JP2812327B1 - Optical semiconductor device resin mold - Google Patents
Optical semiconductor device resin moldInfo
- Publication number
- JP2812327B1 JP2812327B1 JP13224097A JP13224097A JP2812327B1 JP 2812327 B1 JP2812327 B1 JP 2812327B1 JP 13224097 A JP13224097 A JP 13224097A JP 13224097 A JP13224097 A JP 13224097A JP 2812327 B1 JP2812327 B1 JP 2812327B1
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- cavity
- molten resin
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
【要約】
【課題】光半導体装置を樹脂封止する光半導体装置樹脂
封止金型において、リードフレーム８の外部リード部９
に変形をもたらすことなくかつ光特性を劣化させないで
樹脂封止する。
【解決手段】上下金型面の隙間より流量抵抗の小さいゲ
ート２をもつ樹脂溜り室１を、溶融樹脂の流入経路の終
端に位置するキャビティ５ｂに設けることにより、溶融
樹脂が過剰に供給されても、外部リード部９の変形を起
す隙間に多量の溶融樹脂が流れ込むことが無くなる。An external lead portion (9) of a lead frame (8) is provided in an optical semiconductor device resin sealing mold for resin sealing an optical semiconductor device.
Resin sealing is performed without causing any deformation and without deteriorating optical characteristics. A molten resin is excessively supplied by providing a resin reservoir chamber having a gate having a smaller flow resistance than a gap between upper and lower mold surfaces in a cavity located at an end of a molten resin inflow path. Also, a large amount of molten resin does not flow into the gap where the external lead portion 9 is deformed.
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】本発明は、充填材を含有しな
い透明樹脂で光半導体装置を樹脂封止する半導体装置樹
脂封止金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device resin-sealing mold for sealing an optical semiconductor device with a transparent resin containing no filler.
【０００２】[0002]
【従来の技術】従来、この種の光半導体装置の外郭体を
成形する樹脂は、半導体装置の光吸収波長領域において
高い透明度が要求されていた。一方、通常の半導体装置
の樹脂封止に用いられるエポキシ樹脂には、熱伝導度の
向上や機械的性質の改善のために充填材を含ませてい
る。しかしながら、この光半導体装置にこの種の充填材
を含む樹脂で樹脂封止すると、樹脂外郭体に含む充填材
により光の屈折に変化をもたらし受光特性に悪影響を与
えるという問題があった。2. Description of the Related Art Heretofore, a resin for molding the outer body of this type of optical semiconductor device has been required to have high transparency in a light absorption wavelength region of the semiconductor device. On the other hand, an epoxy resin used for resin sealing of an ordinary semiconductor device contains a filler for improving thermal conductivity and mechanical properties. However, if the optical semiconductor device is resin-sealed with a resin containing this kind of filler, there is a problem that the filler contained in the resin outer shell changes the refraction of light and adversely affects light receiving characteristics.
【０００３】図３は従来の光半導体装置樹脂封止金型の
一例を説明するための下型を示す部分平面図である。そ
こで、従来、この種の光半導体装置の樹脂封止には充填
材を含ませないで樹脂封止を行なっていた。そして、充
填材を含まない樹脂材は溶融時に流動性が高いとこか
ら、低圧トランスファモールド法で樹脂封止を行なって
いた。FIG. 3 is a partial plan view showing a lower mold for explaining an example of a conventional resin molding mold for an optical semiconductor device. Therefore, conventionally, resin sealing of this type of optical semiconductor device has been performed without including a filler. Since the resin material containing no filler has a high fluidity at the time of melting, resin sealing is performed by a low-pressure transfer molding method.
