JP2983484B2 - Fixing film - Google Patents
Fixing filmInfo
- Publication number
- JP2983484B2 JP2983484B2 JP9008481A JP848197A JP2983484B2 JP 2983484 B2 JP2983484 B2 JP 2983484B2 JP 9008481 A JP9008481 A JP 9008481A JP 848197 A JP848197 A JP 848197A JP 2983484 B2 JP2983484 B2 JP 2983484B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin layer
- fixing film
- fixing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920006015 heat resistant resin Polymers 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 30
- 239000010954 inorganic particle Substances 0.000 claims description 26
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 7
- 239000010408 film Substances 0.000 description 46
- 238000000034 method Methods 0.000 description 15
- 239000004642 Polyimide Substances 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000004962 Polyamide-imide Substances 0.000 description 4
- -1 aromatic tetracarboxylic acid Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011362 coarse particle Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 229920006361 Polyflon Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Fixing For Electrophotography (AREA)
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子写真複写機、
ファクシミリ、プリンター等の装置のフィルム定着方式
のトナー画像熱定着部に用いられる定着用フィルムに関
する。The present invention relates to an electrophotographic copying machine,
The present invention relates to a fixing film used in a heat fixing unit for a toner image of a film fixing method of an apparatus such as a facsimile or a printer.
【０００２】[0002]
【従来の技術】電子写真複写機、ファクシミリ、プリン
ター等のトナー画像を形成する印刷機器においては、印
刷あるいは複写の最終段階で、記録紙上に形成されたト
ナー画像のトナーを加熱溶融して記録紙上に定着させる
熱定着方式が一般的に使用されている。2. Description of the Related Art In a printing apparatus for forming a toner image, such as an electrophotographic copying machine, a facsimile, a printer, etc., at the final stage of printing or copying, the toner of the toner image formed on the recording paper is heated and melted on the recording paper. In general, a heat fixing method for fixing a toner image is used.
【０００３】このような熱定着方式においては、従来か
ら熱ローラ定着法が汎用されている。熱ローラ定着法で
は、内部に電熱ヒーターを有し、外周を離型性のよいゴ
ムまたは樹脂で被覆したヒートローラを別のゴムローラ
と圧接させ、それらのローラ間をトナー画像が形成され
た記録紙を通過させてトナーを加熱溶融し、トナーを記
録紙上に融着させるものである。In such a heat fixing method, a heat roller fixing method has been widely used. In the heat roller fixing method, a recording paper having an electric heater inside and a heat roller whose outer periphery is coated with rubber or resin having good releasability is pressed against another rubber roller, and a toner image is formed between the rollers. And heats and fuses the toner to fuse the toner on the recording paper.
【０００４】熱ローラ定着法は、ヒートローラ全体が加
熱されるのでローラを所定温度に保持するのが容易であ
り、処理の高速化に適しているが、装置の運転開始時に
ヒートローラ全体を所定の温度まで加熱する時間が必要
であるため、電源投入から運転可能となるまでの待ち時
間が長くなるという欠点を有している。またヒートロー
ラ全体を加熱しなければならないため消費電力も大き
い。In the heat roller fixing method, the entire heat roller is heated, so that it is easy to maintain the roller at a predetermined temperature, which is suitable for speeding up the processing. Since the time required for heating to the temperature is required, there is a disadvantage that the waiting time from when the power is turned on to when the operation becomes possible becomes long. Further, since the entire heat roller must be heated, the power consumption is large.
【０００５】そこで近年では、フィルム状のエンドレス
ベルトを使用したフィルム定着方式の熱定着法が提案さ
れている。Therefore, in recent years, a heat fixing method of a film fixing method using a film-like endless belt has been proposed.
【０００６】このエンドレスベルトを使用した定着法で
は、定着用のエンドレスベルトを複数のローラ間にかけ
渡し、その外側表面の所定位置に別の定着用ゴムローラ
を圧接させ、その圧接位置のエンドレスベルトの内側に
ベルトに接してヒーターが配置される。そしてエンドレ
スベルトとローラを回転させつつその間をトナー粉末画
像が形成された記録紙を通過させ、トナーを記録紙上に
融着させる。この定着方法では、薄いフィルム状のベル
トの実質的に圧接部分のみをヒーターにより直接加熱す
るので電源投入時の待ち時間がほぼゼロとなり、このこ
とからオンデマンド方式の熱定着法と呼ばれている。In this fixing method using an endless belt, an endless belt for fixing is passed over a plurality of rollers, another fixing rubber roller is pressed against a predetermined position on the outer surface of the endless belt, and the inner side of the endless belt at the pressed position is pressed. The heater is arranged in contact with the belt. Then, while rotating the endless belt and the roller, the recording paper on which the toner powder image is formed passes between the endless belt and the roller, and the toner is fused on the recording paper. In this fixing method, substantially only the pressure contact portion of the thin film belt is directly heated by the heater, so that the waiting time at the time of turning on the power is almost zero, and this is called an on-demand type heat fixing method. .
