |
| US4987517A (en) * | 1989-07-03 | 1991-01-22 | Kurz Arthur A | Affixation of mounting brackets to computer circuit boards |
| US5124888A (en) * | 1990-01-25 | 1992-06-23 | Tokyo Electric Co., Ltd. | Electric circuit apparatus |
-
1994
- 1994-08-11 JP JP18951094A patent/JP3347888B2/en not_active Expired - Fee Related
-
1995
- 1995-08-11 DE DE1995129671 patent/DE19529671A1/en not_active Ceased
- 1995-08-11 CN CN95108657A patent/CN1060008C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1122998A (en) | 1996-05-22 |
| DE19529671A1 (en) | 1996-02-15 |
| JPH0856085A (en) | 1996-02-27 |
| CN1060008C (en) | 2000-12-27 |
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