JP2922630B2 - Contact surface treatment method - Google Patents
Contact surface treatment methodInfo
- Publication number
- JP2922630B2 JP2922630B2 JP31963390A JP31963390A JP2922630B2 JP 2922630 B2 JP2922630 B2 JP 2922630B2 JP 31963390 A JP31963390 A JP 31963390A JP 31963390 A JP31963390 A JP 31963390A JP 2922630 B2 JP2922630 B2 JP 2922630B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- mold
- surface treatment
- ultrasonic
- ultrasonic vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は接点の接触抵抗の低減化を図る接点の表面処
理方法に関する。Description: TECHNICAL FIELD The present invention relates to a contact surface treatment method for reducing the contact resistance of a contact.
接点として銀(Ag)素地に金属酸化物を分散させてな
る材料を用いたものがある。例えば、銀素地中にCdOを
分散させてなる接点は耐溶着性に優れるものとして実用
にも供されている。There is a contact using a material obtained by dispersing a metal oxide in a silver (Ag) base. For example, a contact formed by dispersing CdO in a silver base has been put to practical use as having excellent welding resistance.
通常、第9図にみるように、接点1は端子2に取着さ
れている。この接点1では、第10図にみるように、銀素
地3に例えば1〜3μm程度の粒径の金属酸化物4(Cd
O・・)が分散されているのであるが、製造した直ぐ後
では、接点表面1aに金属酸化物4が突出した状態となっ
ている。このため、第11図にみるような接点1が互いに
接触する時は、第12図に示すように、金属酸化物4どう
しが接触する等して銀素地3の個所での接触が妨げられ
るようになる。Normally, the contact 1 is attached to the terminal 2 as shown in FIG. In this contact 1, as shown in FIG. 10, a metal oxide 4 (Cd
O ..) are dispersed, but immediately after the production, the metal oxide 4 protrudes from the contact surface 1a. For this reason, when the contacts 1 as shown in FIG. 11 are in contact with each other, as shown in FIG. 12, the metal oxides 4 come into contact with each other so that the contact at the silver base 3 is prevented. become.
抵抗の低い銀素地3のところの接触が減ると、初期接
触抵抗値が大き過ぎる、初期接触抵抗のバラツキが大き
い、といった問題が起こる。初期接触抵抗特性が十分で
ないと、その接点は不良になってしまうのである。If the contact at the silver substrate 3 having a low resistance is reduced, problems such as an excessively large initial contact resistance value and a large variation in the initial contact resistance occur. If the initial contact resistance characteristics are not sufficient, the contact will be defective.
この場合、接点1間にアーク放電を起こさせて接点表
面1aに突出した金属酸化物4を昇華させる等して除き、
接触抵抗の均一化・低減化を図るようにする方法もあ
る。しかし、この方法は好ましい方策とは言えない。こ
の方法は、手間がかかりコストの上昇を招き、安定性に
乏しいアーク放電現象によるため常に十分な効果が発揮
されるとは限らないからである。In this case, an arc discharge is caused between the contacts 1 to remove the metal oxide 4 projecting from the contact surface 1a by sublimation or the like.
There is also a method for achieving uniform and reduced contact resistance. However, this method is not a preferable measure. This is because this method is troublesome, causes an increase in cost, and does not always exert a sufficient effect due to an arc discharge phenomenon having poor stability.
また他に、特開昭57−78720号に示される溶接法は、
超音波振動子の先端のチップに凹部を設け、このチップ
の凹部と接点表面との間にラップ部材を介在させて超音
波振動させ接点表面をラップする方法もある。しかし、
この方法はラップ部材を超音波ホーン以外に設ける必要
があり、その保持方法と耐久性の点で問題がある。In addition, the welding method disclosed in JP-A-57-78720 is
There is also a method in which a concave portion is provided in the tip of the ultrasonic vibrator and a wrap member is interposed between the concave portion of the chip and the contact surface to ultrasonically oscillate and wrap the contact surface. But,
In this method, it is necessary to provide a wrap member other than the ultrasonic horn, and there is a problem in its holding method and durability.
本発明はこのような点に鑑みてなされたものであり、
接点表面に突出する金属酸化物を手間をかけずに確実に
低減することができる方法を提供することを目的とす
る。The present invention has been made in view of such a point,
It is an object of the present invention to provide a method capable of reliably reducing metal oxides protruding from a contact surface without trouble.