【０００４】この光半導体装置を樹脂封止する金型は、
図３に示すように、下型面６に形成された溶融樹脂の流
路であるランナ４からゲート３を介して溶融樹脂が注入
される複数のキャビティ５を有している。そして、下型
面６にリードフレーム８を載置し、型閉めしてから、プ
ランジャの押圧力によりポット７がら溶融樹脂をランナ
４に流し、キャビテイ５への樹脂充填不足が起きないよ
うに、キャビティ５の容積よりやや過剰の容量の溶融樹
脂をゲート３を介してキャビティ５に注入して半導体装
置を樹脂封止を行なっていた。A mold for sealing the optical semiconductor device with resin is:
As shown in FIG. 3, a plurality of cavities 5 into which the molten resin is injected via a gate 3 from a runner 4 which is a flow path of the molten resin formed on the lower mold surface 6 are provided. Then, after placing the lead frame 8 on the lower mold surface 6 and closing the mold, the molten resin is flowed from the pot 7 to the runner 4 by the pressing force of the plunger so that the cavity 5 is not filled with resin. In this case, the semiconductor device is sealed with a resin by injecting a molten resin having a volume slightly larger than the volume of the cavity 5 into the cavity 5 through the gate 3.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来の光半導
体装置樹脂封止金型では、リードフレーム８の熱膨張な
どを考慮して、型閉めしたとき下型面６と上型面との隙
間は、十数ミクロンの隙間をもたせてある。しかしなが
ら、充填材を含まない溶融樹脂は流動性が高いため、プ
ランジャの低い圧力にもかかわらずこの隙間に溶融樹脂
を侵入させ、侵入した溶融樹脂の流動圧により外部リー
ド部９が曲げられることが多々発生し半導体装置の歩留
りを低下させていた。特に、ポット７から最も離れた位
置のキャビティ５の外部リード部９は、キャビティ５に
過剰の溶融樹脂が最後に注入されるので、供給される溶
融樹脂の流動圧がより高くなり、隙間に侵入し易く多量
の溶融樹脂により外部リード部が曲げられる頻度が高
い。In the above-mentioned conventional resin mold for optical semiconductor device, the gap between the lower mold surface 6 and the upper mold surface when the mold is closed in consideration of the thermal expansion of the lead frame 8 and the like. Has a gap of more than ten microns. However, since the molten resin containing no filler has high fluidity, the molten resin may enter the gap despite the low pressure of the plunger, and the external lead 9 may be bent by the flowing pressure of the entered molten resin. This often occurs and reduces the yield of semiconductor devices. Particularly, in the external lead portion 9 of the cavity 5 farthest from the pot 7, since the excess molten resin is injected into the cavity 5 lastly, the flow pressure of the supplied molten resin becomes higher and the molten resin enters the gap. Frequently, the external lead is frequently bent by a large amount of molten resin.
【０００６】従って、本発明の目的は、リードフレーム
の外部リード部に変形をもたらすことなくかつ光特性を
劣化させないで樹脂封止できる光半導体装置樹脂封止金
型を提供することにある。Accordingly, it is an object of the present invention to provide an optical semiconductor device resin-sealing mold capable of resin-sealing without causing deformation of an external lead portion of a lead frame and without deteriorating optical characteristics.
【０００７】[0007]
【課題を解決するための手段】本発明の特徴は、充填材
を含まない溶融樹脂の供給源であるポットから該溶融樹
脂が流入経路であるランナから派生する複数の第１のゲ
ートを介して前記溶融樹脂が注入されるキャビティを有
する光半導体装置樹脂封止金型において、前記ポットか
ら最も離れた位置の前記キャビテイに前記第１のゲート
より狭い開口の第２のゲートを介して配設される第１の
樹脂溜り室を有する光半導体装置樹脂封止金型である。
また、前記第１の樹脂溜り室をもつ前記キャビテイの前
記ランナの上流にある前記キャビティに第３のゲートを
介して配設される第２の樹脂溜り室を有することが望ま
しい。SUMMARY OF THE INVENTION A feature of the present invention is that a plurality of first gates derived from a runner as an inflow path of a molten resin from a pot as a supply source of a molten resin containing no filler. In the optical semiconductor device resin mold having a cavity into which the molten resin is injected, the cavity is disposed at a position farthest from the pot via a second gate having an opening narrower than the first gate. 1 is an optical semiconductor device resin mold having a first resin reservoir chamber.
In addition, it is preferable that the cavity having the first resin reservoir has a second resin reservoir disposed in the cavity upstream of the runner of the cavity via a third gate.
【０００８】[0008]
【発明の実施の形態】次に、本発明について図面を参照
して説明する。Next, the present invention will be described with reference to the drawings.