【０００７】オンデマンド方式の熱定着法には上記のよ
うな機構を使用することから、これに用いられるエンド
レスベルトには十分な耐熱性、弾性、強度、ベルト内面
の絶縁性、ベルト外面の離型性等が要求される。そして
これに答えるものとして、耐熱性樹脂からなる内側層と
離型性を有する樹脂からなる外側層の２層から構成され
た定着用フィルムからなるベルトが一般に使用されてい
る。Since the above-described mechanism is used in the on-demand type heat fixing method, the endless belt used in the heat fixing method has sufficient heat resistance, elasticity, strength, insulating property on the inner surface of the belt, and separation of the outer surface of the belt. Demands for moldability. To respond to this, a belt made of a fixing film composed of two layers, an inner layer made of a heat-resistant resin and an outer layer made of a releasable resin, is generally used.
【０００８】さらに定着用ベルトは良好な熱伝導性を有
する必要があるため、耐熱性樹脂層中に窒化ホウ素等の
熱伝導性無機粒子を分散させて熱伝導性を高めることが
提案されている（特開平６−２２２６９５号、特開平７
−１１０６３２号等）。ところがこのような熱伝導性無
機粒子を耐熱性樹脂層中に含有させると、ベルトの熱伝
導性を改良することはできるものの、一方ではベルトの
機械的強度を低下させるという問題が生じる。熱伝導性
無機粒子の添加量を増加させると、特に上記のような熱
定着方式で実際に使用される２００℃前後の温度におけ
る強度が大幅に低下し、ベルトに使用するフィルムのし
わの発生や破壊が生じやすい。Further, since the fixing belt needs to have good thermal conductivity, it has been proposed to disperse thermally conductive inorganic particles such as boron nitride in the heat-resistant resin layer to enhance the thermal conductivity. (Japanese Unexamined Patent Application Publication No.
No. 110632). However, when such heat conductive inorganic particles are contained in the heat resistant resin layer, the heat conductivity of the belt can be improved, but on the other hand, there is a problem that the mechanical strength of the belt is reduced. When the amount of the thermally conductive inorganic particles is increased, the strength at a temperature of about 200 ° C., which is actually used in the heat fixing method as described above, is significantly reduced, and the occurrence of wrinkling of the film used for the belt and Destruction is easy to occur.
【０００９】[0009]
【発明が解決しようとする課題】上記のような問題に対
し、耐熱性樹脂層中に熱伝導性無機粒子を分散させても
その機械的強度が低下しないようにできれば、上記のよ
うな定着ベルトの機械的強度を低下させずに熱伝導性を
改善することができ、熱定着をさらに高速化すること等
に対応できる。In order to solve the above-mentioned problem, if the mechanical strength of the heat conductive resin layer can be prevented from lowering even when the heat conductive inorganic particles are dispersed in the heat resistant resin layer, the fixing belt as described above is required. The thermal conductivity can be improved without lowering the mechanical strength of the film, and it is possible to cope with a further increase in the speed of thermal fixing.
【００１０】そこで本発明の目的は、熱伝導性無機粒子
を含む耐熱性樹脂層と離型性樹脂層からなる定着用フィ
ルムであって、高い熱伝導性と高い機械的強度を兼ね備
えた定着用フィルムを提供することである。Accordingly, an object of the present invention is to provide a fixing film comprising a heat-resistant resin layer containing heat-conductive inorganic particles and a release resin layer, the fixing film having both high thermal conductivity and high mechanical strength. Is to provide a film.
【００１１】[0011]
【課題を解決するための手段】本発明者らの研究の結
果、上記のような熱伝導性無機粒子を含む耐熱性樹脂層
と離型性樹脂層からなる定着用フィルムにおいては、平
均粒径が十分に小さくても、比較的粒径の大きい無機粒
子が耐熱性樹脂層に存在するとその粒子の存在自体が耐
熱性樹脂層の欠陥となり、また耐熱性樹脂層に空気が巻
き込まれて空隙が形成されやすく、これらが耐熱性樹脂
層、ひいては定着フィルムの機械的強度の低下の大きな
原因となっていることが見出された。As a result of the study of the present inventors, the fixing film comprising the heat-resistant resin layer containing the heat-conductive inorganic particles and the release resin layer as described above has an average particle diameter. Even if the particle size is sufficiently small, if relatively large inorganic particles are present in the heat-resistant resin layer, the presence of the particles itself will cause a defect in the heat-resistant resin layer, and air will be entrained in the heat-resistant resin layer to form voids It was found that they were easily formed, and these were the major causes of the decrease in the mechanical strength of the heat-resistant resin layer, and eventually the fixing film.
【００１２】従って本発明によれば、耐熱性樹脂層に分
散される熱伝導性粒子から一定以上の粒径を有する粒子
を排除することとし、熱伝導性無機粒子が１０μｍを越
える粒径の粒子を実質的に含まないことを特徴とする定
着用フィルムを提供するものである。Therefore, according to the present invention, the heat conductive particles dispersed in the heat resistant resin layer are excluded from particles having a certain diameter or more, and the heat conductive inorganic particles having a particle diameter exceeding 10 μm are excluded. A fixing film characterized by substantially not containing the same.
