JP2988145B2 - Semiconductor stack - Google Patents
Semiconductor stackInfo
- Publication number
- JP2988145B2 JP2988145B2 JP4248436A JP24843692A JP2988145B2 JP 2988145 B2 JP2988145 B2 JP 2988145B2 JP 4248436 A JP4248436 A JP 4248436A JP 24843692 A JP24843692 A JP 24843692A JP 2988145 B2 JP2988145 B2 JP 2988145B2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- semiconductor element
- semiconductor
- sides
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、運転時の電力損失に
基づく熱膨張によって変位する側のブスバーの、とくに
折曲部に発生する応力の抑制を図り、もってブスバー自
身と半導体素子との破損防止を経済的に実現する半導体
スタックに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention suppresses the stress generated in a bus bar, which is displaced by thermal expansion due to a power loss during operation, particularly at a bent portion, and thereby damages the bus bar itself and the semiconductor element. The present invention relates to a semiconductor stack that economically realizes prevention.
【０００２】[0002]
【従来の技術】二つの従来例について、公開番号：実開
平01-89756号の提案に基づき以下に図を参照しながら説
明する。図３は一従来例の正面図である。図において、
４個の半導体素子7 と、間隔調整と熱伝導用の３個の銅
ブロック8 と、８個の冷却フィン6 とが、半導体素子７
と銅ブロック8 との各両側に冷却フィン6 が位置するよ
うに並設し、この並設したものの左右両側の各冷却フィ
ン6 を、それぞれＬ字形のブスバー2,13を介して、座金
5 とガイド座金10とで押さえる。ここで、右側のブスバ
ー13は、二つの部分と、これらを連結する可撓性導体14
とからなる。このブスバー13の構造の意味は後述する。
さて、この全体ユニットは、左右のコ字形の各支持金具
3A,3B と、両者を連結する絶縁シャフト9 と、左側の押
し付け用のボルト4 と、右側の複数個の皿バネ11とによ
って堅く締め付けられ、一体化される。なお、半導体素
子７, 銅ブロック8,冷却フィン6 は、いずれも中心部に
位置決め用のピン穴があけられ、並設のとき図示してな
いピンを介して同心に位置決めされる。また、各ブスバ
ー2,13は、それぞれの下側部分で、対応する各支持金具
3A,3B と、ボルト，ナットによって締結され、他方の直
立部分が両側の各冷却フィン6 と接触, 接続され、他方
の端部が外部と電気的に接続される。2. Description of the Related Art Two conventional examples will be described below with reference to the drawings based on the proposal of the publication number: Japanese Utility Model Laid-Open No. 01-89756. FIG. 3 is a front view of one conventional example. In the figure,
The four semiconductor elements 7, three copper blocks 8 for spacing adjustment and heat conduction, and eight cooling fins 6
The cooling fins 6 are arranged side by side on both sides of the copper fin and the copper block 8, and the cooling fins 6 on the left and right sides of the juxtaposed one are respectively washed through L-shaped bus bars 2 and 13 with washers.
5 and guide washer 10. Here, the right busbar 13 is composed of two parts and a flexible conductor 14 connecting them.
Consists of The meaning of the structure of the bus bar 13 will be described later.
By the way, this whole unit consists of left and right U-shaped support brackets
3A, 3B, an insulating shaft 9 connecting the two, a pressing bolt 4 on the left side, and a plurality of disc springs 11 on the right side are firmly tightened and integrated. The semiconductor element 7, the copper block 8, and the cooling fin 6 are all provided with a positioning pin hole at the center, and are positioned concentrically via pins (not shown) when juxtaposed. In addition, each bus bar 2, 13 is provided with a corresponding support bracket at the lower portion thereof.
3A and 3B are fastened by bolts and nuts, the other upright portion is in contact with and connected to each cooling fin 6 on both sides, and the other end is electrically connected to the outside.