【０００９】図１は本発明の一実施の形態における光半
導体装置樹脂封止金型を説明するための下型を示す部分
平面図である。この光半導体装置樹脂封止金型は、図１
に示すように、ポット７から供給されランナ４を経て各
ゲート３から溶融樹脂１０がそれぞれのキャビティ５ａ
およひ５ｂに順次充填され、最後に、ポット７から最も
離れた位置のキャビティ５ｂに溶融樹脂１０が完全に充
填されてから、キャビティ５ｂから溶融樹脂がゲート２
から入り込む樹脂溜り室１を設けている。FIG. 1 is a partial plan view showing a lower mold for explaining a resin-sealing mold for an optical semiconductor device according to an embodiment of the present invention. This optical semiconductor device resin mold is shown in FIG.
As shown in FIG. 3, the molten resin 10 is supplied from the pot 7 and passes through the runners 4 from the respective gates 3 to the respective cavities 5a.
5b, and finally, the cavity 5b farthest from the pot 7 is completely filled with the molten resin 10, and then the molten resin is supplied from the cavity 5b to the gate 2b.
There is provided a resin reservoir chamber 1 which enters from above.
【００１０】また、溶融樹脂が流れ込みを調整するため
に、ランナ４から溶融樹脂が流れ込むゲート３の開口面
積に比べ樹脂溜り室１のゲート２の開口面積は小さく
し、上下金型面の隙間（リードフレームの板厚に略同
じ）の面積より大きくすることである。すなわち、溶融
樹脂が入り込む開口部の流量抵抗を変えることである。Further, in order to adjust the flow of the molten resin, the opening area of the gate 2 of the resin reservoir chamber 1 is made smaller than the opening area of the gate 3 into which the molten resin flows from the runner 4, and the gap between the upper and lower mold surfaces is reduced. (Substantially the same as the thickness of the lead frame). That is, the flow resistance of the opening into which the molten resin enters is changed.
【００１１】このように流量抵抗を変えることにより、
樹脂源であるポット７から供給される溶融樹脂は、ま
ず、ランナ４に流れゲート３を介してポット７に最も近
いキャビティ５ａに充填し、次に、再びランナ４に流れ
ゲート３を介してキャビティ５ｂを充填する。さらに、
プランジャの押圧力によりキャビティ５ｂの溶融樹脂
が、上下金型面の隙間より遥に大きい開口をもつゲート
２を介して樹脂溜り室１に入り込む。そして、プランジ
ャが押しが停止すると、溶融樹脂１０は樹脂溜り室１の
例えば半分程度に流し込まれる。By changing the flow resistance in this way,
The molten resin supplied from the pot 7 which is a resin source first flows into the runner 4 and fills the cavity 5 a closest to the pot 7 via the gate 3, and then flows into the runner 4 again through the cavity 3 a via the gate 3. Fill 5b. further,
Due to the pressing force of the plunger, the molten resin in the cavity 5b enters the resin reservoir 1 via the gate 2 having an opening much larger than the gap between the upper and lower mold surfaces. When the plunger stops pushing, the molten resin 10 flows into, for example, about half of the resin reservoir 1.
【００１２】なお、図１ではキャビティ５ａおよび５ａ
の二つが示されているが、実際の金型では、ポット７を
中にキャビティ５ａと５ｂ側とは反対側に二つのキャビ
ティがある。この場合は、両側のキャビティにそれぞれ
樹脂溜り室がある。また、ポットを中心にしてランナ４
を挟んでキャビティが八個ある場合は、ポット７から最
も離れた位置のキャビティに設けることになり、樹脂溜
り室の数は四個となる。In FIG. 1, the cavities 5a and 5a
However, in an actual mold, there are two cavities on the opposite side of the pot 7 from the cavities 5a and 5b. In this case, there is a resin reservoir in each of the cavities on both sides. In addition, runner 4
In the case where there are eight cavities sandwiching, the cavity located farthest from the pot 7 is provided, and the number of resin reservoir chambers is four.
【００１３】この樹脂溜り室を設けるという技術思想
は、例えば、特開平５ー３４３４５５号公報や特開平６
ー１０６５５０号公報に開示されているものの、充填材
を含む樹脂で半導体装置を樹脂封止する金型であって、
いずれも流入経路であるランナの終端に樹脂溜り室を設
け、キャビティに効率良く樹脂を充填し、樹脂外郭体の
欠けやボイドの発生を防止している。しかしながら、こ
の金型に充填材が含まない樹脂封止に適用したとして
も、溶融樹脂がランナの終端に到達する前に、キャビテ
ィに充填された流動性が高い溶融樹脂が金型面の間の隙
間に入り込み外部リード部を変形させることになる。The technical idea of providing the resin reservoir is described in, for example, JP-A-5-343455 and JP-A-6-343455.