【００１３】本発明の定着用フィルムの好ましい態様に
おいては、耐熱性樹脂層の表面粗さ（Ｒｚ）が３μｍ以
下である。In a preferred embodiment of the fixing film of the present invention, the surface roughness (Rz) of the heat-resistant resin layer is 3 μm or less.
【００１４】別の本発明の定着用フィルムの好ましい態
様においては、熱伝導率が２×１０-3Ｃａｌ／ｃｍ・秒
・℃以上である。[0014] In a preferred embodiment of the fixing film by the present invention, the thermal conductivity of 2 × 10 - it is 3Cal / cm · sec · ° C. or higher.
【００１５】さらに別の本発明の定着用フィルムの好ま
しい態様においては、２００℃及び２５℃での引張強度
が１５ｋｇｆ／ｍｍ2 以上である。In another preferred embodiment of the fixing film of the present invention, the tensile strength at 200 ° C. and 25 ° C. is 15 kgf / mm 2 or more.
【００１６】[0016]
【発明の実施の形態】以下、本発明について詳述する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
【００１７】本発明の定着用フィルムは、耐熱性樹脂か
らなる内側層（耐熱性樹脂層）と離型性樹脂からなる外
側層（離型性樹脂層）により構成され、耐熱性樹脂層は
熱伝導性無機粒子を含む。The fixing film of the present invention comprises an inner layer made of a heat-resistant resin (heat-resistant resin layer) and an outer layer made of a release resin (release resin layer). Contains conductive inorganic particles.
【００１８】耐熱性樹脂層に使用される耐熱性樹脂は従
来の定着用ベルトに使用されるものでよく、例えば、ポ
リイミド、ポリアミドイミド、ポリベンズイミダゾー
ル、ポリベンズオキサゾール、ポリフェニレンサルファ
イド、ポリエーテルエーテルケトン、ポリエーテルスル
ホン、ポリエーテルイミド等が挙げられる。これらの耐
熱性樹脂の中では、ポリイミドやポリアミドイミドが特
に好ましい。このような樹脂を使用することにより定着
用フィルムの絶縁性及び耐熱性が確保される。The heat-resistant resin used for the heat-resistant resin layer may be the one used for conventional fixing belts. Examples thereof include polyimide, polyamideimide, polybenzimidazole, polybenzoxazole, polyphenylene sulfide, and polyether ether ketone. , Polyether sulfone, polyether imide and the like. Among these heat resistant resins, polyimide and polyamide imide are particularly preferred. The use of such a resin ensures the insulation and heat resistance of the fixing film.
【００１９】さらにこれらの樹脂単体では熱伝導率が低
いので、絶縁性で熱伝導性の無機粒子を含有させる。Furthermore, since these resins alone have low thermal conductivity, they contain insulating and thermally conductive inorganic particles.
【００２０】このような熱伝導性無機粒子を構成する物
質自体はこれまでに定着用ベルトの耐熱性樹脂層に添加
するものとして提案されているものと同様のものでよ
く、例えば、窒化ホウ素、アルミナ、炭化ケイ素、チタ
ン酸カリウム、窒化アルミ、マイカ、シリカ、酸化チタ
ン、タルク、炭酸カルシウム等を挙げることができる。
これらの物質は２種以上の混合物としても使用すること
ができる。熱伝導性無機粒子を構成する物質としては、
窒化ホウ素、アルミナ、炭化ケイ素、窒化アルミニウム
が好ましく、窒化ホウ素が特に好ましい。The substance itself constituting such thermally conductive inorganic particles may be the same as that which has been proposed to be added to the heat-resistant resin layer of the fixing belt, for example, boron nitride, Alumina, silicon carbide, potassium titanate, aluminum nitride, mica, silica, titanium oxide, talc, calcium carbonate and the like can be mentioned.
These substances can be used as a mixture of two or more kinds. As a material constituting the thermally conductive inorganic particles,
Boron nitride, alumina, silicon carbide, and aluminum nitride are preferred, and boron nitride is particularly preferred.
【００２１】上記のような無機粒子は、例えば平均粒径
が１０μｍのものでも通常は２０μｍ程度までの粒径の
粒子を含んでおり、このような粒径の大きい粒子が上記
のように強度の低下の大きな原因となっていたものであ
る。The above-mentioned inorganic particles include particles having an average particle diameter of, for example, 10 μm but usually having a particle diameter of up to about 20 μm. This was a major cause of the decline.
【００２２】これに対し本発明においては、このような
熱伝導性無機粒子の粒径の上限を制限することによりフ
ィルムの良好な熱伝導性と機械的強度を両立させるもの
であり、本発明の定着用フィルムの耐熱性樹脂層に含有
させる熱伝導性無機粒子は、約１０μｍ、好ましくは約
７μｍを越える粒径を有する粒子を実質的に含まないも
のとする。このような熱伝導性無機粒子を使用すること
により、下記の実施例に具体的に示すようにフィルムの
良好な熱伝導性と十分な機械的強度が得られる。On the other hand, in the present invention, by limiting the upper limit of the particle size of such thermally conductive inorganic particles, both good thermal conductivity and mechanical strength of the film are achieved. The thermally conductive inorganic particles contained in the heat-resistant resin layer of the fixing film are substantially free from particles having a particle size of about 10 μm, preferably, about 7 μm. By using such thermally conductive inorganic particles, good thermal conductivity and sufficient mechanical strength of the film can be obtained as specifically shown in the following examples.