【０００３】ところで、半導体スタックが運転されると
き、半導体素子7 は電力損失に基づいて発熱し、関連す
る部材は温度が上昇するとともに熱膨張する。その結
果、図の寸法Ｌが、熱膨張によってΔだけ伸長する。そ
のため、ブスバー13の二つの部分を連結する可撓性導体
14の変形によって、熱膨張分を吸収するようにして、ブ
スバー13の、とくに折曲部に発生する応力の抑制を図
り、もってブスバー13自身と半導体素子7 との破損防止
を図っている。By the way, when the semiconductor stack is operated, the semiconductor element 7 generates heat based on the power loss, and the related members expand in temperature and increase in temperature. As a result, the dimension L in the figure is extended by Δ due to thermal expansion. Therefore, a flexible conductor connecting the two parts of the busbar 13
Due to the deformation of 14, the thermal expansion is absorbed to suppress the stress generated in the bus bar 13, particularly at the bent portion, thereby preventing the bus bar 13 and the semiconductor element 7 from being damaged.
【０００４】次に、別の従来例について説明する。図４
は別の従来例の正面図、図５は別の従来例の要部詳細図
である。この別の従来例が先の一従来例と異なる点は、
図４において、右側の支持金具3Bと、これに対応するブ
スバー15との間が相対的に横方向に可動な構成にしたこ
とである。この可動な構成について、一点鎖線の円形Ｐ
の箇所の詳細図である図５を参照しながら説明する。ブ
スバー15の下側の脚部に長穴18があけられ、この長穴18
に緩く嵌まる形で円筒状スペーサ19が挿入される。座金
17を付設したボルト16が、スペーサ19を貫通して支持金
具3Bの下側部分にネジ込まれる。このとき、ブスバー15
の下側脚部の厚さｄが、スペーサ19の長さＤよりわずか
だけ小さいから、ブスバー15は、支持金具3Bに対して相
対的に横方向に可動である。したがって、別の従来例で
は、図３における寸法Ｌに相当する部分の熱膨張によっ
て伸長する量Δが、ブスバー15の、支持金具3Bに対する
横方向移動によって吸収され、一従来例におけると同じ
効果が得られる。Next, another conventional example will be described. FIG.
Is a front view of another conventional example, and FIG. 5 is a detailed view of a main part of another conventional example. The difference between this another conventional example and the previous one is that
In FIG. 4, the configuration is such that the space between the right-side support fitting 3B and the corresponding bus bar 15 is relatively movable in the horizontal direction. For this movable configuration, the circle P
This will be described with reference to FIG. An elongated hole 18 is drilled in the lower leg of the bus bar 15, and this elongated hole 18
The cylindrical spacer 19 is inserted so as to fit loosely into the spacer. Washer
A bolt 16 provided with 17 penetrates through the spacer 19 and is screwed into the lower portion of the support fitting 3B. At this time, bus bar 15
Since the thickness d of the lower leg portion is slightly smaller than the length D of the spacer 19, the bus bar 15 is movable in the lateral direction relatively to the support fitting 3B. Therefore, in another conventional example, the amount Δ that is extended by thermal expansion of a portion corresponding to the dimension L in FIG. can get.
【０００５】[0005]
【発明が解決しようとする課題】従来例には次の問題点
がある。すなわち、一従来例では、ブスバー13が二つの
部分に分割され、その間が可撓性導体14によって連結さ
れるから、それだけブスバーの構造が複雑になり、ひい
てはコスト増をもたらす。別の従来例では、一従来例よ
り構造がかなり複雑になるとともに、部品点数も増える
から、さらにコスト増につながる。半導体スタックの熱
膨張分を吸収するための、とくにブスバーでの簡単な形
状, 構造と、これによりコスト増分を小さく抑えること
が強く要請される。The prior art has the following problems. That is, in one conventional example, the bus bar 13 is divided into two parts, and the bus bar is connected by the flexible conductor 14, so that the structure of the bus bar becomes more complicated and the cost increases. In another conventional example, the structure becomes considerably more complicated than that of the conventional example, and the number of parts increases, which leads to a further increase in cost. There is a strong demand for a simple shape and structure, particularly at the busbar, for absorbing the thermal expansion of the semiconductor stack, and thereby to keep the cost increase small.
