JP4396628B2 - Busbar connection type electronic circuit device and assembly method thereof - Google Patents

Busbar connection type electronic circuit device and assembly method thereof Download PDF

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JP4396628B2
JP4396628B2 JP2005372168A JP2005372168A JP4396628B2 JP 4396628 B2 JP4396628 B2 JP 4396628B2 JP 2005372168 A JP2005372168 A JP 2005372168A JP 2005372168 A JP2005372168 A JP 2005372168A JP 4396628 B2 JP4396628 B2 JP 4396628B2
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power electronic
bus bar
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circuit device
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JP2007174863A (en
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明雄 横田
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Denso Corp
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Denso Corp
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Description

本発明は、複数の更に好適には多数のパワー電子部品を互いに平行なバスバー及び放熱部材に締結してなる電力用電子回路装置及びその組み付け方法の改良に関する。   The present invention relates to a power electronic circuit device formed by fastening a plurality of power electronic components, more preferably a large number of power electronic components, to a bus bar and a heat dissipating member which are parallel to each other, and to an improvement of the assembly method.

従来、たとえば電気自動車用モータ制御装置や車両用DC-DCコンバータなど電力消費が大きいパワー電子部品を複数用いる電力用電子回路装置では、これらパワー電子部品の上面に設けられた端子部にバスバーを接続するとともに、各パワー電子部品の底面を金属放熱板や金属ケースの底板部に固定することによりそれらの放熱を図ることが一般的である。   Conventionally, in power electronic circuit devices that use multiple power electronic components that consume a large amount of power, such as motor control devices for electric vehicles and DC-DC converters for vehicles, a bus bar is connected to the terminal provided on the upper surface of these power electronic components. In addition, it is common to attempt to radiate heat by fixing the bottom surface of each power electronic component to a metal heat sink or a bottom plate portion of a metal case.

したがって、この種の電力用電子回路装置（パワー電子回路装置）では、バスバーの少なくとも端子接続部分は、金属放熱板や金属ケースなどの放熱部材の上面に平行に配設されることになる。もちろん、各パワー電子部品の高さに合わせてバスバーのパワー電子部品間の部位に段差を設けたり、放熱部材の上面に段差を設けても良い。なお、この明細書で言う上下は便宜上の方向であって、装置全体を空間的に所定角度回転した状態にて組み付けることを妨げるものではない。   Therefore, in this type of power electronic circuit device (power electronic circuit device), at least the terminal connection portion of the bus bar is disposed in parallel to the upper surface of a heat radiating member such as a metal heat radiating plate or a metal case. Of course, a step may be provided in a portion of the bus bar between the power electronic components according to the height of each power electronic component, or a step may be provided on the upper surface of the heat dissipation member. Note that the upper and lower directions in this specification are directions for convenience, and do not prevent the entire apparatus from being assembled in a state where it is spatially rotated by a predetermined angle.

従来におけるこの種の電力用電子回路装置の典型的な組み付け工程を図１０〜図１２を参照して説明する。   A typical assembly process of this type of power electronic circuit device will be described with reference to FIGS.

まずたとえば金属ケース１の底面に各パワー電子部品２〜４を締結などにより固定し（図１０）、次に、各パワー電子部品２〜４の雌ねじ孔をバスバー５の貫通孔とを合わせ（図１１）、次に、これらの孔にボルト又は雄ねじを螺入して、バスバー５の固定並びにバスバー５と各パワー電子部品２〜４との電気的接続を完了する（図１２）。この種の電力用電子回路装置の一例が、本出願人により出願された下記の特許文献１に記載されている。
特開２００２−８３９１５号公報 First, for example, the power electronic components 2 to 4 are fixed to the bottom surface of the metal case 1 by fastening or the like (FIG. 10), and then the female screw holes of the power electronic components 2 to 4 are aligned with the through holes of the bus bar 5 (FIG. 10). 11) Next, bolts or male screws are screwed into these holes to complete the fixing of the bus bar 5 and the electrical connection between the bus bar 5 and the power electronic components 2 to 4 (FIG. 12). An example of this type of power electronic circuit device is described in the following Patent Document 1 filed by the present applicant.
JP 2002-83915 A

しかしながら、上記した従来のバスバー接続型電子回路装置では、次に説明する問題が生じる場合があることがわかった。すなわち、各パワー電子部品の高さのばらつきにより、各パワー電子部品をたとえば金属放熱板の上面や金属ケースの底面に締結し、かつ、バスバーを各電子部品の端子部に締結した場合に、各パワー電子部品とたとえば金属ケースの底面との間の熱伝導性がばらつくという現象が生じた。   However, it has been found that the above-described conventional bus bar connection type electronic circuit device may cause the following problems. That is, due to variations in the height of each power electronic component, each power electronic component is fastened to, for example, the top surface of the metal heat sink or the bottom surface of the metal case, and the bus bar is fastened to the terminal portion of each electronic component. A phenomenon has occurred in which the thermal conductivity between the power electronic component and, for example, the bottom surface of the metal case varies.

更に具体的に説明すると、相対的に高さが大きいパワー電子部品はバスバーの弾性変形により金属ケースの底面に強く押しつけられて良好に熱伝導を確保できるものの、相対的に高さが小さいパワー電子部品には逆に金属ケースの底面から離れる力が働き、パワー電子部品の底面と金属ケースの底面との間の熱伝導性が低下し、その結果として相対的に高さが小さい電子部品の温度が上昇して、その寿命劣化などを生じる可能性が生じた。   More specifically, although the power electronic component having a relatively large height is strongly pressed against the bottom surface of the metal case by the elastic deformation of the bus bar and can secure good heat conduction, the power electronic component having a relatively small height is used. On the other hand, the force acting away from the bottom surface of the metal case acts on the component, and the thermal conductivity between the bottom surface of the power electronic component and the bottom surface of the metal case decreases, and as a result, the temperature of the electronic component having a relatively small height. As a result, there was a possibility that the life would deteriorate.