本発明では上記課題を解決するために、 接点表面を平滑面に対向して置き、接点を平滑面に押
圧する力を加えた状態で接点又は平滑面に超音波振動を
加えて、この超音波振動エネルギーにより流動化した接
点の銀素地内に接点の表面から突出した金属酸化物を埋
め込むようにしたことに特徴を有する接点の表面処理方
法を提供することにより上記目的を達成している。In the present invention, in order to solve the above problem, the contact surface is placed opposite to a smooth surface, and ultrasonic vibration is applied to the contact or the smooth surface while applying a force for pressing the contact to the smooth surface. The above object has been achieved by providing a contact surface treatment method characterized in that a metal oxide projecting from the surface of a contact is embedded in a silver base material of the contact fluidized by vibration energy.
上記構成による本発明方法いよれば、接点表面と平滑
面を加圧しながら超音波エネルギーを加えることで、延
性に富んだ銀が平滑面接触部で、局部的に塑性流動を起
こし、接点表面が平滑面状態に形成される。この際、接
点表面に突出した金属酸化物が接点内部に入り込み、ま
た銀がその上を包み込むように流動する。その結果、接
点表面の金属酸化物の突出が低減され、接点表面の銀量
が増加し、接点の接触抵抗を低減することができる。According to the method of the present invention having the above configuration, by applying ultrasonic energy while pressing the contact surface and the smooth surface, the highly ductile silver locally causes plastic flow at the smooth surface contact portion, and the contact surface becomes It is formed in a smooth surface state. At this time, the metal oxide protruding from the contact surface enters the inside of the contact, and the silver flows so as to wrap over the contact. As a result, the protrusion of the metal oxide on the contact surface is reduced, the amount of silver on the contact surface is increased, and the contact resistance of the contact can be reduced.
以下、本発明の実施例を図面に基づいて詳しく説明す
る。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第8図(a)に示すように、平滑面5を設けたホーン
9は、接点表面1aと平滑面5を加圧しながら超音波エネ
ルギーを加える。As shown in FIG. 8 (a), the horn 9 provided with the smooth surface 5 applies ultrasonic energy while pressing the contact surface 1a and the smooth surface 5.
第8(b)に示すように、加圧しながら超音波エネル
ギーを加えることで、延性に富んだ銀が平滑面5の接触
部で局部的に塑性流動を起こし、接点表面1aが平滑面状
態に形成される。As shown in FIG. 8 (b), by applying ultrasonic energy while applying pressure, highly ductile silver locally causes plastic flow at the contact portion of the smooth surface 5, and the contact surface 1a becomes a smooth surface state. It is formed.
第8図(c)に示すように接点表面1aから突出した金
属酸化物4が接点内部に入り込み、また銀がその上を包
み込むように流動する。その結果、接点表面1aの金属酸
化物4の突出が低減され、接点表面1aの銀が増加し、接
点1の接触抵抗を低減することができる。As shown in FIG. 8 (c), the metal oxide 4 projecting from the contact surface 1a enters the inside of the contact, and the silver flows so as to wrap over it. As a result, the protrusion of the metal oxide 4 on the contact surface 1a is reduced, the silver on the contact surface 1a increases, and the contact resistance of the contact 1 can be reduced.
第8図(d)は第8図(a)〜(c)における接点内
部の金属酸化物と銀の移動の詳細拡大図であり、
(a)′は金属酸化物4が接点表面1aから突出してお
り、(b)′は金属酸化物4が接点表面1aから内部に入
り込んでおり、(b)″は延性に富んだ銀が流動してお
り、(c)′は接点表面1aが平滑に成ったことを示して
いる。FIG. 8D is a detailed enlarged view of the movement of the metal oxide and silver inside the contact in FIGS. 8A to 8C.
(A) 'shows that the metal oxide 4 protrudes from the contact surface 1a, (b)' shows that the metal oxide 4 penetrates from the contact surface 1a, and (b) 'shows that the highly ductile silver flows. (C) 'indicates that the contact surface 1a is smooth.
〔実施例1〕 第1図は、本発明の第1実施例を示すもので、接点1
と端子2の接合を同時に兼ねた方式である。接点表面1a
が固定治具(例えばアンビル)11の平滑な型面13に接す
るように挿入固定し、接点1の裏面側に端子2を設け、
端子2側から超音波振動を印加することを特徴としてい
る。Embodiment 1 FIG. 1 shows a first embodiment of the present invention.