【００２３】尚、本発明にいう熱伝導性無機粒子の「粒
径」は、このような粒子に通常に使用される意味を有
し、各粒子について、最大径と最小径の平均値をいうも
のである。The "particle size" of the thermally conductive inorganic particles referred to in the present invention has a meaning normally used for such particles, and means an average value of a maximum diameter and a minimum diameter for each particle. Things.
【００２４】本発明に使用される熱伝導性無機粒子は上
記のような条件を満足している限り、その平均粒径は特
に制限されるものではなく、通常の樹脂組成物に添加さ
れる無機充填剤と同様のものでよいが、分散性や平滑な
層を得ること等の観点から、通常は０．５〜１０μｍ、
好ましくは０．５〜７μｍ程度である。The average particle size of the thermally conductive inorganic particles used in the present invention is not particularly limited as long as the above conditions are satisfied. The same as the filler may be used, but from the viewpoint of obtaining a dispersibility and a smooth layer, usually 0.5 to 10 μm,
Preferably it is about 0.5 to 7 μm.
【００２５】０．５μｍ未満であると、熱伝導性の向上
効果が小さく、また粒子の凝集によりフィルムに凹凸を
生じることがある。粒子の平均粒径の上限については、
上記のように粒子の最大径を制限しているので、実質的
にその制限された最大径に達することはなく、そのよう
な最大径未満の平均粒径において本発明の目的を達成す
ることができる。If it is less than 0.5 μm, the effect of improving the thermal conductivity is small, and irregularities may be formed on the film due to aggregation of particles. Regarding the upper limit of the average particle size of the particles,
Since the maximum diameter of the particles is limited as described above, the object of the present invention can be achieved at an average particle diameter smaller than such a maximum diameter without substantially reaching the limited maximum diameter. it can.
【００２６】熱伝導性無機粒子の耐熱性樹脂層中の含有
量も特に制限されるものではないが、熱伝導性の向上、
機械的強度の維持等の観点から、通常は５〜３０容量
％、好ましくは１０〜２５容量％程度である。この範囲
内であれば、樹脂単体からなる層とほぼ同様の柔軟性を
確保した上で、熱伝導性と剛性を向上させることができ
る。含有量が５容量％未満であると十分な熱伝導性向上
効果が得られず、３０容量％を越えると可撓性や強度が
不十分となり、定着用ベルトとして使用した場合に割れ
や破壊を生じやすい。The content of the heat-conductive inorganic particles in the heat-resistant resin layer is not particularly limited, either.
From the viewpoint of maintenance of mechanical strength and the like, it is usually about 5 to 30% by volume, preferably about 10 to 25% by volume. Within this range, it is possible to improve the thermal conductivity and the rigidity while securing substantially the same flexibility as the layer made of the resin alone. If the content is less than 5% by volume, a sufficient effect of improving thermal conductivity cannot be obtained. If the content exceeds 30% by volume, flexibility and strength become insufficient, and cracks and breakage occur when used as a fixing belt. Easy to occur.
【００２７】また熱伝導性無機粒子の形状は、球状、鱗
片状（平板状）、繊維状等のいずれでもよいが、これら
の中でも平板状の粒子が、凹凸が少なく表面の滑らかな
フィルムが得られ、なおかつ球状の粒子フィラーの場合
より高い剛性が得られるため、特に好ましい。The shape of the thermally conductive inorganic particles may be any of spherical, flaky (flat), fibrous, etc. Among them, the flat particles have a smooth surface with little unevenness. It is particularly preferable because the stiffness is higher than that of the spherical particle filler.
【００２８】耐熱性樹脂層の厚さも特に制限されない
が、通常は１０〜７０μｍ、好ましくは３０〜６０μｍ
程度である。Although the thickness of the heat-resistant resin layer is not particularly limited, it is usually 10 to 70 μm, preferably 30 to 60 μm.
It is about.
【００２９】定着用フィルムの外層を構成する離型性樹
脂は、従来の定着用フィルムの離型性樹脂層を構成する
ものでよく、通常はフッ素樹脂が使用される。The releasable resin constituting the outer layer of the fixing film may be a releasable resin layer of a conventional fixing film, and usually a fluororesin is used.
【００３０】フッ素樹脂としては、定着用ベルトを２０
０℃前後の高温で連続使用可能とするために耐熱性に優
れたものが好ましく、例えば、テトラフルオロエチレン
樹脂（ＰＴＦＥ）、テトラフルオロエチレン／パーフル
オロアルコキシエチレン共重合体（ＰＦＡ）、テトラフ
ルオロエチレン／ヘキサフルオロプロピレン共重合体
（ＦＥＰ）等が挙げられる。As the fluororesin, a fixing belt of 20
In order to enable continuous use at a high temperature of about 0 ° C., those excellent in heat resistance are preferable. For example, tetrafluoroethylene resin (PTFE), tetrafluoroethylene / perfluoroalkoxyethylene copolymer (PFA), tetrafluoroethylene / Hexafluoropropylene copolymer (FEP).
