JP2957229B2 - Cleaning equipment for substrate surface - Google Patents
Cleaning equipment for substrate surfaceInfo
- Publication number
- JP2957229B2 JP2957229B2 JP2130246A JP13024690A JP2957229B2 JP 2957229 B2 JP2957229 B2 JP 2957229B2 JP 2130246 A JP2130246 A JP 2130246A JP 13024690 A JP13024690 A JP 13024690A JP 2957229 B2 JP2957229 B2 JP 2957229B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pure water
- cleaning
- substrate surface
- cleaning tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、超微細な氷粒子を基板表面に噴射して基
板の表面の洗浄を行う基板表面の洗浄装置に関するもの
である。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate surface cleaning apparatus that cleans a substrate surface by spraying ultrafine ice particles onto the substrate surface.
第２図は従来の基板表面の洗浄装置の一例を示す模式
図であり、図において、（１）は微細凍結粒子を生成す
るための製氷ホッパー、（２）は液体窒素等の冷媒体、
（３）は先端が製氷ホッパー（１）内に臨んでおり純水
を微噴霧するノズル、（４）は生成された微細凍結粒
子、（５）は非洗浄体である半導体等の基板、（６）は
基板（５）の洗浄を行う洗浄槽、（７）は基板（５）を
固定する支持部、（８）は微細凍結粒子（４）を基板
（５）に向けて噴射する噴射ノズル、（９）は洗浄槽
（６）内の排気を行う排気ブロワー、（10）は基板
（５）に向けて純水を噴射するリンスノズルである。FIG. 2 is a schematic view showing an example of a conventional substrate surface cleaning apparatus. In the figure, (1) is an ice making hopper for generating fine frozen particles, (2) is a cooling medium such as liquid nitrogen,
(3) is a nozzle for spraying pure water with its tip facing the inside of the ice making hopper (1), (4) is generated fine frozen particles, (5) is a non-cleaning substrate such as a semiconductor, 6) a cleaning tank for cleaning the substrate (5); (7) a support for fixing the substrate (5); and (8) an injection nozzle for injecting the fine frozen particles (4) toward the substrate (5). , (9) are exhaust blowers for exhausting the inside of the cleaning tank (6), and (10) is a rinse nozzle for injecting pure water toward the substrate (5).
次に、動作について説明する。第２図において製氷ホ
ッパー（１）内に液体窒素等の冷媒体（２）を注入し、
スプレーノズル（３）による超純水等の被凍結液体を微
噴射して微細凍結粒子（４）を得る。洗浄槽（６）内に
設置されている噴射ノズル（８）は、気体の噴射による
エジェクター方式によって製氷ホッパー（１）内の微細
凍結粒子（４）を引き込み、キャリアガスとともに基板
（５）に向けて噴射する。基板（５）の表面上の汚染物
は噴射された微細凍結粒子（４）の衝突によって除去さ
れる。Next, the operation will be described. In FIG. 2, a cooling medium (2) such as liquid nitrogen is injected into an ice making hopper (1).
The liquid to be frozen such as ultrapure water is finely sprayed by the spray nozzle (3) to obtain fine frozen particles (4). An injection nozzle (8) installed in a cleaning tank (6) draws fine frozen particles (4) in an ice making hopper (1) by an ejector method by jetting gas and directs the fine frozen particles (4) together with a carrier gas toward a substrate (5). To inject. Contaminants on the surface of the substrate (5) are removed by the impact of the jetted fine frozen particles (4).
ところで、洗浄槽（６）内は排気ブロワー（９）によ
って排気されており、除去された汚染物は洗浄槽（６）
の外へ排出されるが、噴射ノズル（８）から噴射される
キャリヤガスによって、洗浄槽（６）内の気流が乱れる
ことにより、一度基板（５）から除去された汚染物が再
度基板（５）に付着することがある。これを防ぐために
洗浄槽（６）内に設けられたリンスノズル（10）により
純水を基板（５）に噴き付け、純水の流れによって汚染
物を基板（５）の表面から洗い流している。洗浄の際、
微細凍結粒子（４）の衝突による基板（５）へのダメー
ジは、噴射ノズル（８）に送るキャリヤガスの圧力調節
（例えば2Kg/cm2〜4Kg/cm2）による微細凍結粒子（４）
の噴射速度変化によって制御される。By the way, the inside of the cleaning tank (6) is exhausted by the exhaust blower (9), and the removed contaminants are removed from the cleaning tank (6).