【０００６】この発明の課題は、従来の技術がもつ以上
の問題点を解消し、簡単な構造をとり、コスト増分の少
ない方法によって、運転時の電力損失に基づく熱膨張に
よって変位する側のブスバーの、とくに折曲部に発生す
る応力の抑制を図り、もってブスバー自身と半導体素子
との破損防止を経済的に実現する半導体スタックを提供
することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, to adopt a simple structure and to reduce the cost increase by a method in which bus bars are displaced by thermal expansion based on power loss during operation. It is another object of the present invention to provide a semiconductor stack which suppresses stress generated particularly in a bent portion and economically realizes prevention of breakage of a bus bar itself and a semiconductor element.
【０００７】[0007]
【課題を解決するための手段】請求項１に係る半導体ス
タックは、複数個の半導体素子と、この各半導体素子を
両側から挟む複数個の冷却フィンとが並設されたものを
両側から押圧，挟持する支持金具と；この各支持金具に
固定され、一方の端部が半導体素子側と、また他方の端
部が外部側とそれぞれ電気的に接続されるＬ字形ブスバ
ーと；を備える半導体スタックにおいて、両側のブスバ
ーの内で、半導体素子および冷却フィンの熱膨張に基づ
いて変位する側のブスバーは、折曲部に近い箇所で幅が
狭められる。According to a first aspect of the present invention, there is provided a semiconductor stack in which a plurality of semiconductor elements and a plurality of cooling fins sandwiching each semiconductor element from both sides are pressed from both sides. And a L-shaped bus bar fixed to each of the support fittings, one end of which is electrically connected to the semiconductor element side and the other end of which is electrically connected to the outside. Of the bus bars on both sides, the bus bar on the side that is displaced based on the thermal expansion of the semiconductor element and the cooling fin is reduced in width near the bent portion.
【０００８】請求項２に係る半導体スタックは、複数個
の半導体素子と、この各半導体素子を両側から挟む複数
個の冷却フィンとが並設されたものを両側から押圧，挟
持する支持金具と；この各支持金具に固定され、一方の
端部が半導体素子側と、また他方の端部が外部側とそれ
ぞれ電気的に接続されるＬ字形ブスバーと；を備える半
導体スタックにおいて、両側のブスバーの内で、半導体
素子および冷却フィンの熱膨張に基づいて変位する側の
ブスバーは、折曲部に近い箇所で厚さが薄くされる。[0008] A semiconductor stack according to a second aspect of the present invention is a supporting bracket for pressing and holding, from both sides, a plurality of semiconductor elements and a plurality of cooling fins sandwiching each semiconductor element from both sides; An L-shaped busbar, one end of which is fixed to each of the support fittings and one end of which is electrically connected to the semiconductor element side and the other end of which is electrically connected to the outside, respectively, Thus, the bus bar on the side that is displaced based on the thermal expansion of the semiconductor element and the cooling fin is reduced in thickness near the bent portion.
【０００９】[0009]
【作用】請求項１または２に係るスタックでは、半導体
素子および冷却フィンの熱膨張に基づいて変位する側の
ブスバーが、その半導体素子側脚部の、折曲部に近い箇
所で主に可撓して発生応力が抑制される。とくに請求項
１に係るスタックでは、変位側ブスバーの幅が狭められ
る部分で、主に可撓して発生応力が抑制される。In the stack according to the first or second aspect, the bus bar that is displaced based on the thermal expansion of the semiconductor element and the cooling fin is mainly flexible at a portion of the semiconductor element side leg near the bent portion. As a result, the generated stress is suppressed. In particular, in the stack according to the first aspect, in the portion where the width of the displacement-side bus bar is narrowed, the stack is mainly flexible and the generated stress is suppressed.