上記した相対的に高さが小さい電子部品の底面と金属ケースの底面との間の熱抵抗増大問題は特に、バスバーの長手方向に配列された多数のパワー電子部品のうちの両端側の２つのパワー電子部品の高さが中央側のパワー電子部品の高さより実質的に小さい場合に顕著となる。すなわち、この場合には、中央側のパワー電子部品にはその両側のパワー電子部品からそれぞれバスバーを通じて上方へ引っ張られるため金属ケースの底面から離れようとする力が倍増することになる。   The above-described problem of increasing the thermal resistance between the bottom surface of the electronic component having a relatively small height and the bottom surface of the metal case is particularly the two of the two power electronic components arranged in the longitudinal direction of the bus bar. This becomes conspicuous when the height of the power electronic component is substantially smaller than the height of the power electronic component on the center side. That is, in this case, since the power electronic component on the center side is pulled upward from the power electronic components on both sides through the bus bars, the force to move away from the bottom surface of the metal case is doubled.

また、上記した金属放熱板や金属ケースとバスバーとの組み付けられるパワー電子部品における従来の組み付け方法は、まず各パワー電子部品を金属放熱板の上面や金属ケースの底面に締結し、その後、金属放熱板に締結された各パワー電子部品の端子部にバスバーを締結していた。   In addition, the conventional assembly method for the power electronic component in which the metal heat sink or the metal case and the bus bar are assembled is as follows. First, each power electronic component is fastened to the upper surface of the metal heat sink or the bottom surface of the metal case, and then the metal heat dissipation. The bus bar was fastened to the terminal portion of each power electronic component fastened to the board.

この組み付け方法では、各パワー電子部品を一つ一つ金属ケースの底面の所定の位置に合わせてから締結する必要があるため、位置合わせ作業が複雑となり、そのうえ各パワー電子部品と金属ケースの底面との組み付け位置のばらつきが各パワー電子部品の端子部の位置ばらつきを増大させるため、端子部とバスバーとの締結が面倒となるという問題も生じた。   In this assembling method, it is necessary to fasten each power electronic component to a predetermined position on the bottom surface of the metal case one by one, which makes the alignment work complicated, and in addition, the power electronic component and the bottom surface of the metal case. Since the variation in the assembly position increases the positional variation of the terminal portion of each power electronic component, there is also a problem that the fastening of the terminal portion and the bus bar becomes troublesome.

本発明は上記問題点に鑑みなされたものであり、作業性に優れ、かつ、パワー電子部品と放熱部材との間の熱抵抗増大を抑止可能なバスバー接続型電子回路装置及びその組み付け方法を提供することをその目的としている。   The present invention has been made in view of the above problems, and provides a bus bar connection type electronic circuit device that is excellent in workability and can suppress an increase in thermal resistance between a power electronic component and a heat radiating member, and an assembling method thereof. Its purpose is to do.

上記問題点を解決する第１発明のバスバー接続型電子回路装置は、複数のパワー電子部品と、前記各パワー電子部品が上面に締結された金属製の放熱部材と、前記各パワー電子部品の上面の端子部に締結されて各パワー電子部品を電気的に接続するバスバーとを備え、前記バスバーの少なくとも前記パワー電子部品との締結部は、前記放熱部材の上面のうち少なくとも前記パワー電子部品の底面に接触する部分に対して略平行に配置される電力用電子回路装置において、共通の前記バスバーの長手方向に配列された３個以上の前記パワー電子部品のうちの両端側の２つの前記パワー電子部品を前記放熱部材及び前記バスバーに取り付けた場合に、中央側の前記パワー電子部品の設置位置にて前記放熱部材と前記バスバーとの間に生じる空間である部品設置空間の高さは、この部品設置空間に設けられる中央側の前記パワー電子部品の高さよりも低く設定されていることを特徴としている。   A bus bar connection type electronic circuit device according to a first aspect of the present invention that solves the above problems includes a plurality of power electronic components, a metal heat dissipating member with the power electronic components fastened to the upper surface, and the upper surfaces of the power electronic components. A bus bar which is fastened to the terminal portion of the power bar and electrically connects each power electronic component, and the fastening portion of the bus bar to at least the power electronic component is at least the bottom surface of the power electronic component among the top surfaces of the heat dissipation member In the power electronic circuit device disposed substantially parallel to the portion in contact with the two, the two power electrons on both ends of the three or more power electronic components arranged in the longitudinal direction of the common bus bar When a component is attached to the heat dissipating member and the bus bar, a space generated between the heat dissipating member and the bus bar at the installation position of the power electronic component on the center side. That the height of the component installation space is characterized in that it is set lower than the height of the power electronic components of the central side provided in the component installation space.

すなわち、この発明では、たとえば一列に並んだ３つのパワー電子部品のうち両端側のパワー電子部品をバスバー及び放熱部材に締結した状態にて、中央側のパワー電子部品の位置にてバスバーと放熱部材との間に形成される空間として定義される部品設置空間は、この中央側のパワー電子部品よりも低くなるように、各パワー電子部品の高さの製造公差を設定する。   That is, according to the present invention, for example, the bus bar and the heat radiating member at the position of the central power electronic component in a state where the power electronic components on both ends of the three power electronic components arranged in a row are fastened to the bus bar and the heat radiating member. The manufacturing tolerance of the height of each power electronic component is set so that the component installation space defined as a space formed between the power electronic components is lower than the power electronic component on the center side.

