JPH038326A - Solid surface cleaning apparatus - Google Patents
Solid surface cleaning apparatusInfo
- Publication number
- JPH038326A JPH038326A JP14206789A JP14206789A JPH038326A JP H038326 A JPH038326 A JP H038326A JP 14206789 A JP14206789 A JP 14206789A JP 14206789 A JP14206789 A JP 14206789A JP H038326 A JPH038326 A JP H038326A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- wafer
- cleaned
- solid surface
- fine ice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 title claims description 18
- 238000004140 cleaning Methods 0.000 title claims description 12
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000007921 spray Substances 0.000 claims abstract description 22
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 16
- 239000012498 ultrapure water Substances 0.000 claims description 16
- 239000000356 contaminant Substances 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000007779 soft material Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、ブラスト、クリーニング等の表面処理用の
砥粒、研磨材等として用いられる極微細な氷粒子を生成
し、半導体ウェハ等の固体の表面に噴射して洗浄するた
めの固体表面洗浄装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention generates ultrafine ice particles used as abrasive grains, abrasives, etc. for surface treatments such as blasting and cleaning, and The present invention relates to a solid surface cleaning device for spraying and cleaning the surface of a solid surface.
［従来の技術］
第４図は従来のこの種の固体表面洗浄装置を示し、微細
凍結粒子を生成するための製氷部（１）に冷却用の液体
窒素（２）が送給される。（３）は純水を噴射するスプ
レーノズルである。生成された微細凍結粒子（４）はノ
ズル（５）により半導体ウェハのような被洗浄物（６）
の表面に向けて噴射される。（７）はオートバルブ、（
８）はブロワ−である。[Prior Art] Fig. 4 shows a conventional solid surface cleaning device of this type, in which liquid nitrogen (2) for cooling is supplied to an ice making section (1) for producing fine frozen particles. (3) is a spray nozzle that sprays pure water. The generated fine frozen particles (4) are passed through a nozzle (5) to an object to be cleaned (6) such as a semiconductor wafer.
is sprayed towards the surface. (7) is an auto valve, (
8) is a blower.
以上の構成により、断熱材で囲まれた製氷部（１）内で
液体窒素等の冷媒（２）を蒸発させることにより製氷部
（１）が冷却される。十分冷却された後、スプレーノズ
ル（３）から超純水を微噴霧し、＠細氷粒子（４）を得
る。こうして得られた微細氷粒子（４）は気体の噴流に
よるエジェクタ一方式によってノズル（５）に送られ、
高純度のＮ２ガスなどをキャリアガスとして、半導体ウ
ェハ等の被洗浄物（６）の表面に噴射され、表面に付着
した汚染物を除去する。この際、微細氷粒子（４）が被
洗浄物（６）の固体表面全体に噴射されるように、噴射
手段であるノズル（５）または固体表面がスキャンニン
グされる機構となっている。With the above configuration, the ice making section (1) is cooled by evaporating the refrigerant (2) such as liquid nitrogen within the ice making section (1) surrounded by the heat insulating material. After sufficiently cooling, ultrapure water is slightly sprayed from the spray nozzle (3) to obtain @fine ice particles (4). The fine ice particles (4) thus obtained are sent to the nozzle (5) by a one-way ejector using a jet of gas,
High-purity N2 gas or the like is used as a carrier gas and is injected onto the surface of the object (6) to be cleaned, such as a semiconductor wafer, to remove contaminants attached to the surface. At this time, the nozzle (5) serving as the spraying means or the solid surface is scanned so that the fine ice particles (4) are sprayed onto the entire solid surface of the object to be cleaned (6).
［発明が解決しようとする課題〕
以上のような従来の固体表面洗浄装置は、高純度ガス（
Ｎｔ等）をキャリアガスとして微細氷粒子のみを噴射し
ていた。そのため、固体表面上の汚染物は微細氷粒子に
より一旦除去されるが、微細氷粒子が噴射されていない
固体表面上に汚染物が移動または再付着し、洗浄効率を
低下させていた。[Problem to be solved by the invention] The conventional solid surface cleaning device as described above uses high-purity gas (
Only fine ice particles were injected using Nt, etc.) as a carrier gas. Therefore, although the contaminants on the solid surface are once removed by the fine ice particles, the contaminants move or re-deposit on the solid surface to which the fine ice particles have not been sprayed, reducing the cleaning efficiency.