And the terminal 2 at the same time. Contact surface 1a
Is inserted and fixed so as to be in contact with a smooth mold surface 13 of a fixing jig (for example, an anvil) 11, and a terminal 2 is provided on the back side of the contact 1,
It is characterized in that ultrasonic vibration is applied from the terminal 2 side.
この固定治具の材質は接点材料が銀合金等の比較的柔
らかい材質であるため、それより硬い材料例えば焼き入
鋼(SKD、SKH)や超硬やセラミックス(Al2O3、Si3N
4他)又はこれらの材料によるコーティング材などが選
定される。この時の型面13の表面粗度0.1μm以下、超
音波加圧力50kgf、超音波周波数15kHz、振幅50μm、超
音波印加時間0.15secとした時の外径φ2.5mm、板厚0.3m
mの材質Ag−CdO接点表面粗度の本作用による変化は、本
処理前は約1〜2μmあった表面粗さが約0.3μm以下
に低減していることが分かった。Since the contact material is a relatively soft material such as a silver alloy, the fixing jig is made of a harder material such as quenched steel (SKD, SKH), carbide or ceramic (Al 2 O 3 , Si 3 N).
4 Other) or a coating material of these materials is selected. At this time, the surface roughness of the mold surface 13 is 0.1 μm or less, an ultrasonic pressure of 50 kgf, an ultrasonic frequency of 15 kHz, an amplitude of 50 μm, an outer diameter φ2.5 mm when the ultrasonic application time is 0.15 sec, and a thickness of 0.3 m.
The change in the surface roughness of the Ag-CdO contact of the material m due to this action was found to be such that the surface roughness, which was about 1-2 μm before this treatment, was reduced to about 0.3 μm or less.
〔実施例2〕 第2図は本発明の第2実施例を示すもので、実施例1
と同様に、接点1と端子2の接合も同時に兼ねた方式で
ある。端子2を固定し、接点表面1aが平滑な超音波ホー
ン型面9aに接するように挿入固定し、接点1の裏面と端
子2を重ね合わせ接点1側から超音波振動を印加するこ
とを特徴としている。Embodiment 2 FIG. 2 shows a second embodiment of the present invention.
In the same manner as described above, the contact 1 and the terminal 2 are simultaneously joined. The terminal 2 is fixed, the contact surface 1a is inserted and fixed so as to be in contact with the smooth ultrasonic horn-shaped surface 9a, and the back surface of the contact 1 is overlapped with the terminal 2 to apply ultrasonic vibration from the contact 1 side. I have.
〔実施例3〕 第3図は本発明の第3実施例を示すもので、接点表面
1aを平滑面5に接するように配置し、端子2側から超音
波振動を印加することを特徴としており(a)は横振動
を(b)は縦振動を加えた例である。Embodiment 3 FIG. 3 shows a third embodiment of the present invention, in which a contact surface is shown.
1a is arranged so as to be in contact with the smooth surface 5, and ultrasonic vibration is applied from the terminal 2 side. (A) is an example in which transverse vibration is applied and (b) is an example in which longitudinal vibration is applied.
〔実施例4〕 第4図は本発明の第4実施例を示すもので、接点表面
1aを平滑面5に接するように配置し、平滑面5側から超
音波振動を印加することを特徴としており、(a)は横
振動を、(b)は縦振動を加えた例である。Embodiment 4 FIG. 4 shows a fourth embodiment of the present invention, in which a contact surface is shown.
1a is disposed so as to be in contact with the smooth surface 5, and ultrasonic vibration is applied from the smooth surface 5 side. FIG. 1A shows an example in which transverse vibration is applied, and FIG.
いずれの実施例においても、平滑面5と接点1の表面
との接触面に対し垂直方向に加圧を行う。加圧力は数kg
f〜数10kgfが望ましい。また、平滑面5は銀に対して硬
い材質、例えば焼き入れ鋼、超硬やセラミックス又はこ
れらの材料によるコーティング材のような材料が望まし
い。In either embodiment, pressure is applied in a direction perpendicular to the contact surface between the smooth surface 5 and the surface of the contact 1. Pressure is several kg
f to several tens kgf is desirable. The smooth surface 5 is preferably made of a material harder than silver, such as hardened steel, carbide, ceramics, or a coating material made of these materials.