これによりバスバーが曲げ変形して、バスバーの長手方向両端側のパワー電子部品にはバスバーにより放熱部材から離れる方向の応力が掛かり、バスバーの長手方向中央側のパワー電子部品にはバスバーにより放熱部材に押しつけられる方向の応力が掛かる。   As a result, the bus bar is bent and deformed, and the power electronic components at both ends in the longitudinal direction of the bus bar are subjected to stress in a direction away from the heat radiating member by the bus bar. Stress in the pressing direction is applied.

このようにすれば、長手方向中央側のパワー電子部品にはその両側から強い押しつけ力が掛かるため、パワー電子部品と放熱部材との間の熱抵抗を良好に低減することができる。その代わりとして、バスバーの長手方向両端側のパワー電子部品にはバスバーの弾性変形により放熱部材から離れる方向への力が働くことになるが、この力はバスバーの長手方向中央側に高さが小さいパワー電子部品を設ける場合に比べて小さいため、放熱性の悪化は相対的に小さくすることができる。   In this way, since a strong pressing force is applied to the power electronic component on the center side in the longitudinal direction from both sides, the thermal resistance between the power electronic component and the heat dissipation member can be favorably reduced. Instead, a force in the direction away from the heat dissipation member acts on the power electronic components at both ends in the longitudinal direction of the bus bar due to elastic deformation of the bus bar, but this force has a small height on the center side in the longitudinal direction of the bus bar. Since the power electronic component is smaller than the case where the power electronic component is provided, the deterioration of heat dissipation can be relatively reduced.

すなわち、バスバーの長手方向中央側に高さが小さいパワー電子部品を設ける場合にはバスバーは高さが高い二つのパワー電子部品に両端支持されて大きな弾性力を中央側のパワー電子部品に掛けるが、バスバーの長手方向両端側に高さが小さいパワー電子部品をそれぞれ設ける場合にはバスバーは中央側の高さが高い一つのパワー電子部品に一端支持されて両端側の二つのパワー電子部品にそれぞれ小さい弾性力（放熱部材から離れる向き）を掛けることになり、両端側のパワー電子部品を放熱部材に締結する力によりそれと対抗して十分良好に両端側のパワー電子部品と放熱部材との密着性を確保することができる。   That is, when a power electronic component with a small height is provided on the center side in the longitudinal direction of the bus bar, the bus bar is supported at both ends by two power electronic components with a high height and applies a large elastic force to the power electronic component on the center side. In the case where power electronic components having a small height are provided at both ends in the longitudinal direction of the bus bar, the bus bar is supported by one power electronic component having a high height on the center side and is provided on each of the two power electronic components on both ends. A small elastic force (direction away from the heat radiating member) is applied, and the power electronic components on both ends are opposed to the heat radiating member by the force to fasten the power electronic components and the heat radiating members on both ends sufficiently well. Can be secured.

好適な態様において、前記バスバーの長手方向両端側の前記パワー電子部品よりも大発熱のパワー電子部品を前記バスバーの中央側に配置する。すなわち、既述したように中央側のパワー電子部品はバスバーにより強く放熱部材に押しつけられるため、両端側のパワー電子部品よりも相対的に優れた単位面積あたりの放熱性をもつ。このため、両端側よりも相対的に大発熱部品（あるいは温度上昇が好ましくない）パワー電子部品を中央側に配置することにより、その温度上昇を抑止することができる。   In a preferred aspect, a power electronic component that generates a larger amount of heat than the power electronic components on both ends in the longitudinal direction of the bus bar is disposed on the center side of the bus bar. That is, as described above, the power electronic component on the center side is strongly pressed against the heat radiating member by the bus bar, and therefore has a heat dissipation performance per unit area that is relatively superior to the power electronic components on both ends. For this reason, it is possible to suppress the temperature increase by disposing the power electronic component having a relatively large heat generation (or temperature increase is not preferable) on the center side relative to both ends.

好適な態様において、前記バスバーは、前記複数の前記パワー電子部品と前記放熱部材との締結部の上方に設定された空間である放熱部材締結用空間を避けて前記パワー電子部品に締結されていることを特徴としている。 In a preferred aspect, the bus bar is fastened to the power electronic component while avoiding a heat dissipating member fastening space that is a space set above a fastening portion of the plurality of power electronic components and the heat dissipating member. It is characterized by that.

すなわち、この発明では、バスバーに各パワー電子部品を予め締結してなる部品アセンブリの各パワー電子部品をバスバーに邪魔されることなく、放熱部材に締結することができる。更に具体的に言うと、各パワー電子部品は、バスバーの側方に確保された放熱部材締結用空間を通じて上下方向に挿入される締結用工具により締結される。   That is, in this invention, each power electronic component of the component assembly formed by previously fastening each power electronic component to the bus bar can be fastened to the heat dissipation member without being obstructed by the bus bar. More specifically, each power electronic component is fastened by a fastening tool that is inserted in the vertical direction through a heat dissipating member fastening space secured on the side of the bus bar.

このため、各パワー電子部品を個々に放熱部材に締結する工程を省略することができる。すなわち、各パワー電子部品をバスバーに接続することにより、各パワー電子部品間の相対空間位置が確定するため、バスバーと放熱部材とを位置合わせするだけで、各パワー電子部品と放熱部材との位置を確定することができるわけである。また、各パワー電子部品を放熱部材に締結する工程を、一括して行うことができ、締結作業を簡素化することができる。   For this reason, the process of fastening each power electronic component individually to a heat radiating member can be omitted. That is, by connecting each power electronic component to the bus bar, the relative spatial position between each power electronic component is determined, so the position of each power electronic component and the heat radiating member can be determined simply by aligning the bus bar and the heat radiating member. Can be determined. Moreover, the process of fastening each power electronic component to a heat radiating member can be performed collectively, and fastening work can be simplified.