【００３１】このような離型性樹脂層には導電性フィラ
ーを含有させることにより導電性を付与して帯電による
オフセットを防止することが好ましい。It is preferable that such a releasing resin layer contains a conductive filler to impart conductivity to prevent offset due to charging.
【００３２】このような目的に使用される導電性フィラ
ーの種類は特に限定されないが、例えば、ケッチェンブ
ラック等のカーボンブラックやアルミニウム等の金属粉
を挙げることができる。導電性フィラーの平均粒子径
は、安定した均一な導電性を得るために、０．５μｍ以
下であることが好ましい。The kind of the conductive filler used for such purpose is not particularly limited, and examples thereof include carbon black such as Ketjen black and metal powder such as aluminum. The average particle size of the conductive filler is preferably 0.5 μm or less in order to obtain stable and uniform conductivity.
【００３３】導電性フィラーの含有量は、通常、樹脂に
対して０．１〜５重量％程度である。ただし、離型性樹
脂層の導電性が高すぎると、記録紙上のトナーが定着用
ベルトの離型性樹脂層と接触した際にトナーの電荷が離
型性樹脂層に流れて、記録紙とトナーとの間の吸引力が
失われることがある。このような現象を防止するために
は、外層の表面抵抗率を１×１０12〜１×１０15Ω／□
とすることが好ましい。The content of the conductive filler is usually about 0.1 to 5% by weight based on the resin. However, if the conductivity of the release resin layer is too high, when the toner on the recording paper comes into contact with the release resin layer of the fixing belt, the charge of the toner flows to the release resin layer, and the recording paper and The suction force between the toner and the toner may be lost. In order to prevent such a phenomenon, the surface resistivity of the outer layer is set to 1 × 10 12 to 1 × 10 15 Ω / □.
It is preferable that
【００３４】離型性樹脂層の厚さも特に制限されない
が、通常は１〜３０μｍ、好ましくは５〜１５μｍ程度
である。Although the thickness of the release resin layer is not particularly limited, it is usually about 1 to 30 μm, preferably about 5 to 15 μm.
【００３５】耐熱性樹脂層と離型性樹脂層との間には、
両者の接着性を高めるために両層の樹脂に接着性を有す
る樹脂からなる中間層（プライマー層）を設けてもよ
い。プライマー層は、例えば離型性樹脂層樹脂がフッ素
樹脂からなる場合にはフッ素樹脂とポリアミドイミドの
混合物、フッ素樹脂とポリエーテルスルホンの混合物等
からなるものとすることができる。溶媒中にこれらの樹
脂を溶解または分散したものがフッ素樹脂用プライマー
として市販されており、好適に使用できる。そのような
市販のフッ素樹脂用プライマーとしては、例えばデュポ
ンジャパン社製プライマー８５５−００１、テフロン８
５５−３００、ダイキン工業社製ポリフロンＥＫ−１７
００、ポリフロンＥＫ−１８００、ポリフロンＥＫ−１
９００等がある。このようなプライマー層も上記のよう
な導電性フィラーを含有してもよい。プライマー層の厚
さは通常、０．１〜２０μｍ、好ましくは１〜１０μｍ
程度である。Between the heat-resistant resin layer and the release resin layer,
In order to enhance the adhesiveness between the two, an intermediate layer (primer layer) made of a resin having adhesiveness may be provided on both layers of the resin. The primer layer may be made of, for example, a mixture of a fluororesin and a polyamideimide, a mixture of a fluororesin and a polyethersulfone when the release resin layer resin is made of a fluororesin. Those obtained by dissolving or dispersing these resins in a solvent are commercially available as primers for fluororesins and can be suitably used. Examples of such commercially available primers for fluororesin include primers 855-001 and Teflon 8 manufactured by DuPont Japan.
55-300, Polykin EK-17 manufactured by Daikin Industries, Ltd.
00, polyflon EK-1800, polyflon EK-1
900 and others. Such a primer layer may also contain the conductive filler as described above. The thickness of the primer layer is usually 0.1-20 μm, preferably 1-10 μm
It is about.
【００３６】本発明の定着用フィルムは、公知の定着用
ベルトと同様の方法により製造できる。例えば、円柱形
状の金型上に、上記のような耐熱性樹脂層を形成する樹
脂あるいはその前駆体を溶媒中に含むワニスを塗布し、
熱処理等により溶媒を除去した後、任意にプライマー層
を形成する樹脂組成物を塗布して乾燥し、さらに離型性
樹脂層を形成する樹脂組成物を含む液を塗布及び乾燥し
た後、必要により耐熱性樹脂や離型性樹脂を焼成するこ
とにより製造できる。The fixing film of the present invention can be manufactured by the same method as that for a known fixing belt. For example, on a cylindrical mold, apply a varnish containing a resin or a precursor thereof for forming a heat-resistant resin layer as described above in a solvent,
After removing the solvent by heat treatment or the like, optionally apply and dry a resin composition for forming a primer layer, and further apply and dry a liquid containing the resin composition for forming a release resin layer, if necessary. It can be manufactured by baking a heat-resistant resin or a release resin.