そのとき、平滑面5を金型として接点1をフォーミン
グすることも可能である。超音波周波数は一般的に10kH
zから100kHzまでが加工用に使用されるが、本用途にお
いては、上記範囲内であれば限定はない。振幅について
は、平滑面5と接点表面1aの接触部で超音波による応力
変化が生じるレベルが必要であり、数μm〜100μm程
度が望ましい。いずれにしても、加圧力、超音波周波
数、振幅は接点形状、寸法に適合した選択が望ましい。At this time, the contact 1 can be formed by using the smooth surface 5 as a mold. Ultrasonic frequency is generally 10 kHz
The frequency from z to 100 kHz is used for processing, but in this application, there is no limitation as long as it is within the above range. As for the amplitude, a level at which a stress change is caused by the ultrasonic wave at the contact portion between the smooth surface 5 and the contact surface 1a is required, and it is preferably about several μm to 100 μm. In any case, it is desirable to select the pressing force, the ultrasonic frequency, and the amplitude in accordance with the contact shape and dimensions.
〔実施例5〕 第5図は本発明の第5実施例を示すもので、接点材料
1c(例えば、外径φ2.5mm、厚さ0.3mm、材質Ag−CdOの
円筒形状)を型部12(例えば、45゜テーパ凹側面を設け
る)に入れパンチ8によるプレスで加圧することで型形
状にフォーミングし、その後端子2(例えばCu)と超音
波溶接する例である。この方法により型部12と接点1の
隙間が完全に無くなり、接点1の固定が確実に行われ
る。その時、型面13を鏡面のような平滑面に仕上げてお
くことで、実施例1〜4と同様に接点表面1aに鏡面が転
写され、接点1としての特性に優れた超音波溶接と接点
の表面処理が行われる。型形状が他の場合も同様であ
る。Embodiment 5 FIG. 5 shows a fifth embodiment of the present invention, in which a contact material is used.
1c (for example, outer diameter φ2.5mm, thickness 0.3mm, cylindrical shape of Ag-CdO material) is put into a mold part 12 (for example, provided with a 45 ° tapered concave side surface) and pressed by a punch 8 to form a mold. This is an example of forming into a shape and then ultrasonically welding the terminal 2 (for example, Cu). By this method, the gap between the mold portion 12 and the contact 1 is completely eliminated, and the contact 1 is securely fixed. At this time, by finishing the mold surface 13 to a smooth surface such as a mirror surface, the mirror surface is transferred to the contact surface 1a similarly to the first to fourth embodiments, and the ultrasonic welding and the contact of the contact 1 having excellent characteristics as the contact 1 are performed. Surface treatment is performed. The same is true for other mold shapes.
〔実施例6〕 第6図は本発明の第6実施例を示すもので、実施例5
において、接点材料1cのフォーミングの加圧時に、表面
に凹凸部8aを設けたパンチ8によるプレスで加圧するこ
とで型形状にフォーミングし、接点1の裏面に凹凸を付
け、接点1と端子2との接合面の凹凸による超音波溶接
性を向上させたものである。[Embodiment 6] Fig. 6 shows a sixth embodiment of the present invention.
In forming the contact material 1c, the contact material 1c is formed into a mold shape by applying pressure by a press using a punch 8 provided with an uneven portion 8a on the surface, and the back surface of the contact 1 is made uneven. The ultrasonic weldability is improved due to the unevenness of the joint surface of (1).
勿論第5図のように、型面13を鏡面のような平滑面に
仕上げしておくことで、実施例1〜4と同様に接点表面
1aに鏡面が転写され、特性に優れた接点の表面処理が行
える。Of course, as shown in FIG. 5, the mold surface 13 is finished to a smooth surface such as a mirror surface, so that the contact surface is made similar to the first to fourth embodiments.
The mirror surface is transferred to 1a, and the surface treatment of the contact with excellent characteristics can be performed.
〔実施例7〕 第7図は本発明の第7実施例を示すもので、接点材料
1c(例えば、外径φ2.5mm、厚さ0.3mm、材質Ag−CdOの
円筒形状)を型部12(例えば、底面にφ2.2、深さ5μ
m〜50μmの段差を設ける)に入れ、その後端子2(例
えば、Cu)とを重ね超音波を印加することで、接点1の
フォーミングと接点1と端子2の溶接を同時に行うもの
である。[Embodiment 7] Fig. 7 shows a seventh embodiment of the present invention.