【００１０】とくに請求項２に係るスタックでは、変位
側ブスバーの厚さが薄くされる部分で、主に可撓して発
生応力が抑制される。In particular, in the stack according to the second aspect, the portion where the thickness of the displacement-side bus bar is reduced is mainly flexible, and the generated stress is suppressed.
【００１１】[0011]
【実施例】この発明に係る半導体スタックの実施例につ
いて、以下に図を参照しながら説明する。図１は第１実
施例の主要部品つまり熱膨張で変位する側のブスバーの
斜視図である。図において、ブスバー21は、半導体素子
側の脚部に相当する直立部分で折曲部に近い箇所が、幅
方向の両側から肉取部21a によって幅が狭められ、ここ
で主に可撓して発生応力が抑制される。ブスバー21は基
本形のＬ字形部材の追加加工によって得られ、もちろん
追加部品も不要であるから、コスト増分はわずかです
む。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor stack according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of the first embodiment, that is, a bus bar on the side that is displaced by thermal expansion. In the figure, the bus bar 21 has an upright portion corresponding to the leg on the semiconductor element side and a portion near the bent portion, the width of which is reduced by the lightening portions 21a from both sides in the width direction, where the bus bar 21 is mainly flexible. The generated stress is suppressed. The bus bar 21 is obtained by additional processing of a basic L-shaped member and, of course, requires no additional parts, so that the cost increase is small.
【００１３】図２は第２実施例の主要部品の斜視図であ
る。図において、変位側ブスバー22は、半導体素子側の
脚部に相当する直立部分で折曲部に近い箇所が、厚さ方
向の両側の肉取部22a によって厚さが薄くされ、ここで
主に可撓して発生応力が抑制される。ブスバー22は基本
形のＬ字形部材の追加加工によって得られ、第１実施例
と同じ効果が得られる。FIG. 2 is a perspective view of the main components of the second embodiment. In the figure, the displacement-side bus bar 22 has an upright portion corresponding to a leg on the semiconductor element side and a portion near a bent portion, the thickness of which is reduced by a hollow portion 22a on both sides in the thickness direction. It is flexible and the generated stress is suppressed. The bus bar 22 is obtained by additional processing of the basic L-shaped member, and the same effect as in the first embodiment can be obtained.
【００１４】[0014]
【発明の効果】請求項１または２に係るスタックでは、
半導体素子および冷却フィンの熱膨張に基づいて変位す
る側のブスバーが、その半導体素子側脚部の、折曲部に
近い箇所で、たとえば請求項１によれば、変位側ブスバ
ーの幅が狭められる部分で、また請求項２によれば、変
位側ブスバーの厚さが薄くされる部分で、それぞれ主と
して可撓して発生応力が抑制される。したがって、当該
ブスバーの簡単な形状改善という方法によって、別の部
品を必要としない形で、ひいてはコスト増分の少ない形
で、ブスバーと半導体素子との破損防止が図れ、さらに
は、既に製作済み、または設置済みの半導体スタックに
対する交換作業も容易にできる。According to the stack according to claim 1 or 2,
The bus bar on the side displaced based on the thermal expansion of the semiconductor element and the cooling fin is located near the bent portion of the semiconductor element side leg, for example, according to claim 1, the width of the displacement side bus bar is narrowed. According to the second aspect of the present invention, in the portion where the thickness of the displacement-side busbar is reduced, the generated stress is suppressed by being mainly flexible. Therefore, by a method of simply improving the shape of the bus bar, breakage of the bus bar and the semiconductor element can be prevented in a form that does not require another component, and thus with a small cost increase, and furthermore, the bus bar is already manufactured or The replacement work for the installed semiconductor stack can be easily performed.
【図１】本発明に係る第１実施例の主要部品の斜視図FIG. 1 is a perspective view of main parts of a first embodiment according to the present invention.
【図２】第２実施例の主要部品の斜視図FIG. 2 is a perspective view of main parts of a second embodiment.