【００３７】耐熱性樹脂がポリイミドの場合、耐熱性樹
脂の前駆体として例えば芳香族テトラカルボン酸成分と
芳香族ジアミン成分とを使用することができ、これらを
有機極性溶媒中で反応させて前記樹脂を得ることができ
る。芳香族テトラカルボン酸成分としては例えば、３，
３’，４，４’−ビフェニルテトラカルボン酸二無水
物、２，３’，４，４’−ベンゾフェノンテトラカルボ
ン酸二無水物、ピロメリット酸二無水物等があり、これ
らは混合物として用いてもよい。芳香族ジアミン成分と
しては例えば、３，３’−ジアミノジフェニルエーテ
ル、３，３’−ジメトキシ−４，４’−ジアミノジフェ
ニルエーテル、４，４’−ジアミノジフェニルエーテル
等のジフェニルエーテル系ジアミン、３，３’−ジフェ
ニルチオエーテル、４，４’−ジアミノジフェニルチオ
エーテル等のジフェニチオエーテル系ジアミン、４，
４’−ジアミノベンゾフェノン等のベンゾフェノン系ジ
アミン、その他ジフェニルメタン系ジアミンパラフェニ
レンジアミン、メタフェニレンジアミン等を挙げること
ができる。有機極性溶媒としては、例えばＮ−メチルピ
ロリドン、ジメチルホルムアミド、ジメチルアセトアミ
ド、フェノール、ｏ−クレゾール、ｍ−クレゾール、ｐ
−クレゾール、ジメチルオキシド等が挙げられる。When the heat-resistant resin is a polyimide, for example, an aromatic tetracarboxylic acid component and an aromatic diamine component can be used as precursors of the heat-resistant resin. Can be obtained. As the aromatic tetracarboxylic acid component, for example, 3,
There are 3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3', 4,4'-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride and the like, and these are used as a mixture. Is also good. Examples of the aromatic diamine component include diphenyl ether diamines such as 3,3′-diaminodiphenyl ether, 3,3′-dimethoxy-4,4′-diaminodiphenyl ether, and 4,4′-diaminodiphenyl ether, and 3,3′-diphenyl Thioethers, diphenylthioether-based diamines such as 4,4′-diaminodiphenylthioether,
Benzophenone diamines such as 4'-diaminobenzophenone, and other diphenylmethane diamines paraphenylenediamine, metaphenylenediamine and the like can be mentioned. Examples of the organic polar solvent include N-methylpyrrolidone, dimethylformamide, dimethylacetamide, phenol, o-cresol, m-cresol, and p-methylpyrrolidone.
-Cresol, dimethyl oxide and the like.
【００３８】離型性樹脂層にフッ素樹脂を用いる場合、
プライマー層は上記のようなフッ素樹脂用プライマーか
ら形成することができ、また離型層は市販のフッ素樹脂
ディスパージョン（例えばデュポンジャパン社製トップ
コート８５５−１０１）等から形成することができる。When a fluororesin is used for the release resin layer,
The primer layer can be formed from a fluororesin primer as described above, and the release layer can be formed from a commercially available fluororesin dispersion (for example, Topcoat 855-101 manufactured by DuPont Japan).
【００３９】上記のようにして製造された本発明の定着
用フィルムにおいては、耐熱性樹脂層に含まれる無機粒
子が大きな粒径のものを含んでいないので、耐熱性樹脂
層表面が従来のフィルムより平滑になり、結果として高
画質のトナー画像が得られるという効果も得られる。本
発明の定着用フィルムにおいては、耐熱性樹脂層のＪＩ
Ｓ−Ｂ０６０１による表面粗さ（Ｒｚ）はほぼ３μｍ以
下となる。In the fixing film of the present invention produced as described above, since the inorganic particles contained in the heat-resistant resin layer do not include those having a large particle size, the surface of the heat-resistant resin layer has a conventional film. The effect is also obtained that the image becomes smoother and a high quality toner image is obtained as a result. In the fixing film of the present invention, the heat-resistant resin layer JI
The surface roughness (Rz) by S-B0601 is approximately 3 μm or less.
【００４０】また、上記のような構成を有する本発明の
定着用フィルムでは一般に、２×１０-3Ｃａｌ／ｃｍ・
秒・℃以上のフィルム自体の熱伝導率、また２００℃及
び２５℃において１５ｋｇｆ／ｍｍ2 以上、より好まし
くは１８ｋｇｆ／ｍｍ2 の引張強度が得られる。In the fixing film of the present invention having the above-mentioned structure, generally, 2 × 10 −3 Cal / cm ·
The thermal conductivity of the second · ° C. or more film itself, also 200 ° C. and 25 ° C. In 15 kgf / mm 2 or more, more preferably a tensile strength of 18 kgf / mm 2 is obtained.
【００４１】[0041]
【実施例】以下、本発明を実施例及び比較例によりさら
に説明するが、本発明はこれらの実施例のみに限定され
るものではない。EXAMPLES Hereinafter, the present invention will be further described with reference to Examples and Comparative Examples, but the present invention is not limited to only these Examples.