1c (for example, outer diameter φ2.5mm, thickness 0.3mm, cylindrical shape of Ag-CdO material) is inserted into the mold part 12 (for example, φ2.2 on the bottom, depth 5μ).
Then, the contact 2 and the terminal 2 are simultaneously formed by superimposing the terminal 2 (for example, Cu) and applying an ultrasonic wave thereto.
この方法により、超音波印加と同時に接点1の表面が
型部段12aに食い込み固定され、さらに型部段12aの型面
13を鏡面仕上げの平滑面にしておくことで実施例1〜4
と同様に接点1の表面に鏡面が転写され、接点1として
の特性に優れた表面を有する接点の超音波溶接が行われ
る。型形状が他の場合も同様であるが、接点1と端子2
の接合面の変形が許容される範囲で型部12によるフォー
ミング量を選択する必要がある。According to this method, the surface of the contact 1 is cut into the mold step 12a and fixed at the same time as the application of the ultrasonic wave.
Examples 1 to 4 can be obtained by making 13 a mirror-finished smooth surface.
Similarly, the mirror surface is transferred to the surface of the contact 1, and the contact having the surface excellent in the characteristics as the contact 1 is subjected to ultrasonic welding. The same applies to other mold shapes, except that contact 1 and terminal 2
It is necessary to select the amount of forming by the mold portion 12 within a range in which the deformation of the bonding surface is allowed.
以上説明したように本発明の方法によれば、接点表面
を平滑面に対向して設置し、接点を平滑面に押圧する力
を加えた状態で接点又は平滑面に超音波振動を加えるの
で、接点表面から突出した金属酸化物を手間をかけずに
容易に低減することができ、初期接触抵抗が十分低くか
つバラツキの少ない安価な接点を製造することができ
る。As described above, according to the method of the present invention, the contact surface is placed so as to face the smooth surface, and ultrasonic vibration is applied to the contact or the smooth surface in a state where a force for pressing the contact against the smooth surface is applied. The metal oxide protruding from the contact surface can be easily reduced without trouble, and an inexpensive contact with a sufficiently low initial contact resistance and little variation can be manufactured.
また、固定治具に設けられた型部の型面を平滑面仕上
げにしておくことにより、接点をその型形状にフォーミ
ングし、固定し、この接点と端子を超音波溶接すること
によって、良好な表面を有する接点を安価に製造するこ
とができる。In addition, by forming the mold surface of the mold portion provided on the fixing jig with a smooth surface finish, the contacts are formed into the shape of the mold, fixed, and the contacts and the terminals are ultrasonically welded. A contact having a surface can be manufactured at low cost.
第1図は第1実施例における固定治具に接点を固定した
場合の超音波溶接と接点の表面処理を示す断面図、 第2図は第2実施例におけるホーン側に接点を収めた場
合の超音波溶接と接点の表面処理を示す断面図、 第3図(a)および第3図(b)は第3実施例における
固定治具の平滑面に接点を配置した場合の超音波振動に
よる接点の表面処理を示す断面図、 第4(a)および第4図(b)は第4実施例におけるホ
ーン側の平滑面に接点を配置した場合の超音波振動によ
る接点の表面処理を示す断面図、第5図は第5実施例
で、接点の成型を伴う超音波溶接と接点の表面処理を示
す断面図、 第6図は第6実施例で、接点の成型の際に凹凸を付与し
た場合の超音波溶接と接点の表面処理を示す断面図、 第7図は第7実施例で、接点の成型の際に段差を設けた
場合の超音波溶接と接点の表面処理を示す断面図、 第8図(a)〜第8図(d)接点表面を平滑にする原理
を説明する断面図、 第9図は従来の接点を表す断面図、第10図は第9図の部
分拡大図、 第11図は従来の接点を表す断面図、第12図は第11図の部
分拡大図である。 1……接点 1a……接点表面 1c……接点材料 2……端子 3……銀素地 4……金属酸化物 5……平滑面 8……パンチ 8a……凹凸部 9……ホーン 9a……ホーン型面 11……固定治具 12……型部 12a……型部段 13……型面FIG. 1 is a sectional view showing ultrasonic welding and surface treatment of a contact when the contact is fixed to a fixing jig in the first embodiment. FIG. 2 is a sectional view showing a case where the contact is housed in the horn side in the second embodiment. FIG. 3 (a) and FIG. 3 (b) are cross-sectional views showing ultrasonic welding and surface treatment of the contacts. FIG. 3 (a) and FIG. FIG. 4 (a) and FIG. 4 (b) are cross-sectional views showing surface treatment of contacts by ultrasonic vibration when the contacts are arranged on the horn-side smooth surface in the fourth embodiment. FIG. 5 is a cross-sectional view showing ultrasonic welding accompanied by molding of a contact and surface treatment of the contact in the