好適な態様において、前記各パワー電子部品に前記バスバーを締結してサブアセンブリを構成する第１工程と、その後、このサブアセンブリを前記放熱部材の上方の所定位置にセットする第２工程と、その後、前記サブアセンブリの前記各パワー電子部品を前記放熱部材に締結する第３工程とを有する。   In a preferred aspect, a first step of fastening the bus bar to each power electronic component to form a subassembly, a second step of setting the subassembly at a predetermined position above the heat radiating member, and thereafter And a third step of fastening the power electronic components of the subassembly to the heat dissipating member.

すなわち、この組み付け方法によれば、既述したように、バスバー接続された各パワー電子部品の放熱部材への位置合わせ作業を簡素化することができ、組み付けコスト及び組み付け時間を減らすことができる。   That is, according to this assembling method, as described above, it is possible to simplify the alignment operation of each power electronic component connected to the bus bar to the heat radiating member, and it is possible to reduce the assembling cost and the assembling time.

好適な態様において、前記各パワー電子部品間の相対位置に前記バスバーへの締結前の前記各パワー電子部品をセットする部品位置決定用の治具を準備し、前記第１工程は、前記各パワー電子部品を前記治具にセットして前記各パワー電子部品間の相対位置をあらかじめ確定した後、前記バスバーを前記パワー電子部品に締結する。   In a preferred aspect, a jig for determining a component position for setting each power electronic component before being fastened to the bus bar at a relative position between the power electronic components is prepared. After the electronic component is set on the jig and the relative position between the power electronic components is determined in advance, the bus bar is fastened to the power electronic component.

すなわち、この態様によれば、各パワー電子部品をバスバーに締結する前に行う各パワー電子部品間の相対位置の設定を、放熱部材の主面と平行な面内に各パワー電子部品が嵌め込み可能な孔をもつ枠材により構成された部品位置決定用の治具を用いて行うため、極めて容易に各パワー電子部品間の相対位置合わせ作業を行うことができる。更に、各パワー電子部品をこの枠材にセットした状態にてバスバーを各パワー電子部品に締結すれば、この締結作業時における各パワー電子部品の保持を行うことができるため、更に組み付け作業の簡素化を実現することができる。   That is, according to this aspect, the setting of the relative position between each power electronic component performed before fastening each power electronic component to the bus bar can be fitted into each power electronic component in a plane parallel to the main surface of the heat dissipation member. Since this is performed using a jig for determining the position of the component made up of a frame material having an appropriate hole, the relative positioning operation between the power electronic components can be performed very easily. Furthermore, if the bus bar is fastened to each power electronic component in a state where each power electronic component is set on the frame member, each power electronic component can be held at the time of the fastening work, and thus the assembly work is further simplified. Can be realized.

結局、この発明は、バスバー接続型電子回路装置では、締結後のバスバーが各パワー電子部品間の相対位置を保持することを利用して、各パワー電子部品への放熱部材の締結作業を簡素化することである。   After all, the present invention simplifies the fastening work of the heat dissipation member to each power electronic component by using the bus bar connected type electronic circuit device that holds the relative position between the power electronic components after the fastening. It is to be.

本発明のバスバー接続型電子回路装置の好適な態様を以下の実施形態を参照して説明する。なお、本発明が下記の実施形態に限定されるものでなく、本発明を他の公知技術等の組み合わせにより実施してもよいことは当然である。また、下記の説明にて、上下方向は便宜的に設定したものに過ぎないことに留意されたい。   Preferred embodiments of the bus bar connection type electronic circuit device of the present invention will be described with reference to the following embodiments. In addition, this invention is not limited to the following embodiment, Of course, this invention may be implemented by the combination of other well-known techniques. In the following description, it should be noted that the vertical direction is merely set for convenience.

（実施形態１）
実施形態１のバスバー接続型電子回路装置をその縦断面である図１を参照して以下に説明する。 (Embodiment 1)
The bus bar connection type electronic circuit device according to the first embodiment will be described below with reference to FIG.

１は金属ケース、２〜４はパワー電子部品、５はバスバー、６〜９は部品締結用のボルト、１０〜１３はバスバー締結用のボルトである。金属ケース１は、たとえばアルミ合金厚板をプレスなどにより成形してなり、上端が開口している。金属ケース１の底面１Ａには、パワー電子部品２〜４がボルト６〜９により締結されている。パワー電子部品２〜４は、パワー半導体スイッチング素子モジュール、トランス、電力コンデンサ、リアクトルなど電力消費が大きい電子部品により構成されている。バスバー５は、樹脂コートされた銅板を所定形状に切断加工してなり、パワー電子部品２〜４の上面に設けられた雌螺子孔をもつ端子部（図示せず）にボルト１０〜１３により締結されている。この実施形態では、組み付け前において、バスバー５は平坦な金属ケース１の底面１Ａと平行な長尺板とされている。パワー電子部品２〜４はバスバー５の長手方向に配列されており、左端側のパワー電子部品２の高さはＬ２、中央側のパワー電子部品４の高さはＬ１、右端側のパワー電子部品３の高さはＬ３とされている。   1 is a metal case, 2 to 4 are power electronic components, 5 is a bus bar, 6 to 9 are bolts for fastening components, and 10 to 13 are bolts for fastening bus bars. The metal case 1 is formed by, for example, pressing an aluminum alloy thick plate by pressing or the like, and has an upper end opened. Power electronic components 2 to 4 are fastened to the bottom surface 1 </ b> A of the metal case 1 by bolts 6 to 9. The power electronic components 2 to 4 are configured by electronic components that consume a large amount of power, such as power semiconductor switching element modules, transformers, power capacitors, and reactors. The bus bar 5 is formed by cutting a resin-coated copper plate into a predetermined shape, and is fastened with bolts 10 to 13 to a terminal portion (not shown) having a female screw hole provided on the upper surface of the power electronic components 2 to 4. Has been. In this embodiment, the bus bar 5 is a long plate parallel to the bottom surface 1A of the flat metal case 1 before assembly. The power electronic components 2 to 4 are arranged in the longitudinal direction of the bus bar 5, the height of the power electronic component 2 on the left end side is L2, the height of the power electronic component 4 on the center side is L1, and the power electronic component on the right end side The height of 3 is L3.