また、被洗浄物の材質（例えばアルミ材料）によっては
表面にダメージが生じるなどの問題があった。Further, there is a problem in that the surface of the object to be cleaned may be damaged depending on the material (for example, aluminum material).
この発明は上記のような問題点を解消するためになされ
たもので、微細氷粒子により一旦除去された汚染物を速
やかに洗い流し、固体表面に再付着させることがなく、
かつ、アルミ等の比較的軟かい材質の被洗浄物に対して
もダメージが生じない固体表面洗浄装置を得ることを目
的とする。This invention was made in order to solve the above-mentioned problems, and it is possible to quickly wash away contaminants once removed by fine ice particles, without causing them to re-adhere to the solid surface.
Another object of the present invention is to provide a solid surface cleaning device that does not cause damage even to objects made of relatively soft materials such as aluminum.
［課題を解決するための手段］
この発明に係る固体表面洗浄装置は、微細氷粒子噴射ノ
ズルに加えて、超純水をスプレーするノズルを設け、微
細氷粒子と超純水を異なった方向より同時に固体表面に
スプレーするようにしたものである。[Means for Solving the Problems] A solid surface cleaning device according to the present invention is provided with a nozzle for spraying ultrapure water in addition to a nozzle for spraying fine ice particles, and sprays fine ice particles and ultrapure water from different directions. It is designed to be sprayed onto solid surfaces at the same time.
［作 用］
この発明においては、スプレーノズルから噴射された超
純水は、固体表面を洗い流す作用を有しており、微細氷
粒子により除去される汚染物の再付着を防止するととも
に、超純水の適宜の温度と固体表面上に付着した水腹に
より、固体表面に対するダメージを解消する。[Function] In this invention, the ultrapure water injected from the spray nozzle has the effect of washing away the solid surface, preventing the re-adhesion of contaminants removed by fine ice particles, and the ultrapure water sprayed from the spray nozzle. Damage to the solid surface is eliminated by the appropriate temperature of the water and the water belly attached to the solid surface.
〔実施例］
第１図はこの発明の一実施例を示し、図において、スプ
レーノズル（９）は超純水を被洗浄物（６）の表面に噴
射するものであり、温度制御器（１０）で超純水の温度
が制御される。[Embodiment] FIG. 1 shows an embodiment of the present invention, in which a spray nozzle (9) sprays ultrapure water onto the surface of an object to be cleaned (6), and a temperature controller (10) ) controls the temperature of ultrapure water.
その他、第４図におけると同一符号は同一部分であり、
説明を省略する。Other than that, the same reference numerals as in Fig. 4 indicate the same parts.
The explanation will be omitted.
次に動作について説明する。微細氷粒子（４）を生成し
、噴射ノズル（５）を用いてウェハ（６）に微細氷粒子
（４）を噴射するまでは従来技術と同様である。ここで
は、微細氷粒子（４）を噴射ノズル（５）よりウェハ（
６）表面に噴射するとともに、同時にスプレーノズル（
９）より超純水をウェハ（６）表面にスプレーする。Next, the operation will be explained. The steps from generating fine ice particles (4) to injecting the fine ice particles (4) onto the wafer (6) using the injection nozzle (5) are the same as in the prior art. Here, fine ice particles (4) are sprayed onto the wafer (
6) At the same time as spraying onto the surface, use the spray nozzle (
9) Spray ultrapure water onto the surface of the wafer (6).
この超純水は温度制御器（１０）によりＯ℃〜６０℃に
制御される。微細氷粒子（４）と超純水の噴射方法の例
を第２図、第３図に示す、噴射ノズル（５）より噴射さ
れる微細氷粒子（４）は、噴射ノズル（５）またはウェ
ハ（６）を移動させることにより図示の矢印のようにス
キャンされ、ウェハ（６）表面の汚染物を除去する。第
２図では上部よりスプレーノズル（９）からウェハ全面
に超純水をスプレーした。This ultrapure water is controlled at 0°C to 60°C by a temperature controller (10). An example of a method for spraying fine ice particles (4) and ultrapure water is shown in Figs. 2 and 3. The fine ice particles (4) sprayed from the spray nozzle (5) can By moving the wafer (6), the wafer (6) is scanned in the direction of the arrow shown, and contaminants on the surface of the wafer (6) are removed. In FIG. 2, ultrapure water was sprayed over the entire surface of the wafer from a spray nozzle (9) from above.