However, the contaminants once removed from the substrate (5) are removed again by the carrier gas injected from the injection nozzle (8), which disturbs the air flow in the cleaning tank (6). ). To prevent this, pure water is sprayed onto the substrate (5) by a rinse nozzle (10) provided in the cleaning tank (6), and contaminants are washed off the surface of the substrate (5) by the flow of the pure water. When washing
Fine frozen particles (4) damage to the substrate (5) by collision, the pressure adjustment of carrier gas sent to the injection nozzle (8) (e.g. 2Kg / cm 2 ~4Kg / cm 2 ) by fine frozen particles (4)
Is controlled by the change in the injection speed.
従来の基板表面の洗浄装置は以上のように構成されて
いるので、洗浄時、汚染物が基板（５）の表面へ再付着
しないように、純水噴き付けによるリンスを行っている
が、基板（５）の表面全域に噴射するのが困難で、十分
な汚染物の再付着防止を行うことができないという問題
点があった。また、基板（５）へのダメージ制御という
点で、制御範囲が狭く基板（５）に対してダメージを与
えてしまうという問題点もあった。Since the conventional substrate surface cleaning apparatus is configured as described above, during cleaning, rinsing is performed by spraying pure water to prevent contaminants from re-adhering to the surface of the substrate (5). There is a problem that it is difficult to spray over the entire surface of (5) and it is not possible to sufficiently prevent re-adhesion of contaminants. Further, in terms of controlling damage to the substrate (5), there is another problem that the control range is narrow and the substrate (5) is damaged.
この発明は、上記のような問題点を解消するためにな
されたもので、微細凍結粒子の噴射によって除去された
汚染物を基板表面に再付着させることがなく、また基板
に対してダメージを与えない基板表面の洗浄装置を得る
ことを目的とする。The present invention has been made in order to solve the above problems, and does not cause the contaminants removed by the injection of the fine frozen particles to adhere again to the substrate surface and damage the substrate. The purpose is to obtain a cleaning device for the substrate surface without any.
この発明に係る基板表面の洗浄装置は、純水の入った
洗浄槽内に基板を純水中に浸漬して設けたものである。A substrate surface cleaning apparatus according to the present invention is provided by immersing a substrate in pure water in a cleaning tank containing pure water.
この発明における基板表面の洗浄装置は、純水中に浸
漬された基板の表面に向けて氷粒子を噴射する。The substrate surface cleaning apparatus according to the present invention ejects ice particles toward the surface of the substrate immersed in pure water.
以下、この発明の一実施例を図について説明する。第
１図において、（１），（２），（３），（４），
（５），（８）は従来の基板表面の洗浄装置と同一のも
のである。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, (1), (2), (3), (4),
(5) and (8) are the same as the conventional substrate surface cleaning apparatus.
（10）は基板（５）の洗浄を行う洗浄槽、（11）は基
板（５）を水平に支持するとともに水面との距離を調節
する支持部、（12）は純水に超音波振動を与える振動
器、（13）は洗浄槽（10）内の純水を循環する配管、
（14）は純水を循環させる循環用ポンプ、（15）は配管
（13）に取り付けられ純水中のパーティクルを除去する
フィルターである。(10) is a cleaning tank for cleaning the substrate (5), (11) is a support for horizontally supporting the substrate (5) and adjusting the distance from the water surface, and (12) is an ultrasonic vibration to pure water. A vibrator to give, (13) a pipe for circulating pure water in the cleaning tank (10),
(14) is a circulation pump for circulating pure water, and (15) is a filter attached to the pipe (13) for removing particles in the pure water.
次に、動作について説明する。微細凍結粒子（４）を
生成し、噴射ノズル（８）によって噴射するまでは従来
技術と同様である。洗浄槽（10）の中には超純水（例え
ば比抵抗18MΩ・cm以上）が満たされている。この超純
水は、循環用ポンプ（14）により配管（13）を通りフィ
ルター（15）によって過されて循環している。微細凍
結粒子（４）は噴射によって純水中を突き抜けて、基板
（５）へ衝突する。基板（５）の表面上の汚染物はこれ
により除去され、また、洗浄槽（10）内の純水の流れに
より、洗浄槽（10）外へ流し出される。また、純水の循
環途中、純水はフィルター（15）によって過され、パ
ーティクル等の汚染物のない純水が洗浄槽（10）へ入り
込まれる。Next, the operation will be described. It is the same as the prior art until the fine frozen particles (4) are generated and injected by the injection nozzle (8). The cleaning tank (10) is filled with ultrapure water (for example, a specific resistance of 18 MΩ · cm or more). The ultrapure water is circulated through a pipe (13) by a circulation pump (14) and passed by a filter (15). The fine frozen particles (4) penetrate the pure water by the injection and collide with the substrate (5). The contaminants on the surface of the substrate (5) are thereby removed, and are discharged out of the cleaning tank (10) by the flow of pure water in the cleaning tank (10). During the circulation of the pure water, the pure water is passed through the filter (15), and pure water free from contaminants such as particles enters the cleaning tank (10).