この実施例の特徴は、中央側のパワー電子部品４の高さＬ１を両端側のパワー電子部品２、３の高さＬ２、Ｌ３よりも製造公差を含んで等しいかあるいは所定量α未満だけ高く設定した点にある。所定量αは、バスバー５の弾性変形力に対応して決定されるが、好適には、０．５〜５ｍｍとされることが好適である。これにより、中央側のパワー電子部品４の位置にて、バスバー５の下面と金属ケース１の底面との間には略（Ｌ２＋Ｌ３）／２の高さの空間（本発明で言う部品設置空間）Ｌxが形成される。   The feature of this embodiment is that the height L1 of the power electronic component 4 on the center side is equal to the heights L2 and L3 of the power electronic components 2 and 3 on both ends, including manufacturing tolerances, or higher than the predetermined amount α. It is in the set point. The predetermined amount α is determined in accordance with the elastic deformation force of the bus bar 5, and preferably 0.5 to 5 mm. As a result, at the position of the power electronic component 4 on the center side, a space having a height of approximately (L2 + L3) / 2 between the lower surface of the bus bar 5 and the bottom surface of the metal case 1 (component installation space referred to in the present invention). Lx is formed.

このようにすると、次の効果が得られる。図１に示すようにパワー電子部品２，３と金属ケース１の底面との間にはボルト１０〜１４を締結する前に隙間が生じるが、この隙間は、ボルト１０〜１４の締結によりバスバー５が金属ケース１の底面１Ａ側に変形して解消される。このバスバー５の変形のうちの弾性変形分は、中央側のパワー電子部品４を金属ケース１の底面１Ａ側に押しつけ、中央側のパワー電子部品４と金属ケース１の底面１Ａとの間の熱抵抗を低減させる。逆に、両端側のパワー電子部品２、３の底面は、このバスバー５の弾性変形分だけ金属ケース１の底面１Ａから離れようとするが、その力は、二つのパワー電子部品２、３に分散されて一つのパワー電子部品に掛かる力は小さくなるため、ボルト６〜９として大型のものを用いなくても、ボルト６〜９はこの力に対抗して両端側のパワー電子部品２、３を良好に金属ケース１の底面１Ａに締結することができる。また、各ボルト６〜９の締結のための回転トルクも小さくて良い。   In this way, the following effects can be obtained. As shown in FIG. 1, a gap is generated between the power electronic components 2 and 3 and the bottom surface of the metal case 1 before the bolts 10 to 14 are fastened. Is eliminated by deformation toward the bottom surface 1 </ b> A side of the metal case 1. The elastic deformation of the deformation of the bus bar 5 presses the power electronic component 4 on the center side against the bottom surface 1A side of the metal case 1, and heat between the power electronic component 4 on the center side and the bottom surface 1A of the metal case 1 is heated. Reduce resistance. On the contrary, the bottom surfaces of the power electronic components 2 and 3 on both ends tend to be separated from the bottom surface 1A of the metal case 1 by the elastic deformation of the bus bar 5, but the force is applied to the two power electronic components 2 and 3 Since the force applied to one power electronic component is reduced when dispersed, the bolts 6 to 9 are opposed to this force even if a large bolt 6-9 is not used. Can be satisfactorily fastened to the bottom surface 1 </ b> A of the metal case 1. Moreover, the rotational torque for fastening each bolt 6-9 may be small.

このことは、両端側のパワー電子部品２、３をバスバー５と金属ケース１とに組み付けた時に中央側のパワー電子部品の位置で生じる空間（本発明で言う部品設置空間）の高さ略（Ｌ２＋Ｌ３）／２は、この部品設置空間に設置される中央側のパワー電子部品４の高さＬ１が両端側のパワー電子部品２、３の高さＬ２、Ｌ３以上とされているため、中央側のパワー電子部品４の高さＬ１よりも小さくなる。逆に言えば、中央側のパワー電子部品４の高さＬ１は部品設置空間略（Ｌ２＋Ｌ３）／２よりも高くなる。このため、パワー電子部品２〜４を金属ケース１の底面に組み付けた時、バスバー５の両端部は、それぞれ高さの差（Ｌ１―（Ｌ２＋Ｌ３）／２）だけ変形する。通常に老いて、この変形には塑性変形と弾性変形とが存在すると考えられるが、この弾性変形による剥離方向への力は、両端側のパワー電子部品２、３に分散して掛かるために、その悪影響が軽減されるわけである。なお、上記説明では、金属ケース１の底板部の曲げ変形は考慮していない。   This means that when the power electronic components 2 and 3 on both ends are assembled to the bus bar 5 and the metal case 1, the height of the space (component installation space referred to in the present invention) generated at the position of the central power electronic component ( L2 + L3) / 2 is equal to or higher than the height L2 and L3 of the power electronic components 2 and 3 on both ends because the height L1 of the central power electronic component 4 installed in the component installation space is equal to or higher than the height L2 and L3. The power electronic component 4 becomes smaller than the height L1. In other words, the height L1 of the central power electronic component 4 is higher than the component installation space (L2 + L3) / 2. For this reason, when the power electronic components 2 to 4 are assembled to the bottom surface of the metal case 1, both end portions of the bus bar 5 are deformed by a height difference (L1− (L2 + L3) / 2). Normally, it is considered that there is plastic deformation and elastic deformation in this deformation, but the force in the peeling direction due to this elastic deformation is distributed and applied to the power electronic components 2 and 3 on both end sides. That adverse effect is reduced. In the above description, bending deformation of the bottom plate portion of the metal case 1 is not considered.