【００４２】実施例１ ４，４’−ジアミノジフェニルエーテル(100 g, 0.5 mo
l)とピロメリット酸二無水物(110.5 g, 0.5 mol)をフラ
スコに入れ、ジメチルアセトアミド／ナフサの混合溶媒
(9:1, 800 ml) を加えて溶解し、重合させて樹脂分２０
重量％、粘度２０００ポアズのポリイミド前駆体溶液を
調製した。Example 1 4,4'-Diaminodiphenyl ether (100 g, 0.5 mol
l) and pyromellitic dianhydride (110.5 g, 0.5 mol) are placed in a flask, and a mixed solvent of dimethylacetamide / naphtha
(9: 1, 800 ml) was added and dissolved.
A polyimide precursor solution having a weight percentage of 2000 poise and viscosity was prepared.
【００４３】このポリイミド前駆体溶液に、粒径８μｍ
以上の粗粒分を除去した窒化ホウ素粉末（信越化学社
製、ＫＢＮ（ｈ）−ＳＰ、平均粒径１．０１μｍ）を１
０容量％添加し、撹拌機で６０分間撹拌した後、真空脱
泡を行い、絶縁性の熱伝導性無機粒子を含むワニスを得
た。This polyimide precursor solution was added with a particle size of 8 μm.
The boron nitride powder (KBN (h) -SP, manufactured by Shin-Etsu Chemical Co., Ltd., average particle size: 1.01 μm) from which the above coarse particles were removed was 1
After adding 0% by volume and stirring with a stirrer for 60 minutes, vacuum degassing was performed to obtain a varnish containing insulating heat conductive inorganic particles.
【００４４】外径３０ｍｍ、長さ３５０ｍｍの円筒形金
属芯体上に上記ワニスを塗布し、内径３１ｍｍのダイス
を芯体にはめて自然落下させて塗布膜を得た。得られた
塗布膜を３００℃に３０分間加熱し、冷却後芯体から抜
いて厚さエンドレスベルト状フィルムを得た。The varnish was applied on a cylindrical metal core having an outer diameter of 30 mm and a length of 350 mm, and a die having an inner diameter of 31 mm was put on the core and allowed to fall naturally to obtain a coating film. The obtained coating film was heated to 300 ° C. for 30 minutes, and after cooling, pulled out from the core to obtain an endless belt-like film.
【００４５】このフィルム上にプライマー層用塗料（デ
ュポンジャパン社製、プライマー８５５−００１、ポリ
アミドイミド、ＰＴＦＥ、ＰＦＡ等の混合物を含む分散
物）をスプレー塗布して乾燥させた。その後さらにその
上にフッ素樹脂ディスパージョン（デュポンジャパン社
製、トップコート８５５−１０１）をスプレー塗布し、
フィルムを４００℃で２０分間熱処理することにより本
発明の定着用フィルムを得た。A paint for a primer layer (a dispersion containing a mixture of primer 855-001, polyamideimide, PTFE, PFA, etc., manufactured by DuPont Japan) was spray-coated on the film and dried. Thereafter, a fluororesin dispersion (DuPont Japan, Topcoat 855-101) is further spray-coated thereon,
The film was heat-treated at 400 ° C. for 20 minutes to obtain a fixing film of the present invention.
【００４６】得られた定着用フィルムの耐熱性樹脂層、
プライマー層及び離型性樹脂層の厚さはそれぞれ５０μ
ｍ、５μｍ及び１０μｍであった。Heat-resistant resin layer of the obtained fixing film,
The thickness of the primer layer and the release resin layer is 50μ each.
m, 5 μm and 10 μm.
【００４７】比較例 耐熱性樹脂層に添加する熱伝導性無機粒子として粗粒分
を除去していない窒化ホウ素粉末（昭和電工社製、ＵＨ
Ｐ−Ｓ１、平均粒径１．０〜２．０μｍ）を使用した以
外は実施例と同様にして定着用フィルムを作製した。Comparative Example As heat conductive inorganic particles to be added to the heat resistant resin layer, boron nitride powder from which coarse particles were not removed (UH, manufactured by Showa Denko KK)
A fixing film was produced in the same manner as in the example except that P-S1, average particle size of 1.0 to 2.0 μm) was used.
【００４８】上記で得た実施例と比較例の定着用フィル
ムについて引張強度（ＪＩＳ Ｋ６３０１）及び引裂強
度（ＪＩＳ Ｋ６３０１）を室温（２５℃）とフィルム
の通常の使用温度である２００℃で測定した。The tensile strength (JIS K6301) and the tear strength (JIS K6301) of the fixing films obtained in Examples and Comparative Examples obtained above were measured at room temperature (25 ° C.) and 200 ° C., which is a normal use temperature of the film. .
