JPH11135971A - Cooling structure of semiconductor device - Google Patents
Cooling structure of semiconductor deviceInfo
- Publication number
- JPH11135971A JPH11135971A JP9293715A JP29371597A JPH11135971A JP H11135971 A JPH11135971 A JP H11135971A JP 9293715 A JP9293715 A JP 9293715A JP 29371597 A JP29371597 A JP 29371597A JP H11135971 A JPH11135971 A JP H11135971A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- plate
- transistors
- printed board
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、プリント板に実
装される複数の半導体素子に共通の放熱体を密着させて
冷却する半導体素子の冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure of a semiconductor element for cooling a plurality of semiconductor elements mounted on a printed circuit board by bringing a common radiator into close contact therewith.
【０００２】[0002]
【従来の技術】電力変換装置として、例えば商用交流電
力をこれとは電圧や周波数が異なる交流電力に変換する
インバータ装置がある。このインバータ装置は、例えば
半導体素子としてのトランジスタの複数を順次オン・オ
フ制御することで電力変換を行うのであるが、このトラ
ンジスタはそのオン・オフ動作に伴って生じる損失によ
り温度が上昇する。接合部温度が所定値を越えるとトラ
ンジスタはその機能を喪失するので、この発熱を除去す
る必要がある。そこで熱抵抗が小さい材料を使って表面
積が大きい放熱体を作り、この放熱体にトランジスタを
密着させるのがもっとも一般的な冷却方法である。2. Description of the Related Art As an electric power conversion device, for example, there is an inverter device for converting commercial AC power into AC power having a different voltage and frequency. This inverter device performs power conversion by, for example, sequentially turning on and off a plurality of transistors as semiconductor elements, and the temperature of the transistor rises due to a loss caused by the on / off operation. When the junction temperature exceeds a predetermined value, the transistor loses its function, and it is necessary to remove this heat generation. Therefore, the most common cooling method is to make a heat radiator having a large surface area by using a material having a small thermal resistance, and to attach a transistor to the heat radiator.
【０００３】インバータ装置が小容量の場合は、主回路
部品であるトランジスタの配線を主回路プリント板上に
印刷しておけば、この主回路プリント板に前記トランジ
スタをはんだ付けするだけで配線が完了するから、装置
組立の手間を大幅に削減できる。更に、当該トランジス
タを制御する制御用プリント板と前述の主回路プリント
板とを一体化するならば、装置全体をより一層小形化す
ることができる。If the inverter device has a small capacity, the wiring of the transistor as the main circuit component is printed on the main circuit printed board, and the wiring is completed only by soldering the transistor to the main circuit printed board. Therefore, labor for assembling the apparatus can be greatly reduced. Further, if the control printed board for controlling the transistor is integrated with the above-mentioned main circuit printed board, the whole device can be further miniaturized.
【０００４】図２は複数の半導体素子をプリント板に実
装して共通の放熱体で冷却する際の従来例を示した構造
図である。図２において、素子取付けブロック７には絶
縁シート１１を介して複数の半導体素子としてのトラン
ジスタ２を、素子取付けねじ８を使って取り付ける。次
いでこの素子取付けブロック７とこれを支持するブロッ
ク支持脚６とを、支持脚取付けねじ１０を使ってプリン
ト板１に固定したのち、トランジスタリード線３をプリ
ント板１にはんだ付けする。FIG. 2 is a structural diagram showing a conventional example in which a plurality of semiconductor elements are mounted on a printed circuit board and cooled by a common radiator. In FIG. 2, a plurality of transistors 2 as semiconductor elements are mounted on an element mounting block 7 via an insulating sheet 11 using element mounting screws 8. Next, the element mounting block 7 and the block supporting legs 6 for supporting the element mounting block 7 are fixed to the printed board 1 using the supporting leg mounting screws 10, and then the transistor lead wires 3 are soldered to the printed board 1.
【０００５】全体取付け枠１２には間座１３とプリント
板取付けねじ１４とでプリント板１を取り付けると共
に、放熱体としての冷却フィン４もこの全体取付け枠１
２に取り付ける。よってブロック取付けねじ９で素子取
付けブロック７を冷却フィン４に密着させれば、トラン
ジスタ２の動作に伴う発生熱は素子取付けブロック７を
介して冷却フィン４へ移動し、この冷却フィン４の表面
から大気中へ放散される。ここで冷却フィン４へ強制的
に空気流を吹きつければ、より効果的に熱を放散できる
のは勿論である。The printed board 1 is mounted on the entire mounting frame 12 with the spacers 13 and the printed board mounting screws 14, and the cooling fins 4 as radiators are also mounted on the entire mounting frame 12.
Attach to 2. Therefore, when the element mounting block 7 is brought into close contact with the cooling fin 4 with the block mounting screw 9, the heat generated by the operation of the transistor 2 moves to the cooling fin 4 via the element mounting block 7, and from the surface of the cooling fin 4. Released into the atmosphere. Here, if the air flow is forcibly blown to the cooling fins 4, the heat can naturally be more effectively dissipated.