また、この実施形態では、中央側のパワー電子部品４として、両端側のパワー電子部品２、３の消費電力より大きいパワー電子部品又は許容温度がより低いパワー電子部品を採用している。これにより、中央側のパワー電子部品４に要請される相対的な強力な冷却効果を簡単に実現することができる。   In this embodiment, as the power electronic component 4 on the center side, a power electronic component larger than the power consumption of the power electronic components 2 and 3 on both ends or a power electronic component having a lower allowable temperature is adopted. As a result, a relatively strong cooling effect required for the central power electronic component 4 can be easily realized.

なお、パワー電子部品２〜４と金属ケース１の底面１Ａとの間に電気絶縁シートなどの介在部材を配置してもよく、この場合には、パワー電子部品２〜４の高さはこれら介在部材を含んで算出されるべきである。   In addition, you may arrange | position interposed members, such as an electrical insulation sheet, between the power electronic components 2-4 and the bottom face 1A of the metal case 1, and in this case, the height of the power electronic components 2-4 is these interposed. It should be calculated including the members.

（変形態様）
図２のバスバー接続型電子回路装置は、図１の装置において、金属ケース１の底面１Ａのうち、中央側のパワー電子部品４の載置面を両端側のパワー電子部品２、３の載置面よりもＬ４だけ高くする段差を金属ケース１の底面１Ａに設けたものである。この場合には、パワー電子部品４の高さとしてこの段差高さＬ４を含ませれば、実施形態１と同じ関係が成り立つことは明白である。 (Modification)
The bus bar connection type electronic circuit device of FIG. 2 is the same as that of the device of FIG. 1, of the bottom surface 1 </ b> A of the metal case 1. A level difference higher than the surface by L4 is provided on the bottom surface 1A of the metal case 1. In this case, if this step height L4 is included as the height of the power electronic component 4, it is clear that the same relationship as in the first embodiment is established.

（変形態様）
図３のバスバー接続型電子回路装置は、図１の装置において、金属ケース１の底面１Ａのうち、中央側のパワー電子部品４の載置面を両端側のパワー電子部品２、３の載置面よりもＬ４だけ低くする溝を金属ケース１の底面１Ａに設けたものである。この場合には、パワー電子部品４の高さとしてこの段差高さＬ４を差し引けば、実施形態１と同じ関係が成り立つことは明白である。 (Modification)
The bus bar connection type electronic circuit device of FIG. 3 is the same as that of the device of FIG. 1, but the mounting surface of the power electronic component 4 on the center side of the bottom surface 1A of the metal case 1 is mounted on the power electronic components 2 and 3 on both ends. A groove which is lower than the surface by L4 is provided on the bottom surface 1A of the metal case 1. In this case, if the step height L4 is subtracted as the height of the power electronic component 4, it is clear that the same relationship as in the first embodiment is established.

（変形態様）
図４のバスバー接続型電子回路装置は、図２の装置において更に、金属ケース１の底面１Ａのうち、右端側のパワー電子部品３の載置面を両端側のパワー電子部品２、３の載置面よりもＬ５だけ高くする段差を金属ケース１の底面１Ａに設けたものである。この場合にも、パワー電子部品５の高さとしてこの段差高さＬ５を含ませれば、実施形態１と同じ関係が成り立つことは明白である。 (Modification)
The bus bar connection type electronic circuit device of FIG. 4 further includes the mounting surface of the power electronic component 3 on the right end side of the bottom surface 1A of the metal case 1 in the device of FIG. A level difference higher than the placement surface by L5 is provided on the bottom surface 1A of the metal case 1. Also in this case, it is obvious that the same relationship as in the first embodiment is established if the step height L5 is included as the height of the power electronic component 5.

（変形態様）
図５のバスバー接続型電子回路装置は、図２の装置において更に、金属ケース１の底面１Ａのうち、右端側のパワー電子部品３の載置面を両端側のパワー電子部品２、３の載置面よりもＬ５だけ低くする溝を金属ケース１の底面１Ａに設けたものである。この場合にも、パワー電子部品５の高さとしてこの段差高さＬ５を差し引けば、実施形態１と同じ関係が成り立つことは明白である。 (Modification)
The bus bar connection type electronic circuit device of FIG. 5 further includes the mounting surface of the power electronic component 3 on the right end side of the bottom surface 1A of the metal case 1 in the device of FIG. A groove that is lower than the placement surface by L5 is provided on the bottom surface 1A of the metal case 1. Also in this case, it is obvious that the same relationship as in the first embodiment is established by subtracting the step height L5 as the height of the power electronic component 5.

（変形態様）
図６のバスバー接続型電子回路装置は、図１の装置において更に、バスバー５のうち、中央側のパワー電子部品４との接続部の高さを両端側のパワー電子部品２、３のバスバー５との接続部の高さよりもΔＬ（図示せず）だけ高くしたものである。この場合には、パワー電子部品４の高さＬ１からこのバスバー段差ΔＬを差し引けば、実施形態１と同じ関係が成り立つことは明白である。 (Modification)
The bus bar connection type electronic circuit device of FIG. 6 further includes the bus bar 5 of the power electronic components 2 and 3 on both ends of the bus bar 5 with the height of the connection portion with the power electronic component 4 on the center side. Is higher than the height of the connecting part by ΔL (not shown). In this case, it is obvious that the same relationship as in the first embodiment is established by subtracting the bus bar step ΔL from the height L1 of the power electronic component 4.

（組み付け工程の説明）
次に、この装置の組み付け工程を図７〜図９を参照して説明する。 (Explanation of assembly process)
Next, the assembly process of this apparatus will be described with reference to FIGS.