fifth embodiment. FIG. 6 is a sixth embodiment showing a case where irregularities are imparted during molding of the contact. FIG. 7 is a cross-sectional view showing ultrasonic welding and surface treatment of a contact. FIG. 8 (a) to FIG. 8 (d) are cross-sectional views showing the principle of smoothing the contact surface, and FIG. 9 is a cross-sectional view showing the ultrasonic welding and the surface treatment of the contact when a step is provided in FIG. FIG. 10 is a partially enlarged view of a conventional contact, FIG. 10 is a partially enlarged view of FIG. 9, FIG. 11 is a sectional view of a conventional contact, and FIG. 12 is a partially enlarged view of FIG. DESCRIPTION OF SYMBOLS 1 ... Contact 1a ... Contact surface 1c ... Contact material 2 ... Terminal 3 ... Silver base 4 ... Metal oxide 5 ... Smooth surface 8 ... Punch 8a ... Unevenness 9 ... Horn 9a ... Horn mold surface 11… Fixing jig 12… Mold part 12a… Mold part step 13 …… Mold surface
Claims (3)
化物系電気材料から製作される接点の表面処理方法にお
いて、 接点表面を平滑面に対向して置き、接点を平滑面に押圧
する力を加えた状態で接点又は平滑面に超音波振動を加
えて、この超音波振動エネルギーにより流動化した接点
の銀素地内に接点の表面から突出した金属酸化物を埋め
込むようにしたことを特徴とする接点の表面処理方法。1. A method for surface treatment of a contact manufactured from an Ag-oxide-based electric material in which CdO, SnO 2 or the like is dispersed in Ag, wherein the contact surface is placed opposite to a smooth surface, and the contact is smoothed. Ultrasonic vibration is applied to the contact or the smooth surface in a state of applying a pressing force to the metal oxide protruding from the surface of the contact in the silver base material of the contact fluidized by the ultrasonic vibration energy. A surface treatment method for a contact, comprising:
を前記型部に対向させて接点をセットし、パンチプレス
を行って型形状へのフォーミングにより固定し、固定し
た前記接点を型部に押圧する力を加えた状態で接点又は
型部に超音波振動を加えることを特徴とする請求項1記
載の接点の表面処理方法。2. A mold is provided on an upper surface of a fixing jig, a contact is set with the surface of the contact facing the mold, and the contact is fixed by forming into a mold by performing punch press. The surface treatment method for a contact according to claim 1, wherein ultrasonic vibration is applied to the contact or the mold while applying a force for pressing the contact to the mold.
音波振動を加えるのと、接点の型形状へのフォーミング
による固定を同時に行うことを特徴とする請求項2記載
の接点の表面処理方法。3. The surface treatment of a contact according to claim 2, wherein said fixing jig simultaneously applies ultrasonic vibration to the contact or the mold portion and simultaneously fixes the contact to the mold shape by forming. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31963390A JP2922630B2 (en) | 1990-11-22 | 1990-11-22 | Contact surface treatment method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31963390A JP2922630B2 (en) | 1990-11-22 | 1990-11-22 | Contact surface treatment method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04190526A JPH04190526A (en) | 1992-07-08 |
JP2922630B2 true JP2922630B2 (en) | 1999-07-26 |
Family
ID=18112474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31963390A Expired - Lifetime JP2922630B2 (en) | 1990-11-22 | 1990-11-22 | Contact surface treatment method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2922630B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4706429B2 (en) * | 2004-10-20 | 2011-06-22 | パナソニック株式会社 | Vehicle switch |
WO2020245920A1 (en) * | 2019-06-04 | 2020-12-10 | 三菱電機株式会社 | Method for manufacturing contactor, contactor, and switch |
-
1990
- 1990-11-22 JP JP31963390A patent/JP2922630B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH04190526A (en) | 1992-07-08 |
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