【０００６】[0006]
【発明が解決しようとする課題】ところで図２に図示の
従来例では、トランジスタ２で生じた熱は素子取付けブ
ロック７を介して冷却フィン４へ移動するので、トラン
ジスタ２の温度は、素子取付けブロック７の熱抵抗分だ
け高くなってしまう。そこで素子取付けブロック７には
特に熱抵抗が小さい材料を使用したり、冷却フィン４の
表面積を大きくする、あるいは強制風冷するなどの対策
を講じる必要があるし、部品点数が増えて組立の手間が
増大する欠点もある。更に輸送中に生じる振動で素子取
付けブロック７が揺れると、トランジスタリード線３が
プリント板１にはんだ付けされているために、トランジ
スタリード線３を介してトランジスタ２に機械的なスト
レスがかかって、当該トランジスタ２を破損する恐れも
ある。In the prior art shown in FIG. 2, the heat generated in the transistor 2 is transferred to the cooling fins 4 through the element mounting block 7, so that the temperature of the transistor 2 is reduced. 7, the thermal resistance becomes higher. Therefore, it is necessary to take measures such as using a material having a particularly low thermal resistance for the element mounting block 7, increasing the surface area of the cooling fins 4, or forcibly cooling the cooling fins 4. Also has the disadvantage of increasing. Further, when the element mounting block 7 is shaken by the vibration generated during transportation, the transistor 2 is mechanically stressed via the transistor lead 3 because the transistor lead 3 is soldered to the printed board 1. The transistor 2 may be damaged.
【０００７】そこでこの発明の目的は、主回路用半導体
素子をプリント板に直接はんだ付けする装置の熱抵抗を
低減すると共に部品点数を減らし、且つ振動による機械
的ストレスが主回路半導体素子にかかるのを回避できる
ようにすることにある。Accordingly, an object of the present invention is to reduce the thermal resistance of an apparatus for directly soldering a main circuit semiconductor element to a printed circuit board, reduce the number of components, and apply mechanical stress due to vibration to the main circuit semiconductor element. Is to be able to avoid.
【０００８】[0008]
【課題を解決するための手段】前記の目的を達成するた
めに、この発明の半導体素子の冷却構造は、プリント板
にはんだ付けされた複数の半導体素子を、これらに共通
の放熱体にとりつける際に、前記複数の半導体素子を素
子おさえ板に一列に並べて一体化してから、これら半導
体素子と素子おさえ金具とをプリント板にはんだ付けし
たのち、この素子おさえ金具と絶縁シートを必要に応じ
て敷いた放熱体とを、前記半導体素子を介してねじ締め
するものとする。In order to achieve the above object, a cooling structure for a semiconductor device according to the present invention is provided in which a plurality of semiconductor devices soldered to a printed board are mounted on a common radiator. Then, after arranging the plurality of semiconductor elements in a row on an element holding plate and integrating them, soldering the semiconductor element and the element holding metal to a printed board, and then laying the element holding metal and an insulating sheet as necessary. The heat radiator is screwed through the semiconductor element.
【０００９】前記素子おさえ金具と複数半導体素子と
は、治具を使って一体化するものとする。The element holder and the plurality of semiconductor elements are integrated using a jig.
【００１０】[0010]
【発明の実施の形態】図１は本発明の実施例を表した構
造図であるが、図１に図示のプリント板１，半導体素子
としてのトランジスタ２，トランジスタリード線３，放
熱体としての冷却フィン４，絶縁シート１１，全体取付
け枠１２，間座１３，およびプリント板取付けねじ１４
の名称・用途・機能は、図２で既述の従来例の場合と同
じであるから、これらの説明は省略する。FIG. 1 is a structural view showing an embodiment of the present invention. FIG. 1 shows a printed board 1, a transistor 2 as a semiconductor device, a transistor lead wire 3, and a cooling device as a heat radiator. Fin 4, insulating sheet 11, overall mounting frame 12, spacer 13, and printed board mounting screw 14
Are the same as in the case of the conventional example described above with reference to FIG.
【００１１】本発明では、治具を使って素子おさえ金具
２１と複数のトランジスタ２とを一体化した後、トラン
ジスタリード線３と素子おさえ金具２１とをプリント板
１にはんだ付けする。次いで冷却フィン４と素子おさえ
金具２１とでトランジスタ２を挟み込み、おさえ金具締
付けねじ２２で締め付けることにより、組立を完了す
る。このとき、必要があればトランジスタ２と冷却フィ
ン４との間には絶縁シート１１を介在させる。In the present invention, after the element holding member 21 and the plurality of transistors 2 are integrated using a jig, the transistor lead wire 3 and the element holding member 21 are soldered to the printed board 1. Next, the transistor 2 is sandwiched between the cooling fin 4 and the element holding member 21 and is tightened by the holding member tightening screw 22 to complete the assembly. At this time, if necessary, an insulating sheet 11 is interposed between the transistor 2 and the cooling fin 4.