図７は、各パワー電子部品２〜４にバスバー５を組み付ける工程を示す。   FIG. 7 shows a process of assembling the bus bar 5 to each power electronic component 2-4.

１４は、各パワー電子部品２〜４間の相対位置を決定し、かつ、各パワー電子部品２〜４をこの相対位置を確保しつつ保持する部品位置決定用の治具である。この治具１４には、穴あき金属板を用いることが好適である。すなわち、治具１４には、各パワー電子部品２〜４の底面が密着する平坦な上面１５〜１７と、各パワー電子部品２〜４の側面に密着する側面１８〜２２とをもつ部品保持溝部２３〜２５を有している。なお、部品保持溝部２３〜２５への各パワー電子部品２〜４のセット（降下）を容易とするために、部品保持溝部２３〜２５の上端周縁にはテーパが形成されている。   Reference numeral 14 denotes a component position determining jig that determines a relative position between the power electronic components 2 to 4 and holds the power electronic components 2 to 4 while securing the relative position. The jig 14 is preferably a perforated metal plate. That is, the jig 14 has a component holding groove portion having flat upper surfaces 15 to 17 in which the bottom surfaces of the power electronic components 2 to 4 are in close contact and side surfaces 18 to 22 in close contact with the side surfaces of the power electronic components 2 to 4. 23 to 25. In order to facilitate setting (lowering) of the power electronic components 2 to 4 in the component holding groove portions 23 to 25, a taper is formed on the upper peripheral edges of the component holding groove portions 23 to 25.

この実施形態では、図７に示すように、治具１４にはボルト６〜９の先端部を囲む貫通孔（溝でもよい）が設けられている。これにより、ボルト６〜９を予め各パワー電子部品２〜４にセットした状態にて、各パワー電子部品２〜４を治具１４の各部品保持溝部２３〜２５に個別にセットすることができる。   In this embodiment, as shown in FIG. 7, the jig 14 is provided with a through hole (may be a groove) surrounding the tip portions of the bolts 6 to 9. As a result, the power electronic components 2 to 4 can be individually set in the component holding groove portions 23 to 25 of the jig 14 with the bolts 6 to 9 being set in advance to the power electronic components 2 to 4. .

各パワー電子部品２〜４を治具１４の各部品保持溝部２３〜２５に降下させ、セットした後、治具１４の上方空間にバスバー５を移動させ、その後、このバスバー５を治具１４に対して水平方向所定位置にセットする。これにより、各パワー電子部品２〜４の端子部の雌螺子孔２６〜２９とバスバー５の貫通孔３０〜３３とを位置合わせすることができるため、ボルト締結工具を用いて、ボルト１０〜１４を締結することによりバスバー５と各パワー電子部品２〜４との締結が完了する。   After each power electronic component 2-4 is lowered and set in each component holding groove 23-25 of the jig 14, the bus bar 5 is moved to the space above the jig 14, and then the bus bar 5 is attached to the jig 14. On the other hand, it is set at a predetermined position in the horizontal direction. Thereby, since the female screw holes 26-29 of the terminal part of each power electronic component 2-4 and the through-holes 30-33 of the bus-bar 5 can be aligned, bolts 10-14 are used using a bolt fastening tool. The fastening between the bus bar 5 and each power electronic component 2 to 4 is completed.

次に、治具１４を各パワー電子部品２〜４から引き離し、各パワー電子部品２〜４とバスバー５とからなるアセンブリ３４を図８に示す金属ケース１の上方に移動し、このアセンブリ３４と金属ケース１との水平方向の位置合わせを行い、その後、ボルト６〜９を締結すればよい。   Next, the jig 14 is separated from the power electronic components 2 to 4, and the assembly 34 including the power electronic components 2 to 4 and the bus bar 5 is moved above the metal case 1 shown in FIG. The horizontal alignment with the metal case 1 is performed, and then the bolts 6 to 9 are fastened.

ここで重要なことは、バスバー５の側方において、ボルト６〜９を締結するためのボルト締結工具が上方からボルト６〜９を締結する位置まで降下し、締結完了後、再度上昇するための作業空間（放熱部材締結用空間）が確保されていることである。つまり、この実施形態では、バスバー５をこの放熱部材締結用空間に配置することが禁止される。これにより、上記した多数のパワー電子部品をバスバー及び金属ケースに極めて簡単に組み付けることが可能となる。バスバーの平面形状を図９に図示する。   What is important here is that, on the side of the bus bar 5, the bolt fastening tool for fastening the bolts 6 to 9 descends from above to the position for fastening the bolts 6 to 9, and rises again after the fastening is completed. The work space (space for fastening the heat radiation member) is secured. That is, in this embodiment, it is prohibited to arrange the bus bar 5 in the heat dissipating member fastening space. Thereby, it becomes possible to assemble a large number of the above-mentioned power electronic components to the bus bar and the metal case very easily. The planar shape of the bus bar is shown in FIG.

なお、この実施例では、各パワー電子部品２〜４の放熱部材として金属ケース１を採用したが、たとえば平板状の金属放熱板としてもよいことは明白である。   In this embodiment, the metal case 1 is adopted as the heat radiating member of each of the power electronic components 2 to 4. However, it is obvious that a flat metal heat radiating plate may be used.