-106550, a mold for resin-sealing a semiconductor device with a resin containing a filler,
In each case, a resin reservoir is provided at the end of the runner, which is the inflow path, and the cavity is efficiently filled with resin to prevent chipping of the resin outer body and generation of voids. However, even if this mold is applied to resin sealing without a filler, before the molten resin reaches the end of the runner, the molten resin with high fluidity filled in the cavity is filled between the mold surfaces. It will enter the gap and deform the external lead.
【００１４】このように上下金型面の隙間より流量抵抗
の小さいゲート２をもつ樹脂溜り室１をランナ４の終端
に位置するキャビティ５ｂに設けることにより、溶融樹
脂が過剰に供給されても、溶融樹脂は隙間に多量に入り
込むことなく、殆どの溶融樹脂は樹脂溜り室１に逃げ込
むので、従来のように、隙間に入り込み外部リード部を
押し曲げることが無くなる。By providing the resin reservoir 1 having the gate 2 having a smaller flow resistance than the gap between the upper and lower mold surfaces in the cavity 5b located at the end of the runner 4, even if the molten resin is excessively supplied, Most of the molten resin escapes into the resin storage chamber 1 without entering a large amount of the molten resin into the gap, so that the external lead portion is not pushed and bent as in the conventional case.
【００１５】図２は本発明の他の実施の形態における光
半導体装置樹脂封止金型を説明するための下型を示す部
分平面図である。この光半導体装置樹脂封止金型は、図
２に示すように、ランナ４の終端にあるキャビティ５ｂ
に充填される樹脂が流れ込む樹脂溜り室１ａ以外に、キ
ャビティ５ｂより前段のキャビティ５ａに充填される溶
融樹脂が流れ込む樹脂溜り室１ｂを設けている。このよ
うな金型の場合は、樹脂入路経路であるランナ４が長
く、キャビティの数が多いときかキャビティ５ａ，５ｂ
の容積が大きい場合に適用される。FIG. 2 is a partial plan view showing a lower mold for explaining a resin mold for an optical semiconductor device according to another embodiment of the present invention. As shown in FIG. 2, the optical semiconductor device resin sealing mold has a cavity 5b at the end of the runner 4.
In addition to the resin reservoir 1a into which the resin to be filled flows, a resin reservoir 1b into which the molten resin to be charged into the cavity 5a preceding the cavity 5b flows is provided. In the case of such a mold, the runner 4 which is a resin entrance path is long and the number of cavities is large or the cavities 5a and 5b
It is applied when the volume of is large.
【００１６】例えば、前述の金型のキャビティより大き
い容積のキャビティ５ａ，５ｂと仮定すると、ポット７
から供給される溶融樹脂は、まず、ランナ４を経てゲー
ト３を通りキャビティ５ａに充填される。そして、余剰
の溶融樹脂はランナ４を経てゲート３を介してキャビテ
ィ５ｂに入り込む。キャビテイ５ｂに溶融樹脂が充填さ
れると、プランジャの上昇によって、キャビテイ５ａの
内圧がキャビティ５ａと同様に上昇し、キャビティ５ａ
のゲート２ａを通り溶融樹脂が樹脂溜り室１ａに流れ込
む、さらに、プランジャの上昇により溶融樹脂は供給さ
れ、キャビティ５ｂの溜った溶融樹脂がゲート２ｂから
樹脂溜り室１ｂへ押し出される。For example, assuming that the cavities 5a and 5b have a larger volume than the cavity of the mold described above,
Is supplied to the cavity 5a through the runner 4 and the gate 3 first. The surplus molten resin enters the cavity 5 b via the gate 3 via the runner 4. When the cavity 5b is filled with the molten resin, the internal pressure of the cavity 5a increases similarly to the cavity 5a due to the rise of the plunger, and the cavity 5a
The molten resin flows into the resin reservoir chamber 1a through the gate 2a, and the molten resin is supplied by the rise of the plunger, and the molten resin accumulated in the cavity 5b is pushed out from the gate 2b to the resin reservoir chamber 1b.