【００４９】またフィルム全体の熱伝導率を迅速熱伝導
率計（京都電子社製、ＱＴＭ−Ｄ３）で、耐熱性樹脂層
表面の表面粗さを表面粗さ測定器（小坂研究所製、ＳＥ
−３Ｈ）で測定した。結果を下記表１に示す。The thermal conductivity of the entire film was measured with a rapid thermal conductivity meter (QTM-D3, manufactured by Kyoto Electronics Co., Ltd.), and the surface roughness of the surface of the heat-resistant resin layer was measured with a surface roughness measuring instrument (SE, manufactured by Kosaka Laboratories, Inc.)
-3H). The results are shown in Table 1 below.
【００５０】[0050]
【表１】 上記の通り、本発明の定着用のフィルムはその強度、熱
伝導率及び耐熱性樹脂層の表面粗さにおいて、粗粒分を
排除しない窒化ホウ素を使用した比較例と比べて明らか
に優れている。[Table 1] As described above, the fixing film of the present invention is clearly superior in strength, thermal conductivity and surface roughness of the heat-resistant resin layer as compared with the comparative example using boron nitride which does not exclude coarse particles. .
【００５１】[0051]
【発明の効果】本発明の定着用フィルムによれば、高い
熱伝導性と高い機械的強度が両立され、ファクシミリ、
プリンター等をさらに高速化することに対応できる。According to the fixing film of the present invention, high thermal conductivity and high mechanical strength are compatible, and facsimile,
It can cope with further speeding up of printers and the like.
【００５２】また本発明の定着用フィルムの表面粗さは
従来のものよりも有意に小さく、従って表面が平滑であ
るので、高画質のトナー画像を得ることができる。Further, the surface roughness of the fixing film of the present invention is significantly smaller than that of the conventional film, and the surface is smooth, so that a high quality toner image can be obtained.
【００５３】さらに本発明の定着用フィルムは強度が高
いのでシワが発生しにくく、結果としてフィルムが長寿
命となる。Further, since the fixing film of the present invention has high strength, wrinkles are hardly generated, and as a result, the film has a long life.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平７−199699（ＪＰ，Ａ) 特開 平８−286536（ＪＰ，Ａ) 特開 平６−222695（ＪＰ，Ａ) 特開 平９−328610（ＪＰ，Ａ) 特開 平２−162382（ＪＰ，Ａ) 特開 平５−84848（ＪＰ，Ａ) 特開 平３−25478（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) G03G 13/20 G03G 15/20 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-7-199699 (JP, A) JP-A-8-286536 (JP, A) JP-A-6-222695 (JP, A) JP-A 9-1996 328610 (JP, A) JP-A-2-162382 (JP, A) JP-A-5-84848 (JP, A) JP-A-3-25478 (JP, A) (58) Fields investigated (Int. 6 , DB name) G03G 13/20 G03G 15/20
Claims (5)
離型性樹脂層からなる定着用フィルムであって、熱伝導
性無機粒子が10μｍを超える粒径の粒子を実質的に含ま
ず、前記耐熱性樹脂層の表面粗さ（Rz）が3μｍ以下で
あることを特徴とする定着用フィルム。1. A fixing film comprising a heat-resistant resin layer containing heat-conductive inorganic particles and a release resin layer, wherein the heat-conductive inorganic particles substantially contain particles having a particle size exceeding 10 μm.
And the surface roughness (Rz) of the heat-resistant resin layer is 3 μm or less.
Fixing film characterized in that a.
る請求項１に記載の定着用フィルム。2. The fixing film according to claim 1, wherein the thermally conductive inorganic particles are boron nitride particles.
または２に記載の定着用フィルム。3. The release resin according to claim 1, wherein the release resin is a fluororesin.
Or the fixing film according to item 2.
ある請求項１〜３のいずれかに記載の定着用フィルム。4. The fixing film according to claim 1 , which has a thermal conductivity of 2 × 10 −3 Cal / cm · sec · ° C. or more.
m2以上である請求項１〜４のいずれかに記載の定着用フ
ィルム。5. The tensile strength at 200 ° C. and 25 ° C. is 15 kgf / m.
The fixing film according to any one of claims 1 to 4 , which has a m 2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9008481A JP2983484B2 (en) | 1997-01-21 | 1997-01-21 | Fixing film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9008481A JP2983484B2 (en) | 1997-01-21 | 1997-01-21 | Fixing film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10207268A JPH10207268A (en) | 1998-08-07 |
| JP2983484B2 true JP2983484B2 (en) | 1999-11-29 |
Family
ID=11694307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9008481A Expired - Fee Related JP2983484B2 (en) | 1997-01-21 | 1997-01-21 | Fixing film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2983484B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012088741A (en) * | 2012-01-23 | 2012-05-10 | Canon Inc | Heat fixing divice and metallic substrate used for sleeve thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4233277B2 (en) * | 2001-12-26 | 2009-03-04 | ジャパンゴアテックス株式会社 | Fluororesin tube |
| JP4708089B2 (en) * | 2005-05-18 | 2011-06-22 | 日東電工株式会社 | Color image fixing belt |
-
1997
- 1997-01-21 JP JP9008481A patent/JP2983484B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012088741A (en) * | 2012-01-23 | 2012-05-10 | Canon Inc | Heat fixing divice and metallic substrate used for sleeve thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10207268A (en) | 1998-08-07 |
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