【００１２】[0012]
【発明の効果】この発明によれば、トランジスタ２は直
接冷却フィン４に密着する（但し絶縁シート１１が介在
する場合もある）ので、トランジスタ２の発生熱は速や
かに冷却フィン４へ移動して放散されるので、熱抵抗が
大きくなって半導体素子の温度が上昇する恐れを回避で
きるし、部品点数を抑制できて組立の手間を削減できる
効果も得られる。更に輸送中に振動を生じても、半導体
素子は冷却フィンと素子おさえ金具とに挟み込まれてい
るから機械的なストレスを受ける恐れも回避できる効果
が得られる。According to the present invention, the transistor 2 adheres directly to the cooling fin 4 (however, the insulating sheet 11 may be interposed), so that the heat generated by the transistor 2 moves to the cooling fin 4 quickly. Since the heat is dissipated, it is possible to avoid the possibility that the temperature of the semiconductor element increases due to an increase in the thermal resistance, and it is also possible to reduce the number of parts and to reduce the labor for assembling. Further, even if vibration occurs during transportation, the semiconductor element is sandwiched between the cooling fin and the element holding member, so that the effect of avoiding the possibility of receiving mechanical stress can be obtained.
【図１】本発明の実施例を表した構造図FIG. 1 is a structural diagram showing an embodiment of the present invention.
【図２】複数の半導体素子をプリント板に実装して共通
の放熱体で冷却する際の従来例を示した構造図FIG. 2 is a structural diagram showing a conventional example in which a plurality of semiconductor elements are mounted on a printed board and cooled by a common radiator;
１ プリント板 ２ 半導体素子としてのトランジスタ ３ トランジスタリード線 ４ 放熱体としての冷却フィン ６ ブロック支持脚 ７ 素子取付けブロック ８ 素子取付けねじ ９ ブロック取付けねじ １０ 支持脚取付けねじ １１ 絶縁シート １２ 全体取付け枠 １３ 間座 １４ プリント板取付けねじ ２１ 素子おさえ金具 ２２ おさえ金具締付けねじ DESCRIPTION OF SYMBOLS 1 Printed board 2 Transistor as a semiconductor element 3 Transistor lead wire 4 Cooling fin as a radiator 6 Block support leg 7 Element mounting block 8 Element mounting screw 9 Block mounting screw 10 Support leg mounting screw 11 Insulation sheet 12 Whole mounting frame 13 Between Seat 14 Printed board mounting screw 21 Element holding bracket 22 Holding bracket tightening screw
Claims (2)
体素子を、これらに共通の放熱体にとりつけている半導
体素子の冷却構造において、 素子おさえ板に前記複数の半導体素子を一列に並べて一
体化し、一体化したこれら半導体素子と素子おさえ金具
とをプリント板にはんだ付けし、この素子おさえ金具と
放熱体とを前記半導体素子を介してねじ締めすることを
特徴とする半導体素子の冷却構造。In a cooling structure for a semiconductor device, wherein a plurality of semiconductor devices soldered to a printed board are attached to a common heat radiator, the plurality of semiconductor devices are arranged in a line on a device holding plate and integrated. A semiconductor element cooling structure, wherein the integrated semiconductor element and the element holding member are soldered to a printed board, and the element holding member and the radiator are screwed together via the semiconductor element.
おいて、 前記素子おさえ金具と複数半導体素子とは治具を使って
一体化することを特徴とする半導体素子の冷却構造。2. The cooling structure for a semiconductor element according to claim 1, wherein said element holding member and said plurality of semiconductor elements are integrated using a jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9293715A JPH11135971A (en) | 1997-10-27 | 1997-10-27 | Cooling structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9293715A JPH11135971A (en) | 1997-10-27 | 1997-10-27 | Cooling structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11135971A true JPH11135971A (en) | 1999-05-21 |
Family
ID=17798313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9293715A Withdrawn JPH11135971A (en) | 1997-10-27 | 1997-10-27 | Cooling structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11135971A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002306A1 (en) * | 2003-06-26 | 2005-01-06 | Toshiba Carrier Corporation | Inverter device and its manufacturing method |
| CN111337809A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for TO-254/257 packaged power device |
| WO2020194327A1 (en) * | 2019-03-22 | 2020-10-01 | Tvs Motor Company Limited | A circuit assembly and a positioning member thereof |
| WO2021057950A1 (en) * | 2019-09-27 | 2021-04-01 | Valeo Siemens Eautomotive (Shenzhen) Co., Ltd. | Electronic device and fixing module thereof for fixing element |
-
1997
- 1997-10-27 JP JP9293715A patent/JPH11135971A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002306A1 (en) * | 2003-06-26 | 2005-01-06 | Toshiba Carrier Corporation | Inverter device and its manufacturing method |
| WO2020194327A1 (en) * | 2019-03-22 | 2020-10-01 | Tvs Motor Company Limited | A circuit assembly and a positioning member thereof |
| WO2021057950A1 (en) * | 2019-09-27 | 2021-04-01 | Valeo Siemens Eautomotive (Shenzhen) Co., Ltd. | Electronic device and fixing module thereof for fixing element |
| CN111337809A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for TO-254/257 packaged power device |
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