【００１７】[0017]
【発明の効果】以上説明したように本発明は、上下金型
面の隙間より流量抵抗の小さいゲートをもつ樹脂溜り室
を、溶融樹脂の流入経路の終端に位置するキャビティに
設けることにより、溶融樹脂が過剰に供給されても隙間
に多量の溶融樹脂が流れ込むことが無くなり、過剰の溶
融樹脂の殆どは樹脂溜り室に逃げ込み、従来、起きてい
た隙間に入り込む溶融樹脂によるリード部の変形が皆無
となり、歩留りが向上するという効果が得られた。As described above, according to the present invention, a resin reservoir having a gate having a smaller flow resistance than the gap between the upper and lower mold surfaces is provided in the cavity located at the end of the molten resin inflow path. Even if the resin is excessively supplied, a large amount of molten resin does not flow into the gap, and most of the excessive molten resin escapes into the resin reservoir, and there is no deformation of the lead portion caused by the molten resin entering the gap, which has conventionally occurred. And the effect of improving the yield was obtained.
【図１】本発明の一実施の形態における光半導体装置樹
脂封止金型を説明するための下型を示す部分平面図であ
る。FIG. 1 is a partial plan view showing a lower mold for describing an optical semiconductor device resin-sealing mold according to an embodiment of the present invention.
【図２】本発明の他の実施の形態における光半導体装置
樹脂封止金型を説明するための下型を示す部分平面図で
ある。FIG. 2 is a partial plan view showing a lower mold for describing an optical semiconductor device resin mold according to another embodiment of the present invention.
【図３】従来の光半導体装置樹脂封止金型の一例を説明
するための下型を示す部分平面図である。FIG. 3 is a partial plan view showing a lower mold for explaining an example of a conventional optical semiconductor device resin sealing mold.
１，１ａ，１ｂ 樹脂溜り室 ２，２ａ，２ｂ，３ ゲート ４ ランナ ５，５ａ，５ｂ キャビティ ６ 下型面 ７ ポット ８ リードフレーム ９ 外部リード部 １０ 溶融樹脂 1, 1a, 1b Resin reservoir 2, 2a, 2b, 3 Gate 4 Runner 5, 5a, 5b Cavity 6 Lower mold surface 7 Pot 8 Lead frame 9 External lead portion 10 Molten resin
Claims (2)
るポットから該溶融樹脂が流入経路であるランナから派
生する複数の第１のゲートを介して前記溶融樹脂が注入
されるキャビティを有する光半導体装置樹脂封止金型に
おいて、前記ポットから最も離れた位置の前記キャビテ
イに前記第１のゲートより狭い開口の第２のゲートを介
して配設される第１の樹脂溜り室を有することを特徴と
する光半導体装置樹脂封止金型。1. A cavity into which the molten resin is injected from a pot as a supply source of the molten resin containing no filler through a plurality of first gates derived from a runner as an inflow path of the molten resin. In the optical semiconductor device resin mold, a first resin reservoir chamber is provided in the cavity farthest from the pot through a second gate having an opening narrower than the first gate. An optical semiconductor device resin-sealing mold characterized by the above-mentioned.
テイの前記ランナの上流にある前記キャビティに第３の
ゲートを介して配設される第２の樹脂溜り室を有するこ
とを特徴とする請求項１記載の光半導体装置樹脂封止金
型。2. The method according to claim 1, further comprising a second resin reservoir disposed in said cavity upstream of said runner of said cavity having said first resin reservoir through a third gate. An optical semiconductor device resin mold according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13224097A JP2812327B1 (en) | 1997-05-22 | 1997-05-22 | Optical semiconductor device resin mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13224097A JP2812327B1 (en) | 1997-05-22 | 1997-05-22 | Optical semiconductor device resin mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2812327B1 true JP2812327B1 (en) | 1998-10-22 |
| JPH10321657A JPH10321657A (en) | 1998-12-04 |
Family
ID=15076652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13224097A Expired - Fee Related JP2812327B1 (en) | 1997-05-22 | 1997-05-22 | Optical semiconductor device resin mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2812327B1 (en) |
-
1997
- 1997-05-22 JP JP13224097A patent/JP2812327B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10321657A (en) | 1998-12-04 |
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| Date | Code | Title | Description |
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980707 |
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| LAPS | Cancellation because of no payment of annual fees |