第３図では同様に上部よりスプレーノズル（９）からウ
ェハ表面に局部的に超純水をスプレーし、同様にスキャ
ンさせた。また、この場合、純水ラインに高圧ポンプ（
１１）を導入し、超純水の高圧ジェットとして噴射する
手段または超音波ノズル（９ａ）を用いた。In FIG. 3, ultrapure water was locally sprayed onto the wafer surface from the spray nozzle (9) from above and scanned in the same manner. Also, in this case, a high-pressure pump (
11) was introduced and a means for spraying as a high-pressure jet of ultrapure water or an ultrasonic nozzle (9a) was used.
［発明の効果］
以上のように、この発明によれば、微細氷粒子の噴射ノ
ズルと超純水のスプレーノズルを併用したことにより、
汚染物が被洗浄物に再付着することを防ぎ、速やかに汚
染物を被洗浄物から流し去ることができるとともに、比
較的軟らかい材質の表面に対してもダメージなく洗浄を
行うことができる効果がある。[Effects of the Invention] As described above, according to the present invention, by using the fine ice particle injection nozzle and the ultrapure water spray nozzle together,
It prevents contaminants from re-adhering to the object to be cleaned, quickly flushes the contaminants away from the object, and has the effect of cleaning relatively soft surfaces without damaging them. be.
第１図はこの発明の一実施例の概略立断面図、第２図お
よび第３図はそれぞれ第１図のものの動作を示す要部斜
視図、第４図は従来の固体表面洗浄装置の概略立断面図
である。
（１）・・製氷部、（４）・・微細氷粒子、（５）・噴
射ノズル、（６）・・被洗浄物、（９）・・スプレーノ
ズル。
なお、各図中、同一符号は同−又は相当部分を示す。FIG. 1 is a schematic vertical sectional view of an embodiment of the present invention, FIGS. 2 and 3 are perspective views of essential parts showing the operation of the device shown in FIG. 1, and FIG. 4 is a schematic diagram of a conventional solid surface cleaning device. FIG. (1) Ice making section, (4) Fine ice particles, (5) Spray nozzle, (6) Object to be cleaned, (9) Spray nozzle. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
細氷粒子を被洗浄物の表面に噴射する噴射ノズルと、超
純水を前記表面に噴射するスプレーノズルとを備えてな
る固体表面洗浄装置。A solid body comprising an ice making unit that makes ultra-fine ice particles from ultra-pure water, a spray nozzle that sprays the ultra-fine ice particles onto the surface of an object to be cleaned, and a spray nozzle that sprays ultra-pure water onto the surface. Surface cleaning equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14206789A JPH038326A (en) | 1989-06-06 | 1989-06-06 | Solid surface cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14206789A JPH038326A (en) | 1989-06-06 | 1989-06-06 | Solid surface cleaning apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH038326A true JPH038326A (en) | 1991-01-16 |
Family
ID=15306660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14206789A Pending JPH038326A (en) | 1989-06-06 | 1989-06-06 | Solid surface cleaning apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH038326A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536662A (en) * | 1991-08-01 | 1993-02-12 | Mitsubishi Electric Corp | Method and device for cleaning semiconductor wafer |
| WO2000061306A1 (en) * | 1999-04-12 | 2000-10-19 | Steag Microtech Gmbh | Method and device for cleaning substrates |
| JP2003039028A (en) * | 2001-07-27 | 2003-02-12 | Kakizaki Mamufacuturing Co Ltd | Method for cleaning housing and apparatus for the same |
-
1989
- 1989-06-06 JP JP14206789A patent/JPH038326A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536662A (en) * | 1991-08-01 | 1993-02-12 | Mitsubishi Electric Corp | Method and device for cleaning semiconductor wafer |
| WO2000061306A1 (en) * | 1999-04-12 | 2000-10-19 | Steag Microtech Gmbh | Method and device for cleaning substrates |
| JP2003039028A (en) * | 2001-07-27 | 2003-02-12 | Kakizaki Mamufacuturing Co Ltd | Method for cleaning housing and apparatus for the same |
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