【図３】一従来例の正面図FIG. 3 is a front view of a conventional example.
【図４】別の従来例の正面図FIG. 4 is a front view of another conventional example.
【図５】別の従来例の要部詳細図FIG. 5 is a detailed view of a main part of another conventional example.
２ ブスバー ３Ａ，３Ｂ 支持金具 ４ ボルト ５ 座金 ６ 冷却フィン ７ 半導体素子 ８ 銅ブロック ９ 絶縁シャフト １０ ガイド座金 １１ 皿バネ ２１，２２ ブスバー ２１ａ，２２ａ 肉取部 2 Bus bar 3A, 3B Support bracket 4 Bolt 5 Washer 6 Cooling fin 7 Semiconductor element 8 Copper block 9 Insulation shaft 10 Guide washer 11 Disc spring 21 and 22 Bus bar 21a, 22a
Claims (2)
を両側から挟む複数個の冷却フィンとが並設されたもの
を両側から押圧，挟持する支持金具と； この各支持金具に固定され、一方の端部が半導体素子側
と、また他方の端部が外部側とそれぞれ電気的に接続さ
れるＬ字形ブスバーと； を備える半導体スタックにおいて、 両側のブスバーの内で、半導体素子および冷却フィンの
熱膨張に基づいて変位する側のブスバーは、折曲部に近
い箇所で幅が狭められることを特徴とする半導体スタッ
ク。1. A support fitting for pressing and holding, from both sides, a plurality of semiconductor elements and a plurality of cooling fins sandwiching each semiconductor element from both sides; fixed to each of the support fittings. And an L-shaped bus bar having one end electrically connected to the semiconductor element side and the other end electrically connected to the external side, respectively. The bus bar on the side displaced based on the thermal expansion of the semiconductor stack has a width reduced at a position near the bent portion.
を両側から挟む複数個の冷却フィンとが並設されたもの
を両側から押圧，挟持する支持金具と； この各支持金具に固定され、一方の端部が半導体素子側
と、また他方の端部が外部側とそれぞれ電気的に接続さ
れるＬ字形ブスバーと； を備える半導体スタックにおいて、 両側のブスバーの内で、半導体素子および冷却フィンの
熱膨張に基づいて変位する側のブスバーは、折曲部に近
い箇所で厚さが薄くされることを特徴とする半導体スタ
ック。2. A support fitting for pressing and holding, from both sides, a plurality of semiconductor elements and a plurality of cooling fins sandwiching each semiconductor element from both sides; fixed to each of the support fittings. And an L-shaped bus bar having one end electrically connected to the semiconductor element side and the other end electrically connected to the external side, respectively. The bus bar on the side displaced based on the thermal expansion of the semiconductor stack is thinned at a position near the bent portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4248436A JP2988145B2 (en) | 1992-09-18 | 1992-09-18 | Semiconductor stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4248436A JP2988145B2 (en) | 1992-09-18 | 1992-09-18 | Semiconductor stack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06104381A JPH06104381A (en) | 1994-04-15 |
| JP2988145B2 true JP2988145B2 (en) | 1999-12-06 |
Family
ID=17178102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4248436A Expired - Lifetime JP2988145B2 (en) | 1992-09-18 | 1992-09-18 | Semiconductor stack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2988145B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4720756B2 (en) | 2007-02-22 | 2011-07-13 | トヨタ自動車株式会社 | Semiconductor power conversion device and manufacturing method thereof |
| JP6299120B2 (en) * | 2013-09-05 | 2018-03-28 | 富士電機株式会社 | Semiconductor module |
| JP7213478B2 (en) * | 2017-12-19 | 2023-01-27 | パナソニックＩｐマネジメント株式会社 | Busbar and battery stack |
| JP6810300B1 (en) * | 2019-02-27 | 2021-01-06 | 京セラ株式会社 | Cell stack device, module and module containment device |
-
1992
- 1992-09-18 JP JP4248436A patent/JP2988145B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06104381A (en) | 1994-04-15 |
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