実施例１の電子回路装置を示す縦断面図である。1 is a longitudinal sectional view showing an electronic circuit device of Example 1. FIG. 変形態様の電子回路装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic circuit apparatus of a deformation | transformation aspect. 変形態様の電子回路装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic circuit apparatus of a deformation | transformation aspect. 変形態様の電子回路装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic circuit apparatus of a deformation | transformation aspect. 変形態様の電子回路装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic circuit apparatus of a deformation | transformation aspect. 変形態様の電子回路装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic circuit apparatus of a deformation | transformation aspect. 図１の電子回路装置の組み付け工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the assembly | attachment process of the electronic circuit device of FIG. 図１の電子回路装置の組み付け工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the assembly | attachment process of the electronic circuit device of FIG. 図１の電子回路装置の要部平面図である。It is a principal part top view of the electronic circuit device of FIG. 従来の電子回路装置の組み付け工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the assembly | attachment process of the conventional electronic circuit device. 従来の電子回路装置の組み付け工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the assembly | attachment process of the conventional electronic circuit device. 従来の電子回路装置の組み付け工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the assembly | attachment process of the conventional electronic circuit device.

符号の説明Explanation of symbols

１は金属ケース、２〜４はパワー電子部品、５はバスバー、６〜９は部品締結用のボルト、１０〜１３はバスバー締結用のボルト、１４は部品位置決定用の治具、２３〜２５は部品保持溝部２３〜２５である。   1 is a metal case, 2 to 4 are power electronic components, 5 is a bus bar, 6 to 9 are bolts for fastening components, 10 to 13 are bolts for fastening bus bars, 14 is a jig for determining the position of components, 23 to 25 Are the component holding groove portions 23 to 25.

Claims (5)

複数のパワー電子部品と、
前記各パワー電子部品が上面に締結された金属製の放熱部材と、
前記各パワー電子部品の上面の端子部に締結されて各パワー電子部品を電気的に接続するバスバーと、
を備え、
前記バスバーの少なくとも前記パワー電子部品との締結部は、前記放熱部材の上面のうち少なくとも前記パワー電子部品の底面に接触する部分に対して略平行に配置されるバスバー接続型電子回路装置において、
共通の前記バスバーの長手方向に配列された３個以上の前記パワー電子部品のうちの両端側の２つの前記パワー電子部品を前記放熱部材及び前記バスバーに取り付けた場合に、中央側の前記パワー電子部品の設置位置にて前記放熱部材と前記バスバーとの間に生じる空間である部品設置空間の高さは、この部品設置空間に設けられる中央側の前記パワー電子部品の高さよりも低く設定されていることを特徴とするバスバー接続型電子回路装置。 Multiple power electronic components,
Each of the power electronic components is a metal heat dissipating member fastened to the upper surface,
A bus bar that is fastened to a terminal portion on the upper surface of each power electronic component and electrically connects each power electronic component;
With
In the bus bar connection type electronic circuit device, the fastening portion of at least the power electronic component of the bus bar is arranged substantially parallel to a portion of the upper surface of the heat dissipation member that contacts at least the bottom surface of the power electronic component.
When the two power electronic components on both ends of the three or more power electronic components arranged in the longitudinal direction of the common bus bar are attached to the heat dissipating member and the bus bar, the power electronics on the center side The height of the component installation space, which is a space generated between the heat dissipation member and the bus bar at the component installation position, is set lower than the height of the power electronic component on the center side provided in the component installation space. A bus bar connection type electronic circuit device. 請求項１記載のバスバー接続型電子回路装置において、
前記バスバーの長手方向両端側の前記パワー電子部品よりも発熱が大きいパワー電子部品を前記バスバーの中央側に配置するバスバー接続型電子回路装置。 The bus bar connection type electronic circuit device according to claim 1,
A bus bar connection type electronic circuit device in which power electronic components that generate more heat than the power electronic components at both ends in the longitudinal direction of the bus bar are arranged on the center side of the bus bar. 請求項１記載のバスバー接続型電子回路装置において、
前記バスバーは、前記複数の前記パワー電子部品と前記放熱部材との締結部の上方に設定された空間である放熱部材締結用空間を避けて前記パワー電子部品に締結されていることを特徴とするバスバー接続型電子回路装置。 The bus bar connection type electronic circuit device according to claim 1,
The bus bar is fastened to the power electronic component while avoiding a heat dissipating member fastening space which is a space set above a fastening portion between the plurality of power electronic components and the heat dissipating member. Busbar connection type electronic circuit device. 請求項３記載のバスバー接続型電子回路装置の組み付け方法において、
前記各パワー電子部品に前記バスバーを締結してサブアセンブリを構成する第１工程と、
その後、このサブアセンブリを前記放熱部材の上方の所定位置にセットする第２工程と、
その後、前記サブアセンブリの前記各パワー電子部品を前記放熱部材に締結する第３工程と、
を有することを特徴とするバスバー接続型電子回路装置の組み付け方法。 In the assembly method of the bus bar connection type electronic circuit device according to claim 3,
A first step of forming a subassembly by fastening the bus bar to each of the power electronic components;
A second step of setting the subassembly at a predetermined position above the heat dissipating member;
Thereafter, a third step of fastening the power electronic components of the subassembly to the heat dissipation member;
A method of assembling a bus bar-connected electronic circuit device, comprising: 請求項４記載のバスバー接続型電子回路装置の組み付け方法において、
前記各パワー電子部品間の相対位置に前記バスバーへの締結前の前記各パワー電子部品をセットする部品位置決定用の治具を準備し、
前記第１工程は、
前記各パワー電子部品を前記治具にセットして前記各パワー電子部品間の相対位置をあらかじめ確定した後、前記バスバーを前記パワー電子部品に締結することを特徴とするバスバー接続型電子回路装置の組み付け方法。 In the assembly method of the bus bar connection type electronic circuit device according to claim 4,
Prepare a jig for component position determination to set each power electronic component before fastening to the bus bar at a relative position between the power electronic components,
The first step includes
A bus bar connection type electronic circuit device comprising: setting each power electronic component on the jig and preliminarily determining a relative position between the power electronic components; and fastening the bus bar to the power electronic component. Assembly method.
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