一方、振動器（12）は超音波振動（例えば1MHz）を純
水に与え、これにより基板（５）上の汚染物除去の効率
を高めている。また、微細凍結粒子（４）が基板（５）
に衝突することによる基板（５）へのダメージは、支持
部（１）による水面と基板（５）との距離の調節によっ
て変えることができ、例えば水面と基板（５）との距離
を大きくとれば、ダメージが小さく調節することができ
る。On the other hand, the vibrator (12) applies ultrasonic vibration (for example, 1 MHz) to the pure water, thereby increasing the efficiency of removing contaminants on the substrate (5). The fine frozen particles (4) are
The damage to the substrate (5) due to the collision with the substrate (5) can be changed by adjusting the distance between the water surface and the substrate (5) by the support portion (1). For example, the distance between the water surface and the substrate (5) can be increased. If the damage is small, it can be adjusted.
なお、上記実施例では循環用ポンプ（14）により、洗
浄槽（10）内の純水は循環しているが、純水を回収しな
いワンパス方式であってもよい。このときはフィルター
（15）は必要としない。Although the pure water in the cleaning tank (10) is circulated by the circulation pump (14) in the above embodiment, a one-pass system that does not collect the pure water may be used. In this case, the filter (15) is not required.
以上説明したように、この発明の基板表面の洗浄装置
によれば、純水中に基板を浸漬しこの基板の表面に向っ
て微細凍結粒子を噴射するようになっているので、基板
洗浄効果を高める効果があるとともに基板へのダメージ
の制御を容易にできるという効果もある。As described above, according to the substrate surface cleaning apparatus of the present invention, since the substrate is immersed in pure water and fine frozen particles are jetted toward the surface of the substrate, the substrate cleaning effect is improved. This has the effect of enhancing the effect and also making it easier to control the damage to the substrate.
第１図はこの発明の一実施例による基板表面の洗浄装置
を示す模式図。第２図は従来の基板表面の洗浄装置の一
例を示す模式図である。 図において、（１）は製氷ホッパー、（２）は冷媒体、
（３）はスプレーノズル、（４）は微細凍結粒子、
（５）は基板、（10）は洗浄槽、（11）は支持部、（1
2）は超音波振動器である。 なお、各図中、同一符号は同一、または相当部分を示
す。FIG. 1 is a schematic view showing an apparatus for cleaning a substrate surface according to one embodiment of the present invention. FIG. 2 is a schematic view showing an example of a conventional substrate surface cleaning apparatus. In the figure, (1) is an ice making hopper, (2) is a cooling medium,
(3) is a spray nozzle, (4) is fine frozen particles,
(5) substrate, (10) cleaning tank, (11) support, (1)
2) is an ultrasonic vibrator. In the drawings, the same reference numerals indicate the same or corresponding parts.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−29515（ＪＰ，Ａ) 特開 平１−95521（ＪＰ，Ａ) 特開 平３−231427（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/304 642 H01L 21/304 643 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-63-29515 (JP, A) JP-A-1-95521 (JP, A) JP-A-3-231427 (JP, A) (58) Field (Int.Cl. 6 , DB name) H01L 21/304 642 H01L 21/304 643
Claims (1)
表面に噴射して基板の表面を洗浄する基板表面の洗浄装
置において、純水の入った洗浄槽内に前記基板を前記純
水中に浸漬して設け、前記氷粒子を前記基板の表面に向
けて噴射するようになっていることを特徴とする基板表
面の洗浄装置。An apparatus for cleaning a surface of a substrate by jetting ultrafine ice particles made from pure water onto the surface of the substrate, wherein the substrate is placed in a cleaning tank containing pure water. An apparatus for cleaning a surface of a substrate, wherein the apparatus is immersed in water to spray the ice particles toward the surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130246A JP2957229B2 (en) | 1990-05-22 | 1990-05-22 | Cleaning equipment for substrate surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130246A JP2957229B2 (en) | 1990-05-22 | 1990-05-22 | Cleaning equipment for substrate surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426121A JPH0426121A (en) | 1992-01-29 |
| JP2957229B2 true JP2957229B2 (en) | 1999-10-04 |
Family
ID=15029638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2130246A Expired - Lifetime JP2957229B2 (en) | 1990-05-22 | 1990-05-22 | Cleaning equipment for substrate surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2957229B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19916345A1 (en) * | 1999-04-12 | 2000-10-26 | Steag Electronic Systems Gmbh | Method and device for cleaning substrates |
-
1990
- 1990-05-22 JP JP2130246A patent/JP2957229B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426121A (en) | 1992-01-29 |
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